CN110366331A - A kind of three ply board manufacturing control method - Google Patents
A kind of three ply board manufacturing control method Download PDFInfo
- Publication number
- CN110366331A CN110366331A CN201910576154.8A CN201910576154A CN110366331A CN 110366331 A CN110366331 A CN 110366331A CN 201910576154 A CN201910576154 A CN 201910576154A CN 110366331 A CN110366331 A CN 110366331A
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- China
- Prior art keywords
- ply board
- plate
- face
- control method
- rivet
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Abstract
The present invention provides a kind of three ply board manufacturing control method, which is characterized in that including following aspect: the processing method that the internal layer circuit of three ply board described in A. uses one face copper sheet of a face route；B. the processing technology of etching is controlled；C. the sheeting process of independent routine pressing plate is used；D. the precision of each layer in three ply board process is adjusted.The present invention in internal layer circuit mainly by using the two sides of one face copper sheet of a face route to need the processing method of layers of copper, in conjunction with the control for the point that production process should be noted, three ply board not stick up by generating plate after achieving the effect that pressing, while can provide reference frame for the production and processing of other special plates.
Description
Technical field
The invention belongs to wiring board technology fields, and in particular to a kind of three ply board manufacturing control method.
Background technique
At present in the industry multi-layer board mainly based on even number multi-layer board, such as four, six, laminate, however still have part end
It brings out in the product function, cost the considerations of, by PCB design at odd number plate, such as three ply board.
The common mechanism of three ply board is copper foil, prepreg, core plate composition.Although such template is pair on matching this structure
Claim structure, but since in pressing, the contractility of core layer is relatively small, so after three ply board pressing, it may appear that warpage is asked
Topic, part demanding terminal three ply board depth of camber is lower than 1 percent at present, is unable to satisfy angularity using normal production technology
Requirement.
Summary of the invention
In view of this, the present invention provides a kind of three ply board manufacturing control method, the present invention is mainly by interior layer line
Road needs the processing method of layers of copper using the two sides of one face copper sheet of a face route, in conjunction with the control for the point that production process should be noted,
Achieve the effect that pressing after three ply board generating plate is not stuck up, while can be provided for the production and processing of other special plates reference according to
According to.
The technical solution of the present invention is as follows:
A kind of three ply board manufacturing control method, which is characterized in that including following aspect:
A. the processing method that the internal layer circuit of the three ply board uses one face copper sheet of a face route；
B. the processing technology of etching is controlled；
C. the sheeting process of independent routine pressing plate is used, in order to avoid unbalance stress in production occur and cause warpage.
D. the precision of each layer in three ply board process is adjusted.
Further, in the step B, etching time control sets up the plate face of route upward, and another side is avoided by grid
Hole site.
Further, in the step C, sheeting process includes:
C1. location hole is arranged in corresponding position on PP piece and core plate technique edges to be laminated respectively；
C2. the rivet to match with location hole size is made, height of rivet is less than the overall thickness after plate lamination to be laminated；
C3. each laminate is subjected to lamination, is pressed after squeezing into rivet positioning.
Further, the height of rivet is 0.05-0.08mm lower than the overall thickness after plate lamination to be laminated.
Pass through this processing method, it is ensured that be capable of fixing in plate pressing working procedure and do not slide between layers, it is ensured that pressing
The quality of back plate, improves product yield.
Further, the three ply board includes the core plate, inner plating, lamina rara externa set gradually, and wherein core plate is using one side
The processing method of one face copper sheet of route.
Further, it in sawing sheet, needs to mark in the one side of core plate copper thickness.
Further, the lamina rara externa needs to retain full copper.
The present invention mainly by needing the processing method of layers of copper using the two sides of one face copper sheet of a face route in internal layer circuit,
In conjunction with the control for the point that production process should be noted, three ply board not stick up by generating plate after achieving the effect that pressing, while can be other
The production and processing of special plate provides reference frame.
Specific embodiment
To make the objectives, technical solutions, and advantages of the present invention more comprehensible, below in conjunction with specific embodiment, to this
Invention is described in further detail.It should be understood that the specific embodiments described herein are only to explain this hair
It is bright, and the scope of protection of the present invention is not limited.
Embodiment 1
A kind of three ply board manufacturing control method, which is characterized in that including following aspect:
A. the processing method that the internal layer circuit of the three ply board uses one face copper sheet of a face route；
B. the processing technology of etching is controlled；
C. the sheeting process of independent routine pressing plate is used, in order to avoid unbalance stress in production occur and cause warpage.
D. the precision of each layer in three ply board process is adjusted.
Further, in the step B, etching time control sets up the plate face of route upward, and another side is avoided by grid
Hole site.
Further, in the step C, sheeting process includes:
C1. location hole is arranged in corresponding position on PP piece and core plate technique edges to be laminated respectively；
C2. the rivet to match with location hole size is made, height of rivet is less than the overall thickness after plate lamination to be laminated；
C3. each laminate is subjected to lamination, is pressed after squeezing into rivet positioning.
Further, the height of rivet is 0.08mm lower than the overall thickness after plate lamination to be laminated.
Pass through this processing method, it is ensured that be capable of fixing in plate pressing working procedure and do not slide between layers, it is ensured that pressing
The quality of back plate, improves product yield.
Further, the three ply board includes the core plate, inner plating, lamina rara externa set gradually, and wherein core plate is using one side
The processing method of one face copper sheet of route.
Further, it in sawing sheet, needs to mark in the one side of core plate copper thickness.
Further, the lamina rara externa needs to retain full copper.
The present invention mainly by needing the processing method of layers of copper using the two sides of one face copper sheet of a face route in internal layer circuit,
In conjunction with the control for the point that production process should be noted, three ply board not stick up by generating plate after achieving the effect that pressing, while can be other
The production and processing of special plate provides reference frame.
Embodiment 2
A kind of three ply board manufacturing control method, which is characterized in that including following aspect:
A. the processing method that the internal layer circuit of the three ply board uses one face copper sheet of a face route；
B. the processing technology of etching is controlled；
C. the sheeting process of independent routine pressing plate is used, in order to avoid unbalance stress in production occur and cause warpage.
D. the precision of each layer in three ply board process is adjusted.
Further, in the step B, etching time control sets up the plate face of route upward, and another side is avoided by grid
Hole site.
Further, in the step C, sheeting process includes:
C1. location hole is arranged in corresponding position on PP piece and core plate technique edges to be laminated respectively；
C2. the rivet to match with location hole size is made, height of rivet is less than the overall thickness after plate lamination to be laminated；
C3. each laminate is subjected to lamination, is pressed after squeezing into rivet positioning.
Further, the height of rivet is 0.07mm lower than the overall thickness after plate lamination to be laminated.
Pass through this processing method, it is ensured that be capable of fixing in plate pressing working procedure and do not slide between layers, it is ensured that pressing
The quality of back plate, improves product yield.
Further, the three ply board includes the core plate, inner plating, lamina rara externa set gradually, and wherein core plate is using one side
The processing method of one face copper sheet of route.
Further, it in sawing sheet, needs to mark in the one side of core plate copper thickness.
Further, the lamina rara externa needs to retain full copper.
The present invention mainly by needing the processing method of layers of copper using the two sides of one face copper sheet of a face route in internal layer circuit,
In conjunction with the control for the point that production process should be noted, three ply board not stick up by generating plate after achieving the effect that pressing, while can be other
The production and processing of special plate provides reference frame.
Embodiment 3
A kind of three ply board manufacturing control method, which is characterized in that including following aspect:
A. the processing method that the internal layer circuit of the three ply board uses one face copper sheet of a face route；
B. the processing technology of etching is controlled；
C. the sheeting process of independent routine pressing plate is used, in order to avoid unbalance stress in production occur and cause warpage.
D. the precision of each layer in three ply board process is adjusted.
Further, in the step B, etching time control sets up the plate face of route upward, and another side is avoided by grid
Hole site.
Further, in the step C, sheeting process includes:
C1. location hole is arranged in corresponding position on PP piece and core plate technique edges to be laminated respectively；
C2. the rivet to match with location hole size is made, height of rivet is less than the overall thickness after plate lamination to be laminated；
C3. each laminate is subjected to lamination, is pressed after squeezing into rivet positioning.
Further, the height of rivet is 0.06mm lower than the overall thickness after plate lamination to be laminated.
Pass through this processing method, it is ensured that be capable of fixing in plate pressing working procedure and do not slide between layers, it is ensured that pressing
The quality of back plate, improves product yield.
Further, the three ply board includes the core plate, inner plating, lamina rara externa set gradually, and wherein core plate is using one side
The processing method of one face copper sheet of route.
Further, it in sawing sheet, needs to mark in the one side of core plate copper thickness.
Further, the lamina rara externa needs to retain full copper.
The present invention mainly by needing the processing method of layers of copper using the two sides of one face copper sheet of a face route in internal layer circuit,
In conjunction with the control for the point that production process should be noted, three ply board not stick up by generating plate after achieving the effect that pressing, while can be other
The production and processing of special plate provides reference frame.
Embodiment 4
A kind of three ply board manufacturing control method, which is characterized in that including following aspect:
A. the processing method that the internal layer circuit of the three ply board uses one face copper sheet of a face route；
B. the processing technology of etching is controlled；
C. the sheeting process of independent routine pressing plate is used, in order to avoid unbalance stress in production occur and cause warpage.
D. the precision of each layer in three ply board process is adjusted.
Further, in the step B, etching time control sets up the plate face of route upward, and another side is avoided by grid
Hole site.
Further, in the step C, sheeting process includes:
C1. location hole is arranged in corresponding position on PP piece and core plate technique edges to be laminated respectively；
C2. the rivet to match with location hole size is made, height of rivet is less than the overall thickness after plate lamination to be laminated；
C3. each laminate is subjected to lamination, is pressed after squeezing into rivet positioning.
Further, the height of rivet is 0.05mm lower than the overall thickness after plate lamination to be laminated.
Pass through this processing method, it is ensured that be capable of fixing in plate pressing working procedure and do not slide between layers, it is ensured that pressing
The quality of back plate, improves product yield.
Further, the three ply board includes the core plate, inner plating, lamina rara externa set gradually, and wherein core plate is using one side
The processing method of one face copper sheet of route.
Further, it in sawing sheet, needs to mark in the one side of core plate copper thickness.
Further, the lamina rara externa needs to retain full copper.
The present invention mainly by needing the processing method of layers of copper using the two sides of one face copper sheet of a face route in internal layer circuit,
In conjunction with the control for the point that production process should be noted, three ply board not stick up by generating plate after achieving the effect that pressing, while can be other
The production and processing of special plate provides reference frame.
Experiment test
Three ply board is produced respectively by the control method and prior art production method of implementing 1-4, and the product of production is taken out at random
Sample 10 is opened, and wiring board plate sticks up test, and computing board sticks up rate, as a result as shown in the table.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims
Variation is included within the present invention.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.It is noted that the technical characteristic being not described in detail in the present invention, can pass through this
Field any prior art is realized.
Claims (7)
1. a kind of three ply board manufactures control method, which is characterized in that including following aspect:
A. the processing method that the internal layer circuit of the three ply board uses one face copper sheet of a face route；
B. the processing technology of etching is controlled；
C. the sheeting process of independent routine pressing plate is used；
D. the precision of each layer in three ply board process is adjusted.
2. three ply board according to claim 1 manufactures control method, which is characterized in that in the step B, when etching
Control is equipped with the plate face of route upward, and another side avoids hole site by grid.
3. three ply board according to claim 1 manufactures control method, which is characterized in that in the step C, pressing plate work
Skill includes:
C1. location hole is arranged in corresponding position on PP piece and core plate technique edges to be laminated respectively；
C2. the rivet to match with location hole size is made, height of rivet is less than the overall thickness after plate lamination to be laminated；
C3. each laminate is subjected to lamination, is pressed after squeezing into rivet positioning.
4. three ply board according to claim 1 manufactures control method, which is characterized in that the height of rivet ratio waits pressing
The low 0.05-0.08mm of overall thickness after the plate lamination of conjunction.
5. three ply board according to claim 1 manufactures control method, which is characterized in that the three ply board includes successively
Core plate, inner plating, the lamina rara externa of setting, the processing method that wherein core plate uses one face copper sheet of a face route.
6. three ply board according to claim 5 manufactures control method, which is characterized in that in sawing sheet, need in core
The one side of plate copper thickness marks.
7. three ply board according to claim 5 manufactures control method, which is characterized in that the lamina rara externa needs to retain
Full copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910576154.8A CN110366331A (en) | 2019-06-28 | 2019-06-28 | A kind of three ply board manufacturing control method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910576154.8A CN110366331A (en) | 2019-06-28 | 2019-06-28 | A kind of three ply board manufacturing control method |
Publications (1)
| Publication Number | Publication Date |
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| CN110366331A true CN110366331A (en) | 2019-10-22 |
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ID=68216013
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910576154.8A Pending CN110366331A (en) | 2019-06-28 | 2019-06-28 | A kind of three ply board manufacturing control method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113795093A (en) * | 2021-08-31 | 2021-12-14 | 江门市众阳电路科技有限公司 | Production method of PCB (printed circuit board) cathode and anode copper plates |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11204942A (en) * | 1998-01-12 | 1999-07-30 | Hitachi Chem Co Ltd | Manufacture of multilayer wiring board |
| CN105682381A (en) * | 2016-03-03 | 2016-06-15 | 深圳市景旺电子股份有限公司 | High multi-layer PCB and laminating method thereof |
| CN106852031A (en) * | 2017-03-22 | 2017-06-13 | 深圳市景旺电子股份有限公司 | A kind of mixed-compression board of three layers of HDI plates and aluminium base and preparation method thereof |
| CN109287080A (en) * | 2018-11-13 | 2019-01-29 | 梅州市志浩电子科技有限公司 | The compression method of asymmetric core plate and asymmetric core plate |
-
2019
- 2019-06-28 CN CN201910576154.8A patent/CN110366331A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11204942A (en) * | 1998-01-12 | 1999-07-30 | Hitachi Chem Co Ltd | Manufacture of multilayer wiring board |
| CN105682381A (en) * | 2016-03-03 | 2016-06-15 | 深圳市景旺电子股份有限公司 | High multi-layer PCB and laminating method thereof |
| CN106852031A (en) * | 2017-03-22 | 2017-06-13 | 深圳市景旺电子股份有限公司 | A kind of mixed-compression board of three layers of HDI plates and aluminium base and preparation method thereof |
| CN109287080A (en) * | 2018-11-13 | 2019-01-29 | 梅州市志浩电子科技有限公司 | The compression method of asymmetric core plate and asymmetric core plate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113795093A (en) * | 2021-08-31 | 2021-12-14 | 江门市众阳电路科技有限公司 | Production method of PCB (printed circuit board) cathode and anode copper plates |
| CN113795093B (en) * | 2021-08-31 | 2023-08-04 | 江门市众阳电路科技有限公司 | Production method of PCB (printed circuit board) cathode-anode copper plate |
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Application publication date: 20191022 |