CN203523147U - Rigid-flexible PCB - Google Patents
Rigid-flexible PCB Download PDFInfo
- Publication number
- CN203523147U CN203523147U CN201320542806.4U CN201320542806U CN203523147U CN 203523147 U CN203523147 U CN 203523147U CN 201320542806 U CN201320542806 U CN 201320542806U CN 203523147 U CN203523147 U CN 203523147U
- Authority
- CN
- China
- Prior art keywords
- base material
- rigid
- board
- hardboard
- soft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a rigid-flexible PCB, comprising a first rigid board substrate (7), a flexible board portion (8), and a second rigid board substrate (9). The flexible board portion (8) is disposed between the first rigid board substrate (7) and the second rigid board substrate (9). The PCB is made by cutting a waste material on a flexible-rigid combining portion in one-step. A rigid board of the combining portion of the rigid-flexible board is formed by the one-step cutting on the external, and meanwhile the rigid board portion can protect a cover film of the flexible board in copper deposition. Smoothness of a board surface is ensured in resistance welding manufacturing, bad phenomenon of oil gathering in resistance welding is improved, and cost is effectively saved.
Description
Technical field
The utility model relates to a kind of soft or hard in conjunction with pcb board.
Background technology
Develop rapidly along with modern processing, at numerous areas, oneself replaces traditional process technology at the increasing Modern Laser process technology that adopts, cutting industry at pcb board, the main method adopting was in the past: by soft or hard binding site being carried out to hardboard, mill out a groove of not wearing, when being in the end shaped, carry out milling from front again, the same line is carried out to cutting twice, the error of cutting twice can produce at line of cut position a step; With copper foil covering method, complete after etching, when doing welding resistance because soft or hard binding site is outputed, so produce poly-oil in element sides when welding resistance is printed.The present invention adopts the cutting of the laser controlling degree of depth, can after welding resistance, carry out disposable shaping, has solved the step that cutting twice produces, the poly-oily problem in the time of also can improving welding resistance making.
Summary of the invention
The purpose of this utility model is to overcome the deficiency of prior art, provide a kind of soft or hard in conjunction with pcb board, comprise the first hardboard base material (7), soft board portion (8) and the second hardboard base material (9), described soft board portion (8) is positioned between the first hardboard base material (7) and the second hardboard base material (9), it is characterized in that:
Described the first hardboard base material (7) comprises the first solder mask (1-1) successively, the first bronze medal layer (2-1), the first fiberglass resin hardboard base material (3-1), the second bronze medal layer (2-2) and the first tack coat (4-1);
Described soft board portion (8) comprises the first coverlay (5-1) successively, the 3rd bronze medal layer (2-3), soft board base material (6), the 4th bronze medal layer (2-4) and the second coverlay (5-2);
Described the second hardboard base material (9) comprises the second tack coat (4-2) successively, the 5th bronze medal layer (2-5), the second fiberglass resin hardboard base material (3-2), the 6th bronze medal layer (2-6) and the second solder mask (1-2);
Described the first hardboard base material (7) middle part has the first cutting part (10), and the second hardboard base material (9) middle part has the second cutting part (11).
Described soft board base material (6) is polyimides soft board base material.
Described the first tack coat (4-1) and the second tack coat (4-2) all adopt PP glue.
The utility model is simple in structure; reasonable in design; this patent is by the control to laser energy; for the waste material of soft or hard bound fraction, carrying out disposable cutting completes; in profile, once cut the hardboard of the binding site of Rigid Flex, hardboard part can be protected the coverlay of soft board when heavy copper simultaneously, has also guaranteed the smooth of plate face when welding resistance is made; poly-wet goods bad phenomenon while having improved welding resistance, effectively cost-saving.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Embodiment
Below in conjunction with drawings and Examples, the utility model is described in further detail.
With reference to accompanying drawing, soft or hard, in conjunction with a pcb board, comprises the first hardboard base material (7), soft board portion (8) and the second hardboard base material (9), described soft board portion (8) is positioned between the first hardboard base material (7) and the second hardboard base material (9), it is characterized in that:
Described the first hardboard base material (7) comprises the first solder mask (1-1) successively, the first bronze medal layer (2-1), the first fiberglass resin hardboard base material (3-1), the second bronze medal layer (2-2) and the first tack coat (4-1);
Described soft board portion (8) comprises the first coverlay (5-1) successively, the 3rd bronze medal layer (2-3), soft board base material (6), the 4th bronze medal layer (2-4) and the second coverlay (5-2);
Described the second hardboard base material (9) comprises the second tack coat (4-2) successively, the 5th bronze medal layer (2-5), the second fiberglass resin hardboard base material (3-2), the 6th bronze medal layer (2-6) and the second solder mask (1-2);
Described the first hardboard base material (7) middle part is longitudinally cut with the first cutting part (10), and the second hardboard base material (9) middle part is longitudinally cut with the second cutting part (11).
Described soft board base material (6) is polyimides soft board base material.
Described the first tack coat (4-1) and the second tack coat (4-2) all adopt PP glue.
Certainly; the above is only a kind of execution mode of the present utility model; should be understood that those skilled in the art; do not departing under the prerequisite of the utility model principle; can also make some improvements and modifications, within these improvements and modifications all belong to the protection range of the utility model claim.
Claims (3)
1. a soft or hard is in conjunction with pcb board, comprise the first hardboard base material (7), soft board portion (8) and the second hardboard base material (9), described soft board portion (8) is positioned between the first hardboard base material (7) and the second hardboard base material (9), it is characterized in that:
Described the first hardboard base material (7) comprises the first solder mask (1-1) successively, the first bronze medal layer (2-1), the first fiberglass resin hardboard base material (3-1), the second bronze medal layer (2-2) and the first tack coat (4-1);
Described soft board portion (8) comprises the first coverlay (5-1) successively, the 3rd bronze medal layer (2-3), soft board base material (6), the 4th bronze medal layer (2-4) and the second coverlay (5-2);
Described the second hardboard base material (9) comprises the second tack coat (4-2) successively, the 5th bronze medal layer (2-5), the second fiberglass resin hardboard base material (3-2), the 6th bronze medal layer (2-6) and the second solder mask (1-2);
Described the first hardboard base material (7) middle part has the first cutting part (10), and the second hardboard base material (9) middle part has the second cutting part (11).
2. a kind of soft or hard according to claim 1, in conjunction with pcb board, is characterized in that: described soft board base material (6) is polyimides soft board base material.
3. a kind of soft or hard according to claim 1, in conjunction with pcb board, is characterized in that: described the first tack coat (4-1) and the second tack coat (4-2) all adopt PP glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320542806.4U CN203523147U (en) | 2013-09-03 | 2013-09-03 | Rigid-flexible PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320542806.4U CN203523147U (en) | 2013-09-03 | 2013-09-03 | Rigid-flexible PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203523147U true CN203523147U (en) | 2014-04-02 |
Family
ID=50382010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320542806.4U Expired - Fee Related CN203523147U (en) | 2013-09-03 | 2013-09-03 | Rigid-flexible PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203523147U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104125727A (en) * | 2014-07-31 | 2014-10-29 | 高德（无锡）电子有限公司 | Method for manufacturing rigid-flexible printed circuit board with multiple layers of soft boards |
| CN108076589A (en) * | 2016-11-18 | 2018-05-25 | 同泰电子科技股份有限公司 | Rigid-flexible combined board structure |
-
2013
- 2013-09-03 CN CN201320542806.4U patent/CN203523147U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104125727A (en) * | 2014-07-31 | 2014-10-29 | 高德（无锡）电子有限公司 | Method for manufacturing rigid-flexible printed circuit board with multiple layers of soft boards |
| CN108076589A (en) * | 2016-11-18 | 2018-05-25 | 同泰电子科技股份有限公司 | Rigid-flexible combined board structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140402 Termination date: 20150903 |
|
| EXPY | Termination of patent right or utility model |