CN107708330A - A kind of high-accuracy PCS plates implantation method - Google Patents
A kind of high-accuracy PCS plates implantation method Download PDFInfo
- Publication number
- CN107708330A CN107708330A CN201710759759.1A CN201710759759A CN107708330A CN 107708330 A CN107708330 A CN 107708330A CN 201710759759 A CN201710759759 A CN 201710759759A CN 107708330 A CN107708330 A CN 107708330A
- Authority
- CN
- China
- Prior art keywords
- jigsaw
- gong
- accuracy
- implantation method
- plates
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
Abstract
The present invention relates to a kind of high-accuracy PCS plates implantation method, comprise the following steps：S1, data make, make the more jigsaw of A and the more jigsaw of B；S2, transfer the more jigsaw of A；S3, gong go out impairment unit；S4, transfer the more jigsaw of B；S5, gong go out concatenation unit；S6, the contraposition of joint frame and concatenation unit that gong goes out is stitched together；S7, dispensing operation is carried out in a glue groove, put glue and stood 5min；S8, baking box is put into by bay, opens 150 DEG C of roasting 10min of oven；S9, examine wiring board plate face and dimensional accuracy.The present invention makes it splice use again there will be more jigsaw of defect by way of cutting and recombinating, positioning precision management and control is within 1mil during cutting, cutting tool is using 2 cuttings of interior compensation and external compensation, point glue groove reserves 0.2mm groove widths in stitching portion, using deep 0.5mm gongs groove is controlled, in order to which injecting glue sutures, fabulous integrate more jigsaw utilizes, product rejection rate is reduced, greatlys save production cost.
Description
Technical field
The present invention relates to wiring board manufacture field, and in particular to a kind of high-accuracy PCS plates implantation method.
Background technology
With the high speed development of electronic product industry, electronic product renewal speed is maked rapid progress, the need of corresponding PCB production capacities
Also sharp increase is asked, while as people improve to product quality requirement, electronics industry must capture city with high-quality, high efficiency
, while reduce finished product and scrap and turn into industry primary study project.More jigsaw especially in wiring board, in flakes plate, this kind of line
Road plate makes sheet frame and multiple plate units in the sheet frame in production by one piece of whole plate, not only process it is very difficult,
As long as a plate unit after finished product is made to go wrong, whole more jigsaw, plate will be scrapped completely in flakes, cause great economy
Loss, while cause the waste of material.
The content of the invention
It is an object of the present invention to provide a kind of high-accuracy PCS plates implantation method, it can efficiently solve in background technology and be deposited
The problem of.
The technical problems to be solved by the invention are realized using following technical scheme：
A kind of high-accuracy PCS plates implantation method, comprises the following steps：
S1, data make, make the more jigsaw of A and the more jigsaw of B, and the more jigsaw of A are that the more jigsaw cutting for having unit to damage retains
Joint frame, the more jigsaw of B are that the more jigsaw cutting for having unit to damage retains concatenation unit；
S2, the more jigsaw of A are transferred, play location pin nail；
S3, gong go out impairment unit, extract joint frame, the reserved point glue groove of joint frame；
S4, the more jigsaw of B are transferred, play location pin nail；
S5, gong go out concatenation unit, the reserved point glue groove of concatenation unit；
S6, the contraposition of joint frame and concatenation unit that gong goes out is stitched together；
S7, dispensing operation is carried out in a glue groove, put glue and stood 5min；
S8, baking box is put into by bay, opens 150 DEG C of roasting 10min of oven；
S9, examine wiring board plate face and dimensional accuracy.
Wherein, take CCD shaven heads to concentrate on work at selected units when the more jigsaw of the A and the more jigsaw of B are positioned, positioning precision≤
1mil。
Wherein, cutter compensation parameter is interior compensation during the A more jigsaw gong plates, controls deep value 0.5mm.
Wherein, cutter compensation parameter is external compensation during the B more jigsaw gong plates, controls deep value 0.5mm.
Wherein, the S9 is specially and takes out wiring board to check plate face, send three-D to detect after confirmation, three-D measurement size
Deviation is controlled within 2mil.
Wherein, the more jigsaw of the A and B more jigsaw gong point glue groove time-divisions do not reserve 0.2mm groove widths in stitching portion, using control
Deep 0.5mm gongs groove, in order to which injecting glue sutures.
The beneficial effects of the invention are as follows：
The present invention makes it splice use again there will be more jigsaw of defect by way of cutting and recombinating, positioning precision during cutting
Within 1mil, cutting tool reserves 0.2mm groove widths in stitching portion using 2 cuttings of interior compensation and external compensation, point glue groove for management and control,
Using deep 0.5mm gongs groove is controlled, in order to which injecting glue sutures, fabulous integrate more jigsaw utilizes, and reduces product rejection rate, saves significantly
Production cost is saved.
Embodiment
In order that the technical means, the inventive features, the objects and the advantages of the present invention are easy to understand, further
Illustrate the present invention.
Embodiment 1
A kind of high-accuracy PCS plates implantation method, comprises the following steps：
S1, data make, make the more jigsaw of A and the more jigsaw of B, and the more jigsaw of A are that the more jigsaw cutting for having unit to damage retains
Joint frame, the more jigsaw of B are that the more jigsaw cutting for having unit to damage retains concatenation unit；
S2, the more jigsaw of A are transferred, play location pin nail and the more jigsaw of A are fixed；
S3, gong go out impairment unit, extract joint frame, and joint frame reserves point glue groove in stitching portion, and groove width is predetermined groove width half；
S4, the more jigsaw of B are transferred, play location pin nail and the more jigsaw of B are fixed；
S5, gong go out concatenation unit, concatenation unit in the reserved point glue groove in stitching portion, groove width be predetermined groove width half and with joint frame structure
Into complete point glue groove；
S6, the contraposition of joint frame and concatenation unit that gong goes out is stitched together；
S7, dispensing operation is carried out in a glue groove, put glue and stood 5min；
S8, baking box is put into by bay, opens 150 DEG C of roasting 10min of oven；
S9, examine wiring board plate face and dimensional accuracy.
The more jigsaw of the A and B more jigsaw take CCD shaven heads to concentrate on work at selected units when being positioned, and positioning precision is in≤1mil.
Cutter compensation parameter is interior compensation during the A more jigsaw gong plates, controls deep value 0.5mm.
Cutter compensation parameter is external compensation during the B more jigsaw gong plates, controls deep value 0.5mm.
The S9 is specially to take out wiring board to check plate face, send three-D to detect after confirmation, three-D measurement dimensional discrepancy
Control is within 2mil.
The more jigsaw of the A and B more jigsaw gong point glue groove time-divisions do not reserve 0.2mm groove widths in stitching portion, deep using control
0.5mm gong grooves, in order to which injecting glue sutures.
I takes charge of and monthly produces more ㎡ of jigsaw 400, that is, reduces and scrap 400 ㎡, the 500 yuan of calculating of Yi Mei ㎡ unit prices：400㎡*500
Member=200,000 yuan, it can be monthly that company reduces 200,000 yuan of scrap cost, scrap cost can be reduced every year：200000 yuan/month * December=
2400000 yuan
It is the wherein specific implementation of the present invention above, its description is more specific and detailed, but can not therefore be interpreted as
Limitation to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, this hair is not being departed from
On the premise of bright design, various modifications and improvements can be made, these obvious alternative forms belong to the present invention's
Protection domain.
Claims (6)
1. a kind of high-accuracy PCS plates implantation method, it is characterised in that comprise the following steps：
S1, data make, make the more jigsaw of A and the more jigsaw of B, and the more jigsaw of A are that the more jigsaw cutting for having unit to damage retains
Joint frame, the more jigsaw of B are that the more jigsaw cutting for having unit to damage retains concatenation unit；
S2, the more jigsaw of A are transferred, play location pin nail；
S3, gong go out impairment unit, extract joint frame, the reserved point glue groove of joint frame；
S4, the more jigsaw of B are transferred, play location pin nail；
S5, gong go out concatenation unit, the reserved point glue groove of concatenation unit；
S6, the contraposition of joint frame and concatenation unit that gong goes out is stitched together；
S7, dispensing operation is carried out in a glue groove, put glue and stood 5min；
S8, baking box is put into by bay, opens 150 DEG C of roasting 10min of oven；
S9, examine wiring board plate face and dimensional accuracy.
2. a kind of high-accuracy PCS plates implantation method according to claim 1, it is characterised in that the more jigsaw of the A and B are more
CCD shaven heads are taken to concentrate on work at selected units when jigsaw is positioned, positioning precision is in≤1mil.
3. a kind of high-accuracy PCS plates implantation method according to claim 1, it is characterised in that during the more jigsaw gong plates of the A
Cutter compensation parameter is interior compensation, controls deep value 0.5mm.
4. a kind of high-accuracy PCS plates implantation method according to claim 1, it is characterised in that during the more jigsaw gong plates of the B
Cutter compensation parameter is external compensation, controls deep value 0.5mm.
5. a kind of high-accuracy PCS plates implantation method according to claim 1, it is characterised in that the S9 is specially to take out
Wiring board checks plate face, send three-D to detect after confirmation, and three-D measurement dimensional discrepancy control is within 2mil.
6. a kind of high-accuracy PCS plates implantation method according to claim 1, it is characterised in that the more jigsaw of the A and B are more
The jigsaw gong point glue groove time-division does not reserve 0.2mm groove widths in stitching portion, using deep 0.5mm gongs groove is controlled, in order to which injecting glue sutures.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710759759.1A CN107708330A (en) | 2017-08-30 | 2017-08-30 | A kind of high-accuracy PCS plates implantation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710759759.1A CN107708330A (en) | 2017-08-30 | 2017-08-30 | A kind of high-accuracy PCS plates implantation method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107708330A true CN107708330A (en) | 2018-02-16 |
Family
ID=61169933
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710759759.1A Pending CN107708330A (en) | 2017-08-30 | 2017-08-30 | A kind of high-accuracy PCS plates implantation method |
Country Status (1)
| Country | Link |
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| CN (1) | CN107708330A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109780961A (en) * | 2019-02-01 | 2019-05-21 | 奥士康精密电路（惠州）有限公司 | A kind of overall dimensions detection instrument and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1956630A (en) * | 2005-10-28 | 2007-05-02 | 诠脑电子（深圳）有限公司 | Method of transplating and splicing single board of printed circuit board |
| CN1993023A (en) * | 2005-12-30 | 2007-07-04 | 杨合卿 | Processing method and structure for replacing bad element in printed circuit board |
| CN201063967Y (en) * | 2007-04-20 | 2008-05-21 | 欣兴电子股份有限公司 | Transplant structure of printed circuit board |
| CN101299909A (en) * | 2007-04-30 | 2008-11-05 | 益庭股份有限公司 | Method for preparing multi-sheet printed circuit board |
| CN101557680A (en) * | 2008-04-10 | 2009-10-14 | 欣兴电子股份有限公司 | Transplanting method of multiplex circuit board |
| CN102905463A (en) * | 2011-07-27 | 2013-01-30 | 深圳市亿铖希科技有限公司 | PCB (printed circuit board) structure available for grafting and transplanting and PCB structure grafting method |
| CN103200789A (en) * | 2013-03-18 | 2013-07-10 | 昆山汇仁氏电子有限公司 | Printed circuit board transplanting technology |
| CN103607852A (en) * | 2013-12-06 | 2014-02-26 | 柏承科技(昆山)股份有限公司 | Printed circuit board core transplanting method |
-
2017
- 2017-08-30 CN CN201710759759.1A patent/CN107708330A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1956630A (en) * | 2005-10-28 | 2007-05-02 | 诠脑电子（深圳）有限公司 | Method of transplating and splicing single board of printed circuit board |
| CN1993023A (en) * | 2005-12-30 | 2007-07-04 | 杨合卿 | Processing method and structure for replacing bad element in printed circuit board |
| CN201063967Y (en) * | 2007-04-20 | 2008-05-21 | 欣兴电子股份有限公司 | Transplant structure of printed circuit board |
| CN101299909A (en) * | 2007-04-30 | 2008-11-05 | 益庭股份有限公司 | Method for preparing multi-sheet printed circuit board |
| CN101557680A (en) * | 2008-04-10 | 2009-10-14 | 欣兴电子股份有限公司 | Transplanting method of multiplex circuit board |
| CN102905463A (en) * | 2011-07-27 | 2013-01-30 | 深圳市亿铖希科技有限公司 | PCB (printed circuit board) structure available for grafting and transplanting and PCB structure grafting method |
| CN103200789A (en) * | 2013-03-18 | 2013-07-10 | 昆山汇仁氏电子有限公司 | Printed circuit board transplanting technology |
| CN103607852A (en) * | 2013-12-06 | 2014-02-26 | 柏承科技(昆山)股份有限公司 | Printed circuit board core transplanting method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109780961A (en) * | 2019-02-01 | 2019-05-21 | 奥士康精密电路（惠州）有限公司 | A kind of overall dimensions detection instrument and preparation method thereof |
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Application publication date: 20180216 |