CN113054059A - Display device, LED package and manufacturing method thereof - Google Patents
Display device, LED package and manufacturing method thereof Download PDFInfo
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- CN113054059A CN113054059A CN202010328690.9A CN202010328690A CN113054059A CN 113054059 A CN113054059 A CN 113054059A CN 202010328690 A CN202010328690 A CN 202010328690A CN 113054059 A CN113054059 A CN 113054059A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides a display device, an LED packaging body and a manufacturing method thereof.A colloid enclosure dam enclosing each solid crystal area is formed around each solid crystal area on a circuit board, then the solid crystal of an LED wafer is completed on the solid crystal area in each colloid enclosure dam, and a sealing material covering the LED wafer is arranged in each colloid enclosure dam to obtain the LED packaging body; therefore, the display device comprising the LED packaging body has good display effect, and has better product quality and product competitiveness.
Description
Technical Field
The present invention relates to the field of Light Emitting Diodes (LEDs), and in particular, to a display device, an LED package and a method for manufacturing the LED package.
Background
The development action plan of the ultra-high definition video industry (2019 and 2022) provides a general technical route of '4K leading and 8K' and greatly promotes the development of the ultra-high definition video industry and the application of the related fields. One of the effective methods for improving the video display quality is to use a flip chip small-pitch COB (chip on Board) as the backlight of the smart screen (liquid crystal display television).
At present, the backlight manufacturing method of the COB LED module is to print solder paste on a substrate, then place an LED chip, perform a test after reflow soldering, mold-press a transparent resin layer with a thickness of about 0.2-0.4 mm above the substrate after the test is OK, and manufacture the COB LED module after drying, for example, a manufactured COB LED module is shown in fig. 1, and the finished product includes a substrate 11, an LED chip directly disposed on the substrate 11, and a transparent resin layer formed by mold-pressing and drying above the substrate, that is, a package adhesive layer 13. The packaging adhesive layer 13 is an integral body, the size of the packaging adhesive layer is close to that of the substrate 11, and the length and the width of the packaging adhesive layer are generally dozens of centimeters; the COB LED module with the structure is easy to cause the situation that the colloid is separated from the substrate or the colloid is cracked in the actual work, so that the backlight function is lost; meanwhile, the LED chips are directly arranged on the circuit board, no reflection cup is arranged at the position of the LED chips, the brightness of the LED chips in the normal direction is high, the brightness among the LED chips is low, the brightness and color difference can occur during light emitting, and the light loss is large; also, the COB LED module has the problems of low light-emitting efficiency, and uneven brightness and color.
Disclosure of Invention
The invention provides a display device, an LED packaging body and a manufacturing method thereof, and solves the problems that the packaging glue of the existing LED module is easy to fall off or crack, so that the reliability is poor, the luminous efficiency is low, and the brightness and the color are easy to be uneven.
In order to solve the above technical problems, an embodiment of the present invention provides a method for manufacturing an LED package, including:
preparing a circuit board, wherein a plurality of die attach regions for placing LED wafers are distributed on the front surface of the circuit board, the die attach regions are electrically connected through a connecting circuit included in the circuit board, and the LED wafers are mini LED wafers or Micro LED wafers;
forming colloid dams surrounding each solid crystal area by printing around each solid crystal area, wherein the colloid dams form bowls of the LED wafers to be arranged in the solid crystal areas, and the adjacent solid crystal areas are isolated by the colloid dams;
the die bonding of the LED wafer is completed in the die bonding area in each colloid dam;
and arranging sealing materials for covering the LED chips in the colloid dams.
In an embodiment of the present invention, on the circuit board, a guide hole for guiding the inflow of the colloid is disposed in an area around each solid crystal region for forming the colloid box dam, and when the colloid for forming the colloid box dam is printed around each solid crystal region, a part of the colloid flows into the guide hole and is bonded with an inner wall of the guide hole after being cured.
In an embodiment of the present invention, forming a colloid dam around each of the solid crystal regions includes:
printing colloid around each solid crystal area, wherein the colloid is white glue or transparent glue;
and curing the printed colloid to form a colloid dam enclosing the solid crystal areas.
In an embodiment of the present invention, the forming of the colloid dam around each solid crystal region includes:
and forming a colloid enclosure dam which encloses the solid crystal areas and has the height of 0.1mm to 1mm around each solid crystal area.
In an embodiment of the present invention, the forming of the colloid dam around each solid crystal region includes:
and forming a colloid box dam surrounding the solid crystal area corresponding to one solid crystal area, wherein the colloid box dams of the adjacent solid crystal areas are mutually separated.
In one embodiment of the present invention, the sealing material may be, but is not limited to, a packaging adhesive, and the disposing of the packaging adhesive covering the LED chip in each of the adhesive dams includes:
transparent glue, semi-transparent glue or luminous conversion glue for covering the LED wafer is arranged in each colloid dam, and the height of the packaging glue is less than or equal to that of the colloid dam.
In one embodiment of the present invention, the sealing material may be, but is not limited to, a packaging adhesive, and the disposing of the packaging adhesive covering the LED chip in each of the adhesive dams includes:
arranging packaging glue for covering the LED wafer in each colloid dam;
and curing the packaging adhesive, wherein the top surface of the cured packaging adhesive is a concave or convex arc surface.
In an embodiment of the present invention, the LED chip is a flip mini LED chip or a flip Micro LED chip.
In order to solve the technical problem, an embodiment of the present invention further provides an LED package, where the LED package is manufactured by the above-described method for manufacturing an LED package.
In order to solve the above technical problem, an embodiment of the present invention further provides a display device, where the display device includes the LED package as described above.
Advantageous effects
The invention provides a display device, an LED packaging body and a manufacturing method thereof, which comprises the steps of preparing a circuit board, wherein a plurality of solid crystal areas for placing LED wafers are distributed on the front surface of the prepared circuit board, the solid crystal areas are electrically connected through a connecting circuit included by the circuit board, and the LED wafers can be but not limited to mini LED wafers or Micro LED wafers; the method comprises the following steps of forming colloid dams surrounding each solid crystal area by printing around each solid crystal area on a circuit board, then completing the solid crystal of an LED wafer on the solid crystal area in each colloid dam, and arranging sealing materials covering the LED wafer in each colloid dam, wherein the LED packaging body prepared by the manufacturing method of the LED packaging body at least has the following advantages:
each solid crystal area can be directly and electrically connected through a connecting circuit included by the circuit board, so that the LED wafers in each solid crystal area are electrically connected to form a backlight source or an illumination source, the structure is simple, the integration level is high, and the product reliability is better;
the colloid dams formed around each solid crystal area can form a bowl cup of the LED wafer positioned in the solid crystal area, so that the LED wafer can be protected, meanwhile, light emitted by the LED wafer can be reflected and mixed through the side wall of the bowl cup to form more uniform light, and the uniformity and the brightness of the emergent light are improved (namely the light-emitting efficiency is improved);
the colloid box dam is directly arranged around the die bonding area on the circuit board, and the conductive metal layer (such as a copper layer) on the circuit board and the colloid box dam form a similar LED support structure, so that an LED support is avoided being independently adopted, the material cost and the manufacturing cost can be reduced, the manufacturing efficiency can be improved, the integrity of the LED packaging body can be improved, and the thickness of the LED packaging body can be reduced;
the colloid enclosing dam enclosing each solid crystal region is formed around each solid crystal region through a printing process, the realization mode is simple, the manufacturing efficiency is high, the cost is low, the precision can completely meet the requirement, the printed colloid has strong covering power and adhesive force, and the consistency is good;
because the adjacent solid crystal regions on the circuit board are isolated by the colloid dam, the sealing material (such as but not limited to packaging glue) arranged in the colloid dam is also isolated into a plurality of small sealing units by the colloid dam, so that the prepared LED packaging body has small thermal expansion influence and stronger thermal stress resistance, the condition that the lamp is dead due to the falling or cracking of the colloid and the like is greatly reduced, and the quality and the reliability of the product are improved.
In addition, in the manufacturing process, since the colloid dams surrounding each solid crystal area are formed around each solid crystal area on the circuit board firstly, and then the solid crystal of the LED wafer is completed on the solid crystal area in each colloid dam, the LED wafer is firstly fixed on the circuit board firstly, and then the colloid dam is formed around each solid crystal area, so that the LED wafer and the circuit connection between the LED wafer and the circuit board can be prevented from being damaged in the setting process of the colloid dams, and the yield and the reliability of the obtained product are higher;
the display device comprising the LED packaging body has good display effect, and has better product quality and product competitiveness due to the advantages of the LED packaging body.
Drawings
FIG. 1 is a schematic diagram of a conventional LED package;
fig. 2 is a first schematic flow chart illustrating a method for manufacturing an LED package according to an embodiment of the present invention;
fig. 3 is a schematic flow chart illustrating a manufacturing method of an LED package according to an embodiment of the present invention;
fig. 4 is a second schematic diagram of an LED package according to an embodiment of the invention;
fig. 5 is a third schematic view of an LED package according to an embodiment of the present invention;
fig. 6 is a fourth schematic view of an LED package according to an embodiment of the present invention;
fig. 7 is a perspective view of the LED package in fig. 4 to 6;
fig. 8 is a fifth schematic view of an LED package according to an embodiment of the present invention;
fig. 9 is a sixth schematic view of an LED package according to an embodiment of the present invention;
fig. 10 is a seventh schematic view of an LED package according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention are described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Compared with the existing LED packaging body, the manufactured LED packaging body at least has the advantages of being more uniform in light emitting, higher in light emitting efficiency, good in integrity, low in cost, smaller in thermal expansion influence, stronger in thermal stress resistance, better in product quality and reliability and the like.
For ease of understanding, the present embodiment will be described below with reference to a method for manufacturing the LED package shown in fig. 2 as an example.
Referring to fig. 2, a method for manufacturing an LED package includes:
s201: a circuit board is prepared.
It should be understood that the type of the circuit board in this embodiment can be flexibly selected, and can be a flexible circuit board, and the material of the circuit board can be flexibly selected, for example, but not limited to, epoxy glass fiber board FR-4, FR-1, CEM-3, thick copper foil, high TG circuit board, aluminum-based circuit board, copper-based board, halogen-free board, rocky high frequency board, PTFE polytetrafluoroethylene, Teflon, ceramic board, Polyimide (PI), BT material, etc.
The front surface of the circuit board in the embodiment is provided with a plurality of solid crystal areas for placing the LED wafers, and each solid crystal area can be directly electrically connected through a connecting circuit included by the circuit board, so that the LED wafers in each solid crystal area are electrically connected to form a backlight source or an illumination source, the structure is simple, the integration level is high, and the reliability of the product is better. And correspondingly, the die bonding area is provided with an electrode connecting area which is electrically conducted with a connecting circuit on the circuit board and is used for being respectively and electrically connected with the positive electrode and the negative electrode of the LED wafer. In this embodiment, one die attach area may be used to dispose one LED chip, or two or more LED chips may be disposed as required, and when two or more LED chips are disposed, the electrical connection manner between the LED chips may be serial connection, parallel connection, or combination of serial and parallel connection. The number, type, light emitting color and electrical connection mode between the LED chips disposed in each die bonding region may be the same, or may be different or partially different according to the arrangement. The LED wafers between the solid crystal regions (namely, the solid crystal regions) can be electrically connected according to requirements, and the electrical connection mode can be series connection, parallel connection or series-parallel connection combination; of course, in some application scenarios, it may be also possible to set the LED chips between some of the die bonding regions not to be electrically connected. The method can be flexibly set according to application requirements.
The LED chip disposed in the die attach region in this embodiment may be, but is not limited to, a mini LED chip or a Micro LED chip. In some application scenarios, the set mini LED wafer or Micro LED wafer can be an inverted mini LED wafer or an inverted Micro LED wafer, can also be a positively-mounted mini LED wafer or a positively-mounted Micro LED wafer, and can be flexibly set according to requirements.
S202: and forming a colloid enclosure dam surrounding each solid crystal area on the circuit board around each solid crystal area.
The colloid dam formed in the step forms a bowl cup of the LED wafer to be arranged in the solid crystal area, so that light emitted by the LED wafer in the solid crystal area can be emitted and refracted through the side wall of the bowl cup and is emitted in a mixed mode, the brightness of the emitted light can be improved, and the uniformity of the emitted light can be improved; meanwhile, the bowl cup can also form physical protection on the LED wafer in the wafer fixing area, and the safety of the LED wafer is improved.
In this step, after a colloid dam enclosing each solid crystal region is formed around each solid crystal region on the circuit board, each adjacent solid crystal region on the front surface of the circuit board is isolated by the colloid dam.
In addition, it should be understood that the manner of forming the colloid enclosure surrounding each solid crystal region around each solid crystal region on the circuit board in the embodiment may also be flexibly arranged. For example, in one example, a glue may be printed around each die attach area on the circuit board by a printing process, and then the glue may be cured to form a glue dam. The colloid enclosing dam enclosing each solid crystal region is formed around each solid crystal region through a printing process, the process is simple, the manufacturing efficiency is high, the cost is low, the precision is good, the covering power and the adhesive force of the printed colloid are strong, and the consistency is good.
The type of the colloid forming the dam in this embodiment may also be flexibly set according to the requirement, for example, but not limited to, white glue or transparent glue may be adopted, and the selected white glue or transparent glue may be a thermosetting type, and may also be a UV type. One example arrangement may include:
arranging a steel mesh or a silk screen with a corresponding pattern on the front surface of the circuit board, exposing the area for forming the colloid box dam around each solid crystal area on the circuit board out of the steel mesh or the silk screen, closely covering other areas on the front surface of the circuit board by the steel mesh or the silk screen, and then printing colloid on the steel mesh or the silk screen so as to arrange the colloid for forming the colloid box dam around each solid crystal area;
and curing the printed colloid (the colloid can be cured by high-temperature baking when the colloid is in a thermosetting type, and can be cured by UV irradiation when the colloid is in a UV type) to form a colloid dam enclosing each solid crystal region.
It should be understood that in some application scenarios, a colloid dam may also be formed around each die bonding region on the circuit board by means of molding; at the moment, a steel male die and a steel female die with corresponding structures are needed to be customized, the circuit board is clamped between the male die and the female die, corresponding cavities are formed corresponding to the areas, used for forming the colloid box dam, around each solid crystal area on the circuit board, the cavities are communicated with corresponding glue injection ports on the male die and the female die, other areas on the front side of the circuit board are covered by the male die or the female die in a clinging mode, and then the colloid is injected into the cavities through the glue injection ports. Compared with the printing mode, the mould pressing mode has the disadvantages of complex process, low efficiency, weak colloid covering force and adhesive force and high cost.
In the embodiment, the height of the formed colloid box dam can be flexibly set according to requirements, and the height can be greater than that of the LED wafer; of course, the height of the LED chip can be set to be less than or equal to the height of the LED chip according to the requirement in some application scenarios.
In this embodiment, the height of the colloid dam is preferably greater than the height of the LED chip, for example, in an example, the colloid dam surrounding each die bonding area on the circuit board may include: and forming a colloid dam which surrounds each solid crystal area on the front surface of the circuit board and has a height of 0.1mm to 1mm, wherein the colloid dam can be 0.1mm, 0.2mm, 0.3mm, 0.5mm, 0.7mm, 0.8mm, 0.9mm or 1mm and the like.
In this example, the shape enclosed by the colloid dams, that is, the shape of the formed bowl cup, may also be flexibly set according to requirements, for example, in an example, in consideration of the light-emitting angle between the side surface and the front surface of the LED wafer, in order to further improve the light-emitting brightness and the light mixing effect of the LED wafer, the inner side surface of each colloid dam located in the corresponding solid crystal region may be an inclined surface, that is, the inner side surface of the formed bowl cup is an inclined surface, and the inclination angle of the inclined surface (that is, the included angle between the inner side surface and the front surface of the substrate) may also be flexibly set according to requirements, for example, may be set to any one angle between 15 ° to 75 ° (for example, but not limited to 30 °, 45 °, 60 °), and the opening size of the bowl cup formed in this way is.
In an example of this embodiment, the colloid dams surrounding the solid crystal regions are formed around the solid crystal regions on the front surface of the circuit board, and the colloid dams of adjacent solid crystal regions may be connected into a whole, that is, the colloid layer forming the colloid dams on the front surface of the circuit board may be an integrally formed colloid layer.
In another example of this embodiment, the colloid dams surrounding the solid crystal regions are formed around the solid crystal regions on the front surface of the circuit board, and the colloid dams of adjacent solid crystal regions are separated from each other, that is, the colloid layer forming the colloid dams on the front surface of the circuit board does not completely cover the circuit board area between the adjacent solid crystal regions. The colloid layer forming the colloid box dam is also divided into a plurality of small units, so that the influence of thermal expansion of the prepared LED packaging body is further smaller, the thermal stress resistance is stronger, the condition that the lamp is dead due to the falling or cracking of the colloid is further reduced, and the quality and the reliability of the product are improved; meanwhile, the area of the circuit board which is not covered by the colloid layer can be directly utilized to radiate heat outwards, and the radiating efficiency is improved.
Optionally, in this embodiment, around each die bonding area on the front surface of the circuit board, in an area corresponding to the colloid box dam, a guide hole for guiding the inflow of the colloid may be further provided; therefore, when the colloid is arranged around each solid crystal area on the front surface of the circuit board to form the colloid box dam, the arranged colloid can flow into the guide hole, and after the colloid is solidified, for example, the colloid in the guide hole is combined with the inner wall of the guide hole, so that the connection strength of the colloid on the circuit board is improved, and the reliability of a product can be further improved. It should be understood that the shape (regular shape or irregular shape), size and number of the guide holes can be flexibly set in this embodiment as long as the above purpose is achieved. The guide hole can penetrate through the back surface of the circuit board or not, and the specific depth of the guide hole can be flexibly set according to requirements. Of course, the area corresponding to the colloid box dam around each die-bonding area on the front surface of the circuit board can be set to be a rough surface to improve the bonding strength between the colloid and the circuit board.
In the embodiment, the colloid box dam is directly arranged around the die bonding area on the circuit board, and the conductive metal layer (such as a copper layer) on the circuit board and the colloid box dam form a similar LED support structure, so that an LED support is avoided being independently adopted, the material cost and the manufacturing cost can be reduced, the manufacturing efficiency can be improved, the integrity of the LED packaging body can be improved, and the thickness of the LED packaging body can be reduced.
S203: and completing die bonding of the LED wafer in the die bonding area in each colloid dam.
In this embodiment, the LED chips can be placed on the die attach area by, but not limited to, the die attach or bulk transfer function, and the electrode of each LED chip is electrically connected to the corresponding electrode connection area in the die attach area.
In some application scenarios, after the conductive connection material such as silver paste or solder paste is printed at the electrode connection region in the die attach region, the LED chip can be placed in the die attach region by using the function of a die attach machine or a bulk transfer machine. In other application scenarios, if the LED chip with the solder is adopted, the conductive connecting material such as silver paste or tin paste does not need to be printed at the electrode connecting area in the die bonding area.
In this embodiment, since the colloid dams surrounding the die bonding regions are formed around the die bonding regions on the circuit board, and then the die bonding of the LED chips is completed on the die bonding regions in the colloid dams, the die bonding of the LED chips on the circuit board is completed first, and then the colloid dams are formed around the die bonding regions, so that the LED chips, the circuit connection between the LED chips and the circuit board can be prevented from being damaged during the arrangement of the colloid dams, and the yield and reliability of the obtained product are higher.
S204: sealing materials for covering the LED chips are arranged in the colloid dams on the circuit board.
In the embodiment, the sealing material which is arranged in each colloid enclosure dam and covers the LED wafer can provide reliable physical protection for the LED wafer; and it should be understood that the material selected for the sealing material may be flexibly selected. For example, in one example, the encapsulant may be, but is not limited to, an encapsulant.
In this embodiment, when the sealing material is an encapsulation adhesive, the encapsulation adhesive may be disposed in each of the adhesive dams by, but not limited to, dispensing, spraying, printing, molding, and the like. And the selected packaging adhesive can be transparent adhesive or semitransparent adhesive, and can also be luminous conversion adhesive or other types of packaging adhesive. And the colloid can adopt but not limited to epoxy resin, silica gel or UV gel and the like. And the specific arrangement of the packaging adhesive in this embodiment can be flexibly set according to, but not limited to, the color of the light required to be emitted by the LED package.
And optionally, in some application examples, a quantum dot film (QD film) may be further disposed on the LED wafer according to requirements, and the quantum dot film is located between the LED wafer and the encapsulant layer, in which case the encapsulant layer may be disposed as, but not limited to, a transparent adhesive layer or a semi-transparent adhesive layer.
In some examples of this embodiment, the height of the packaging adhesive that sets up in the colloid box dam is preferred to be set up to be less than or equal to the height of colloid box dam, like this because keep apart through the colloid box dam between the adjacent solid crystalline region on the circuit board, the packaging adhesive that sets up in the colloid box dam is kept apart into a plurality of little packaging adhesive units by the colloid box dam too, thereby it is less to make the LED packaging body that makes thermal expansion influence, it is stronger to resist thermal stress ability, thereby the condition that the colloid drops or ftractures etc. and lead to dying the lamp to appear greatly reduced, the quality and the reliability of product have been improved.
In this example, the shape of the top surface of the encapsulation adhesive provided in each colloid dam can also be flexibly set according to the requirement. For example, in one example, the top surface of the encapsulation adhesive may be a concave arc surface to form a similar concave lens, and the top surface of the encapsulation adhesive may also be a convex arc surface to form a similar convex lens; the specific radian of the top surface can be flexibly selected according to specific application scenes, so that the light-emitting uniformity and the light-emitting brightness are further improved.
The present embodiment also provides a display device, which may include the LED package as exemplified above. The display device in this embodiment may include, but is not limited to, a COB lighting device (e.g., COB lamp bar, COB lamp, etc.), a display screen light source device (e.g., backlight light source, or direct display screen light source device).
For convenience of understanding, in the present embodiment, the following description is made in conjunction with some specific process flow steps to exemplarily describe a manufacturing process of an LED package, and please refer to fig. 3, which includes:
s301: preparing a PCB301, wherein a plurality of die bonding areas for placing the LED wafers are distributed on the front surface of the PCB, and electrode connecting areas which are electrically communicated with circuits on the PCB and are respectively electrically connected with the positive electrodes and the negative electrodes of the LED wafers are correspondingly arranged on the die bonding areas. And guide holes for guiding the flowing-in of the colloid can be arranged around each solid crystal area on the front surface of the PCB in the area corresponding to the colloid box dam, so that the bonding force is improved.
S302: a white glue (e.g., white oil) or a transparent glue (e.g., thermosetting resin) is printed around each die attach area on the front surface of the PCB, and the printed white glue or transparent glue is baked or UV-irradiated to form a glue dam 32.
S303: and placing silver paste or tin paste on the electrode connecting area of each solid crystal area.
S304: the flip-chip LED chip 33 is placed in each die bonding area, and the positive and negative electrodes of the LED chip are connected to the corresponding electrode bonding areas through silver paste or solder paste, respectively, and die bonding is completed by baking or reflow soldering.
S305: after the test is passed, the encapsulation glue 34 (which may be UV type or thermosetting type resin, although other sealing materials may be provided in this step) is filled into each colloid box dam 32 through the glue injection device 4, the glue spraying device, or the glue printing device.
S306: after the packaging adhesive 34 is filled, the packaging adhesive is baked through UV irradiation or high-temperature baking to obtain an LED package in S307; and the obtained LED package can be further tested.
In the LED package obtained at S307 in fig. 3, one LED chip is disposed in one colloid dam 32, and it should be understood that a plurality of LED chips may be disposed as required. The vertical cross section of the cavity formed by the colloid dam 32 on the PCB31 is an inverted trapezoid, that is, the inner wall of the colloid dam 32 is an inclined surface. The encapsulant 34 is a concave arc on the top surface of the encapsulant dam 32 to form a similar concave lens. Of course, the LED packages shown in fig. 4 to 10 can also be manufactured by the manufacturing process shown in fig. 3, wherein:
compared with the LED package obtained in S307 of fig. 3, the height of the encapsulant 34 in the LED package shown in fig. 4 is higher and is substantially flush with the top surface of the encapsulant dam 32, that is, the specific height of the encapsulant 34 can be flexibly set.
In the LED package shown in fig. 5, compared to the LED package shown in fig. 4, the top surface of the encapsulant dam 32 is an arc surface protruding upwards to form a similar convex lens, so as to further improve the brightness and uniformity of the emitted light.
In the LED package shown in fig. 6, compared to the LED packages shown in fig. 4 and 5, the encapsulation adhesive 34 is planar on the top surface of the colloid dam 32 and is flush with the top surface of the colloid dam 32, but the top surface of the colloid dam 32 may be lower than the top surface of the colloid dam 32 or higher than the top surface of the colloid dam 32 according to requirements.
The LED package shown in fig. 7 is a perspective view of the LED package shown in fig. 4-6.
The LED packages shown in fig. 8, 9 and 10 are separated from the LED packages shown in fig. 4, 5 and 6, respectively, so that the thermal expansion between the PCB31 and the gel dam 32 is less affected, the thermal stress resistance is high, and the heat dissipation effect is better.
It should be understood that the LED packages shown in fig. 4 to 10 are not limited to being manufactured by the manufacturing method exemplified in the present embodiment. In the LED packages shown in fig. 4 to 10, compared to the LED package shown in fig. 1, the colloid dam 32 formed around each die bonding region on the PCB31 can protect the LED chip, and the light emitted from the LED chip can be reflected and mixed by the side wall of the bowl cup to form more uniform light, so that the uniformity and brightness of the emitted light are improved (i.e., the light emitting efficiency is improved); meanwhile, the LED support can be avoided being adopted independently, so that the material cost and the manufacturing cost can be reduced, the manufacturing efficiency can be improved, the integrity of the LED packaging body can be improved, and the thickness of the LED packaging body can be reduced; because the adjacent solid crystal areas on the PCB31 are isolated by the colloid box dam, the packaging adhesive 34 arranged in the colloid box dam 32 is also isolated into a plurality of small packaging adhesive units by the colloid box dam, so that the prepared LED packaging body has small thermal expansion influence, the thermal stress resistance is stronger, and the condition that the lamp is dead due to the falling or cracking of the colloid is greatly reduced. And the LED packaging body is not only suitable for blue light chip backlight (white light is generated by matching with the QD film), but also suitable for fluorescent glue white light emitting backlight, and the product comprehensive competitiveness of the LED packaging body is improved.
The foregoing is a more detailed description of embodiments of the present invention, and the present invention is not to be considered limited to such descriptions. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Claims (10)
1. A method for manufacturing an LED package body is characterized by comprising the following steps:
preparing a circuit board, wherein a plurality of die attach regions for placing LED wafers are distributed on the front surface of the circuit board, the die attach regions are electrically connected through a connecting circuit included in the circuit board, and the LED wafers are mini LED wafers or Micro LED wafers;
forming colloid dams surrounding each solid crystal area by printing around each solid crystal area, wherein the colloid dams form bowls of the LED wafers to be arranged in the solid crystal areas, and the adjacent solid crystal areas are isolated by the colloid dams;
the die bonding of the LED wafer is completed in the die bonding area in each colloid dam;
and arranging sealing materials for covering the LED chips in the colloid dams.
2. The method of manufacturing an LED package according to claim 1, wherein a via hole for guiding inflow of the gel is provided in a region around each of the die regions for forming the gel dam, and when the gel for forming the gel dam is printed around each of the die regions, a part of the gel flows into the via hole and is bonded to an inner wall of the via hole after curing.
3. The method of manufacturing an LED package according to claim 1, wherein forming a colloid dam around each of the die attach regions comprises:
printing colloid around each solid crystal area, wherein the colloid is white glue or transparent glue;
and curing the printed colloid to form a colloid dam enclosing the solid crystal areas.
4. The method for manufacturing an LED package according to any one of claims 1 to 3, wherein the forming of the colloid dam around each of the die bonding regions includes:
and forming a colloid enclosure dam which encloses the solid crystal areas and has the height of 0.1mm to 1mm around each solid crystal area.
5. The method for manufacturing an LED package according to any one of claims 1 to 3, wherein the forming of the colloid dam around each of the die bonding regions includes:
and forming a colloid box dam surrounding the solid crystal area corresponding to one solid crystal area, wherein the colloid box dams of the adjacent solid crystal areas are mutually separated.
6. The method of any of claims 1-3, wherein the encapsulant is encapsulant, and disposing encapsulant covering the LED chip in each encapsulant dam comprises:
transparent glue, semi-transparent glue or luminous conversion glue for covering the LED wafer is arranged in each colloid dam, and the height of the packaging glue is less than or equal to that of the colloid dam.
7. The method of any of claims 1-3, wherein the encapsulant is encapsulant, and disposing encapsulant covering the LED chip in each encapsulant dam comprises:
arranging packaging glue for covering the LED wafer in each colloid dam;
and curing the packaging adhesive, wherein the top surface of the cured packaging adhesive is a concave or convex arc surface.
8. The method for manufacturing an LED package according to any one of claims 1 to 3, wherein the LED chip is a flip mini LED chip or a flip Micro LED chip.
9. An LED package, wherein the LED package is manufactured by the method of manufacturing the LED package according to any one of claims 1 to 8.
10. A display device, characterized in that the display device comprises the LED package according to claim 9.
Priority Applications (2)
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| CN202010328690.9A CN113054059A (en) | 2020-04-23 | 2020-04-23 | Display device, LED package and manufacturing method thereof |
| PCT/CN2021/086602 WO2021213204A1 (en) | 2020-04-23 | 2021-04-12 | Led substrate, led package and manufacturing method therefor, and display device |
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| CN202010328690.9A CN113054059A (en) | 2020-04-23 | 2020-04-23 | Display device, LED package and manufacturing method thereof |
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