CN210778586U

CN210778586U - Double-color light-emitting component

Info

Publication number: CN210778586U
Application number: CN201921593634.7U
Authority: CN
Inventors: 蔡志嘉; 李文亮
Original assignee: Suzhou Lighting Optoelectronics Technology Co ltd
Current assignee: Suzhou Lighting Optoelectronics Technology Co ltd
Priority date: 2019-09-24
Filing date: 2019-09-24
Publication date: 2020-06-16
Anticipated expiration: 2029-09-24

Abstract

The utility model provides a double-colored light-emitting component, include: the PCB substrate is provided with a die bonding area; the LED chip structure comprises four LED chips arranged on the PCB substrate, wherein the four LED chips are arranged in the die attach area in a 2 x 2 array mode, the two LED chips in each row or each column of the 2 x 2 array have different light emitting colors, and the two LED chips on each diagonal line have the same light emitting color. The utility model discloses can avoid the luminous angle curve off-centre when monochromatic is lighted to can guarantee higher luminance, luminous effect is better.

Description

Double-color light-emitting component

Technical Field

The utility model relates to a chip LED technical field, concretely relates to double-colored light-emitting component.

Background

In the current consumer electronics field, the two-color lamp beads on the market mainly use planar positive light emitting products such as 1206, 0805, 1615 and 0603 as mainstream products, but because the brightness of the products is influenced by the size of a wafer, the high brightness cannot be achieved.

The Lens LED product utilizes a small light-emitting angle (15-60 degrees) to bring high brightness, the brightness of a lamp bead of the current single-color Lens LED product is very high, but the light-emitting angle curve of the measuring lamp bead of the current double-color Lens LED product is in an eccentric shape, and the requirement of high brightness is difficult to achieve. As shown in fig. 1, in the current two-color Lens LED product, two LED chips (blue B green G is taken as an example in the figure) with different colors are placed on two-color lamp beads, the two chips are placed horizontally or vertically, any one of the lamps is on, and the product shows the angle diagram shown in fig. 2, which is an eccentric shape.

SUMMERY OF THE UTILITY MODEL

The utility model provides a solve above-mentioned technical problem, provide a double-colored light-emitting component, can avoid the luminous angle curve off-centre when monochromatic is lighted to can guarantee higher luminance, luminous effect is better.

The utility model adopts the technical scheme as follows:

a two-color light emitting device comprising: the PCB substrate is provided with a die bonding area; the LED chip structure comprises four LED chips arranged on the PCB substrate, wherein the four LED chips are arranged in the die attach area in a 2 x 2 array mode, the two LED chips in each row or each column of the 2 x 2 array have different light emitting colors, and the two LED chips on each diagonal line have the same light emitting color.

The double-color light-emitting component further comprises a packaging colloid for packaging the four LED wafers.

The bottom surface of the packaging colloid is circular, and the center point of the 2 x 2 array is coincided with the circle center of the bottom surface of the circular packaging colloid.

The bottom lines of two LED chips with the same luminous color are connected in parallel.

The utility model has the advantages that:

the utility model discloses a set up four LED wafers that constitute 2X 2 array on the base plate, the LED wafer of two kinds of luminous colours is respectively two, and two LED wafers that luminous colour is the same are in the array diagonal on, from this, light simultaneously through making two LED wafers that luminous colour is the same, can avoid the luminous angle curve off-centre when monochromatic lighting to can guarantee higher luminance, luminous effect is better.

Drawings

FIG. 1 is a schematic diagram of a two-color Lens LED product in the related art;

FIG. 2 is a graph showing a luminous angle of a two-color Lens LED product according to the related art;

fig. 3 is a schematic front view of a two-color light-emitting device according to an embodiment of the present invention;

fig. 4 is a schematic diagram of electrode connection of an LED chip according to an embodiment of the present invention;

fig. 5 is a schematic side view of a two-color light-emitting device according to an embodiment of the present invention;

fig. 6 is a graph showing the light-emitting angle of the two-color light-emitting device according to an embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

As shown in fig. 3, the dual-color light emitting device according to the embodiment of the present invention includes a PCB substrate 10 and four LED chips 20 disposed on the PCB substrate 10. The PCB substrate 10 has a die attach area, the four LED chips 20 are arranged in the die attach area in a 2 × 2 array, two LED chips in each row or each column of the 2 × 2 array have different light emission colors, and two LED chips on each diagonal have the same light emission color.

Further, as shown in fig. 4, the dual color light emitting device according to the embodiment of the present invention may further include a molding compound 30 for encapsulating the four LED chips. In one embodiment of the present invention, the material of the encapsulant 30 may be epoxy resin or silicone plastic.

Based on the PCB substrate 10, the four LED chips 20, and the encapsulant 30 as a Lens, a Lens ChipLED bi-color light emitting device is formed.

In an embodiment of the present invention, the bottom surface of the encapsulant 30 may be circular, and the center point of the 2 × 2 array coincides with the center of the circular bottom surface of the encapsulant 30. In fig. 3, two blue LED chips and two green LED chips are illustrated, the two blue LED chips are symmetric with respect to the center point, and the two green LED chips are symmetric with respect to the center point.

In an embodiment of the present invention, each LED chip 10 can be fixedly connected to the front surface of the PCB substrate 10, the surface of the PCB substrate 10 connected to the LED chip 10 has a conductive layer plated with gold or silver, and the bottom lines of two LED chips 20 with the same light emitting color are connected in parallel. As shown in fig. 3 and 5, the anode and cathode of each blue LED may be connected to

contacts

3 and 2, respectively, and the anode and cathode of each green LED may be connected to

contacts

4 and 1, respectively. By connecting the LED chips 20 having the same emission color in parallel, the LEDs having the same emission color can be simultaneously turned on regardless of the single-color lighting or the double-color lighting. And because two LED chips 20 with the same light-emitting color are symmetrical about the center of the central point, the situation that the light-emitting angle curve is eccentric when the single color is lightened is effectively avoided.

The utility model discloses two-color light emitting component's luminous angle curve is as shown in figure 6.

The utility model discloses preparation flow of double-colored light-emitting component as follows: 1. and (3) crystal solidification: the LED wafer is adhered to the PCB substrate through the die bonding adhesive; 2. baking: fixing the LED wafer on the PCB substrate by baking; 3. welding wires: connecting and conducting the electrodes of the LED wafer on the PCB substrate through gold wires; 4. and (3) die pressing: molding the packaging adhesive (epoxy resin or organic silicon plastic) on the PCB substrate through a die; 5. baking: curing the packaging adhesive by baking; 6. cutting: the product is cut to the design finished size.

According to the utility model discloses double-colored light-emitting component, through set up four LED wafers that constitute 2X 2 array on the base plate, the LED wafer of two kinds of luminous colours is respectively two, and two LED wafers that luminous colour is the same are in the array diagonal line, from this, light simultaneously through making two LED wafers that luminous colour is the same, can avoid the luminous angle curve off-centre when monochromatic lighting to can guarantee higher luminance, luminous effect is better.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A two-color light emitting device, comprising:

the PCB substrate is provided with a die bonding area;

the LED chip structure comprises four LED chips arranged on the PCB substrate, wherein the four LED chips are arranged in the die attach area in a 2 x 2 array mode, the two LED chips in each row or each column of the 2 x 2 array have different light emitting colors, and the two LED chips on each diagonal line have the same light emitting color.

2. The bi-color light emitting component of claim 1 further comprising an encapsulant encapsulating the four LED dies.

3. A bi-color light emitting device as claimed in claim 2, wherein the bottom surface of the encapsulant is circular, and the center point of the 2 x 2 array coincides with the center of the circular bottom surface of the encapsulant.

4. A two-color light emitting device as claimed in claim 3, wherein the bottom lines of two LED chips having the same emission color are connected in parallel.