WO2016041366A1 - Full color method of novel substrate packaging light-emitting diode (led) - Google Patents

Full color method of novel substrate packaging light-emitting diode (led) Download PDF

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Publication number
WO2016041366A1
WO2016041366A1 PCT/CN2015/078768 CN2015078768W WO2016041366A1 WO 2016041366 A1 WO2016041366 A1 WO 2016041366A1 CN 2015078768 W CN2015078768 W CN 2015078768W WO 2016041366 A1 WO2016041366 A1 WO 2016041366A1
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Prior art keywords
substrate
led light
led
circuit line
emitting chip
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PCT/CN2015/078768
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French (fr)
Chinese (zh)
Inventor
龚文
邵鹏睿
周姣敏
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深圳市晶台股份有限公司
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Publication of WO2016041366A1 publication Critical patent/WO2016041366A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

Definitions

  • the present invention relates to the field of LED packaging technology, and more particularly to a novel substrate packaging LED full color method.
  • the traditional display can not fully meet the needs of market applications. Especially after the display screen has been used for a period of time, there are obvious differences in color and brightness. There is no way to achieve standard resolution. For example, the fusion band in the projection “eats” overlapping pixels, the patching phenomenon in DLP, and the splicing gaps in the LCD are clearly divided. It will affect the final display effect. This type of display is greatly affected by the environment, and the brighter light is also seriously affected by the display effect.
  • the LED small-pitch display can completely solve the above problems, the pads of the existing small-pitch LED full-color display devices are realized by pad sharing, because the conductive holes are filled with epoxy or green paint.
  • the present invention provides a novel substrate-package LED full-color method that can not only improve the reliability of the display screen but also avoid dead lights.
  • the present invention provides the following technical solutions:
  • a novel substrate packaging LED full color method the novel substrate specifically includes:
  • the novel substrate packaging LED full color method specifically includes the following steps:
  • the LED light-emitting chip pitch is uniformly expanded, and is bonded to the substrate through a die bonding machine and a solid crystal primer;
  • the substrate has a thickness of 0.1 mm to 10 mm, and the color is black or white, and the material is one of a BT substrate, an FR4 substrate, an aluminum substrate, a copper substrate, and a ceramic substrate.
  • the material is one of a BT substrate, an FR4 substrate, an aluminum substrate, a copper substrate, and a ceramic substrate.
  • Kind or several kinds of mixing are possible.
  • the space size of the circuit line is designed according to the size of the LED light emitting chip.
  • the pad of the back circuit line is connected to the outside of the substrate by solder paste to control the light emission of the LED light-emitting chip.
  • the conductive hole has a diameter of 0.1 mm to 0.5 mm, and is subjected to drilling, copper foil etching, and surface plating treatment.
  • the LED light emitting chip is fixed on the surface of the copper foil by using a solid glue, and then connected on the circuit line through a bonding wire for conducting.
  • the encapsulant is one of epoxy glue, silica gel, and silicone resin, and the package glue faces the substrate, the LED light-emitting chip, and
  • the circuit circuit is packaged in one piece and cut into individual products by a cutting device.
  • the invention adopts a substrate filled with metal as a conductive hole to carry out full-color encapsulation of the LED chip, and solves the problem that the filling material falls off after the 1/4 cutting of the cutting line of the product is caused by filling the epoxy resin or the green paint in the conductive hole, and also
  • the invention avoids the situation that the solder paste crawls and protrudes into the gel body due to poor airtightness during soldering, thereby causing the dead lamp; the invention greatly improves the moisture resistance of the product by embedding the conductive hole in the glue body; the invention provides a
  • the new substrate package LED full color method can not only avoid dead lights, but also improve production efficiency, improve the reliability of the indoor display and extend the service life.
  • Figure 1 is a schematic view of the front structure of the present invention.
  • Figure 2 is a schematic view of the back structure of the present invention.
  • Figure 3 is a schematic view of the overall structure of the present invention.
  • 1 is a substrate
  • 2 is a circuit line
  • 3 is a conductive hole
  • 4 is LED light-emitting chip
  • 5 is package rubber
  • 6 is bonding wire
  • 21 is the front circuit line and 22 is the back circuit line.
  • the embodiment of the invention discloses a novel substrate encapsulating LED full color method.
  • the new substrate specifically comprises: a substrate 1; a circuit circuit 2 disposed on the substrate 1, the circuit circuit 2 comprising two parts: a front side circuit located on the front side of the substrate 1. a line 21 and a back circuit line 22 on the back surface of the substrate 1; a conductive hole 3 provided on the substrate 1 and connected to the front circuit line 21 and the back circuit line 22, the conductive hole 3 extending from the front circuit line 21 to the back circuit line 22, and filled with a conductive metal material to fill the seal; the LED light-emitting chip 4 placed on the front circuit line 21; and the encapsulant 5 for encapsulating the LED light-emitting chip 4.
  • the new substrate packaging LED full color method specifically includes the following steps:
  • the LED light-emitting chip pitch is uniformly expanded, and is bonded to the substrate through a die bonding machine and a solid crystal primer;
  • the substrate 1 has a thickness of 0.1 mm to 10 mm, and the color is black or white.
  • the material is a mixture of one or more of a BT substrate, an FR4 substrate, an aluminum substrate, a copper substrate, and a ceramic substrate. Stronger.
  • the space size of the circuit line is designed according to the size of the LED light emitting chip, which can save material and save production cost.
  • the pads of the back circuit line 22 are electrically connected to the outside of the substrate 1 by solder paste, and control the light emission of the LED light-emitting chip 4.
  • the conductive hole 3 has a diameter of 0.1 mm to 0.5 mm and is subjected to drilling, copper foil etching, and surface plating treatment.
  • the LED light-emitting chip 4 is fixed on the surface of the copper foil by using a solid glue, and then connected to the circuit line 2 through a bonding wire for conducting.
  • the encapsulant 5 is one of epoxy glue, silica gel and silicone glue, and the encapsulant 5 encapsulates the front surface of the substrate 1 , the LED light-emitting chip 4 and the circuit circuit 2 into one body, and passes through the cutting device. Cutting into a single finished product, the conductive hole is built in the colloid and will not be cut into the conductive hole, which avoids the burr phenomenon, and does not cause the cutting offset due to the substrate fabrication and the operation precision of the device, thereby causing the application to be patched.
  • the lamp beads attached to the board are not on the same straight line, so that the illumination is not uniform; the cutting speed is not reduced, which affects the production efficiency problem; at the same time, the conductive hole is not affected by the large cutting offset error.
  • the product is ineffective due to cutting off; therefore, the invention not only improves the production efficiency, but also enhances the moisture-proof performance of the product, thereby truly meeting the reliability requirements of the small-pitch LED display product.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

A full color method of a substrate packaging LED comprises: a substrate (1); a circuit (2) arranged on the substrate, the circuit comprising a front face circuit (21) arranged on the front face of the substrate and a back face circuit (22) arranged on the back face of the substrate; a conductive hole (3) arranged in the substrate for connecting the front face circuit and the back face circuit, and the conductive hole extending from the front face circuit to the back face circuit, and filled, sealed and packed by conductive metal materials; LED light emitting chips (4) arranged on the front face circuit; packaging glue (5) for packaging the LED light emitting chips; the full color method of a substrate packaging LED includes: a. cleaning the substrate; b. unfreezing die bonding primer; c. uniformly expanding the distances among the LED light emitting chips, attaching the LED light emitting chips to the substrate through a die bonder and die bonding primer; d. connecting the LED light emitting chips attached to the substrate with a bonding pad on the substrate through a welding wire machine and bonding wires; e. compression molding of packaging glue and the front face of the substrate through a die manufacturing machine under a high temperature to protect the LED light emitting chips on the substrate.

Description

一种新型基板封装LED全彩方法Novel substrate packaging LED full color method 技术领域Technical field
本发明涉及LED封装技术领域，更具体的说是涉及一种新型基板封装LED全彩方法。The present invention relates to the field of LED packaging technology, and more particularly to a novel substrate packaging LED full color method.
背景技术Background technique
随着室内显示应用技术不断提高，传统显示产品技术逐渐登顶，室内小间距产品成为未来主要的技术拓展空间；传统LED大屏市场价格激烈，市场利润下滑，终端企业迫切需要寻找新的增长点，提高利润水平；室内显示逐渐进入多种技术相互渗透阶段，市场机遇凸显。由此可见小间距LED大屏的出现，既有技术上的必然性，也有企业的主动市场选择，更有资本追逐效益和扩张的本能驱动。With the continuous improvement of indoor display application technology, traditional display product technology has gradually reached the top, indoor small-pitch products have become the main technological expansion space in the future; the traditional LED large-screen market is fierce, the market profits are declining, and terminal enterprises urgently need to find new growth points. To improve the profit level; indoor display gradually entered the stage of mutual penetration of various technologies, and market opportunities were highlighted. It can be seen that the emergence of small-pitch LED large screens has both technical inevitability and active market choices of enterprises, as well as the instinct drive of capital chasing benefits and expansion.
相对LED小间距显示屏而言，传统显示屏的已不能完全满足市场应用需求。尤其是显示屏使用一段时间后存在明显的色彩、亮度差异，没办法实现标准分辨率，如投影中融合带“吃掉”重叠部分像素，DLP中打补丁现象，LCD中拼接缝隙明显分割，这些都会影响最终显示效果，该类显示屏受环境的影响较大，光线较亮对显示的效果也严重受到影响。虽然LED小间距显示屏完全可以解决以上问题，但是现有小间距的LED全彩显示器件的焊盘采用焊盘共享的方式实现，由于导电孔内塞环氧树脂或绿漆封装导致导电孔在产品切割线1/4分割处位置在切割后存在填充物质脱落的现象，导致焊锡时因气密性不好锡膏爬伸至胶体内导致死灯现象，从而使得灯珠失效。Compared with LED small-pitch display, the traditional display can not fully meet the needs of market applications. Especially after the display screen has been used for a period of time, there are obvious differences in color and brightness. There is no way to achieve standard resolution. For example, the fusion band in the projection “eats” overlapping pixels, the patching phenomenon in DLP, and the splicing gaps in the LCD are clearly divided. It will affect the final display effect. This type of display is greatly affected by the environment, and the brighter light is also seriously affected by the display effect. Although the LED small-pitch display can completely solve the above problems, the pads of the existing small-pitch LED full-color display devices are realized by pad sharing, because the conductive holes are filled with epoxy or green paint. There is a phenomenon that the filling material falls off after the cutting of the product cutting line at the quarter of the position of the cutting line. As a result, the soldering is not good due to the airtightness, and the solder paste is stretched into the gel body to cause a dead light phenomenon, thereby causing the lamp bead to fail.
综上所述，如何提供一种不仅可以提高显示屏的可靠性，又可以避免死灯的新型基板封装LED全彩方法是本领域技术人员亟需解决的问题。 In summary, how to provide a new type of substrate package LED full color method which can not only improve the reliability of the display screen but also avoid dead lights is an urgent problem to be solved by those skilled in the art.
发明内容Summary of the invention
有鉴于此，本发明提供了一种不仅可以提高显示屏的可靠性，又可以避免死灯的新型基板封装LED全彩方法。In view of this, the present invention provides a novel substrate-package LED full-color method that can not only improve the reliability of the display screen but also avoid dead lights.
为了实现上述目的，本发明提供如下的技术方案：In order to achieve the above object, the present invention provides the following technical solutions:
一种新型基板封装LED全彩方法，所述新型基板具体包括：A novel substrate packaging LED full color method, the novel substrate specifically includes:
基板；设置于所述基板上的电路线路，所述电路线路包括位于所述基板正面的正面电路线路和位于所述基板背面的背面电路线路；设置于所述基板上，并且用于连接所述正面电路线路和所述背面电路线路的导电孔，所述导电孔从所述正面电路线路延伸到所述背面电路线路，并通过导电金属物质将其塞满密封填平；放置在所述正面电路线路上的LED发光芯片；和，用于封装所述LED发光芯片的封装胶。所述新型基板封装LED全彩方法具体包括以下步骤：a circuit line disposed on the substrate, the circuit circuit including a front side circuit line on a front surface of the substrate and a back circuit line on a back side of the substrate; disposed on the substrate, and configured to connect the substrate a front side circuit line and a conductive hole of the back circuit line, the conductive hole extending from the front side circuit line to the back circuit line, and filled with a conductive metal substance to fill the seal; placed on the front side circuit An LED light emitting chip on the line; and an encapsulant for encapsulating the LED light emitting chip. The novel substrate packaging LED full color method specifically includes the following steps:
a.基板的清洗；a. cleaning of the substrate;
b.固晶底胶解冻；b. solid crystal primer is thawed;
c.将LED发光芯片间距扩张均匀，通过固晶机和固晶底胶邦定在基板上；c. The LED light-emitting chip pitch is uniformly expanded, and is bonded to the substrate through a die bonding machine and a solid crystal primer;
d.将邦定在基板上的LED发光芯片通过焊线机，用键合线与基板上的焊盘连接；和d. connecting the LED light-emitting chip bonded on the substrate to the pad on the substrate by a bonding wire through a wire bonding machine; and
e.在高温情况下通过模造机，用封装胶与基板正面模压成型来保护基板上的LED发光芯片。e. Protecting the LED light-emitting chip on the substrate by a molding machine and a front side of the substrate by a molding machine at a high temperature.
优选的，在上述新型基板封装LED全彩方法中，所述基板的厚度为0.1mm-10mm，颜色为黑色或者白色，材质为BT基板、FR4基板、铝基板、铜基板、陶瓷基板中的一种或几种混合。Preferably, in the above-mentioned novel substrate package LED full color method, the substrate has a thickness of 0.1 mm to 10 mm, and the color is black or white, and the material is one of a BT substrate, an FR4 substrate, an aluminum substrate, a copper substrate, and a ceramic substrate. Kind or several kinds of mixing.
优选的，在上述新型基板封装LED全彩方法中，根据所述LED发光芯片规格大小来设计所述电路线路的空间大小。Preferably, in the above-mentioned novel substrate package LED full color method, the space size of the circuit line is designed according to the size of the LED light emitting chip.
优选的，在上述新型基板封装LED全彩方法中，所述背面电路线路的焊盘是通过锡膏与所述基板外部进行连接通电，控制所述LED发光芯片的发光。Preferably, in the above-mentioned novel substrate-package LED full-color method, the pad of the back circuit line is connected to the outside of the substrate by solder paste to control the light emission of the LED light-emitting chip.
优选的，在上述新型基板封装LED全彩方法中，所述导电孔的直径为0.1mm-0.5mm，并且经过钻孔、铜箔蚀刻、表面电镀处理。 Preferably, in the above-mentioned novel substrate package LED full color method, the conductive hole has a diameter of 0.1 mm to 0.5 mm, and is subjected to drilling, copper foil etching, and surface plating treatment.
优选的，在上述新型基板封装LED全彩方法中，所述LED发光芯片采用固晶胶固定在铜箔表面，然后通过键合线连接在所述电路线路上进行导通。Preferably, in the above-mentioned novel substrate package LED full color method, the LED light emitting chip is fixed on the surface of the copper foil by using a solid glue, and then connected on the circuit line through a bonding wire for conducting.
优选的，在上述新型基板封装LED全彩方法中，所述封装胶为环氧胶、硅胶、硅树脂胶其中的一种，并且所述封装胶将所述基板正面、所述LED发光芯片以及所述电路线路封装为一体，并通过切割设备进行切割成单个成品。Preferably, in the above-mentioned novel substrate-package LED full-color method, the encapsulant is one of epoxy glue, silica gel, and silicone resin, and the package glue faces the substrate, the LED light-emitting chip, and The circuit circuit is packaged in one piece and cut into individual products by a cutting device.
本发明采用填充金属物作为导电孔的基板进行LED芯片的全彩封装，解决了因导电孔内填塞环氧树脂或绿漆导致产品切割线1/4切割后存在填充物质脱落的问题，同时也避免了因焊锡时气密性不好引起的锡膏爬伸至胶体内导致死灯的情况；本发明通过将导电孔内置于胶体内，大大提高了产品的防潮性能；本发明提供了一种新型基板封装LED全彩方法，不仅可以避免死灯，又可以提高了生产效率，提升室内显示屏的可靠性以及延长使用寿命。The invention adopts a substrate filled with metal as a conductive hole to carry out full-color encapsulation of the LED chip, and solves the problem that the filling material falls off after the 1/4 cutting of the cutting line of the product is caused by filling the epoxy resin or the green paint in the conductive hole, and also The invention avoids the situation that the solder paste crawls and protrudes into the gel body due to poor airtightness during soldering, thereby causing the dead lamp; the invention greatly improves the moisture resistance of the product by embedding the conductive hole in the glue body; the invention provides a The new substrate package LED full color method can not only avoid dead lights, but also improve production efficiency, improve the reliability of the indoor display and extend the service life.
附图说明DRAWINGS
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅是本发明的实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据提供的附图获得其他的附图。In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the description of the prior art will be briefly described below. Obviously, the drawings in the following description are only It is an embodiment of the present invention, and those skilled in the art can obtain other drawings according to the provided drawings without any creative work.
图1为本发明的正面结构示意图。Figure 1 is a schematic view of the front structure of the present invention.
图2为本发明的背面结构示意图。Figure 2 is a schematic view of the back structure of the present invention.
图3为本发明的整体结构示意图。Figure 3 is a schematic view of the overall structure of the present invention.
图号的简单说明：A brief description of the figure number:
1为基板、           2为电路线路、        3为导电孔、1 is a substrate, 2 is a circuit line, 3 is a conductive hole,
4为LED发光芯片、    5为封装胶、          6为键合线、4 is LED light-emitting chip, 5 is package rubber, 6 is bonding wire,
21为正面电路线路、  22为背面电路线路。 21 is the front circuit line and 22 is the back circuit line.
具体实施方式detailed description
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, but not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.
本发明实施例公开了一种新型基板封装LED全彩方法，所述新型基板具体包括：基板1；设置于基板1上的电路线路2，电路线路2包括两部分：位于基板1正面的正面电路线路21和位于基板1背面的背面电路线路22；设置于基板1上，并且用于连接正面电路线路21和背面电路线路22的导电孔3，导电孔3从正面电路线路21延伸到背面电路线路22，并通过导电金属物质将其塞满密封填平；放置在正面电路线路21上的LED发光芯片4；用于封装LED发光芯片4的封装胶5。The embodiment of the invention discloses a novel substrate encapsulating LED full color method. The new substrate specifically comprises: a substrate 1; a circuit circuit 2 disposed on the substrate 1, the circuit circuit 2 comprising two parts: a front side circuit located on the front side of the substrate 1. a line 21 and a back circuit line 22 on the back surface of the substrate 1; a conductive hole 3 provided on the substrate 1 and connected to the front circuit line 21 and the back circuit line 22, the conductive hole 3 extending from the front circuit line 21 to the back circuit line 22, and filled with a conductive metal material to fill the seal; the LED light-emitting chip 4 placed on the front circuit line 21; and the encapsulant 5 for encapsulating the LED light-emitting chip 4.
而所述新型基板封装LED全彩方法具体包括以下步骤：The new substrate packaging LED full color method specifically includes the following steps:
a.基板的清洗；a. cleaning of the substrate;
b.固晶底胶解冻；b. solid crystal primer is thawed;
c.将LED发光芯片间距扩张均匀，通过固晶机和固晶底胶邦定在基板上；c. The LED light-emitting chip pitch is uniformly expanded, and is bonded to the substrate through a die bonding machine and a solid crystal primer;
d.将邦定在基板上的LED发光芯片通过焊线机，用键合线与基板上的焊盘连接；d. connecting the LED light-emitting chip bonded on the substrate to the pad on the substrate by a bonding wire through a wire bonding machine;
e.在高温情况下通过模造机，用封装胶与基板正面模压成型来保护基板上的LED发光芯片。e. Protecting the LED light-emitting chip on the substrate by a molding machine and a front side of the substrate by a molding machine at a high temperature.
为了进一步优化上述技术方案，基板1的厚度为0.1mm-10mm，颜色为黑色或者白色，材质为BT基板、FR4基板、铝基板、铜基板、陶瓷基板的其中一种或几种混合，选择性更强。In order to further optimize the above technical solution, the substrate 1 has a thickness of 0.1 mm to 10 mm, and the color is black or white. The material is a mixture of one or more of a BT substrate, an FR4 substrate, an aluminum substrate, a copper substrate, and a ceramic substrate. Stronger.
为了进一步优化上述技术方案，根据所述LED发光芯片规格大小来设计所述电路线路的空间大小，这样可以省料、节省生产成本。 In order to further optimize the above technical solution, the space size of the circuit line is designed according to the size of the LED light emitting chip, which can save material and save production cost.
为了进一步优化上述技术方案，背面电路线路22的焊盘是通过锡膏与基板1外部进行连接通电，控制LED发光芯片4的发光。In order to further optimize the above-described technical solution, the pads of the back circuit line 22 are electrically connected to the outside of the substrate 1 by solder paste, and control the light emission of the LED light-emitting chip 4.
为了进一步优化上述技术方案，导电孔3的直径为0.1mm-0.5mm，并且经过钻孔、铜箔蚀刻、表面电镀处理。In order to further optimize the above technical solution, the conductive hole 3 has a diameter of 0.1 mm to 0.5 mm and is subjected to drilling, copper foil etching, and surface plating treatment.
为了进一步优化上述技术方案，LED发光芯片4采用固晶胶固定在铜箔表面，然后通过键合线连接在电路线路2上进行导通。In order to further optimize the above technical solution, the LED light-emitting chip 4 is fixed on the surface of the copper foil by using a solid glue, and then connected to the circuit line 2 through a bonding wire for conducting.
为了进一步优化上述技术方案，封装胶5为环氧胶、硅胶、硅树脂胶其中的一种，并且封装胶5将基板1正面、LED发光芯片4以及电路线路2封装为一体，并通过切割设备进行切割成单个成品，导电孔内置于胶体里面不会切割到导电孔，避免了毛刺现象，并且不会因为基板制作和设备操作精度达不到而引起切割偏移，从而导致应用端贴片时通过背面焊盘识别进而引起贴在板在的灯珠不在同一条直线上，使得发光不均匀；不会因切割速度降低，影响生产效率问题；同时更不会因切割偏移误差较大将导电孔切掉而导致产品失效；因此本发明不仅提高了生产效率，而且加强了产品的防潮性能，进而真正满足小间距LED显示产品的可靠性需求。In order to further optimize the above technical solution, the encapsulant 5 is one of epoxy glue, silica gel and silicone glue, and the encapsulant 5 encapsulates the front surface of the substrate 1 , the LED light-emitting chip 4 and the circuit circuit 2 into one body, and passes through the cutting device. Cutting into a single finished product, the conductive hole is built in the colloid and will not be cut into the conductive hole, which avoids the burr phenomenon, and does not cause the cutting offset due to the substrate fabrication and the operation precision of the device, thereby causing the application to be patched. Through the rear pad identification, the lamp beads attached to the board are not on the same straight line, so that the illumination is not uniform; the cutting speed is not reduced, which affects the production efficiency problem; at the same time, the conductive hole is not affected by the large cutting offset error. The product is ineffective due to cutting off; therefore, the invention not only improves the production efficiency, but also enhances the moisture-proof performance of the product, thereby truly meeting the reliability requirements of the small-pitch LED display product.
本说明书中各个实施例采用递进的方式描述，每个实施例重点说明的都是与其他实施例的不同之处，各个实施例之间相同相似部分互相参见即可。对于实施例公开的装置而言，由于其与实施例公开的方法相对应，所以描述的比较简单，相关之处参见方法部分说明即可。对所公开的实施例的上述说明，使本领域专业技术人员能够实现或使用本发明。对这些实施例的多种修改对本领域的专业技术人员来说将是显而易见的，本文中所定义的一般原理可以在不脱离本发明的精神或范围的情况下，在其它实施例中实现。因此，本发明将不会被限制于本文所示的这些实施例，而是要符合与本文所公开的原理和新颖特点相一致的最宽的范围。 The various embodiments in the present specification are described in a progressive manner, and each embodiment focuses on differences from other embodiments, and the same similar parts between the various embodiments may be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part. The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments are obvious to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but the scope of the invention is to be accorded

Claims (7)

  1. 一种新型基板封装LED全彩方法，所述新型基板包含：基板(1)；设置于所述基板(1)上的电路线路(2)，所述电路线路(2)包括位于所述基板(1)正面的正面电路线路(21)和位于所述基板(1)背面的背面电路线路(22)；设置于所述基板(1)上，并且用于连接所述正面电路线路(21)和所述背面电路线路(22)的导电孔(3)，所述导电孔(3)从所述正面电路线路(21)延伸到所述背面电路线路(22)，并通过导电金属物质将其塞满密封填平；放置在所述正面电路线路(21)上的LED发光芯片(4)；和用于封装所述LED发光芯片(4)的封装胶(5)，其特征在于，所述新型基板封装LED全彩方法具体包括以下步骤：A novel substrate packaging LED full color method, the novel substrate comprises: a substrate (1); a circuit line (2) disposed on the substrate (1), the circuit line (2) comprising the substrate ( 1) a front side circuit line (21) on the front side and a back circuit line (22) on the back side of the substrate (1); disposed on the substrate (1) and used to connect the front side circuit line (21) and a conductive hole (3) of the back circuit line (22), the conductive hole (3) extending from the front circuit line (21) to the back circuit line (22), and plugged by a conductive metal substance a full seal filling; an LED light emitting chip (4) placed on the front circuit line (21); and an encapsulant (5) for encapsulating the LED light emitting chip (4), characterized in that the new type The substrate package LED full color method specifically includes the following steps:
    a.基板(1)的清洗；a. cleaning of the substrate (1);
    b.固晶底胶解冻；b. solid crystal primer is thawed;
    c.将LED发光芯片(4)间距扩张均匀，通过固晶机和所述固晶底胶邦定在所述基板(1)上；c. The LED light-emitting chip (4) is uniformly expanded in pitch, and is bonded to the substrate (1) by a die bonder and the solid crystal primer;
    d.将邦定在基板(1)上的LED发光芯片(4)通过焊线机，用键合线(6)与基板(1)上的焊盘连接；和d. connecting the LED light-emitting chip (4) bonded on the substrate (1) to the pad on the substrate (1) by a bonding wire (6) through a wire bonding machine; and
    e.在高温情况下通过模造机，用封装胶(5)与基板(1)正面模压成型来保护基板(1)上的LED发光芯片(4)。e. The LED light-emitting chip (4) on the substrate (1) is protected by a molding machine (5) and a substrate (1) by a front molding at a high temperature.
  2. 根据权利要求1所述的新型基板封装LED全彩方法，其特征在于，所述基板(1)的厚度为0.1mm-10mm，颜色为黑色或者白色，材质为BT基板、FR4基板、铝基板、铜基板、陶瓷基板中的一种或几种混合而成。The method of claim 1 , wherein the substrate (1) has a thickness of 0.1 mm to 10 mm, the color is black or white, and the material is a BT substrate, an FR4 substrate, an aluminum substrate, One or a combination of a copper substrate and a ceramic substrate is mixed.
  3. 根据权利要求1所述的新型基板封装LED全彩方法，其特征在于，根据所述LED发光芯片(4)规格大小来设计所述电路线路(2)的空间大小。The novel substrate-packaged LED full color method according to claim 1, characterized in that the space size of the circuit line (2) is designed according to the size of the LED light-emitting chip (4).
  4. 根据权利要求1所述的新型基板封装LED全彩方法，其特征在于，所述背面电路线路(22)的焊盘是通过锡膏与所述基板(1)外部进行连接通电，控制所述LED发光芯片(4)的发光。 The method of claim 1 , wherein the pad of the back circuit line (22) is electrically connected to the outside of the substrate (1) by solder paste, and the LED is controlled. Illumination of the light-emitting chip (4).
  5. 根据权利要求1所述的新型基板封装LED全彩方法，其特征在于，所述导电孔(3)的直径为0.1mm-0.5mm，并且经过钻孔、铜箔蚀刻、表面电镀处理。The novel substrate-packaged LED full color method according to claim 1, wherein the conductive hole (3) has a diameter of 0.1 mm to 0.5 mm and is subjected to drilling, copper foil etching, and surface plating treatment.
  6. 根据权利要求1所述的新型基板封装LED全彩方法，其特征在于，所述LED发光芯片(4)采用固晶胶固定在铜箔表面，然后通过键合线(6)连接在所述电路线路(2)上进行导通。The method of claim 1 , wherein the LED light-emitting chip (4) is fixed on the surface of the copper foil by using a bonding adhesive, and then connected to the circuit through a bonding wire (6). Conduction is performed on line (2).
  7. 根据权利要求1所述的新型基板封装LED全彩方法，其特征在于，所述封装胶(5)为环氧胶、硅胶、硅树脂胶其中的一种，并且所述封装胶(5)将所述基板(1)正面、所述LED发光芯片(4)以及所述电路线路(2)封装为一体，并通过切割设备进行切割成单个成品。 The method of claim 1 , wherein the encapsulant (5) is one of an epoxy glue, a silicone gel, and a silicone adhesive, and the encapsulant (5) The front surface of the substrate (1), the LED light-emitting chip (4) and the circuit circuit (2) are packaged in one piece and cut into individual products by a cutting device.
PCT/CN2015/078768 2014-09-19 2015-05-12 Full color method of novel substrate packaging light-emitting diode (led) WO2016041366A1 (en)

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