WO2020108501A1 - Led array and led display screen - Google Patents

Led array and led display screen Download PDF

Info

Publication number
WO2020108501A1
WO2020108501A1 PCT/CN2019/121092 CN2019121092W WO2020108501A1 WO 2020108501 A1 WO2020108501 A1 WO 2020108501A1 CN 2019121092 W CN2019121092 W CN 2019121092W WO 2020108501 A1 WO2020108501 A1 WO 2020108501A1
Authority
WO
WIPO (PCT)
Prior art keywords
led
bracket
chip
led array
array according
Prior art date
Application number
PCT/CN2019/121092
Other languages
French (fr)
Chinese (zh)
Inventor
李泽龙
王代青
强科文
季洪雷
Original Assignee
深圳Tcl新技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳Tcl新技术有限公司 filed Critical 深圳Tcl新技术有限公司
Publication of WO2020108501A1 publication Critical patent/WO2020108501A1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Definitions

  • the present disclosure relates to the field of display, and particularly to an LED array and an LED display screen having the LED array.
  • LED As a semiconductor light-emitting device, LED has been widely used in the fields of lighting, backlight and display due to its advantages of low energy consumption, high brightness, low heat generation and long life.
  • the LED display screen composed of LEDs is currently widely used in outdoor display, monitoring, advertising and other fields, and the demand for small-pitch LED display screens is increasing.
  • mainstream display screens use formal LED arrays as light-emitting units.
  • Each LED contains three chips of red, green and blue.
  • the chips are connected by gold wires. This form of gold wire makes the LED particles larger and difficult to shrink due to the presence of gold wires.
  • the spacing between LEDs The other form adopts the flip chip method, and the chip is directly attached to the PCB board by COB. This method can greatly reduce the spacing between the light emitting units, but due to the small size of the light emitting chip, there is SMT placement accuracy and The problem of low placement yield.
  • the present disclosure proposes an LED array, which can effectively improve the placement accuracy and placement yield.
  • An LED array includes a PCB board and a plurality of light-emitting units assembled on the PCB board, each light-emitting unit includes a bracket and three LED chips, and the three LED chips are packaged on the bracket in a flip-chip manner Inside, the bracket is assembled on the PCB board in a formally installed manner, and the LED chips in the bracket are electrically connected to the PCB board through the bracket.
  • the three LED chips in the light-emitting unit are a red chip, a green chip and a blue chip, respectively.
  • the main wavelength of the blue chip is 450-470 nm
  • the main wavelength of the green chip is 530-550 nm
  • the main wavelength of the red chip is 610-630 nm.
  • the LED chip is flip-chip mounted in the bracket by a die bonding machine.
  • the three LED chips of the light-emitting unit are arranged in a "product" shape and share an anode; the cathode of the three LED chips and the common anode at the bottom of the bracket are provided with four solder joints.
  • the solder joints electrically connect the LED chip in the bracket with the PCB board.
  • the common anode is arranged at an empty position of the support.
  • the three LED chips of the light-emitting unit are arranged in a straight line and share an anode; the cathode of the three LED chips and the common anode are provided with four solder joints at the bottom of the bracket, and the bracket passes through the four The solder joint electrically connects the LED chip in the bracket to the PCB board.
  • the light emitting unit further includes an encapsulation layer, the encapsulation layer is formed on the bracket and covers the LED chip.
  • the encapsulation layer is made of encapsulated silica gel or encapsulant made of epoxy resin.
  • the bracket is a rectangular flat plate, and the LED chips are arranged on the surface of the bracket at intervals.
  • the bracket is a bracket with a bowl-shaped structure, which includes a concave receiving slot, and the LED chips are arranged in the receiving slot at intervals.
  • the LED array further includes a protective film formed on the PCB board and covering the light-emitting unit.
  • the protective film is made of silica gel or epoxy resin glue.
  • the entire LED array is dispensed, glued, or molded.
  • the present disclosure also provides an LED display screen having the LED array described above.
  • the LED array and the LED display screen of the present disclosure Compared with the prior art, in the LED array and the LED display screen of the present disclosure, after the LED chip is flip-chip packaged on the bracket in advance, the bracket is assembled on the PCB board in a formally installed manner. In other words, the LED array of the present disclosure directly flips all the LED chips on the PCB board, which advances the process of flipping the LED chips, thereby reducing the accuracy requirements of the LED chips during placement and effectively improving SMD accuracy and yield.
  • FIG. 1 is a front view and a side view of an LED array according to an embodiment of the present disclosure.
  • FIG. 2 is a schematic structural view of the light emitting unit of the LED array shown in FIG. 1.
  • FIG. 3 is a schematic structural diagram of a light-emitting unit of another embodiment of the LED array shown in FIG. 1.
  • FIG. 4 is a schematic view of the arrangement of LED chips in the light emitting unit of the LED array shown in FIG.
  • FIG. 5 is an arrangement diagram of another embodiment of LED chips in the light emitting unit of the LED array shown in FIG. 1.
  • connection should be understood in a broad sense, for example, it can be a fixed connection or a removable Ground connection, or integral connection; may be a mechanical connection; may be directly connected, or may be indirectly connected through an intermediate medium, or may be a connection between two elements.
  • connection should be understood in specific situations.
  • An embodiment of the present disclosure provides an LED array. After the LED chip is flip-chip packaged on a bracket in advance, the bracket is assembled on the PCB board in a formally mounted manner. In other words, the LED array of the present disclosure directly flips all the LED chips on the PCB board, which advances the process of flipping the LED chips, thereby reducing the accuracy requirements of the LED chips during placement and effectively improving SMD accuracy and yield.
  • FIG. 1 is a front view and a side view of an LED array according to an embodiment of the present disclosure.
  • FIG. 2 is a schematic structural diagram of a light emitting unit of the LED array shown in FIG. 1.
  • the LED array 100 includes a PCB board 10 and a plurality of light emitting units 30 mounted on the PCB board 10, wherein each light emitting unit 30 includes a bracket 31 and three LED chips 33, three
  • the LED chip 33 is packaged on the bracket 31 in a flip-chip manner, and the bracket 31 is assembled on the PCB board 10 in a front-mounted manner.
  • the LED chip 33 on the bracket 31 passes through the bracket 31 and the PCB
  • the board 10 is electrically connected.
  • the bracket 31 is assembled on the PCB board 10 in a formally mounted manner.
  • the LED array 100 of the present disclosure directly flips all the LED chips on the PCB board 10, which advances the process of flipping the LED chips, thereby reducing the accuracy requirements of the LED chips during placement. Effectively improve the accuracy and yield of the patch.
  • the three LED chips 33 in each light-emitting unit 30 are a red chip, a green chip, and a blue chip, respectively.
  • the main wavelength of the blue chip is 450-470nm
  • the main wavelength of the green chip is 530-550nm
  • the main wavelength of the red chip is 610-630nm.
  • the red light chip, the green light chip and the blue light chip are packaged into a light-emitting unit 30, so that the light-emitting unit 30 can emit monochromatic light or emit mixed light of red light and/or green light and/or blue light as needed
  • the light of other colors is formed to meet the color display requirements of the LED display screen.
  • the LED chip 33 is mounted in the bracket 31 in a flip-chip form using a die bonding machine.
  • the high-precision positioning capability of the die bonding machine is used, so that when the LED chip 33 is flip-chip mounted in the bracket 31, higher accuracy can be obtained, and the yield yield of mass production can be improved.
  • FIG. 4 is a schematic diagram of the arrangement of LED chips in the light emitting unit of the LED array shown in FIG. 1.
  • the three LED chips 33 of the light-emitting unit 30 are arranged in a "product" shape, and the three LED chips 33 share an anode (not shown in the figure), and the common anode is provided at an empty position of the bracket 31; the bottom of the bracket 31 Four solder joints (not shown) are provided for the cathodes and common anodes of the three LED chips 33.
  • the bracket 31 When the bracket 31 is installed on the PCB board 10, the solder joints on the bracket 31 and the contacts on the PCB board 10 are electrically connected, so that the LED chip 33 in the bracket 31 and the PCB board 10 are electrically connected.
  • the number of solder joints on the bracket 31 can be reduced, which can simplify the wiring and complexity of the circuit connection between the LED chip 33 and the PCB board 10 through the bracket 31 .
  • FIG. 5 is an arrangement diagram of another embodiment of the LED chips in the light emitting unit of the LED array shown in FIG. 1.
  • the three LED chips 33 of the light emitting unit 30 are arranged in a straight line, and the three LED chips 33 share an anode (not shown); the bottom of the bracket 31 corresponds to the cathodes (not shown) of the three LED chips 33 and common
  • the anode is provided with four solder joints (not shown).
  • the number of solder joints on the bracket 31 can be reduced, corresponding to simplifying the implementation of the LED chip 33 and the PCB board 10 through the solder joints on the bracket 31 The wiring and complexity of the connection between the circuits.
  • the light-emitting unit 30 further includes an encapsulation layer 35 formed on the bracket 31 and covering the LED chip 33.
  • the encapsulating layer 35 is made of encapsulating silicone. In other embodiments, it may also be made of encapsulant of other materials such as epoxy resin. In this disclosure, the encapsulating layer 35 is not used. The material is specifically limited.
  • the bracket 31 is a rectangular flat plate, the LED chips 33 are arranged on the surface of the bracket 31 at intervals, and the encapsulation layer 35 is formed on the flat bracket 31 ⁇ ,cover the LED chip 33.
  • the flat plate-shaped bracket 31 can provide the entire plane to mount the LED chips 33, therefore, under the same LED chip 33 pitch requirement, the size of the bracket 31 can be made smaller, thereby reducing the application of the LED array 100 to the LED The display spacing when the screen is displayed.
  • the preparation process of the LED array is as follows: a whole bracket—solid crystal LED chip—dot encapsulant—bake—cut. That is, a whole block of support is used, and LED chips 33 of different colors are flip-chip mounted on the whole block of the support in sequence through a die bonding machine, and then coated with encapsulant and baked and cured to form the encapsulation layer 35 Then, the whole bracket is cut into multiple brackets, so that three LED chips of different colors are encapsulated on each bracket, and multiple light-emitting units 30 can be obtained.
  • FIG. 3 is a schematic structural diagram of a light emitting unit of another embodiment of the LED array shown in FIG. 1.
  • the bracket 31 is a bracket with a bowl-shaped structure, and includes a concave receiving slot (not shown in the figure), the LED chips 33 are arranged in the receiving slot at intervals, and an encapsulation layer 35 is formed on the bracket 31 mounted on the tablet Up and filling the receiving slot to cover the LED chip 33 in the receiving slot.
  • the bowl-shaped structure can provide a smaller plane for mounting the LED chips 33
  • the design of the bowl-shaped structure can effectively prevent the LED chips 33 in the frame 31 from mixing with the LED chips 33 in the adjacent frame 31 With light, the light mixing between adjacent light emitting units 30 can be prevented.
  • the preparation process of the LED array is as follows: a whole bracket—cutting—solid crystal LED chip—dot encapsulant—baking. That is, since the bracket has a bowl-shaped design (that is, a plurality of concave receiving grooves are provided on the whole block of the bracket), after cutting the whole block of the bracket into a plurality of brackets having a bowl-shaped structure, the After the crystal machine flips the LED chips 33 of different colors on the bowl-shaped brackets in turn, it is coated with encapsulant and baked and cured to form the encapsulation layer 35. At this time, three different colors are encapsulated in each bracket The LED chip forms the light-emitting unit 30.
  • the LED array 100 further includes a protective film 50 formed on the PCB 10 and covering the light emitting unit 30.
  • the protective film 50 is preferably made of silica gel. In other embodiments of the present disclosure, epoxy resin glue or other glues may also be used.
  • the material of the protective film 50 is not specifically limited. .
  • a film coating operation is performed on them to realize the protection of the light-emitting units 30.
  • the present disclosure also provides an LED display screen having the LED array described above.
  • the bracket 31 is assembled on the PCB board 10 in a formally installed manner.
  • the LED array 100 of the present disclosure directly flips all the LED chips on the PCB board 10, which advances the process of flipping the LED chips, thereby reducing the accuracy requirements of the LED chips during placement. Effectively improve the accuracy and yield of the patch.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Led Device Packages (AREA)

Abstract

An LED array (100) and an LED display screen having the LED array (100). The LED array (100) comprises a PCB (10) and a plurality of light-emitting units (30) installed at the PCB (10). Each light-emitting unit (30) comprises a frame (31) and three LED chips (33). The three LED chips (33) are packaged in the frame (31) in a face down manner, and the frame (31) is installed at the PCB (10) in a face up manner, such that the LED chips (33) in the frame (31) are electrically connected to the PCB (10). In the invention, a frame (31) is installed at a PCB (10) in a face up manner after LED chips (33) have been packaged therein in a face down manner. Moving the step of flipping over the LED chips (33) forward can lower the requirement on precision of surface-mounting the LED chips (33), thereby effectively increasing the precision and yield of surface mounting.

Description

LED阵列及LED显示屏LED array and LED display 技术领域Technical field
本公开涉及显示领域，尤其涉及一种LED阵列及具有该LED阵列的LED显示屏。The present disclosure relates to the field of display, and particularly to an LED array and an LED display screen having the LED array.
背景技术Background technique
LED作为一种半导体发光器件，由于其具有能耗低、亮度高、发热量小、寿命长等优势，目前已广泛应用于照明、背光和显示领域。As a semiconductor light-emitting device, LED has been widely used in the fields of lighting, backlight and display due to its advantages of low energy consumption, high brightness, low heat generation and long life.
而由LED构成的LED显示屏目前在户外显示、监控、广告等领域大规模应用，且对小间距LED显示屏的需求越来越高。目前主流的显示屏采用正装LED阵列作为发光单元，每颗LED包含红绿蓝三颗芯片，芯片采用打金线形式进行电气连接，该种形式由于金线的存在使LED颗粒较大，难以缩小LED之间的间距。另一种形式采用倒装芯片的方式，将芯片直接以COB的方式贴在PCB板上，该种方式可以大大缩小发光单元之间的间距，但由于发光芯片尺寸小，存在SMT贴片精度和贴片良率低的问题。The LED display screen composed of LEDs is currently widely used in outdoor display, monitoring, advertising and other fields, and the demand for small-pitch LED display screens is increasing. At present, mainstream display screens use formal LED arrays as light-emitting units. Each LED contains three chips of red, green and blue. The chips are connected by gold wires. This form of gold wire makes the LED particles larger and difficult to shrink due to the presence of gold wires. The spacing between LEDs. The other form adopts the flip chip method, and the chip is directly attached to the PCB board by COB. This method can greatly reduce the spacing between the light emitting units, but due to the small size of the light emitting chip, there is SMT placement accuracy and The problem of low placement yield.
发明内容Summary of the invention
鉴于上述现有技术的不足之处，本公开为解决现有技术缺陷和不足，提出了一种LED阵列，可有效提升贴片精度和贴片良率。In view of the above shortcomings of the prior art, in order to solve the shortcomings and shortcomings of the prior art, the present disclosure proposes an LED array, which can effectively improve the placement accuracy and placement yield.
一种LED阵列，包括PCB板以及装配在所述PCB板上的若干发光单元，每一发光单元包括一支架以及三个LED芯片，三个所述LED芯片采用倒装的方式封装在所述支架内，所述支架采用正装的方式装配在所述PCB板上，支架内的LED芯片通过所述支架与所述PCB板电性连接。An LED array includes a PCB board and a plurality of light-emitting units assembled on the PCB board, each light-emitting unit includes a bracket and three LED chips, and the three LED chips are packaged on the bracket in a flip-chip manner Inside, the bracket is assembled on the PCB board in a formally installed manner, and the LED chips in the bracket are electrically connected to the PCB board through the bracket.
其中，所述发光单元内的三个LED芯片分别为红光芯片、绿光芯片和蓝光芯片。Among them, the three LED chips in the light-emitting unit are a red chip, a green chip and a blue chip, respectively.
其中，所述蓝光芯片主波长在450-470nm，所述绿光芯片主波长在530-550nm,所述红光芯片主波长在610-630nm。The main wavelength of the blue chip is 450-470 nm, the main wavelength of the green chip is 530-550 nm, and the main wavelength of the red chip is 610-630 nm.
其中，所述LED芯片采用固晶机倒装在所述支架内。Wherein, the LED chip is flip-chip mounted in the bracket by a die bonding machine.
其中，所述发光单元的三个LED芯片呈“品”字形排布，并且共用阳极；所述支架底部对应三个LED芯片的阴极以及共用的阳极设置有四个焊点，所述支架通过四个所述焊点使支架内的LED芯片与所述PCB板电性连接。Among them, the three LED chips of the light-emitting unit are arranged in a "product" shape and share an anode; the cathode of the three LED chips and the common anode at the bottom of the bracket are provided with four solder joints. The solder joints electrically connect the LED chip in the bracket with the PCB board.
其中，所述共用阳极设置在支架的空位处。Wherein, the common anode is arranged at an empty position of the support.
其中，所述发光单元的三个LED芯片呈直线排布，并且共用阳极；所述支架底部对应三个LED芯片的阴极以及共用的阳极设置有四个焊点，所述支架通过四个所述焊点使支架内的LED芯片与所述PCB板电性连接。The three LED chips of the light-emitting unit are arranged in a straight line and share an anode; the cathode of the three LED chips and the common anode are provided with four solder joints at the bottom of the bracket, and the bracket passes through the four The solder joint electrically connects the LED chip in the bracket to the PCB board.
其中，所述发光单元还包括封装层，所述封装层形成在所述支架上，并覆盖所述LED芯片。Wherein, the light emitting unit further includes an encapsulation layer, the encapsulation layer is formed on the bracket and covers the LED chip.
其中，所述封装层采用封装硅胶制成，或者采用环氧树脂材质的封装胶制成。Wherein, the encapsulation layer is made of encapsulated silica gel or encapsulant made of epoxy resin.
其中，所述支架为一矩形平板，所述LED芯片间隔设置在所述支架的表面。Wherein, the bracket is a rectangular flat plate, and the LED chips are arranged on the surface of the bracket at intervals.
其中，所述支架为一碗状结构的支架，包括内凹的收容槽，所述LED芯片间隔设置在所述收容槽内。Wherein, the bracket is a bracket with a bowl-shaped structure, which includes a concave receiving slot, and the LED chips are arranged in the receiving slot at intervals.
其中，所述LED阵列还包括保护膜，所述保护膜形成在所述PCB板上方，并覆盖所述发光单元。Wherein, the LED array further includes a protective film formed on the PCB board and covering the light-emitting unit.
其中，所述保护膜采用硅胶制备，或者采用环氧树脂的胶水制备。Wherein, the protective film is made of silica gel or epoxy resin glue.
其中，在覆形成所述保护膜时，对整个LED阵列进行点胶或涂胶或模压胶的操作。Wherein, when forming the protective film, the entire LED array is dispensed, glued, or molded.
本公开还提供了一种LED显示屏，其具有上述的LED阵列。The present disclosure also provides an LED display screen having the LED array described above.
与现有技术相比较，本公开的LED阵列及LED显示屏，其预先将LED芯片倒装封装到支架上后，支架再采用正装的方式装配在PCB板上。也就是说，本公开的LED阵列，较直接将所有LED芯片倒装在PCB板上的方式，其将倒装LED芯片的制程前移，从而降低LED芯片在贴片时的精度要求，有效提高贴片的精度和良率。Compared with the prior art, in the LED array and the LED display screen of the present disclosure, after the LED chip is flip-chip packaged on the bracket in advance, the bracket is assembled on the PCB board in a formally installed manner. In other words, the LED array of the present disclosure directly flips all the LED chips on the PCB board, which advances the process of flipping the LED chips, thereby reducing the accuracy requirements of the LED chips during placement and effectively improving SMD accuracy and yield.
附图说明BRIEF DESCRIPTION
图1是本公开实施例一种LED阵列的正视图及侧视图。FIG. 1 is a front view and a side view of an LED array according to an embodiment of the present disclosure.
图2是图1所示LED阵列的发光单元的结构示意图。FIG. 2 is a schematic structural view of the light emitting unit of the LED array shown in FIG. 1.
图3是图1所示LED阵列的另一实施例的发光单元的结构示意图。FIG. 3 is a schematic structural diagram of a light-emitting unit of another embodiment of the LED array shown in FIG. 1.
图4是图1所示LED阵列的发光单元中LED芯片的排列示意图。4 is a schematic view of the arrangement of LED chips in the light emitting unit of the LED array shown in FIG.
图5是图1所示LED阵列的发光单元中LED芯片的另一实施例的排列示意图。FIG. 5 is an arrangement diagram of another embodiment of LED chips in the light emitting unit of the LED array shown in FIG. 1.
具体实施方式detailed description
下面将结合本公开实施方式中的附图，对本公开实施方式中的技术方案进行清楚、完整地描述。显然，所描述的实施方式是本公开的一部分实施方式，而不是全部实施方式。基于本公开中的实施方式，本领域普通技术人员在没有做出创造性劳动的前提下所获得的所有其他实施方式，都应属于本公开保护的范围。The technical solutions in the embodiments of the present disclosure will be described clearly and completely in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are a part of the embodiments of the present disclosure, but not all the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present disclosure.
在本公开的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸地连接，或者一体地连接；可以是机械连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本公开中的具体含义。In the description of the present disclosure, it should be noted that the terms "installation", "connection", and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a removable Ground connection, or integral connection; may be a mechanical connection; may be directly connected, or may be indirectly connected through an intermediate medium, or may be a connection between two elements. For those of ordinary skill in the art, the specific meaning of the above terms in the present disclosure may be understood in specific situations.
此外，在本公开的描述中，除非另有说明，“多个”的含义是两个或两个以上。若本说明书中出现“工序”的用语，其不仅是指独立的工序，在与其它工序无法明确区别时，只要能实现所述工序所预期的作用则也包括在本用语中。另外，本说明书中用“～”表示的数值范围是指将“～”前后记载的数值分别作为最小值及最大值包括在内的范围。在附图中，结构相似或相同的单元用相同的标号表示。In addition, in the description of the present disclosure, unless otherwise specified, the meaning of "plurality" is two or more. If the term "process" appears in this specification, it not only refers to an independent process, but when it cannot be clearly distinguished from other processes, it is also included in this term as long as it can achieve the expected effect of the process. In addition, the numerical range represented by "-" in this specification means the range which includes the numerical value described before and after "-" as a minimum value and a maximum value, respectively. In the drawings, units with similar or identical structures are denoted by the same reference numerals.
本公开实施例提供了一种LED阵列，其预先将LED芯片倒装封装到支架上后，支架再采用正装的方式装配在PCB板上。也就是说，本公开的LED阵列，较直接将所有LED芯片倒装在PCB板上的方式，其将倒装LED芯片的制程前移，从而降低LED芯片在贴片时的精度要求，有效提高贴片的精度和良率。An embodiment of the present disclosure provides an LED array. After the LED chip is flip-chip packaged on a bracket in advance, the bracket is assembled on the PCB board in a formally mounted manner. In other words, the LED array of the present disclosure directly flips all the LED chips on the PCB board, which advances the process of flipping the LED chips, thereby reducing the accuracy requirements of the LED chips during placement and effectively improving SMD accuracy and yield.
请参阅图1及图2，图1是本公开实施例一种LED阵列的正视图及侧视图，图2是图1所示LED阵列的发光单元的结构示意图。在本公开实施例中，该LED阵列100包括PCB板10以及装配在所述PCB板10上的若干发光单元30，其中，每一发光单元30包括一支架31以及三个LED芯片33，三个所述LED芯片33采用倒装的方式封装在所述支架31上，所述支架31再采用正装的方式装配在所述PCB板10上，支架31上的LED芯片33通过所述支架31与PCB板10电性 连接。Please refer to FIGS. 1 and 2. FIG. 1 is a front view and a side view of an LED array according to an embodiment of the present disclosure. FIG. 2 is a schematic structural diagram of a light emitting unit of the LED array shown in FIG. 1. In the embodiment of the present disclosure, the LED array 100 includes a PCB board 10 and a plurality of light emitting units 30 mounted on the PCB board 10, wherein each light emitting unit 30 includes a bracket 31 and three LED chips 33, three The LED chip 33 is packaged on the bracket 31 in a flip-chip manner, and the bracket 31 is assembled on the PCB board 10 in a front-mounted manner. The LED chip 33 on the bracket 31 passes through the bracket 31 and the PCB The board 10 is electrically connected.
本公开的LED阵列100，其预先将LED芯片33倒装封装到支架31上后，支架31再采用正装的方式装配在PCB板10上。也就是说，本公开的LED阵列100，较直接将所有LED芯片倒装在PCB板10上的方式，其将倒装LED芯片的制程前移，从而降低LED芯片在贴片时的精度要求，有效提高贴片的精度和良率。In the LED array 100 of the present disclosure, after the LED chip 33 is flip-chip packaged on the bracket 31 in advance, the bracket 31 is assembled on the PCB board 10 in a formally mounted manner. In other words, the LED array 100 of the present disclosure directly flips all the LED chips on the PCB board 10, which advances the process of flipping the LED chips, thereby reducing the accuracy requirements of the LED chips during placement. Effectively improve the accuracy and yield of the patch.
在本公开一实施方式中，每一所述发光单元30内的三个LED芯片33分别为红光芯片、绿光芯片和蓝光芯片。其中，蓝光芯片主波长在450-470nm，绿光芯片主波长在530-550nm，红光芯片主波长在610-630nm。通过将红光芯片、绿光芯片与蓝光芯片封装成一个发光单元30，使得所述发光单元30能根据需要发出单色光，或者发出由红光和/或绿光和/或蓝光混光后形成的其它颜色的光，以满足LED显示屏的颜色显示需求。In an embodiment of the present disclosure, the three LED chips 33 in each light-emitting unit 30 are a red chip, a green chip, and a blue chip, respectively. Among them, the main wavelength of the blue chip is 450-470nm, the main wavelength of the green chip is 530-550nm, and the main wavelength of the red chip is 610-630nm. The red light chip, the green light chip and the blue light chip are packaged into a light-emitting unit 30, so that the light-emitting unit 30 can emit monochromatic light or emit mixed light of red light and/or green light and/or blue light as needed The light of other colors is formed to meet the color display requirements of the LED display screen.
在本公开一实施方式中，所述LED芯片33采用固晶机以倒装的形式安装在所述支架31内。本实施例利用固晶机的高精度定位能力，使得LED芯片33倒装在支架31内时，能获得较高的精度，提升量产良率。In an embodiment of the present disclosure, the LED chip 33 is mounted in the bracket 31 in a flip-chip form using a die bonding machine. In this embodiment, the high-precision positioning capability of the die bonding machine is used, so that when the LED chip 33 is flip-chip mounted in the bracket 31, higher accuracy can be obtained, and the yield yield of mass production can be improved.
实施例1Example 1
在本公开一实施方式中，请一并参阅图4，图4是图1所示LED阵列的发光单元中LED芯片的排列示意图。所述发光单元30的三个LED芯片33呈“品”字形排布，并且三个LED芯片33共用阳极(图未示)，所述共用阳极设置在支架31的空位处；所述支架31底部对应三个LED芯片33的阴极以及共用的阳极设置有四个焊点(图未示)。所述支架31安装在所述PCB板10上时，支架31上的焊点和PCB板10上的触点电连接，从而将支架31内的LED芯片33和PCB板10建立电连接。在本实施方式中，通过将三个LED芯片33的阳极共用，可减少支架31上的焊点的数量，对应可简化通过支架31实现LED芯片33与PCB板10电路连接时的布线与复杂程度。In an embodiment of the present disclosure, please refer to FIG. 4 together. FIG. 4 is a schematic diagram of the arrangement of LED chips in the light emitting unit of the LED array shown in FIG. 1. The three LED chips 33 of the light-emitting unit 30 are arranged in a "product" shape, and the three LED chips 33 share an anode (not shown in the figure), and the common anode is provided at an empty position of the bracket 31; the bottom of the bracket 31 Four solder joints (not shown) are provided for the cathodes and common anodes of the three LED chips 33. When the bracket 31 is installed on the PCB board 10, the solder joints on the bracket 31 and the contacts on the PCB board 10 are electrically connected, so that the LED chip 33 in the bracket 31 and the PCB board 10 are electrically connected. In this embodiment, by sharing the anodes of the three LED chips 33, the number of solder joints on the bracket 31 can be reduced, which can simplify the wiring and complexity of the circuit connection between the LED chip 33 and the PCB board 10 through the bracket 31 .
实施例2Example 2
在本公开另一实施方式中，请一并参阅图5，图5是图1所示LED阵列的发光单元中LED芯片的另一实施例的排列示意图。所述发光单元30的三个LED芯片33呈直线排布，并且三个LED芯片33共用阳极(图未示)；所述支架31 底部对应三个LED芯片33的阴极(图未示)以及共用的阳极设置有四个焊点(图未示)。所述支架31安装在所述PCB板10上时，支架31上的焊点和PCB板10上的触点电连接，从而将支架31内的LED芯片33和PCB板10建立电连接。同样的，在本实施方式中，通过将三个LED芯片33的阳极共用，可减少支架31上的焊点的数量，对应可简化通过支架31上的焊点实现LED芯片33与PCB板10之间电路连接的布线与复杂程度。In another embodiment of the present disclosure, please refer to FIG. 5 together. FIG. 5 is an arrangement diagram of another embodiment of the LED chips in the light emitting unit of the LED array shown in FIG. 1. The three LED chips 33 of the light emitting unit 30 are arranged in a straight line, and the three LED chips 33 share an anode (not shown); the bottom of the bracket 31 corresponds to the cathodes (not shown) of the three LED chips 33 and common The anode is provided with four solder joints (not shown). When the bracket 31 is installed on the PCB board 10, the solder joints on the bracket 31 and the contacts on the PCB board 10 are electrically connected, so that the LED chip 33 in the bracket 31 and the PCB board 10 are electrically connected. Similarly, in the present embodiment, by sharing the anodes of the three LED chips 33, the number of solder joints on the bracket 31 can be reduced, corresponding to simplifying the implementation of the LED chip 33 and the PCB board 10 through the solder joints on the bracket 31 The wiring and complexity of the connection between the circuits.
请再次参阅图2，在本公开一实施方式中，所述发光单元30还包括封装层35，所述封装层35形成在所述支架31上，并覆盖所述LED芯片33。在本实施方式中，所述封装层35采用封装硅胶制成，在其它实施方式中，也可以采用环氧树脂等其他材质的封装胶制成，并且在本公开中，不对所述封装层35的材质做具体限定。Please refer to FIG. 2 again. In an embodiment of the present disclosure, the light-emitting unit 30 further includes an encapsulation layer 35 formed on the bracket 31 and covering the LED chip 33. In this embodiment, the encapsulating layer 35 is made of encapsulating silicone. In other embodiments, it may also be made of encapsulant of other materials such as epoxy resin. In this disclosure, the encapsulating layer 35 is not used. The material is specifically limited.
请再次参阅图2，在本公开一实施方式中，所述支架31为一矩形平板，所述LED芯片33间隔设置在所述支架31的表面，封装层35形成在所述平板状的支架31上，并覆盖所述LED芯片33。平板状的支架31可提供整个平面来安装所述LED芯片33，因此，在相同的LED芯片33间距要求下，可将支架31的尺寸做的更小，从而缩小将该LED阵列100应用到LED显示屏时的显示间距。Please refer to FIG. 2 again. In an embodiment of the present disclosure, the bracket 31 is a rectangular flat plate, the LED chips 33 are arranged on the surface of the bracket 31 at intervals, and the encapsulation layer 35 is formed on the flat bracket 31上，cover the LED chip 33. The flat plate-shaped bracket 31 can provide the entire plane to mount the LED chips 33, therefore, under the same LED chip 33 pitch requirement, the size of the bracket 31 can be made smaller, thereby reducing the application of the LED array 100 to the LED The display spacing when the screen is displayed.
当所述支架31为平板状的结构时，所述LED阵列的制备工艺如下：整块支架—固晶LED芯片—点封装胶—烘烤—切割。即，采用一整块的支架，并通过固晶机将不同颜色的LED芯片33依次倒装在所述整块的支架上后，再涂布封装胶并烘烤固化而形成所述封装层35，再将所述整块的支架切割成多个支架，使得每个支架上封装有3个不同颜色的LED芯片，即可获得多个所述发光单元30。When the bracket 31 has a flat structure, the preparation process of the LED array is as follows: a whole bracket—solid crystal LED chip—dot encapsulant—bake—cut. That is, a whole block of support is used, and LED chips 33 of different colors are flip-chip mounted on the whole block of the support in sequence through a die bonding machine, and then coated with encapsulant and baked and cured to form the encapsulation layer 35 Then, the whole bracket is cut into multiple brackets, so that three LED chips of different colors are encapsulated on each bracket, and multiple light-emitting units 30 can be obtained.
在本公开另一实施方式中，请一并参阅图3，图3是图1所示LED阵列的另一实施例的发光单元的结构示意图。所述支架31为一碗状结构的支架，包括内凹的收容槽(图未标)，所述LED芯片33间隔设置在所述收容槽内，封装层35形成在所述平板装的支架31上、填充所述收容槽，从而覆盖所述收容槽中的LED芯片33。虽然，碗状结构的支架能提供安装LED芯片33的平面变小，然而，碗状结构的设计，可有效防止该支架31内的LED芯片33和相邻的支架31内的LED芯片33产生混光，即可防止相邻发光单元30之间产生混光。In another embodiment of the present disclosure, please refer to FIG. 3 together. FIG. 3 is a schematic structural diagram of a light emitting unit of another embodiment of the LED array shown in FIG. 1. The bracket 31 is a bracket with a bowl-shaped structure, and includes a concave receiving slot (not shown in the figure), the LED chips 33 are arranged in the receiving slot at intervals, and an encapsulation layer 35 is formed on the bracket 31 mounted on the tablet Up and filling the receiving slot to cover the LED chip 33 in the receiving slot. Although the bowl-shaped structure can provide a smaller plane for mounting the LED chips 33, the design of the bowl-shaped structure can effectively prevent the LED chips 33 in the frame 31 from mixing with the LED chips 33 in the adjacent frame 31 With light, the light mixing between adjacent light emitting units 30 can be prevented.
当所述支架31为碗状的结构设计时，所述LED阵列的制备工艺如下：整块 支架—切割—固晶LED芯片—点封装胶—烘烤。即，由于所述支架是碗状的设计(即整块支架上设置有多个内凹的收容槽)，所以将所述整块的支架切割成多个具有碗状结构的支架后，通过固晶机将不同颜色的LED芯片33依次倒装在所述碗状的支架上后，再涂布封装胶并烘烤固化形成所述封装层35，此时每个支架内封装有三个不同颜色的LED芯片，即形成了所述发光单元30。When the bracket 31 is designed as a bowl-shaped structure, the preparation process of the LED array is as follows: a whole bracket—cutting—solid crystal LED chip—dot encapsulant—baking. That is, since the bracket has a bowl-shaped design (that is, a plurality of concave receiving grooves are provided on the whole block of the bracket), after cutting the whole block of the bracket into a plurality of brackets having a bowl-shaped structure, the After the crystal machine flips the LED chips 33 of different colors on the bowl-shaped brackets in turn, it is coated with encapsulant and baked and cured to form the encapsulation layer 35. At this time, three different colors are encapsulated in each bracket The LED chip forms the light-emitting unit 30.
请再次参阅图1，在发明一实施方式中，所述LED阵列100还包括保护膜50，所述保护膜50形成在所述PCB板10上方，并覆盖所述发光单元30。在本实施方式中，所述保护膜50优选采用硅胶制备，在本公开其它实施方式中，也可以采用环氧树脂胶等其他胶水制备，在此，不对所述保护膜50的材料做具体限定。在本实施方式中，将所有发光单元30打件到PCB板10上后，对其进行覆膜操作，以实现对所述发光单元30的保护。并且覆膜操作时，优选对每个或多个发光LED单元进行分别点胶；在其它实施方式中，覆膜操作时，也可以对整个LED阵列100进行点胶或涂胶或模压胶的操作。Please refer to FIG. 1 again. In an embodiment of the invention, the LED array 100 further includes a protective film 50 formed on the PCB 10 and covering the light emitting unit 30. In this embodiment, the protective film 50 is preferably made of silica gel. In other embodiments of the present disclosure, epoxy resin glue or other glues may also be used. Here, the material of the protective film 50 is not specifically limited. . In this embodiment, after all the light-emitting units 30 are stamped onto the PCB board 10, a film coating operation is performed on them to realize the protection of the light-emitting units 30. In addition, during the lamination operation, it is preferable to separately dispense each or more light-emitting LED units; in other embodiments, during the lamination operation, the entire LED array 100 may also be dispensed, glued, or molded. .
本公开还提供一种LED显示屏，其具有上述的LED阵列。The present disclosure also provides an LED display screen having the LED array described above.
本公开的LED阵列及LED显示屏，其预先将LED芯片33倒装封装到支架31上后，支架31再采用正装的方式装配在PCB板10上。也就是说，本公开的LED阵列100，较直接将所有LED芯片倒装在PCB板10上的方式，其将倒装LED芯片的制程前移，从而降低LED芯片在贴片时的精度要求，有效提高贴片的精度和良率。In the LED array and the LED display screen of the present disclosure, after the LED chip 33 is flip-chip packaged on the bracket 31 in advance, the bracket 31 is assembled on the PCB board 10 in a formally installed manner. In other words, the LED array 100 of the present disclosure directly flips all the LED chips on the PCB board 10, which advances the process of flipping the LED chips, thereby reducing the accuracy requirements of the LED chips during placement. Effectively improve the accuracy and yield of the patch.
应当理解的是，以上所述仅为本公开的较佳实施例而已，并不足以限制本公开的技术方案，对本领域普通技术人员来说，在本公开的精神和原则之内，可以根据上述说明加以增减、替换、变换或改进，而所有这些增减、替换、变换或改进后的技术方案，都应属于本公开所附权利要求的保护范围。It should be understood that the above is only the preferred embodiments of the present disclosure and is not sufficient to limit the technical solutions of the present disclosure. For those of ordinary skill in the art, within the spirit and principles of the present disclosure, the above Descriptions are added, subtracted, replaced, transformed or improved, and all these added, subtracted, replaced, transformed or improved technical solutions shall fall within the protection scope of the claims appended to this disclosure.

Claims (15)

  1. 一种LED阵列，包括PCB板以及装配在所述PCB板上的若干发光单元，其特征在于：每一发光单元包括一支架以及三个LED芯片，三个所述LED芯片采用倒装的方式封装在所述支架内，所述支架采用正装的方式装配在所述PCB板上，支架内的LED芯片通过所述支架与所述PCB板电性连接。An LED array includes a PCB board and a plurality of light-emitting units assembled on the PCB board, characterized in that each light-emitting unit includes a bracket and three LED chips, and the three LED chips are packaged in a flip-chip manner In the bracket, the bracket is assembled on the PCB board in a formal manner, and the LED chip in the bracket is electrically connected to the PCB board through the bracket.
  2. 根据权利要求1所述的LED阵列，其特征在于，所述发光单元内的三个LED芯片分别为红光芯片、绿光芯片和蓝光芯片。The LED array according to claim 1, wherein the three LED chips in the light-emitting unit are a red chip, a green chip and a blue chip, respectively.
  3. 根据权利要求2所述的LED阵列，其特征在于，所述蓝光芯片主波长在450-470nm，所述绿光芯片主波长在530-550nm,所述红光芯片主波长在610-630nm。The LED array according to claim 2, wherein the main wavelength of the blue chip is 450-470 nm, the main wavelength of the green chip is 530-550 nm, and the main wavelength of the red chip is 610-630 nm.
  4. 根据权利要求1所述的LED阵列，其特征在于：所述LED芯片采用固晶机倒装在所述支架内。The LED array according to claim 1, wherein the LED chip is flip-chip mounted in the holder by a die bonding machine.
  5. 根据权利要求1所述的LED阵列，其特征在于，所述发光单元内的三个LED芯片呈“品”字形排布，并且共用阳极；所述支架底部对应三个LED芯片的阴极以及共用的阳极设置有四个焊点，所述支架通过四个所述焊点使支架内的LED芯片与所述PCB板电性连接。The LED array according to claim 1, wherein the three LED chips in the light-emitting unit are arranged in a "product" shape and share an anode; the bottom of the bracket corresponds to the cathodes of the three LED chips and the common The anode is provided with four solder joints, and the bracket electrically connects the LED chip in the bracket to the PCB board through the four solder joints.
  6. 根据权利要求5所述的LED阵列，其特征在于，所述共用阳极设置在支架的空位处。The LED array according to claim 5, wherein the common anode is provided at a vacant position of the support.
  7. 根据权利要求1所述的LED阵列，其特征在于，所述发光单元的三个LED芯片呈直线排布，并且共用阳极；所述支架底部对应三个LED芯片的阴极以及共用的阳极设置有四个焊点，所述支架通过四个所述焊点使支架内的LED芯片与所述PCB板电性连接。The LED array according to claim 1, wherein the three LED chips of the light-emitting unit are arranged in a straight line and share an anode; the cathode of the bottom of the bracket corresponding to the three LED chips and the common anode are provided with four Four solder joints, the bracket electrically connects the LED chip in the bracket to the PCB board.
  8. 根据权利要求1所述的LED阵列，其特征在于，所述发光单元还包括封装层，所述封装层形成在所述支架上，并覆盖所述LED芯片。The LED array according to claim 1, wherein the light-emitting unit further comprises an encapsulation layer formed on the bracket and covering the LED chip.
  9. 根据权利要求8所述的LED阵列，其特征在于，所述封装层采用封装硅胶制成，或者采用环氧树脂材质的封装胶制成。The LED array according to claim 8, wherein the encapsulation layer is made of encapsulating silica gel or encapsulant made of epoxy resin.
  10. 根据权利要求1-9任意一项所述的LED阵列，其特征在于，所述支架为一矩形平板，所述LED芯片间隔设置在所述支架的表面。The LED array according to any one of claims 1-9, wherein the support is a rectangular flat plate, and the LED chips are arranged on the surface of the support at intervals.
  11. 根据权利要求1-9任意一项所述的LED阵列，其特征在于，所述支架为一碗状结构的支架，包括内凹的收容槽，所述LED芯片间隔设置在所述收容 槽内。The LED array according to any one of claims 1-9, wherein the bracket is a bowl-shaped bracket including a concave receiving groove, and the LED chips are arranged at intervals in the receiving groove.
  12. 根据权利要求1-9任意一项所述的LED阵列，其特征在于，所述LED阵列还包括保护膜，所述保护膜形成在所述PCB板上方，并覆盖所述发光单元。The LED array according to any one of claims 1-9, wherein the LED array further includes a protective film formed on the PCB board and covering the light emitting unit.
  13. 根据权利要求12所述的LED阵列，其特征在于，所述保护膜采用硅胶制备，或者采用环氧树脂的胶水制备。The LED array according to claim 12, wherein the protective film is made of silica gel or epoxy resin glue.
  14. 根据权利要求13所述的LED阵列，其特征在于，在覆形成所述保护膜时，对整个LED阵列进行点胶或涂胶或模压胶的操作。The LED array according to claim 13, wherein when the protective film is formed, the entire LED array is dispensed, glued, or molded.
  15. 一种LED显示屏，其特征在于，包括上述权利要求1-14任意一项所述的LED阵列。An LED display screen, characterized by comprising the LED array according to any one of claims 1-14.
PCT/CN2019/121092 2018-11-28 2019-11-27 Led array and led display screen WO2020108501A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201811435962.4 2018-11-28
CN201811435962.4A CN111244245A (en) 2018-11-28 2018-11-28 LED array and LED display screen

Publications (1)

Publication Number Publication Date
WO2020108501A1 true WO2020108501A1 (en) 2020-06-04

Family

ID=70852319

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/121092 WO2020108501A1 (en) 2018-11-28 2019-11-27 Led array and led display screen

Country Status (2)

Country Link
CN (1) CN111244245A (en)
WO (1) WO2020108501A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204289531U (en) * 2014-12-25 2015-04-22 深圳市安普光光电科技有限公司 Full-color LED encapsulation structure and LED show module
US20160133806A1 (en) * 2014-11-11 2016-05-12 Toyoda Gosei Co., Ltd. Light emitting device
CN205488200U (en) * 2016-01-19 2016-08-17 深圳市华天迈克光电子科技有限公司 Encapsulation of full -color SMD display screen
CN206992109U (en) * 2017-06-07 2018-02-09 佛山市国星光电股份有限公司 A kind of outdoor big spacing LED component and LED display
CN108400220A (en) * 2018-04-25 2018-08-14 江苏稳润光电有限公司 A kind of encapsulating structure of miniature LED display module

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102969433A (en) * 2012-12-06 2013-03-13 上海顿格电子贸易有限公司 LED (Light-Emitting Diode) wafer modularized packaging process
CN206134731U (en) * 2016-10-11 2017-04-26 佛山市国星光电股份有限公司 Luminous LED support, device and display screen of side
CN108831903A (en) * 2018-07-17 2018-11-16 佛山市国星光电股份有限公司 A kind of LED display unit group and display panel

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160133806A1 (en) * 2014-11-11 2016-05-12 Toyoda Gosei Co., Ltd. Light emitting device
CN204289531U (en) * 2014-12-25 2015-04-22 深圳市安普光光电科技有限公司 Full-color LED encapsulation structure and LED show module
CN205488200U (en) * 2016-01-19 2016-08-17 深圳市华天迈克光电子科技有限公司 Encapsulation of full -color SMD display screen
CN206992109U (en) * 2017-06-07 2018-02-09 佛山市国星光电股份有限公司 A kind of outdoor big spacing LED component and LED display
CN108400220A (en) * 2018-04-25 2018-08-14 江苏稳润光电有限公司 A kind of encapsulating structure of miniature LED display module

Also Published As

Publication number Publication date
CN111244245A (en) 2020-06-05

Similar Documents

Publication Publication Date Title
US9966367B2 (en) Light emitting device
TWI389295B (en) Light-emitting diode light source module
WO2017206405A1 (en) Novel cob full-color led light-emitting panel and manufacturing method thereof
US10431567B2 (en) White ceramic LED package
CN208045002U (en) High contrast integration packaging display module structure
CN212257436U (en) LED substrate, LED packaging body and display device
CN113380776A (en) Manufacturing method of LED display module
JP2017521702A (en) Flash module including reflective cup array for phosphor-converted LED
CN113130466A (en) LED display module and manufacturing method thereof
US20110014732A1 (en) Light-emitting module fabrication method
CN113054059A (en) Display device, LED package and manufacturing method thereof
TWI764096B (en) Double-sided display package structure
EP4016649A1 (en) Light-emitting device and manufacturing method, and display screen and lighting equipment comprising said light-emitting device
WO2020108501A1 (en) Led array and led display screen
CN116314550A (en) CSP (chip scale package) structure of forward-mounted LED (light emitting diode) chip, preparation method of CSP structure and COB (chip on board) light source
WO2021213204A1 (en) Led substrate, led package and manufacturing method therefor, and display device
JP6092136B2 (en) Light emitting device
CN214411240U (en) LED packaging structure, LED module and LED display screen
CN220189645U (en) LED packaging structure and LED display screen
CN210120152U (en) CSP light-emitting diode packaging device
CN210778586U (en) Double-color light-emitting component
CN217086563U (en) LED lamp bead, LED display module and LED display screen
CN211828767U (en) Display module and display screen
CN216818339U (en) COB (chip on board) packaging all-in-one module
CN217086564U (en) LED lamp bead, LED display module and LED display screen

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19888398

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19888398

Country of ref document: EP

Kind code of ref document: A1