CN105979707A - Method and system for identifying copper free area in line layer - Google Patents
Method and system for identifying copper free area in line layer Download PDFInfo
- Publication number
- CN105979707A CN105979707A CN201610519225.7A CN201610519225A CN105979707A CN 105979707 A CN105979707 A CN 105979707A CN 201610519225 A CN201610519225 A CN 201610519225A CN 105979707 A CN105979707 A CN 105979707A
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- region
- area
- line layer
- copper
- substrate regions
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Abstract
The invention discloses a method and system for identifying a copper free area in a line layer. The method includes the following steps: generating a line layer area and a copper plate layer area which is in the line layer area on the basis of a line figure file of the line layer; determining a plurality of base material areas in the line layer area on the basis of the line layer area and the copper plate layer area, the plurality of base material areas and the copper plate layer area are merged together into the line layer area; determining whether the area of each base material area is greater than a first preset area, and determining the base material area that has the area greater than the first preset area as the copper free area; displaying the base material area which is determined as the copper free area and the line layer area. According to the invention, the method and the system can rapidly and accurately identify whether the line layer area has the copper free area, and production workers can adopt corresponding measures directed at line layers that have the copper free areas.
Description
Technical field
The present invention relates to wiring board manufacturing technology field, especially relate to a kind of line layer and know without copper region
Other method and system.
Background technology
Region without copper refers to by the closing being surrounded between copper sheet in line layer or semi-enclosed and area 2.1
(being specifically defined area can be according to actual track plate actual process production capacity for Wu Tongqu more than square inch
Set).Region without copper is recessed in pcb layer, easily runs off at the colloid without copper region.So,
Wiring board, in lamination process, is easily caused between wiring board generation starved phenomenon without copper region, and then causes
There is the quality problem such as white macula, bubble and copper sheet be wrinkling in the wiring board after lamination.Wiring board was manufactured
Cheng Zhong, often artificially identifies the Wu Tongqu of each line layer, and makees according to without copper district according to line pattern file
Go out corresponding production measure.But, when manufacture is produced by batch for wiring board, each line layer of wiring board
Circuit element is more, and artificial recognition method easily produces error, and the region without copper in line layer is easily omitted,
The Qualified Products Rate of wiring board is relatively low.
Summary of the invention
Based on this, the invention reside in the defect overcoming prior art, it is provided that a kind of line layer is without copper region recognition
Method and system, it can conveniently identify the region without copper in line layer, and can improve the production effect of wiring board
Rate.
Its technical scheme is as follows: a kind of line layer, without copper area recognizing method, comprises the steps: according to line
The line pattern file generated line layer region of road floor and the copper plate region in described line layer region；According to
Described line layer region and described copper plate region determine the multiple substrate regions in described line layer region, its
In, multiple described substrate regions and described copper plate region piece together described line layer region；Judge described base
The area in material region, whether more than the first preset area, will be greater than the described substrate area of described first preset area
Territory is defined as without copper region；Will determine as the described substrate regions without copper region to carry out with described line layer region
Display.
A kind of line layer is without copper region recognition system, including the first generation module, described first generation module
Copper plate in the line pattern file generated line layer region according to line layer with described line layer region
Region；First display module, described first display module is for will determine as the described substrate area without copper region
Territory shows with described line layer region；Reversal block, described reversal block is for according to described line layer
Region and described copper plate region determine the multiple substrate regions in described line layer region；Judge module, institute
State judge module for judging that whether the area of described substrate regions is more than the first preset area；And identification module,
Described identification module is defined as without copper region for the described substrate regions that will be greater than described first preset area.
Wherein in an embodiment, whether the described area judging described substrate regions presets face more than first
Long-pending step includes step: obtain the central point of described substrate regions, by the edge of described substrate regions with described
The first preset area is inwardly reduced centered by central point；The institute reducing described first preset area will be fewer than
State substrate regions to mask from described line layer region, the described base after described first preset area will be reduced
The edge in material region outwards expands the second preset area centered by described central point and generates without copper tag slot
Territory.
Wherein in an embodiment, described determine institute according to described line layer region and described copper plate region
State the multiple substrate regions steps in line layer region and include step: by the described plating in described line layer region
Layers of copper region shields, and is shown in remaining region in described line layer region, remaining district described
Territory is multiple described substrate regions.
Wherein in an embodiment, whether the described area judging described substrate regions presets face more than first
Long-pending step includes step: calculate the area of described substrate regions；By the area of described substrate regions and described the
One preset area compares.
Wherein in an embodiment, described in will be greater than the described substrate regions of described first preset area and determine
For without further comprising the steps of: after the step of copper region according to described region without copper at the line pattern of described line layer
Position in file generates without copper region recognition point.
Wherein in an embodiment, described judge module include acquisition module, area reduce module, first
Shroud module and the second generation module, described acquisition module is for obtaining the central point of described substrate regions, institute
State area and reduce module for the edge of described substrate regions inwardly being reduced centered by described central point first
Preset area, described first shroud module is for being fewer than the described base reducing described first preset area
Material region masks from described line layer region, and described second generation module is described first pre-for reducing
If the edge of the described substrate regions after area outwards expand centered by described central point the second preset area,
And generate without copper identified areas.
Wherein in an embodiment, described reversal block includes secondary shielding module and the second display module,
Described secondary shielding module is for shielding the described copper plate region in described line layer region, described
Second display module is for showing the multiple described substrate regions in described line layer region.
Wherein in an embodiment, described judge module includes area calculation module and Area comparison module,
Described area calculation module is for calculating the area of described substrate regions, and described Area comparison module is for by institute
The area stating substrate regions compares with described first preset area.
Wherein in an embodiment, described line layer also includes the 3rd generation module without copper region recognition system,
Described 3rd generation module is for according to position in the line pattern file of described line layer, the described region without copper
Put generation without copper region recognition point.
Below in conjunction with technique scheme, principle, the effect of the present invention are further illustrated:
Above-mentioned line layer, without copper area recognizing method, first passes through line layer region, copper plate region and obtains many
Individual substrate layer area, is then defined as area without copper region more than the substrate regions of the first preset area, and
Will determine as the substrate regions without copper region to show with line layer region.So present invention can be quick and precisely
Identifying whether line layer has without copper region, producers just can be for the line layer having without copper region
Take appropriate measures.
Accompanying drawing explanation
Fig. 1 is that line layer described in the embodiment of the present invention one is without copper area recognizing method flow chart one；
Fig. 2 is that line layer described in the embodiment of the present invention two is without copper area recognizing method flowchart 2；
Fig. 3 is that line layer described in the embodiment of the present invention three is without copper area recognizing method flow chart 3；
Fig. 4 is that line layer described in the embodiment of the present invention is without copper region recognition system structural representation；
Fig. 5 be line layer described in the embodiment of the present invention without copper plate region in copper area recognizing method at line layer
Schematic diagram in region；
Fig. 6 is that line layer described in the embodiment of the present invention is without copper plate region and substrate area in copper area recognizing method
Territory schematic diagram after reversion；
Fig. 7 is that line layer described in the embodiment of the present invention generates without copper district without substrate regions in copper area recognizing method
The schematic diagram in territory.
Description of reference numerals:
10, line layer region, 11, copper plate region, 12, substrate regions, 121, without copper region, 122,
Via regions, 123, without copper identified areas, the 21, first generation module, the 22, first display module, 23,
Reversal block, 24, judge module, 25, identification module.
Detailed description of the invention
Below embodiments of the invention are described in detail:
Embodiment one
As it is shown in figure 1, the line layer described in the embodiment of the present invention is without copper area recognizing method, including walking as follows
Rapid:
S101, line pattern file generated line layer region 10 and described line layer region 10 according to line layer
In copper plate region 11, and described copper plate region 11 is shown in described line layer region 10
(referring to Fig. 5)；
S102, determine described line layer region according to described line layer region 10 and described copper plate region 11
Multiple substrate regions 12 in 10, wherein, multiple described substrate regions 12 are spelled with described copper plate region 11
Synthesize described line layer region 10；Copper plate region 11 has copper plate, and substrate regions 12 includes Wu Tongqu
Territory 121 and via regions 122, all do not have copper plate without copper region 121 and via regions 122.Substrate regions
12 distinguish whether to have copper plate with copper plate region 11.
S103, judge that the area of described substrate regions 12, whether more than the first preset area, will be greater than described the
The described substrate regions 12 of one preset area is defined as without copper region 121.Wherein, the first preset area according to
Area defined in region without copper 121 determines, if being defined as area more than 2 squares of English without copper region 121
Very little substrate regions 12, then the first preset area is 2 square inches；
S104, will determine as the described substrate regions 12 without copper region 121 and enter with described line layer region 10
Row display.
Above-mentioned line layer, without copper area recognizing method, first passes through line layer region 10, copper plate region 11 and obtains
To multiple substrate layer area, then area is defined as Wu Tongqu more than the substrate regions 12 of the first preset area
Territory 121, and will determine as showing with line layer region 10 without the substrate regions 12 in copper region 121.As
This present invention can quick and precisely identify whether line layer has without copper region 121, and producers just can be for
There is the line layer without copper region 121 take appropriate measures.
Embodiment two
As in figure 2 it is shown, the line layer described in the embodiment of the present invention is without copper area recognizing method, including walking as follows
Rapid:
S201, line pattern file generated line layer region 10 and described line layer region 10 according to line layer
In copper plate region 11, and described copper plate region 11 is shown in described line layer region 10
(referring to Fig. 5)；
S202, the described copper plate region 11 in described line layer region 10 is shielded, and by described
Remaining region in line layer region 10 shows, remaining region described is multiple described substrate regions 12
(referring to Fig. 6)；
S203, obtain the central point of described substrate regions 12, by the edge of described substrate regions 12 with described
The first preset area is inwardly reduced centered by central point；Wherein, the first preset area is according to without copper region 121
Defined area determines, if being defined as the area substrate regions more than 2 square inches without copper region 121
12, then the first preset area is 2 square inches.
S204, the described substrate regions 12 reducing described first preset area will be fewer than from described line layer
Region 10 masks；The area of via regions 122 is less than the first preset area, is fewer than and reduces first
Preset area, via regions 122 is the most all shielded.The area in region without copper 121 presets face more than first
Long-pending, it is possible to for reducing the substrate regions 12 of the first preset area for without copper region 121.
S205, the edge of the described substrate regions 12 after described first preset area will be reduced with described central point
Centered by outwards expand the second preset area and generate without copper identified areas 123 (referring to Fig. 7).Second
The varying in size in the first preset area and could be arranged to less than the first preset area, so of preset area
Identified areas without copper 123 generated in circuit layer region 10 is positioned at the inside without copper region 121, without copper
Identified areas 123 can be used in identifying substrate regions 12 for without copper region 121 and can with without copper region 121
Distinguish.
S205, will determine as the described substrate regions 12 without copper region 121 and enter with described line layer region 10
Row display.
Embodiment three
As it is shown on figure 3, the line layer described in the embodiment of the present invention is without copper area recognizing method, including walking as follows
Rapid:
S301, line pattern file generated line layer region 10 and described line layer region 10 according to line layer
In copper plate region 11, and described copper plate region 11 is shown in described line layer region 10
(referring to Fig. 5)；
S302, determine described line layer region according to described line layer region 10 and described copper plate region 11
Multiple substrate regions 12 in 10, wherein, multiple described substrate regions 12 are spelled with described copper plate region 11
Synthesize described line layer region 10；Copper plate region 11 has copper plate, and substrate regions 12 includes Wu Tongqu
Territory 121 and via regions 122, all do not have copper plate without copper region 121 and via regions 122.Substrate regions
12 distinguish whether to have copper plate with copper plate region 11.
S303, calculate the area of described substrate regions 12；
S304, the area of described substrate regions 12 is compared with described first preset area；Wherein,
One preset area determines according to without area defined in copper region 121, if being defined as face without copper region 121
The long-pending substrate regions 12 more than 2 square inches, then the first preset area is 2 square inches.
S305, area more than the first preset area substrate regions 12 in generate without copper region 121 identification point.
Region without copper 121 identification point, for being indicated in the region without copper 121 in line layer region 10, produces people
Member according in line layer region 10 indicate region without copper 121 identification point in line layer region 10 without copper
Region 121 is identified, and can take appropriate measures for having the line layer without copper region 121.
S306, will determine as the described substrate regions 12 without copper region 121 and enter with described line layer region 10
Row display.
With the difference of embodiment two, embodiment three is that step S303～S305, embodiment three directly calculate
The area of each substrate regions 12 and judge the area of each substrate regions 12 whether more than the first preset area,
The substrate regions 12 that will be greater than the first preset area is defined as without copper region 121 and in corresponding substrate regions
Add without copper region 121 identification point in 12.
Referring to Fig. 4, the line layer described in the embodiment of the present invention identifies system without copper region 121, including: the
One generation module 21, reversal block 23, judge module 24, identification module 25 and the first display module 22.
Described first generation module 21 is for the line pattern file generated line layer region 10 according to line layer and institute
State the copper plate region 11 in line layer region 10.Described reversal block 23 is for according to described line layer district
Territory 10 and described copper plate region 11 determine the multiple substrate regions 12 in described line layer region 10.Described
Judge module 24 is for judging that whether the area of described substrate regions 12 is more than the first preset area.Described knowledge
Other module 25 is defined as without copper region for the described substrate regions 12 that will be greater than described first preset area
121.Described first display module 22 is for will determine as the described substrate regions 12 without copper region 121 and institute
State line layer region 10 to show.
Above-mentioned line layer identifies system without copper region 121, obtains line layer district by the first generation module 21
Territory 10, copper plate region 11, then line layer region 10, copper plate region 11 are obtained by reversal block 23
To multiple substrate layer area, then by judge module 24, identification module 25, area is preset face more than first
Long-pending substrate regions 12 is defined as, without copper region 121, will determine as without copper finally by the first display module 22
The described substrate regions 12 in region 121 shows with described line layer region 10.So present invention can be fast
Speed is recognized accurately whether line layer has without copper region 121, and producers just can be for having without copper region
The line layer of 121 takes appropriate measures.
Wherein in an embodiment, described judge module 24 include acquisition module, area reduce module,
One shroud module and the second generation module.Described acquisition module is for obtaining the central point of described substrate regions 12.
Described area reduces module for inwardly being reduced centered by described central point at the edge of described substrate regions 12
First preset area.Described first shroud module is for being fewer than the institute reducing described first preset area
State substrate regions 12 to mask from described line layer region 10.Described second generation module will be for reducing
The edge of the described substrate regions 12 after described first preset area outwards expands the centered by described central point
Two preset area also generate without copper identified areas 123.Described reversal block 23 include secondary shielding module with
Second display module.Described secondary shielding module is for by the described copper plate district in described line layer region 10
Territory 11 shields, and described second display module is for by the multiple described base in described line layer region 10
Material region 12 shows.
In another embodiment, described judge module 24 includes area calculation module and Area comparison module.
Described area calculation module is for calculating the area of described substrate regions 12, and described Area comparison module is used for will
The area of described substrate regions 12 compares with described first preset area.Described line layer is without copper region 121
Identification system also includes the 3rd generation module.Described 3rd generation module is for according to described region without copper 121
Position in the line pattern file of described line layer generates without copper region 121 identification point.
Each technical characteristic of embodiment described above can combine arbitrarily, for making description succinct, the most right
The all possible combination of each technical characteristic in above-described embodiment is all described, but, if these skills
There is not contradiction in the combination of art feature, is all considered to be the scope that this specification is recorded.
Embodiment described above only have expressed the several embodiments of the present invention, and it describes more concrete and detailed,
But can not therefore be construed as limiting the scope of the patent.It should be pointed out that, for this area
For those of ordinary skill, without departing from the inventive concept of the premise, it is also possible to make some deformation and change
Entering, these broadly fall into protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be with appended power
Profit requires to be as the criterion.
Claims (10)
1. a line layer is without copper area recognizing method, it is characterised in that comprise the steps:
Line pattern file generated line layer region according to line layer and the copper plate in described line layer region
Region；
The multiple base materials in described line layer region are determined according to described line layer region and described copper plate region
Region, wherein, multiple described substrate regions and described copper plate region piece together described line layer region；
Judge that the area of described substrate regions, whether more than the first preset area, will be greater than described first and presets face
Long-pending described substrate regions is defined as without copper region；
Will determine as the described substrate regions without copper region to show with described line layer region.
Line layer the most according to claim 1 is without copper area recognizing method, it is characterised in that described in sentence
Whether the area of disconnected described substrate regions includes step more than the first preset area step: obtain described substrate area
The central point in territory, inwardly reduces first centered by described central point by the edge of described substrate regions and presets face
Long-pending；Shield being fewer than the described substrate regions reducing described first preset area from described line layer region
Cover, the edge of the described substrate regions after described first preset area will be reduced centered by described central point
Outwards expand the second preset area and generate without copper identified areas.
Line layer the most according to claim 2 is without copper area recognizing method, it is characterised in that described
The multiple substrate regions step in described line layer region is determined according to described line layer region and described copper plate region
Suddenly step is included: shielded in the described copper plate region in described line layer region, and by described circuit
Remaining region in layer region shows, remaining region described is multiple described substrate regions.
Line layer the most according to claim 1 is without copper area recognizing method, it is characterised in that described in sentence
Whether the area of disconnected described substrate regions includes step more than the first preset area step: calculate described substrate area
The area in territory；The area of described substrate regions is compared with described first preset area.
5. according to the line layer described in Claims 1 to 4 any one without copper area recognizing method, its feature
Be, described in will be greater than after the described substrate regions of described first preset area is defined as without copper region step
Further comprise the steps of: and generate without copper region recognition point in the area substrate regions more than the first preset area.
6. a line layer is without copper region recognition system, it is characterised in that including:
First generation module, described first generation module is for the line pattern file generated line according to line layer
Road layer region and the copper plate region in described line layer region；
Reversal block, described reversal block is for determining with described copper plate region according to described line layer region
Multiple substrate regions in described line layer region；
Judge module, whether described judge module is preset more than first for the area judging described substrate regions
Area；
Identification module, described identification module is true for the described substrate regions that will be greater than described first preset area
It is set to without copper region；And
First display module, described first display module is for will determine as the described substrate regions without copper region
Show with described line layer region.
Line layer the most according to claim 6 is without copper region recognition system, it is characterised in that described in sentence
Disconnected module includes that acquisition module, area reduce module, the first shroud module and the second generation module, described in obtain
Delivery block is for obtaining the central point of described substrate regions, and described area reduces module for by described substrate area
The edge in territory inwardly reduces the first preset area centered by described central point, and described first shroud module is used for
Shield being fewer than the described substrate regions reducing described first preset area from described line layer region
Falling, described second generation module is for the edge by reducing the described substrate regions after described first preset area
Centered by described central point, outwards expand the second preset area and generate without copper identified areas.
Line layer the most according to claim 6 is without copper region recognition system, it is characterised in that described instead
Revolving die block includes secondary shielding module and the second display module, and described secondary shielding module is for by described circuit
Described copper plate region in layer region shields, and described second display module is for by described line layer district
Multiple described substrate regions in territory shows.
Line layer the most according to claim 6 is without copper region recognition system, it is characterised in that described in sentence
Disconnected module includes area calculation module and Area comparison module, and described area calculation module is used for calculating described base
The area in material region, described Area comparison module is for presetting the area of described substrate regions with described first
Area compares.
10. according to the line layer described in claim 6～9 any one without copper region recognition system, its feature
Being, also include the 3rd generation module, described 3rd generation module is used for according to described region without copper described
Position in the line pattern file of line layer generates without copper region recognition point.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610519225.7A CN105979707B (en) | 2016-07-01 | 2016-07-01 | A kind of line layer is without copper area recognizing method and system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610519225.7A CN105979707B (en) | 2016-07-01 | 2016-07-01 | A kind of line layer is without copper area recognizing method and system |
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| Publication Number | Publication Date |
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| CN105979707A true CN105979707A (en) | 2016-09-28 |
| CN105979707B CN105979707B (en) | 2018-06-19 |
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| CN108008288A (en) * | 2017-12-29 | 2018-05-08 | 大连崇达电路有限公司 | A kind of multilayer circuit board is without copper area automatic identification early warning system |
| CN110636717A (en) * | 2019-09-24 | 2019-12-31 | 北大方正集团有限公司 | Method and device for reducing press rejection rate of printed circuit board |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN105979707B (en) | 2018-06-19 |
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