CN101532610A - High-power LED lamp and production process thereof - Google Patents
High-power LED lamp and production process thereof Download PDFInfo
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- CN101532610A CN101532610A CN200910020521A CN200910020521A CN101532610A CN 101532610 A CN101532610 A CN 101532610A CN 200910020521 A CN200910020521 A CN 200910020521A CN 200910020521 A CN200910020521 A CN 200910020521A CN 101532610 A CN101532610 A CN 101532610A
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Abstract
The invention discloses an illuminating device and a process for producing the same, in particular a high-power LED lamp and a production process thereof. The high-power LED lamp comprises a packaging optical system, a radiating system and a drive system, and is characterized in that the radiating system adopts a lamp body surface cross-ventilation natural heat dissipation mode; the drive system is an extra-low voltage constant pressure power supply system; and a lamp is separated from a power adapter; the production process of the high-power LED lamp comprises a packaging process of the lamp, production processes of the lamp and a light source, and a technological process of producing the lamp, and is characterized in that the packaging process comprises the following steps of cleaning, press welding and packaging; and the technological process of production comprises the following steps of plate setting, welding and closing up, hydraulic straightening system, galvanization, spraying, lifter installing, moulding bracket mounting and assembling. The high-power LED lamp and the production process thereof have the advantages of energy conservation, consumption reduction, high efficiency and safety.
Description
(1) technical field
The present invention relates to a kind of production lighting device and technology thereof, particularly a kind of high-powered LED lamp and production technology thereof.
(2) background technology
Street lamp is the important component part of city illumination, and its power consumption occupies the very most of of whole electric consumption on lighting.Traditional street lamp often adopts high-pressure mercury lamp, because high-pressure mercury lamp is that 360 degree full-shapes are luminous, traditional street lamp adds at the high-pressure mercury lamp back side that usually reflex reflector can be used on the road light energy as much as possible.But the high-pressure mercury lamp light source is huge, lacks effective optical shaping system, thereby causes normally uneven round spot of hot spot that high-pressure mercury lamp forms on the road surface, and cause two consequences: one, center are very bright.And it is very fast in radial decay.In order to make deep road satisfy lighting standard, just have to improve street lamp power, make a large amount of light energies be wasted near the center; Its two, the light that the high-pressure mercury lamp street lamp sends has greatly that light is wasted in outside the target irradiation area, has not only further reduced energy utilization efficiency, and has easily caused light pollution.Therefore, efficient, energy-conservation, long-life of development of new, better, the eco-friendly street lamp of colour rendering index have a crucial meaning to city illumination is energy-conservation.
(3) summary of the invention
The present invention provides a kind of energy-efficient high-powered LED lamp and production technology thereof in order to remedy the deficiencies in the prior art.
The present invention is achieved through the following technical solutions:
A kind of high-powered LED lamp, comprise encapsulating optical system, cooling system and drive system, it is characterized in that: described cooling system adopts lamp body appearance cross-ventilation natural heat dissipation mode, and described drive system is that the ELV weighing apparatus is pressed electric power system, and light fixture separates with power supply adaptor.
A kind of production technology of high-powered LED lamp, comprise the production technology of packaging technology, light fixture and light source of LED lamp and the technological process of production of lamp, it is characterized in that: described packaging technology comprises step: clean, shelve, pressure welding, encapsulation, weld, cut film, assembling, test; Described light fixture and light source production technology comprise grinding tool design, die cast, anti-dandruff back of the body silk, line design, are welded, seal, assemble; The described lamp technological process of production comprises sheet material setting, welding closings in, hydraulic pressure alignment system, zinc-plated, spraying, lifter, installation model bracket, assembling is installed.
The more excellent technical scheme of the present invention is: described cleaning comprises that the employing ultrasonic wave cleans on PCB or the corresponding pad of led support, carries out sintering subsequently elargol is solidified.
Beneficial effect of the present invention: this project combines high power semi-conductor LED electric light source with solar energy, is carrying out innovative research aspect LED encapsulating optical system, cooling system and the drive system three.The LED electricity-saving lamp light source of development adopts low-voltage DC supply, have that energy-saving and cost-reducing, highly effective and safe, purposes scope are wide, life-span length, high color rendering index (CRI), illumination evenly, no hot spot and advantage such as pollution-free, be the substitute products of fluorescent lamp, incandescent lamp, the every index of product reaches national quality testing standard, can be widely used in city illumination.Its production technology adopts ultrasonic cleaning technology, and is unique advanced in encapsulation, pressure welding, the technology of cutting aspect the film; Adopt new LGP technology, belong to domestic initiation in technology aspect the luminous energy heat radiation.
(4) description of drawings
The present invention is further illustrated below in conjunction with accompanying drawing.
Accompanying drawing is 1 production process for encapsulating flow chart of the present invention;
Accompanying drawing is the technological process of production figure of 2 light fixtures of the present invention and light source;
Accompanying drawing is the process chart of 3 LED lamps of the present invention.
(5) specific embodiment
Accompanying drawing is a kind of specific embodiment of the present invention.This embodiment comprises encapsulating optical system, cooling system and drive system, and described cooling system adopts lamp body appearance cross-ventilation natural heat dissipation mode, and described drive system is that the ELV weighing apparatus is pressed electric power system, and light fixture separates with power supply adaptor.Comprise the production technology of packaging technology, light fixture and light source of lamp and the technological process of production of lamp, described packaging technology comprises step: clean, shelve, pressure welding, encapsulation, weld, cut film, assembling, test; Described light fixture and light source production technology comprise grinding tool design, die cast, anti-dandruff back of the body silk, line design, are welded, seal, assemble; The described lamp technological process of production comprises sheet material setting, welding closings in, hydraulic pressure alignment system, zinc-plated, spraying, lifter, installation model bracket, assembling is installed.
Described cleaning comprises that the employing ultrasonic wave cleans on PCB or the corresponding pad of led support, carries out sintering subsequently elargol is solidified.Described bond technology comprises gold ball bonding and aluminium wire pressure welding.Described diffusion barrier and the reflective membrane of cutting membrane process employing punch press cross cutting backlight needs.This project combines high power semi-conductor LED electric light source with solar energy, carrying out innovative research aspect LED encapsulating optical system, cooling system and the drive system three.The LED electricity-saving lamp light source of development adopts low-voltage DC supply, have that energy-saving and cost-reducing, highly effective and safe, purposes scope are wide, life-span length, high color rendering index (CRI), illumination evenly, no hot spot and advantage such as pollution-free, be the substitute products of fluorescent lamp, incandescent lamp, the every index of product reaches national quality testing standard, can be widely used in city illumination.Its production technology adopts ultrasonic cleaning technology, and is unique advanced in encapsulation, pressure welding, the technology of cutting aspect the film; Adopt new LGP technology, belong to domestic initiation in technology aspect the luminous energy heat radiation.
According to grid division methods-variables separation mapping method and new three-dimensional surface formative method-noncontinuous surface 3-dimensional object formation, the success design can form the street lamp optical lens of even rectangle Illumination Distribution, not only has very high packaging efficiency, and environmentally friendly and human eye close friend, the LED actuation techniques of employing high efficiency, high reliability.Developed the scheme of electric power at street lamp application, effectively reduced line loss, the power supply conversion efficiency of acquisition is near 90%.Simultaneously, be fit to the circuit elements device of hot environment requirement, the novel reliability that current stabilization designs, distinctive overheat protective function has guaranteed the great power LED energy-efficient lamp, the life-span of having improved the LED energy-conserving road lamp.Unique industrialization LED energy-conserving road lamp assembling manufacturing technology.The industrialization of New LED energy-conserving road lamp assembling manufacturing technology is integrated up-to-date industrialized technologies such as Mould Machining, plating, the processing of metal fast precise, have yield rate height, production efficiency height, advantage that cost is low, and have the advantage of many uniquenesses: same set of mould can adapt to the street lamp of plurality of specifications; The installation and removal of street lamp module are convenient, and can realize automation mechanized operation; Lens design based on nonimaging optics makes that the street lamp module can be infinitely seamless spliced, forms the multiple product line of 42W-350W.
The specific design scheme is as follows:
(1) concerning road lamp optical system, the Illumination Distribution of the even rectangle that the output light distribution design one-tenth of every power-type LED is consistent with road illumination standards regulation area.When the plurality of LEDs cluster was the LED energy-conserving road lamp, the Illumination Distribution on the road was consistent with the Illumination Distribution of single LEDs, and the size of illumination is the simple superposition of plurality of LEDs action effect.Based on this design concept, the Illumination Distribution of adjacent LED energy-conserving road lamp can realize seamless link, and the size of road illumination can arbitrarily adjust the number of LED according to actual conditions, and the inefficacy of single LEDs can not cause blackening on the road surface.This design concept can be brought into play the advantage of LED to greatest extent, improves the optical energy utilization efficiency of LED, strengthens the security and stability of LED energy-conserving road lamp, is the new design concept that leads the world development trend.
(2) restriction great power LED large-scale application is a heat dissipation problem in the principal element of lighting field.If the heat that LED produces can't be derived smoothly, will cause the LED operating temperature to improve constantly, thereby reduce the efficient of LED.The life-span also can shorten when simultaneously, LED was operated in higher temperature.The heat dissipation design of street lamp will be controlled the operating temperature of LED on the one hand, will limit the weight of heat abstractor on the other hand.
In the selection of radiating mode, investigate the applied environment and the requirement of street lamp.The applied environment of street lamp is quite abominable, at first will stand the erosion of dust storm, rainwater.Secondly also to face impact, the vibrations that may run into.So the road lamp cooling designing requirement must be a good airproof performance, the reliability height is firm, corrosion-resistant.Factors such as comprehensive heat-sinking capability, efficient, cost, stability, life-span, the LED energy-conserving road lamp adopts lamp body appearance cross-ventilation natural heat dissipation mode, improves electrical efficiency, reduces the light fixture cost, improves the stability and the life-span of light fixture.
We adopt advanced radiator to optimize the heat abstractor that software is optimized the LED energy-conserving road lamp, obtain limiting each parameters such as optimum size, ratio, fin number of the heat abstractor under the light fixture weight situation.With the working condition under various environment behind the calorifics simulation softward simulation street lamp assembling formulation heat abstractor, by the reliability of verification experimental verification heat abstractor.
(3) design of the drive circuit of LED is another key factor that influences street lamp luminous efficiency, life performance.We select the high-quality electronic devices and components that are fit to hot environment work for use, guarantee the stability of circuit; Adopt the power supply of SELV constant voltage, street lamp separates with power supply adaptor, reduces the lamp body volume and weight, is convenient to heat radiation and maintenance; LED is by 1 series loop of 13 or 14 lamps, and constant current output circuit is powered; If temperature, current protection; Automatically regulate the function of lamp power during design lamps temperature anomaly.
The technology detailed annotation:
1, production technology
A) clean: adopt ultrasonic wave to clean PCB or led support, and oven dry.
B) shelve: be equipped with upward at LED tube core (big circular slice) bottom electrode and expand behind the elargol, tube core (big circular slice) after the expansion is placed on the brilliant platform of thorn, tube core is installed on PCB or the corresponding pad of led support one by one with the brilliant pen of thorn at microscopically, carries out sintering subsequently elargol is solidified.
C) pressure welding: with aluminium wire or spun gold welding machine electrode is connected on the LED tube core, to make the lead-in wire that electric current injects.LED is directly installed on the PCB, generally adopts the aluminium wire welding machine.(make white light TOP-LED and need the gold thread welding machine)
D) encapsulation:, LED tube core and bonding wire are protected with epoxy by a glue.Put glue on pcb board, the cured glue shape is had strict demand, this is directly connected to the emitting brightness of backlight finished product.This procedure also will be born the task of dot fluorescent powder (white light LEDs).
E) welding:, then before assembly technology, LED need be welded on the pcb board if backlight is to adopt SMD-LED or other encapsulated LED.
F) cut film: with the required various diffusion barriers of punch press cross cutting backlight, reflective membrane etc.
G) assembling:, the various material handworks of backlight are installed correct position according to the drawing requirement.
H) test: check whether backlight photoelectric parameter and light-emitting uniformity be good.
I) packing: finished product is packed on request, put in storage.
2, packaging technology
(1) task of the encapsulation of LED is that outer lead is connected on the electrode of led chip, protects led chip simultaneously, and plays and improve the effect that light takes out efficient.Critical process is shelved, pressure welding, encapsulation.
(2) LED packing forms LED packing forms can be described as multifariously, mainly adopts corresponding appearance and size according to different application scenarios, heat radiation countermeasure and go out light effect.LED has Lamp-LED, TOP-LED, Side-LED, SMD-LED, High-Power-LED etc. by the packing forms classification.
(3) LED packaging technology flow process
(4) packaging technology explanation
1) chip inspection microscopy: whether whether material surface has mechanical damage and pit pockmark (lockhill) chip size and electrode size whether to meet the technological requirement electrode pattern complete.
2) expand sheet because led chip is still arranged close space length very little (about 0.1mm) after scribing, be unfavorable for the operation of back operation.We adopt expansion sheet machine that the film that coheres chip is expanded, and make the spacing of led chip be stretched to about 0.6mm.
3) some glue elargol or insulating cement on the relevant position point of led support.Critical technological point is a control of glue amount, in colloid height, some glue position detailed technological requirement is arranged all.Because elargol and insulating cement are being stored and used the requirement that strictness is all arranged, the awake material of elargol, stirring, service time all are the items that must be noted that on the technology.
4) glue is opposite with some glue fully, and being equipped with glue is with being equipped with glue machine elder generation elargol to be coated on the LED backplate, then the LED of back band elargol is installed on the led support.The efficient that is equipped with glue is far above a glue, but not all product all is suitable for adhesive process fully.
5) led chip after manual thorn sheet will be expanded (be equipped with glue or be equipped with glue) is placed on the anchor clamps of thorn sheet platform, and led support is placed under the anchor clamps, led chip is stung on the corresponding position one by one with pin at microscopically.Manual thorn sheet has been compared a benefit with shelving automatically, is convenient to change different chips at any time, is applicable to the product that needs to install various chips.
6) shelve automatically that to shelve automatically be to combine to be stained with glue (some glue) and chip two big steps are installed in fact, with vacuum slot led chip is picked up the shift position then earlier, be placed in again on the corresponding backing positions putting elargol (insulating cement) on the led support.Automatically shelve and on technology, mainly will be familiar with equipment operation programming, simultaneously to equipment be stained with glue and installation accuracy is adjusted.Select the bakelite suction nozzle for use selecting for use of suction nozzle as far as possible, prevent damage the led chip surface, what particularly blue, green chip must be with bakelite.Because the steel mouth can scratch the current-diffusion layer of chip surface.
7) purpose of sintering sintering is that elargol is solidified, and sintering requires temperature is monitored, and prevents that batch property is bad.The temperature of elargol sintering generally is controlled at 150 ℃, sintering time 2 hours.Can adjust to 170 ℃ according to actual conditions, 1 hour.General 150 ℃ of insulating cement, 1 hour.Elargol sintering baking oven must open the product of changing sintering every 2 hours (or 1 hour) by technological requirement, the centre must not arbitrarily be opened.The sintering baking oven is other purposes again, prevent to pollute.
8) purpose of pressure welding pressure welding is guided to electrode on the led chip, finishes the connection work of outer lead in the product.The bond technology of LED has two kinds of gold ball bonding and aluminium wire pressure weldings.Pressure welding is the key link in the LED encapsulation technology, and what mainly need monitoring on the technology is pressure welding spun gold (aluminium wire) arch filament shape, solder joint shape, pulling force.Further investigation to bond technology relates to many-sided problem, as gold (aluminium) wire material, ultrasonic power, pressure welding pressure, chopper (steel mouth) select for use, chopper (steel mouth) movement locus or the like.
9) encapsulation of some glue packaged LED mainly has three kinds in a glue, embedding, mold pressing.Basically the difficult point of technology controlling and process is bubble, material, the stain of lacking more.The manual spot-gluing encapsulation requires very high (particularly white light LEDs) to operant level, and main difficult point is to a control of glue amount, because epoxy in use can retrogradation.Company adopts up-to-date injecting type point glue encapsulation, and the fluorescent material precipitation that has solved the some glue existence of white light LEDs causes the problem of bright dipping aberration.
10) form of embedding is adopted in the encapsulation of encapsulating encapsulation Lamp-LED.The process of embedding is to inject earlier liquid epoxy in the LED shaping mold cavity, inserts the good led support of pressure welding then, put into baking oven by curable epoxide after, it is moulding that LED is deviate from from die cavity.
11) the mold pressing encapsulation led support that pressure welding is good is put into mould, up and down two secondary moulds are with the hydraulic press matched moulds and vacuumize, the inlet heating of solid-state epoxy being put into the injecting glue road is pressed into the mold glue road with hydraulic mandril, and epoxy enters in each LED forming tank and curing along Jiao Dao.
12) solidify with the back and solidify the curing that is meant the encapsulation epoxy, general curable epoxide condition is at 135 ℃, 1 hour.Mold pressing encapsulates generally at 150 ℃, 4 minutes.
13) solidifying after solidify the back is in order to allow epoxy fully solidify, simultaneously LED to be carried out heat ageing.The back is solidified for the adhesive strength that improves epoxy and support (PCB) extremely important.General condition is 120 ℃, 4 hours.
14) cut muscle and scribing because LED is (not being single) that connects together aborning, the Lamp packaged LED adopts cuts company's muscle that muscle cuts off led support.SMD-LED then is on a slice pcb board, needs scribing machine to finish mask work.
15) photoelectric parameter of test test LED, check appearance and size are carried out sorting according to customer requirement to the LED product simultaneously.
16) packing is counted packing with finished product.Ultra-bright LED needs antistatic packaging.
This project product meets national energy-saving and emission-reduction policy and encourages to support the Industrialization Projects of development, and its general technical technology reaches leading domestic level in the same industry.
Claims (5)
1. a high-powered LED lamp comprises encapsulating optical system, cooling system and drive system, it is characterized in that: described cooling system adopts lamp body appearance cross-ventilation natural heat dissipation mode,
Described drive system is that the ELV weighing apparatus is pressed electric power system, and light fixture separates with power supply adaptor.
2. as the production technology of the high-powered LED lamp under the claim 1, comprise the production technology of packaging technology, light fixture and light source of lamp and the technological process of production of lamp, it is characterized in that: described packaging technology comprises step: clean, shelve, pressure welding, encapsulation, weld, cut film, assembling, test; Described light fixture and light source production technology comprise grinding tool design, die cast, anti-dandruff back of the body silk, line design, are welded, seal, assemble; The described lamp technological process of production comprises sheet material setting, welding closings in, hydraulic pressure alignment system, zinc-plated, spraying, lifter, installation model bracket, assembling is installed.
3. the production technology of described high-powered LED lamp according to claim 2 is characterized in that: described cleaning comprises and adopts ultrasonic wave to clean on PCB or the corresponding pad of led support, carries out sintering subsequently elargol is solidified.
4. the production technology of described high-powered LED lamp according to claim 2, it is characterized in that: described bond technology comprises gold ball bonding and aluminium wire pressure welding.
5. the production technology of described high-powered LED lamp according to claim 2 is characterized in that: described diffusion barrier and the reflective membrane of cutting membrane process employing punch press cross cutting backlight needs.
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| CN102445270A (en) * | 2011-05-20 | 2012-05-09 | 上海蓝光科技有限公司 | Test method for luminous angle and distribution of light emitting diode (LED) chip |
| CN102544252A (en) * | 2011-07-05 | 2012-07-04 | 曹永革 | Method for efficiently packaging light-emitting diode (LED) chips by using substrate high diffuse reflection optical design |
| CN102853306A (en) * | 2012-10-10 | 2013-01-02 | 长兴泛亚照明电器有限公司 | LED (Light Emitting Diode) lamp without heat radiator and production process of LED lamp |
| CN103021293A (en) * | 2013-01-10 | 2013-04-03 | 宏齐光电子(深圳)有限公司 | Manufacturing method of LED display screen module |
| CN103162100A (en) * | 2011-12-08 | 2013-06-19 | 苏州市世纪晶源电力科技有限公司 | Method for integration packaging of alternating current or direct current light-emitting diode (LED) light source by formal structure LED chip |
| CN103398797A (en) * | 2013-08-16 | 2013-11-20 | 肇庆爱晟电子科技有限公司 | Thermal resistor temperature sensor and manufacturing method thereof |
| CN104821362A (en) * | 2015-03-31 | 2015-08-05 | 长治虹源光电科技有限公司 | LED packaging technical process based on iron substrate |
| CN105179965A (en) * | 2015-08-31 | 2015-12-23 | 安徽福恩光电科技有限公司 | Process for producing LED lamp |
| CN105304803A (en) * | 2015-09-21 | 2016-02-03 | 安徽科发信息科技有限公司 | Glue sealing process for surface of LED light guide plate |
| CN105977363A (en) * | 2016-07-01 | 2016-09-28 | 安徽亮亮电子科技有限公司 | LED substandard lamp bead recycling and re-use method |
| CN108758379A (en) * | 2018-05-17 | 2018-11-06 | 浙江安吉成新照明电器有限公司 | A kind of production technology of LED desk lamp |
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- 2009-04-17 CN CN200910020521A patent/CN101532610A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102445270A (en) * | 2011-05-20 | 2012-05-09 | 上海蓝光科技有限公司 | Test method for luminous angle and distribution of light emitting diode (LED) chip |
| CN102544252A (en) * | 2011-07-05 | 2012-07-04 | 曹永革 | Method for efficiently packaging light-emitting diode (LED) chips by using substrate high diffuse reflection optical design |
| CN102544252B (en) * | 2011-07-05 | 2015-10-07 | 中国科学院福建物质结构研究所 | One utilizes the design of substrate high diffuse reflective optical to carry out efficient LED chip packaging method |
| CN103162100A (en) * | 2011-12-08 | 2013-06-19 | 苏州市世纪晶源电力科技有限公司 | Method for integration packaging of alternating current or direct current light-emitting diode (LED) light source by formal structure LED chip |
| CN102853306A (en) * | 2012-10-10 | 2013-01-02 | 长兴泛亚照明电器有限公司 | LED (Light Emitting Diode) lamp without heat radiator and production process of LED lamp |
| CN103021293A (en) * | 2013-01-10 | 2013-04-03 | 宏齐光电子(深圳)有限公司 | Manufacturing method of LED display screen module |
| CN103398797B (en) * | 2013-08-16 | 2016-11-09 | 广东爱晟电子科技有限公司 | Thermistor temperature sensor and preparation method thereof |
| CN103398797A (en) * | 2013-08-16 | 2013-11-20 | 肇庆爱晟电子科技有限公司 | Thermal resistor temperature sensor and manufacturing method thereof |
| CN104821362A (en) * | 2015-03-31 | 2015-08-05 | 长治虹源光电科技有限公司 | LED packaging technical process based on iron substrate |
| CN105179965A (en) * | 2015-08-31 | 2015-12-23 | 安徽福恩光电科技有限公司 | Process for producing LED lamp |
| CN105304803A (en) * | 2015-09-21 | 2016-02-03 | 安徽科发信息科技有限公司 | Glue sealing process for surface of LED light guide plate |
| CN105977363A (en) * | 2016-07-01 | 2016-09-28 | 安徽亮亮电子科技有限公司 | LED substandard lamp bead recycling and re-use method |
| CN108758379A (en) * | 2018-05-17 | 2018-11-06 | 浙江安吉成新照明电器有限公司 | A kind of production technology of LED desk lamp |
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Open date: 20090916 |