CN105108922B - Ceramic body crude porcelain chamfering die and chamfering method - Google Patents
Ceramic body crude porcelain chamfering die and chamfering method Download PDFInfo
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- CN105108922B CN105108922B CN201510484004.6A CN201510484004A CN105108922B CN 105108922 B CN105108922 B CN 105108922B CN 201510484004 A CN201510484004 A CN 201510484004A CN 105108922 B CN105108922 B CN 105108922B
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- chamfering
- ceramic body
- green base
- cutting
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Abstract
The invention discloses a ceramic body crude porcelain chamfering die and chamfering method. Inward cutting along the same one edge is carried out on a ceramic body formed after sintering, two vertical and crossed straight lines are formed, a right triangle is cut off from the ceramic body, and a right angle of the right triangle is located in the ceramic body. The chamfering die is easy to manufacture, wherein the ceramic body manufactured through stacking and sintering of crude ceramic sheets is used in the chamfering die, and the chamfering die is cut through a grinding wheel. The chamfering die is convenient to use; as a marking line is arranged, the chamfering accuracy is high; and when a crude porcelain body is cut, chamfering can be manufactured through the chamfering die at the same time, chamfering is carried out on the marking line of the chamfering die, and the accuracy can reach +/-20 micrometers.
Description
Technical field
The present invention relates to a kind of ceramic body green base chamfer mould.
Background technology
With requirement more and more higher of the electronic product to performance, function, cost, reliability, miniaturization etc., LTCC is promoted
Technology rapid progress, LTCC Technology are more and more extensive in the application of each field.Ltcc substrate is more and more assemblied in
In various modules.
In assembling process, especially four corners are vulnerable to the effect of mechanical stress to substrate outer edge to ltcc substrate, sternly
Substrate corner defect is caused during weight, affects assembly performance.Now, increasing ltcc substrate adopts corner chamfering in design
Design, the design can effectively reduce the mechanical stress that substrate is subject in assembling process corner.Ltcc substrate is sintered by green base
Form, chamfering must be completed before sintering, it is desirable to which the chamfering of making meets design size requirement.
The content of the invention
It is an object of the invention to utilize green to make ceramic body green base chamfer tool, solve LTCC green base chamferings and ask
Topic so that LTCC greens base completes the making of chamfering before sintering, and ensures the required precision of chamfering.
For solving above-mentioned technical problem, the present invention provides a kind of ceramic body green base chamfer mould, it is characterized in that, in sintering
On the ceramic body for being formed afterwards, the straight line of two square crossings is formed along the inside cutting-up in same side, make to be fallen by cutting-up on ceramic body
One right angled triangle, and the right angle of right angled triangle is in ceramic body.
By green base being formed after ceramic chips lamination, lamination, green base sintering is formed into the ceramic body.
In green base surface printing cutting-up line, the cutting-up line is to be inwardly formed two vertically along the same side of green base
The straight line of intersection.
When cutting-up falls a right angled triangle on ceramic body, cutting-up is carried out along the cutting-up line.
Mark line is printed with also on green base surface.
Mark line is a plurality of parallel straight line.
Mark line point on the basis of the intersection point of the straight line of two square crossings, arranges along the direction of cutting-up line.
The chamfering method of ceramic body green base chamfer mould, is characterized in that, comprise the following steps：
(1) will treat that chamfering green base product is positioned on cutting machine wafer-supporting platform, chamfer mould is buckled in green base product and needs chamfering
Corner on；
(2) the alignment symbol alignment chamfer mould of cutting machine is adjusted by chamfering requirement；
(3) after being aligned, chamfer mould is removed；
(4) position of the cutting machine by alignment, cuts and treats chamfering green base product, forms chamfering.
A plurality of parallel mark line is provided with chamfer mould, and mark line is with the intersection point of the straight line of two square crossings as base
On schedule, arrange along the direction of cutting-up line；
Wherein one mark line on the alignment symbol alignment chamfer mould of adjustment cutting machine, removes chamfer mould after alignment；
Cutting machine treats chamfering green base product by the position cutting of alignment, forms chamfering.
The present invention principle be：Chamfering mark line and Mold Making cutting-up are made using screen printing mode on ceramic chips
Line, and the mode using lamination and sintering makes ripe porcelain body, is fabricated to chamfer mould according to cutting-up line.Root during cutting green base
Chamfering is carried out to green base according to the mark line of chamfer mould.
Compared with prior art, its remarkable advantage is the present invention：
1st, chamfer mould makes simple：The chamfer mould is using ceramic chips lamination and sinters the ceramic body that is made, and makes
With emery wheel cutting-up into chamfer mould；
2nd, chamfer mould of the invention is easy to use, as chamfer mould is unlikely to deform and is provided with mark line, chamfering essence
Degree is high：Chamfering can be made simultaneously using chamfer mould when green base cuts, according to the mark line chamfering of chamfer mould, precision can
Up to ± 20 μm.
Description of the drawings
Fig. 1 is ceramic body green base chamfer mould schematic diagram.
Specific embodiment
The invention will be further described below in conjunction with the accompanying drawings.Following examples are only used for clearly illustrating the present invention
Technical scheme, and can not be limited the scope of the invention with this.
Concrete operations are as follows：
(1) use ceramic chips lamination and blank green base is formed after being laminated；
(2) in green base surface printing mark line 1 and cutting-up line 2；Cutting-up line 2 is the inside shape in same side along green base
Into two square crossings straight line.Mark line 1 is a plurality of parallel straight line, and mark line 1 with the intersection point of two cutting-up lines 2 is
Datum mark, arranges along the direction of cutting-up line 2.The more common corresponding mark of chamfer dimesion can be arranged according to the size of conventional chamfering
Note line 1.
(3) after sintering, ceramic body is formed；
(4) cutting-up is carried out along surface of ceramic body cutting-up line 2, make to be fallen a right angled triangle 3, and right angle by cutting-up on ceramic body
The right angle of triangle is located in ceramic body, is formed ceramic body chamfer mould, is seen Fig. 1.
Green base chamfering operating procedure is carried out using the mould of the present invention as follows：
(1) will treat that chamfering green base product is positioned on cutting machine wafer-supporting platform, chamfer mould is buckled in green base corner；
(2) the mark line of chamfer mould is directed at using the alignment symbol of cutting machine by chamfering requirement；
(3) after being aligned, chamfer mould is removed；
(4) after cutting chamfering is formed on chamfering green base product is treated.
The above is only the preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, on the premise of without departing from the technology of the present invention principle, some improvement and deformation can also be made, these improve and deform
Also should be regarded as protection scope of the present invention.
Claims (7)
1. a kind of ceramic body green base chamfer mould, is characterized in that, on the ceramic body for being formed after sintering, inside along same side
Cutting-up forms the straight line of two square crossings, makes to be fallen a right angled triangle, and the right angle of right angled triangle by cutting-up on ceramic body
Positioned at ceramic internal；
By green base being formed after ceramic chips lamination, lamination, green base sintering is formed into the ceramic body；
Mark line is printed with also on green base surface.
2. ceramic body green base chamfer mould according to claim 1, is characterized in that, in green base surface printing cutting-up
Line, the cutting-up line are to be inwardly formed the straight line of two square crossings along the same side of green base.
3. ceramic body green base chamfer mould according to claim 2, is characterized in that, on ceramic body, cutting-up falls a right angle
During triangle, cutting-up is carried out along the cutting-up line.
4. ceramic body green base chamfer mould according to claim 1, is characterized in that, mark line is a plurality of parallel straight
Line.
5. ceramic body green base chamfer mould according to claim 4, is characterized in that, mark line is with two square crossings
Point on the basis of the intersection point of straight line, arranges along the direction of cutting-up line.
6. the chamfering method based on the ceramic body green base chamfer mould described in claim 1, is characterized in that, including following step
Suddenly：
(1) will treat that chamfering green base product is positioned on cutting machine wafer-supporting platform, chamfer mould is buckled in green base product and needs the side of chamfering
On angle；
(2) the alignment symbol alignment chamfer mould of cutting machine is adjusted by chamfering requirement；
(3) after being aligned, chamfer mould is removed；
(4) position of the cutting machine by alignment, cuts and treats chamfering green base product, forms chamfering.
7. the chamfering method of ceramic body green base chamfer mould according to claim 6, is characterized in that, set on chamfer mould
A plurality of parallel mark line is equipped with, mark line point on the basis of the intersection point of the straight line of two square crossings, along the direction of cutting-up line
Arrangement；
Wherein one mark line on the alignment symbol alignment chamfer mould of adjustment cutting machine, removes chamfer mould after alignment；Cutting
Machine treats chamfering green base product by the position cutting of alignment, forms chamfering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510484004.6A CN105108922B (en) | 2015-08-10 | 2015-08-10 | Ceramic body crude porcelain chamfering die and chamfering method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510484004.6A CN105108922B (en) | 2015-08-10 | 2015-08-10 | Ceramic body crude porcelain chamfering die and chamfering method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105108922A CN105108922A (en) | 2015-12-02 |
| CN105108922B true CN105108922B (en) | 2017-03-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510484004.6A Active CN105108922B (en) | 2015-08-10 | 2015-08-10 | Ceramic body crude porcelain chamfering die and chamfering method |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108145865B (en) * | 2017-11-16 | 2019-11-15 | 华中科技大学 | Chamfer processing method and related device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57178659A (en) * | 1981-04-22 | 1982-11-02 | Hitachi Seiko Ltd | Grinding method of wafer |
| CN100565935C (en) * | 2008-03-21 | 2009-12-02 | 常州有则科技有限公司 | Ultra-thin solar silicon slice and cutting technique thereof |
| CN201436554U (en) * | 2009-07-09 | 2010-04-07 | 常州天合光能有限公司 | Evolution verticality detecting rule |
| CN102336571A (en) * | 2010-07-28 | 2012-02-01 | 深圳振华富电子有限公司 | Manufacture method for chip ceramic element |
| CN202420405U (en) * | 2011-12-02 | 2012-09-05 | 青特集团有限公司 | Novel chamfering measuring tool |
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| CN105108922A (en) | 2015-12-02 |
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Effective date of registration: 20180817 Address after: 233030 2016 Tang He road, Bengbu, Anhui Patentee after: Huadong Photoelectric Integrated Device Research Institute Address before: 215163 No. 89 Longshan Road, hi tech Zone, Suzhou, Jiangsu Patentee before: China North Industries Group Corporation No.214 Research Institute Suzhou R&D Center |