CN107613645A - A kind of wiring board gong band processing method - Google Patents
A kind of wiring board gong band processing method Download PDFInfo
- Publication number
- CN107613645A CN107613645A CN201710608240.3A CN201710608240A CN107613645A CN 107613645 A CN107613645 A CN 107613645A CN 201710608240 A CN201710608240 A CN 201710608240A CN 107613645 A CN107613645 A CN 107613645A
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- gong
- road
- wiring board
- processing
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- 238000003672 processing method Methods 0.000 title claims abstract description 16
- 238000012545 processing Methods 0.000 claims abstract description 48
- 238000000034 method Methods 0.000 claims abstract description 11
- 230000008569 process Effects 0.000 claims abstract description 10
- 238000003754 machining Methods 0.000 claims abstract description 5
- 239000002390 adhesive tape Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000006073 displacement reaction Methods 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 3
- 238000012797 qualification Methods 0.000 abstract description 3
- 238000013461 design Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 238000012356 Product development Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000010141 design making Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
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Abstract
The present invention discloses a kind of wiring board gong band processing method, comprises the following steps：S1. the quantity and machining area in gong road are set on the wiring board for needing to process according to processing request, the gong road of setting is then divided into odd number gong road and even numbers gong road.S2. plant equipment gong since first of odd number gong road port of wiring board is processed corresponding to using, and after first of odd number gong road gong machines, is directly jumped road to second odd number gong road port and is carried out gong processing, by that analogy, until odd number gong road gong completion of processing.S3. after odd number gong road gong completion of processing, then start to carry out even numbers gong road gong processing, even numbers gong road uses step S2 gong processing mode, until even numbers gong road gong completion of processing.The present invention can the wide wiring board small, that thickness is big in opposite be processed operation, solve the problems, such as displacement and size deviation occur during conventional line sheet metal forming machining, and wiring board dimensional accuracy is high, there is the characteristics of high qualification rate, production operation simplicity and good product performance.
Description
Technical field
The present invention relates to wiring board processing technique field, more particularly to a kind of wiring board gong band processing method.
Background technology
As electronic product development is fast changing, people's keen-witted and capable design concept short and small to electronic product requires more and more tighter
Lattice, require more harsh on graphic designs dimensional stability, the difficulty of wiring board design making is significantly greatly increased.Product design line
Road Slab element size is smaller, and thickness is bigger, and the difficulty of mechanical-moulded processing is bigger, 2 graphic designs extremely required, its into
It is core technology difficult point in type processing, such design belongs to highly difficult production category in the industry.
In more than 50mm*50mm, board thickness design surpasses in 0.5-2.5mm material thickness conventional line plate design size
The typically few enterprise of wiring board for going out this scope makes inquiries.Traditional wiring board molding mode is because its circuit board size is larger, gong knife
Influence to wiring board unit dimensional stability is less, is not in that gong knife aisle causes unit figure offset phenomena occur, and
Wiring board less than below size 20mm*20mm, dimensional discrepancy is directly contributed during shaping, the phenomenon of dimensional stability missing, is led
Cause product rejection.Therefore, for some sizes are small, thickness is big wiring board when being molded using normal CNC numerical controls, conventional gong
Size, the problem of offset deviation is big are that those skilled in the art need to solve the problems, such as caused by band formula processing method.
The content of the invention
The purpose of the present invention is to overcome weak point of the prior art, there is provided a kind of wiring board gong band processing method, is fitted
Gong process operation for size is small, thickness is big wiring board.
The purpose of the present invention is achieved through the following technical solutions：
A kind of wiring board gong band processing method, it is characterised in that comprise the following steps：
S1, quantity and machining area according to processing request setting gong road on the wiring board for needing to process, then will set
Ding Luo roads are divided into odd number gong road and even numbers gong road；
S2, using corresponding plant equipment, gong is processed since first of odd number gong road port of wiring board, and first single
After Shuo Luo roads gong machines, directly jump road to second odd number gong road port and carry out gong processing, by that analogy, until odd number gong
Road gong completion of processing；
After S3, odd number gong road gong completion of processing, then start to carry out gong processing to even numbers gong road, even numbers gong road uses the step
Rapid S2 gong processing mode, until even numbers gong road gong completion of processing.
As a kind of preferable scheme of the present invention, the gong processing in the step S2 uses one step completed smart gong or thick gong
Processing mode.
As a kind of preferable scheme of the present invention, the gong processing in the step S3 uses one step completed smart gong or thick gong
Processing mode.
As a kind of preferable scheme of the present invention, the plant equipment in the step S2 is CNC process equipments.
As a kind of preferable scheme of the present invention, the bottom of the wiring board is provided with location structure.
As a kind of preferable scheme of the present invention, the location structure is double faced adhesive tape, and the double faced adhesive tape is arranged on the line
Between the adjacent gong road in road plate bottom.
Compared with prior art, the present invention has advantages below：
The present invention wiring board gong with processing method can the wide wiring board small, that thickness is big in opposite be processed operation, solution
There is the problem of displacement and size deviation, and wiring board dimensional accuracy when being machined in conventional line sheet metal forming of having determined
Height, there is the characteristics of high qualification rate, production operation simplicity and good product performance.
Brief description of the drawings
Fig. 1 is the structure chart of the wiring board of one embodiment of the invention.
Embodiment
For the ease of understanding the present invention, the present invention is described more fully below with reference to relevant drawings.In accompanying drawing
Give the better embodiment of the present invention.But the present invention can realize in many different forms, however it is not limited to herein
Described embodiment.On the contrary, the purpose for providing these embodiments is to make to understand more the disclosure
Add thorough and comprehensive.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be element placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
For illustrative purposes only, it is unique embodiment to be not offered as " right side " and similar statement.
Unless otherwise defined, all of technologies and scientific terms used here by the article is with belonging to technical field of the invention
The implication that technical staff is generally understood that is identical.Term used in the description of the invention herein is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term as used herein " and/or " include one or more
The arbitrary and all combination of related Listed Items.
As shown in figure 1, the structure chart of the wiring board 10 for one embodiment of the invention.
A kind of wiring board gong band processing method, comprises the following steps：
S1. the quantity and machining area in gong road 100 are set on the wiring board 10 for needing to process according to processing request, then
The gong road 100 of setting is divided into odd number gong road 110 and even numbers gong road 120.
S2. plant equipment gong since first of odd number gong road 110 port of wiring board 10 is processed corresponding to using, and first
After the gong of road odd number gong road 110 machines, directly jump road to the port of second odd number gong road 110 and carry out gong processing, by that analogy,
Until the gong completion of processing of odd number gong road 110.In the present embodiment, the plant equipment used is CNC process equipment.
S3. after the completion of processing of odd number gong road gong 110, then start to carry out gong processing, even numbers gong road 120 to even numbers gong road 120
Using step S2 gong processing mode, until the completion of processing of even numbers gong road gong 120.
S4. the circuit test of correlation is entered to completing the wiring board after gong road processes.
S5. add after completion circuit test using whether the artificial visual condition for carrying out sight check wiring board 10 meets production
Work requirement.
S6. after completing visual detection, qualified wiring board 10 is subjected to packaging and storage.
In the present embodiment, the gong processing in step S2 and step S3 uses one step completed smart gong or thick gong processing side
Formula.Use and thick gong or the processing of smart gong carried out once in CNC process equipments and the Optimal Parameters assist side 10 set so that
Wiring board 10 after processing reaches the standard of Ordinary fruit quality management and control.
Because when the wide wiring board 10 less than thickness is processed over there, machinery drives the power of gong knife up speed rotation very
Greatly so that displacement easily occurs in process in wiring board 10, causes dimensional discrepancy.So conventional first progress is quick together
The processing mode that thick gong processing carries out quick smart gong together again is not particularly suited for the wide wiring board processing small, thickness is big in face, therefore
It can be solved the above problems very well using the gong processing for once completing mode.
Further, the bottom of wiring board 10 is provided with location structure (not shown).In the present embodiment, location structure is
Double faced adhesive tape, double faced adhesive tape are set between the adjacent gong road 100 in the bottom of assist side 10.
It is noted that double faced adhesive tape is posted in the bottom of wiring board 10, for the position of wiring board to be fixed, so that
Position skew will not occur when gong is processed for wiring board.Specifically, wiring board bottom gong road sticks a 5-10cm every 30cm
Double faced adhesive tape, two-sided friendship according to certain distance laying can play positioning action, prevent wiring board occur position skew, improve line
The precision of road plate processing.
Compared with prior art, the present invention has advantages below：
The present invention wiring board gong with processing method can the wide wiring board small, that thickness is big in opposite be processed operation, solution
There is the problem of displacement and size deviation, and wiring board dimensional accuracy when being machined in conventional line sheet metal forming of having determined
Height, there is the characteristics of high qualification rate, production operation simplicity and good product performance.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more specific and detailed, but simultaneously
Can not therefore it be construed as limiting the scope of the patent.It should be pointed out that come for one of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (6)
1. a kind of wiring board gong band processing method, it is characterised in that comprise the following steps：
S1, quantity and machining area according to processing request setting gong road on the wiring board for needing to process, then by setting
Gong road is divided into odd number gong road and even numbers gong road；
S2, using corresponding plant equipment, gong is processed since first of odd number gong road port of wiring board, first of odd number gong
After road gong machines, directly jump road to second odd number gong road port and carry out gong processing, by that analogy, until odd number gong road gong
Completion of processing；
After S3, odd number gong road gong completion of processing, then start to carry out gong processing to even numbers gong road, even numbers gong road uses the step S2
Gong processing mode, until even numbers gong road gong completion of processing.
2. wiring board gong band processing method according to claim 1, it is characterised in that the gong processing in the step S2 is adopted
With one step completed smart gong or thick gong processing mode.
3. wiring board gong band processing method according to claim 1, it is characterised in that the gong processing in the step S3 is adopted
With one step completed smart gong or thick gong processing mode.
4. wiring board gong band processing method according to claim 1, it is characterised in that the plant equipment in the step S2
For for CNC process equipments.
5. wiring board gong band processing method according to claim 1, it is characterised in that the bottom of the wiring board is provided with
Location structure.
6. wiring board gong band processing method according to claim 5, it is characterised in that the location structure is double faced adhesive tape,
The double faced adhesive tape is arranged between the adjacent gong road in the wiring board bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710608240.3A CN107613645B (en) | 2017-07-24 | 2017-07-24 | Circuit board gong and band processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710608240.3A CN107613645B (en) | 2017-07-24 | 2017-07-24 | Circuit board gong and band processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107613645A true CN107613645A (en) | 2018-01-19 |
| CN107613645B CN107613645B (en) | 2020-05-05 |
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ID=61059470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710608240.3A Active CN107613645B (en) | 2017-07-24 | 2017-07-24 | Circuit board gong and band processing method |
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| Country | Link |
|---|---|
| CN (1) | CN107613645B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109842991A (en) * | 2018-11-27 | 2019-06-04 | 惠州市金百泽电路科技有限公司 | It is a kind of without interior positioning narrow side PTFE antenna PCB product contour processing method |
| CN111586982A (en) * | 2020-05-28 | 2020-08-25 | 遂宁市广天电子有限公司 | Processing method for reducing PCB (printed Circuit Board) out-of-tolerance phenomenon |
| CN111598383A (en) * | 2020-04-03 | 2020-08-28 | 广州兴森快捷电路科技有限公司 | Prediction method, system and storage medium of yield influence degree of PCB order |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090293261A1 (en) * | 2008-05-27 | 2009-12-03 | Kai-Ti Yang | Method for manufacturing a touch panel |
| CN203019076U (en) * | 2013-01-29 | 2013-06-26 | 惠州中京电子科技股份有限公司 | PCS gong plate auxiliary jig |
| CN104968151A (en) * | 2015-07-03 | 2015-10-07 | 景旺电子科技(龙川)有限公司 | Manufacturing method of carved copper substrate |
-
2017
- 2017-07-24 CN CN201710608240.3A patent/CN107613645B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090293261A1 (en) * | 2008-05-27 | 2009-12-03 | Kai-Ti Yang | Method for manufacturing a touch panel |
| CN203019076U (en) * | 2013-01-29 | 2013-06-26 | 惠州中京电子科技股份有限公司 | PCS gong plate auxiliary jig |
| CN104968151A (en) * | 2015-07-03 | 2015-10-07 | 景旺电子科技(龙川)有限公司 | Manufacturing method of carved copper substrate |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109842991A (en) * | 2018-11-27 | 2019-06-04 | 惠州市金百泽电路科技有限公司 | It is a kind of without interior positioning narrow side PTFE antenna PCB product contour processing method |
| CN109842991B (en) * | 2018-11-27 | 2021-06-18 | 惠州市金百泽电路科技有限公司 | Method for processing outline of PTFE antenna PCB product without inner positioning narrow edge |
| CN111598383A (en) * | 2020-04-03 | 2020-08-28 | 广州兴森快捷电路科技有限公司 | Prediction method, system and storage medium of yield influence degree of PCB order |
| CN111598383B (en) * | 2020-04-03 | 2024-03-15 | 广州兴森快捷电路科技有限公司 | Method, system and storage medium for predicting qualification rate influence degree of PCB order |
| CN111586982A (en) * | 2020-05-28 | 2020-08-25 | 遂宁市广天电子有限公司 | Processing method for reducing PCB (printed Circuit Board) out-of-tolerance phenomenon |
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| Publication number | Publication date |
|---|---|
| CN107613645B (en) | 2020-05-05 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A Processing Method for PCB Gongdai Effective date of registration: 20231219 Granted publication date: 20200505 Pledgee: Bank of China Limited by Share Ltd. Huizhou branch Pledgor: HUIZHOU XINGZHIGUANG TECHNOLOGY Co.,Ltd. Registration number: Y2023980072782 |
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