CN204859738U

CN204859738U - Circuit board with module of counterpointing between layer

Info

Publication number: CN204859738U
Application number: CN201520463566.8U
Authority: CN
Inventors: 张伟连
Original assignee: KAIPING ELEC&ELTEK E&E MAGNETIC PRODUCTS Ltd
Current assignee: KAIPING ELEC&ELTEK E&E MAGNETIC PRODUCTS Ltd
Priority date: 2015-06-30
Filing date: 2015-06-30
Publication date: 2015-12-09
Anticipated expiration: 2025-06-30

Abstract

The utility model discloses a circuit board with module of counterpointing between layer, the circuit board is closed by many block base plate voltage and forms, be provided with on the base plate and be used for counterpointing the module of counterpointing between the layer of detecting. The utility model discloses a have the module of counterpointing between the layer on the circuit board, can utilize X -Ray measuring instrument to detect after outer circuit etching, reject the defective products, guarantee that the circuit board quality of production meets the requirements, reduce the defective products simultaneously to the waste of material, reduce cost in subsequent processing procedure.

Description

A kind of wiring board with interlayer alignment module

Technical field

The utility model relates to copper-clad plate field, is specifically related to a kind of wiring board with interlayer alignment module.

Background technology

Along with the development of wiring board techniques, particularly client to the stability of digital data transmission and integrity demands stricter.In design principle, requirements at the higher level are proposed to interlayer alignment.Require that interlayer deviation feasible value two-layer is arbitrarily within 4.8mil.

Utility model content

In order to solve existing wiring board, high problem is required to interlayer alignment, the purpose of this utility model is to provide a kind of wiring board with interlayer alignment module, can detect after outer-layer circuit etching, reject defective products, ensure that the quality of wiring board meets the requirements.

The technical scheme that the utility model adopts is:

With a wiring board for interlayer alignment module, described wiring board is formed by the pressing of polylith substrate, described substrate is provided with the interlayer alignment module for carrying out contraposition detection.

As the further improvement of technique scheme, described interlayer alignment module arranges near the edge of substrate and parallels with the limit of substrate.

As the further improvement of technique scheme, described interlayer alignment module installation is on the position, angle of substrate.

The beneficial effects of the utility model are:

With interlayer alignment module on wiring board of the present utility model, can X-Ray testing tool be utilized to detect after outer-layer circuit etching, reject defective products, ensure that the wiring board quality of producing meets the requirements, minimizing defective products is to the waste of material in follow-up processing procedure simultaneously, reduces costs.

Accompanying drawing explanation

Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.

Fig. 1 is the circuit board structure schematic diagram with interlayer alignment module of the present utility model;

Fig. 2 is the cross section structure schematic diagram of the wiring board with interlayer alignment module of the present utility model.

Drawing reference numeral illustrates: 1, substrate; 2, interlayer alignment module.

Embodiment

With reference to Fig. 1, Fig. 2, the preferred embodiment that the utility model provides, a kind of wiring board with interlayer alignment module, described wiring board is formed by polylith substrate 1 pressing, substrate 1 is provided with the interlayer alignment module 2 for carrying out contraposition detection, interlayer alignment module 2 arranges near the edge of substrate 1 and parallels with the limit of substrate 1, and preferably, interlayer alignment module 2 is arranged on the position, angle of substrate 1.Wiring board detection method with interlayer alignment module of the present utility model comprises the following steps: S1, on the position, four angles of each substrate 1 of internal layer, be provided with interlayer alignment module 2, and interlayer alignment module 2 parallels with the limit of substrate 1; S2, by pressing, multiple substrates 1 are combined together to form wiring board; S3, interlayer alignment module 2 is also set at wiring board skin, and makes outer-layer circuit figure; S4, utilize X-Ray testing tool to detect wiring board, when interlayer alignment module 2 exceeds the detection range of X-Ray testing tool setting, judge that wiring board is defective products and rejects.With reference to Fig. 2, in Fig. 2, wiring board is by N block substrate 1(L1-LN) pressing forms, I line in figure and VI line are the detection line utilizing X-Ray testing tool to set, II, III, IV, V be the corresponding position arranging the interlayer alignment module 2 of position, four angles on substrate 1 respectively, when there is any one situation following in wiring board, judge that this wiring board is defective, reject: 1. in L1-LN, the II point of any layer overlaps with I line or exceeds, and V point overlaps with VI line or exceeds; 2. in L1-LN, the III line of any layer overlaps with I line or exceeds; 3. in L1-LN, the IV line of any layer overlaps with VI line or exceeds.

With interlayer alignment module 2 on wiring board of the present utility model, can X-Ray testing tool be utilized to detect after outer-layer circuit etching, reject defective products, ensure that the wiring board quality of producing meets the requirements, minimizing defective products is to the waste of material in follow-up processing procedure simultaneously, reduces costs.

Above concrete structure and sized data illustrate preferred embodiment of the present utility model, but the utility model is created and is not limited to described embodiment, those of ordinary skill in the art also can make all equivalent variations or replacement under the prerequisite without prejudice to the utility model spirit, and these equivalent distortion or replacement are all included in the application's claim limited range.

Claims

1. the wiring board with interlayer alignment module, it is characterized in that: described wiring board is formed by polylith substrate (1) pressing, described substrate (1) is provided with the interlayer alignment module (2) for carrying out contraposition detection, described interlayer alignment module (2) arranges near the edge of substrate (1) and parallels with the limit of substrate (1).

2. a kind of wiring board with interlayer alignment module according to claim 1, is characterized in that: described interlayer alignment module (2) is arranged on the position, angle of substrate (1).