CN104302108B - A kind of printed wiring board test forming method - Google Patents
A kind of printed wiring board test forming method Download PDFInfo
- Publication number
- CN104302108B CN104302108B CN201410510896.8A CN201410510896A CN104302108B CN 104302108 B CN104302108 B CN 104302108B CN 201410510896 A CN201410510896 A CN 201410510896A CN 104302108 B CN104302108 B CN 104302108B
- Authority
- CN
- China
- Prior art keywords
- printed wiring
- wiring board
- test
- shipment
- badge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Management, Administration, Business Operations System, And Electronic Commerce (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
The invention discloses a kind of printed wiring board test forming method, and it includes, testing procedure：Full wafer printed wiring board is tested, test does the first test badge after passing through on each shipment small pieces；Forming step：The distance of layer pattern is designed in more than 12mil inside and outside form wire distance, do first printed wiring board and confirm size, examine outward appearance, whether the printed wiring board that first printed wiring board takes test to pass through passes through to test exact p-value, by the printed wiring board shipment passed through to examining eventually after printed wiring sheet metal forming, the printed wiring board for having done second test badge is scrapped according to code of scrapping friendship.Method provided by the invention can greatly improve the efficiency of test product and significantly save the reduction of human cost, equipment cost, the energy consumption such as electricity, gas；Meanwhile shorten the production time, quick shipment is to client.
Description
Technical field
The invention belongs to circuit board technology field, and in particular to the production method tested before a kind of printed wiring sheet metal forming.
Background technology
In the prior art, the traditional manufacture craft of printed wiring board is first is molded re-test, and operations for forming is mainly from it
1 preceding sheet is divided into many small pieces, then is tested, and such as shaping charging 50 is large stretch of, and plank typesetting is 1*50, i.e. 1 sheet has
50 small pieces, shipment is exactly 2500 small pieces to test feed after shaping, and the quantity showed increased of test, testing efficiency is seriously low,
Influence shipment speed and production capacity.
The content of the invention
The purpose of this part is to summarize some aspects of embodiments of the invention and briefly introduce some preferably to implement
Example.It may do a little simplified or be omitted to avoid making our department in this part and the description of the present application summary and denomination of invention
Point, the purpose of specification digest and denomination of invention obscure, and this simplification or omit and cannot be used for limiting the scope of the present invention.
In view of problem present in a kind of above-mentioned and/or existing printed wiring board test forming method, it is proposed that the present invention.
It is therefore an object of the present invention to provide a kind of printed wiring board test forming method, this method can greatly improve
The efficiency of test product and the reduction for significantly saving human cost, equipment cost, the energy consumption such as electricity, gas；Meanwhile shorten production
Time, quick shipment is to client.
In order to solve the above technical problems, according to an aspect of the present invention, the invention provides following technical scheme：It is a kind of
Printed wiring board test forming method, it includes, testing procedure：Full wafer printed wiring board is tested, test pass through after
The first test badge is done on each shipment small pieces, now, the printed wiring board of substandard products does the second test on each shipment small pieces
Mark, and carry out looking for a confirmation, look for a printed wiring board for confirmation substandard products directly to scrap, and remember in corresponding code of scrapping, then
Look for and be a little identified through retesting, after test passes through, do the first test badge shipment；Forming step：Form wire is apart from ectonexine
The distance of figure is designed in more than 12mil, is done first printed wiring board and is confirmed size, examines outward appearance, first printed wiring
Whether plate takes the printed wiring board that test passes through to test exact p-value by the track that will pass through after printed wiring sheet metal forming
To examining eventually, the printed wiring board for having done second test badge is scrapped according to code of scrapping friendship for road plate shipment.
As a kind of preferred scheme of printed wiring board test forming method of the present invention, wherein：Opened in testing procedure
Before beginning, in addition to, the tool or formula needed for setup test in advance.
As a kind of preferred scheme of printed wiring board test forming method of the present invention, wherein：It is complete in testing procedure
Cheng Hou, before forming step starts, in addition to, need between printed wiring board full wafer and full wafer to set pad paper when test is looked for.
The present invention has the advantages that in terms of existing technologies：
(1) figure in plate can not be reaped by solving profile milling cutter, the problem of causing to reveal copper or network conduction performance；
(2) solve the problems, such as that profile milling cutter is reaped figure in plate and can verify that；
(3) solve the problems, such as that printed wiring board full wafer size measuring exception plate is beaten to scrap, avoid abnormal plate from flowing to client；
(4) solve the problems, such as that printed wiring board full wafer size is looked for and be a little unable to scratch.
Embodiment
In order to facilitate the understanding of the purposes, features and advantages of the present invention, below to the specific reality of the present invention
The mode of applying is described in detail.
Many details are elaborated in the following description to facilitate a thorough understanding of the present invention, still the present invention can be with
It is different from other manner described here using other to implement, those skilled in the art can be without prejudice to intension of the present invention
In the case of do similar popularization, therefore the present invention is not limited by following public specific embodiment.
Embodiments of the present invention, its technical scheme used its actually：Flow scheme design is adjusted, was first molded and surveys again originally
Examination, is adjusted to first to test reshaping, and if printed wiring board typesetting be 1*50, being first molded re-test needs to test 50 that (50 is small
Piece), as long as and first test reshaping test 1, being capable of significant increase tested productivity.Specially：
Step 1, testing procedure：The charging test of printed wiring board full wafer
1st, the tool or formula of setup test are shifted to an earlier date；
2nd, printed wiring board carries out full wafer test；
3rd, test in this embodiment, can pass through lid by doing the first test badge on each shipment small pieces
Test passes through chapter to reach technical purpose, and the printed wiring board of substandard products does the second test badge on each shipment small pieces,
In this embodiment, technical purpose can be reached by beating V symbols on the printed wiring board of substandard products, and look for a little really
Recognize, look for a printed wiring board for confirmation substandard products directly to be scrapped with steel knife or oiliness stroke X, and code of scrapping is write on and scraps plate
On, look for and be a little identified through retesting, after test passes through, do the first test badge shipment, in this embodiment, Ke Yitong
Cross lid and pass through chapter shipment.
4th, scratch is should be noted because printed wiring board is larger when test is looked for, personnel gently take according to standard operation taking laying board
Put down gently, will pad paper between full wafer and full wafer.
Step 2, forming step：Shaping is walked after printed wiring board test
1st, the distance design of layer pattern in more than 12mil, specifically sees ability and the client of equipment inside and outside form wire distance
It is required that appropriate adjustment, is the bigger the better in principle；
2nd, production prepares shaping formula and confirms shaping drawing in advance；
3rd, do initial workpiece printed wiring board and confirm size, examine outward appearance, emphasis confirms printed wiring sheet metal forming side whether there is cut more
With leakage copper；
4th, initial workpiece printed wiring board takes whether test is passed through by plate to test exact p-value；
5th, it will be broken X plates by plate shipment to examining eventually and handed over according to code of scrapping and scrapped after printed wiring sheet metal forming.
As can be seen here, the present invention includes two steps, i.e. testing procedure and forming step in fact, have adjusted existing procedure
Sequentially, wherein, testing procedure：Full wafer printed wiring board is tested, test does first after passing through on each shipment small pieces
Test badge, now, the printed wiring board of substandard products do the second test badge on each shipment small pieces, and carry out looking for a confirmation,
Look for a printed wiring board for confirmation substandard products directly to scrap, and remember in corresponding code of scrapping, then look for and be a little identified through retesting,
After test passes through, the first test badge shipment is done；Forming step：The distance of layer pattern is designed in 12mil inside and outside form wire distance
More than, do first printed wiring board and confirm size, examine outward appearance, first printed wiring board takes the printed wiring that test passes through
Whether plate is to test exact p-value by the way that the printed wiring board shipment passed through has been done into institute to examining eventually after printed wiring sheet metal forming
The printed wiring board for stating the second test badge is scrapped according to code of scrapping friendship.Method provided by the invention can greatly improve
The efficiency of test product and the reduction for significantly saving human cost, equipment cost, the energy consumption such as electricity, gas；Meanwhile shorten production
Time, quick shipment is to client.
It should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention and it is unrestricted, although with reference to preferable
The present invention is described in detail embodiment, it will be understood by those within the art that, can be to the technology of the present invention
Scheme is modified or equivalent substitution, and without departing from the spirit and scope of technical solution of the present invention, it all should cover in this hair
Among bright right.
Claims (2)
- A kind of 1. printed wiring board test forming method, it is characterised in that：Including,Testing procedure：Printed wiring board without shaping is tested, the printed wiring board tested after passing through is in each shipment The first test badge is done on small pieces, now, the printed wiring board of substandard products does the second test badge on each shipment small pieces, goes forward side by side Row looks for a confirmation, looks for a printed wiring board for confirmation substandard products directly to scrap, and records corresponding code of scrapping, looks for and being a little identified through The printed wiring board of test retests, and after test passes through, does the first test badge shipment；Forming step：The distance of layer pattern is designed in more than 12mil inside and outside form wire distance, does first printed wiring board, really Recognize size, examine outward appearance, first printed wiring board takes the printed wiring board that test passes through, to test exact p-value whether By the way that after the printed wiring board for having done first test badge is molded and shipment to examining eventually, has done described second and has surveyed The printed wiring board of test-object note is handed over according to the code of scrapping to be scrapped.
- 2. printed wiring board test forming method as claimed in claim 1, it is characterised in that：Before testing procedure starts, also Including the tool or formula needed for setup test in advance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410510896.8A CN104302108B (en) | 2014-09-28 | 2014-09-28 | A kind of printed wiring board test forming method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410510896.8A CN104302108B (en) | 2014-09-28 | 2014-09-28 | A kind of printed wiring board test forming method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104302108A CN104302108A (en) | 2015-01-21 |
| CN104302108B true CN104302108B (en) | 2017-12-01 |
Family
ID=52321603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410510896.8A Active CN104302108B (en) | 2014-09-28 | 2014-09-28 | A kind of printed wiring board test forming method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104302108B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111698838A (en) * | 2020-06-19 | 2020-09-22 | 奥士康精密电路（惠州）有限公司 | Method for controlling micro-short of carbon oil plate |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1641852A (en) * | 2004-01-13 | 2005-07-20 | 自由度半导体公司 | Marking method for electronic packaging test result |
| CN1834678A (en) * | 2005-03-17 | 2006-09-20 | 上海华虹集成电路有限责任公司 | Multi-channel analyzer of non-contact applied chip |
| CN201788254U (en) * | 2010-07-27 | 2011-04-06 | 深南电路有限公司 | PCB withstand voltage testing device |
| CN103607852A (en) * | 2013-12-06 | 2014-02-26 | 柏承科技(昆山)股份有限公司 | Printed circuit board core transplanting method |
-
2014
- 2014-09-28 CN CN201410510896.8A patent/CN104302108B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1641852A (en) * | 2004-01-13 | 2005-07-20 | 自由度半导体公司 | Marking method for electronic packaging test result |
| CN1834678A (en) * | 2005-03-17 | 2006-09-20 | 上海华虹集成电路有限责任公司 | Multi-channel analyzer of non-contact applied chip |
| CN201788254U (en) * | 2010-07-27 | 2011-04-06 | 深南电路有限公司 | PCB withstand voltage testing device |
| CN103607852A (en) * | 2013-12-06 | 2014-02-26 | 柏承科技(昆山)股份有限公司 | Printed circuit board core transplanting method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104302108A (en) | 2015-01-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105338746B (en) | A kind of circuit panel forming method of no positioning hole | |
| WO2016054605A3 (en) | Systems and methods involving diagnostic monitoring, aggregation, classification, analysis and visual insights | |
| CN106550543A (en) | A kind of circuit panel forming method without location hole | |
| CN104302108B (en) | A kind of printed wiring board test forming method | |
| EP4234767A3 (en) | Electroforming assemblies for electrical machines | |
| CN102615181B (en) | Continuous punching die suitable for punching automobile brake pad and punching method | |
| CN103018591A (en) | Method for testing electrical property of high-precision circuit board | |
| CN103737184A (en) | Device and fixture for performing laser machining on through hole and fixture installation method | |
| CN204052274U (en) | A kind of device removing dust in PCB aperture | |
| CN106908713B (en) | A kind of determination method of wiring board internal layer circuit short circuit reason | |
| CN202019499U (en) | Riveting die for multilayer printed circuit board | |
| CN105120595B (en) | The production indicating means and system of a kind of wiring board | |
| CN202479324U (en) | Appearance processing jig for LED (light-emitting diode) metal base circuit board | |
| CN104602455B (en) | Package substrate one side anti-pad milling contour processing method | |
| CN202694677U (en) | Tear-to-stick anti-fake service label | |
| CN203951684U (en) | Environmental protection backing plate | |
| CN105979707A (en) | Method and system for identifying copper free area in line layer | |
| CN202679785U (en) | Multilayer PCB plate possessing quality inspection ring | |
| CN204800317U (en) | Part clamping device | |
| CN104394651A (en) | Electronic product manufacturability specification method | |
| CN106503875A (en) | A kind of propulsion project management method of Computer systems | |
| CN204800316U (en) | Frock tool | |
| CN204525231U (en) | Frock clamp | |
| CN104602456B (en) | A kind of lamp bar plate makes and the method for inspection | |
| CN203409540U (en) | Sheet chambering tool |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |