CN103021293A - Manufacturing method of LED display screen module - Google Patents
Manufacturing method of LED display screen module Download PDFInfo
- Publication number
- CN103021293A CN103021293A CN2013100134872A CN201310013487A CN103021293A CN 103021293 A CN103021293 A CN 103021293A CN 2013100134872 A CN2013100134872 A CN 2013100134872A CN 201310013487 A CN201310013487 A CN 201310013487A CN 103021293 A CN103021293 A CN 103021293A
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- CN
- China
- Prior art keywords
- led
- pcb
- die
- adhesive
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 3
- 238000000034 method Methods 0.000 claims abstract description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000004593 Epoxy Substances 0.000 claims abstract description 4
- 238000004140 cleaning Methods 0.000 claims abstract description 4
- 238000009792 diffusion process Methods 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims abstract description 4
- 238000005245 sintering Methods 0.000 claims abstract description 4
- 238000003860 storage Methods 0.000 claims abstract description 4
- 239000003292 glue Substances 0.000 claims description 9
- 238000003466 welding Methods 0.000 claims description 7
- 239000010931 gold Substances 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 238000005538 encapsulation Methods 0.000 claims description 4
- 230000004888 barrier function Effects 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 239000012528 membrane Substances 0.000 claims description 3
- 239000002002 slurry Substances 0.000 claims description 3
- 238000012856 packing Methods 0.000 claims description 2
- 238000012360 testing method Methods 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 abstract 4
- 230000001070 adhesive effect Effects 0.000 abstract 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 1
- 238000002347 injection Methods 0.000 abstract 1
- 239000007924 injection Substances 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 150000001398 aluminium Chemical class 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012956 testing procedure Methods 0.000 description 1
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Abstract
The invention discloses a manufacturing method of an LED display screen module. The manufacturing method includes: cleaning a surface oxide layer of a PCB (printed circuit board) by plasma, installing red chips, green chips and blue chips on corresponding pads of the PCB sequentially one by one by die-bonding process, sintering to solidify silver adhesive, connecting electrodes to LED dies by a gold wire bonder to service as leads for current injection, dispensing adhesive, protecting the LED dies and bonding wires with epoxy, dispensing the adhesive on the PCB, with high requirement on the shape of the solidified adhesive, using a punch press to die-cut various diffusion films, reflecting films and the like required by a backlight, manually setting materials of an LED module at the correct positions according to drawing requirements, checking whether photoelectric parameters and outgoing light uniformity of an LED module light source are fine or not, and packaging and putting finished products in storage as required.
Description
Technical field
The present invention relates to the LED lighting field, be specifically related to a kind of method for making of LED display module, be applied in LED TV, LED display, LED rear-projection TV.
Background technology
The tradition LED display is that single welding diode slaps together, no matter be to have qualitatively defective, can see that on viewing and admiring the splicing vestige is arranged between the diode.As shown in Figure 2, be distributed with successively emitting led 11 on the LED substrate 12.
Summary of the invention
The problem to be solved in the present invention provides a kind of method for making of LED display module.
For addressing the above problem, the present invention realizes by following scheme: a kind of method for making of LED display module, and its key step comprises:
A, cleaning adopt plasma electric slurry to clean the PCB surface oxide layer;
B, die bond adopt DIE-bonding technique, first with red light chips, green glow and blue chip are installed on the corresponding pad of PCB one by one again, carry out subsequently sintering elargol is solidified;
C, bonding wire are connected to electrode on the LED tube core with the spun gold welding machine, the lead-in wire that injects to make electric current, and LED is directly installed on the PCB, generally adopts the spun gold welding machine;
D, encapsulation by a glue, protect LED tube core and bonding wire with epoxy, put glue at pcb board, and the cured glue shape is had strict demand, and this is directly connected to the emitting brightness of LED die set light source finished product;
E, cut film, with the required various diffusion barriers of punch press cross cutting backlight, reflective membrane etc.;
F, assembling according to drawing requirement, are installed correct position with the various material handworks of LED module;
G, test check whether LED die set light source photoelectric parameter and light-emitting uniformity be good;
H, packing are packed finished product on request, are put in storage.
Beneficial effect of the present invention:
1, LED display is module whole shape;
2, unified encapsulation is adopted on the surface;
3, aberration is lower;
Even 4 closely look equally very clear.
Description of drawings
Fig. 1 is that the present invention makes process flow diagram;
Fig. 2 is traditional LED structural representation;
Fig. 3 is LED structural representation of the present invention.
Embodiment
As shown in Figure 3, display screen module of the present invention comprises aluminium base 1, the luminous LED lamp pearl 2 that distributes on this aluminium base 1, and these LED lamp pearl 2 peripheries arrange transparent colloid 3.
As shown in Figure 1, make flow process:
1, cleaning step adopts plasma electric slurry to clean the PCB surface oxide layer;
2, die bond step adopts DIE-bonding technique, first with red light chips, green glow and blue chip is installed on the corresponding pad of PCB one by one again, carries out subsequently sintering elargol is solidified;
3, bonding wire step is connected to electrode on the LED tube core with the spun gold welding machine, the lead-in wire that injects to make electric current, and LED is directly installed on the PCB, generally adopts the spun gold welding machine;
4, encapsulation step by a glue, protects LED tube core and bonding wire with epoxy, puts glue at pcb board, and the cured glue shape is had strict demand, and this is directly connected to the emitting brightness of LED die set light source finished product;
5, cut the film step, with the required various diffusion barriers of punch press cross cutting backlight, reflective membrane etc.;
6, installation step according to drawing requirement, is installed correct position with the various material handworks of LED module;
7, testing procedure checks whether LED die set light source photoelectric parameter and light-emitting uniformity be good;
8, packaging step is packed finished product on request, is put in storage.
Claims (1)
1. the method for making of a LED display module is characterized in that, its key step comprises:
A, cleaning adopt plasma electric slurry to clean the PCB surface oxide layer;
B, die bond adopt DIE-bonding technique, first with red light chips, green glow and blue chip are installed on the corresponding pad of PCB one by one again, carry out subsequently sintering elargol is solidified;
C, bonding wire are connected to electrode on the LED tube core with the spun gold welding machine, the lead-in wire that injects to make electric current, and LED is directly installed on the PCB, generally adopts the spun gold welding machine;
D, encapsulation by a glue, protect LED tube core and bonding wire with epoxy, put glue at pcb board, and the cured glue shape is had strict demand, and this is directly connected to the emitting brightness of LED die set light source finished product;
E, cut film, with the required various diffusion barriers of punch press cross cutting backlight, reflective membrane etc.;
F, assembling according to drawing requirement, are installed correct position with the various material handworks of LED module;
G, test check whether LED die set light source photoelectric parameter and light-emitting uniformity be good;
H, packing are packed finished product on request, are put in storage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100134872A CN103021293A (en) | 2013-01-10 | 2013-01-10 | Manufacturing method of LED display screen module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100134872A CN103021293A (en) | 2013-01-10 | 2013-01-10 | Manufacturing method of LED display screen module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103021293A true CN103021293A (en) | 2013-04-03 |
Family
ID=47969841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013100134872A Pending CN103021293A (en) | 2013-01-10 | 2013-01-10 | Manufacturing method of LED display screen module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103021293A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104134741A (en) * | 2014-07-23 | 2014-11-05 | 深圳蓝普科技有限公司 | Packaging method for LED (Light-Emitting Diode) display screen module |
| CN109210404A (en) * | 2018-09-11 | 2019-01-15 | 台山鸿隆光电科技有限公司 | A kind of LED light and its packaging method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07199824A (en) * | 1993-12-28 | 1995-08-04 | Idemitsu Kosan Co Ltd | Multicolor display device |
| JPH08272316A (en) * | 1995-03-30 | 1996-10-18 | Toshiba Corp | Led display and led display system |
| CN1755953A (en) * | 2004-09-28 | 2006-04-05 | 华上光电股份有限公司 | Full color LED formed by superposition of three primary colors |
| CN101532610A (en) * | 2009-04-17 | 2009-09-16 | 宋国兴 | High-power LED lamp and production process thereof |
| CN101548131A (en) * | 2009-03-02 | 2009-09-30 | 香港应用科技研究院有限公司 | Light-emitting equipment package with temperature detection |
| CN201910207U (en) * | 2010-11-22 | 2011-07-27 | 金建电子有限公司 | High-density full-color LED (light-emitting diode) display plate |
-
2013
- 2013-01-10 CN CN2013100134872A patent/CN103021293A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07199824A (en) * | 1993-12-28 | 1995-08-04 | Idemitsu Kosan Co Ltd | Multicolor display device |
| JPH08272316A (en) * | 1995-03-30 | 1996-10-18 | Toshiba Corp | Led display and led display system |
| CN1755953A (en) * | 2004-09-28 | 2006-04-05 | 华上光电股份有限公司 | Full color LED formed by superposition of three primary colors |
| CN101548131A (en) * | 2009-03-02 | 2009-09-30 | 香港应用科技研究院有限公司 | Light-emitting equipment package with temperature detection |
| CN101532610A (en) * | 2009-04-17 | 2009-09-16 | 宋国兴 | High-power LED lamp and production process thereof |
| CN201910207U (en) * | 2010-11-22 | 2011-07-27 | 金建电子有限公司 | High-density full-color LED (light-emitting diode) display plate |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104134741A (en) * | 2014-07-23 | 2014-11-05 | 深圳蓝普科技有限公司 | Packaging method for LED (Light-Emitting Diode) display screen module |
| CN104134741B (en) * | 2014-07-23 | 2017-12-22 | 深圳蓝普科技有限公司 | The method for packing of LED display module |
| CN109210404A (en) * | 2018-09-11 | 2019-01-15 | 台山鸿隆光电科技有限公司 | A kind of LED light and its packaging method |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20130403 |
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| RJ01 | Rejection of invention patent application after publication |