CN113885211A - Display screen, preparation method of display screen and head-mounted device - Google Patents
Display screen, preparation method of display screen and head-mounted device Download PDFInfo
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- CN113885211A CN113885211A CN202111321222.XA CN202111321222A CN113885211A CN 113885211 A CN113885211 A CN 113885211A CN 202111321222 A CN202111321222 A CN 202111321222A CN 113885211 A CN113885211 A CN 113885211A
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/01—Head-up displays
- G02B27/017—Head mounted
- G02B27/0176—Head mounted characterised by mechanical features
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
- G09G3/36—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/01—Head-up displays
- G02B27/017—Head mounted
- G02B2027/0178—Eyeglass type
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- Crystallography & Structural Chemistry (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Control Of Indicators Other Than Cathode Ray Tubes (AREA)
Abstract
The invention relates to the technical field of head display, and provides a display screen, a preparation method of the display screen and head-mounted equipment, wherein the display screen comprises: a CMOS integrated circuit driving substrate; the Micro LED light-emitting chip is arranged on one side of the CMOS integrated circuit driving substrate and is electrically connected with the CMOS integrated circuit driving substrate; the optical sealant is arranged on one side of the light emitting surface of the Micro LED light emitting chip and used for sealing the Micro LED light emitting chip. According to the display screen provided by the invention, the Micro LED light-emitting chip has the characteristics of small size, high integration level and self-luminescence, so that the display brightness and the resolution of the display screen can be improved, the pixel density can reach more than 1500PPI, meanwhile, the energy consumption can be reduced, the cruising ability can be improved, and the service life can be prolonged.
Description
Technical Field
The invention relates to the technical field of head display, in particular to a display screen, a preparation method of the display screen and head-mounted equipment.
Background
Consumers can go to the cinema when watching movies, with the improvement of the image quality effect of high-end televisions and projection, some consumers establish home cinemas at home, but the cinema effect is difficult to achieve due to the limitation of the conditions of sound insulation, shading, space and the like of the home environment. With the development of science and technology development, VR (Virtual Reality) technology and AR (Augmented Reality) technology are gradually applied to video entertainment, but the display screen of the existing AR/VR glasses is an LCD or OLED display screen, which is not high in resolution and brightness, and the cruising ability is not good.
Disclosure of Invention
The invention aims to provide a display screen, a preparation method of the display screen and head-mounted equipment, and aims to solve the technical problems that in the prior art, the display screen of AR/VR glasses adopts an LCD display screen or an OLED display screen, so that the resolution and the brightness are not high, and the cruising ability is not good.
In order to achieve the purpose, the invention adopts the technical scheme that:
in one aspect, the present invention provides a display screen, comprising:
a CMOS integrated circuit driving substrate;
the Micro LED light-emitting chip is arranged on one side of the CMOS integrated circuit driving substrate and is electrically connected with the CMOS integrated circuit driving substrate;
the optical sealant is arranged on one side of the light emitting surface of the Micro LED light emitting chip and used for sealing the Micro LED light emitting chip.
According to the display screen, one side, close to the Micro LED light-emitting chip, of the CMOS integrated circuit driving substrate is provided with the pad position, the pad position is provided with the UBM pad, the UBM pad is connected with the CMOS integrated circuit driving substrate, and the UBM pad is connected with the Micro LED light-emitting chip.
According to the display screen, the display screen further comprises a supporting plate, the supporting plate is arranged on one side, away from the Micro LED light-emitting chip, of the CMOS integrated circuit driving substrate, and the supporting plate is connected with the CMOS integrated circuit driving substrate through glue.
According to the display screen, the supporting plate is a curved surface supporting plate.
According to the display screen, the supporting plate is a resin sheet; alternatively, the support plate is a glass sheet.
According to the display screen, the size of the Micro LED light-emitting chip is not larger than 8 um.
In another aspect, the present invention further provides a method for manufacturing a display screen, which is used for manufacturing the display screen, and includes:
providing a CMOS integrated circuit driving substrate, wherein the CMOS integrated circuit driving substrate is provided with a pad position;
manufacturing a UBM bonding pad at the bonding pad position;
transferring the Micro LED light-emitting chip to the CMOS integrated circuit driving substrate, wherein the UBM bonding pad is welded at low temperature so as to fix the Micro LED light-emitting chip on the CMOS integrated circuit driving substrate and be electrically connected with the CMOS integrated circuit driving substrate;
and arranging an optical sealant on one side of the light emitting surface of the Micro LED light emitting chip, and sealing the Micro LED light emitting chip by the optical sealant to form a Micro LED display panel.
According to the preparation method of the display screen, after the step of arranging the optical sealant on one side of the light emitting surface of the Micro LED light emitting chip, the optical sealant seals the Micro LED light emitting chip to form the Micro LED display panel, the preparation method further comprises the following steps of:
and placing the manufactured Micro LED display panel on a support plate, and bonding the substrate of the CMOS integrated circuit drive substrate with the support plate through glue.
In three aspects, the invention further provides a head-mounted device, which comprises the display screen;
the head-mounted equipment further comprises a helmet bracket and a glasses bracket;
the glasses bracket is convexly arranged on the helmet bracket, the display screen is arranged on one side of the glasses bracket, which is far away from the helmet bracket, the display direction of the display screen faces to the eyes of a helmet wearer, and a shading cavity is arranged between the helmet bracket and the display screen;
the helmet support is provided with a control circuit board, and the control circuit board is electrically connected with the CMOS integrated circuit driving substrate of the display screen.
According to the head-mounted device, the helmet support and the glasses support are both made of plastic materials;
and/or the head-mounted equipment further comprises an FPC (flexible printed circuit) circuit board, wherein one end of the FPC circuit board is electrically connected with the CMOS integrated circuit driving substrate, and the other end of the FPC circuit board is electrically connected with the control circuit board;
and/or the head-mounted equipment further comprises a Bluetooth module, the Bluetooth module is electrically connected with the control circuit board, and the Bluetooth module is used for carrying out Bluetooth connection with external equipment;
and/or the head-mounted equipment further comprises a data transmission line, one end of the data transmission line is electrically connected with the control circuit board, and the other end of the data transmission line is used for carrying out data connection with external equipment;
and/or the head-mounted equipment further comprises a power line, one end of the power line is electrically connected with the control circuit board, and the other end of the power line is used for being electrically connected with an external charging seat;
and/or the head-mounted equipment further comprises a sound box, wherein the sound box is arranged on the helmet bracket and is electrically connected with the control circuit board;
and/or the head-mounted equipment further comprises a sound adjusting knob, wherein the sound adjusting knob is arranged on the helmet bracket and is electrically connected with the control circuit board;
and/or the head-mounted equipment further comprises a screen brightness adjusting knob, the screen brightness adjusting knob is arranged on the helmet bracket and is electrically connected with the control circuit board;
and/or the head-mounted equipment further comprises an adjusting support frame, and the adjusting support frame is arranged at the top of the helmet support;
and/or the head-mounted equipment further comprises a nose bridge support frame, the nose bridge support frame is connected with the helmet support frame, and a leather pad wraps the nose bridge support frame.
The display screen, the preparation method of the display screen and the head-mounted equipment provided by the invention have the beneficial effects that:
according to the display screen, the preparation method of the display screen and the head-mounted device, the display screen is arranged on the head-mounted device, the Micro LED light-emitting chip is arranged on the CMOS integrated circuit driving substrate and is electrically connected with the display screen, then the optical sealant is arranged on one side of the light-emitting surface of the Micro LED light-emitting chip and is used for sealing the Micro LED light-emitting chip, and after the optical sealant is used for sealing, the Micro LED light-emitting chip can be protected mechanically, protected from oxygen and protected from water, and the phenomenon of light reflection is reduced. Meanwhile, the Micro LED light-emitting chip has the characteristics of small size, high integration level and self-luminescence, so that the display brightness of the display screen can be improved, the resolution ratio can be improved, the pixel density can reach more than 1500PPI, the energy consumption can be reduced, the cruising ability can be improved, and the service life can be prolonged.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a display panel (after UBM pads are formed on a CMOS integrated circuit driving substrate) according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a display screen (a Micro LED light emitting chip is transferred onto a CMOS integrated circuit driving substrate) according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a display screen (after sealing the Micro LED light emitting chip) according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a display screen (after a support plate is attached to a substrate side of a CMOS integrated circuit driving substrate) according to an embodiment of the present invention;
FIG. 5 is a schematic view of a process for manufacturing a display panel according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a head-mounted device according to an embodiment of the present invention.
Wherein, in the figures, the respective reference numerals:
100. a display screen; 110. a CMOS integrated circuit driving substrate; 111. a UBM pad; 120. a Micro LED light emitting chip; 130. an optical sealant; 140. a support plate; 150. glue; 200. a helmet support; 210. a control circuit board; 220. a Bluetooth module; 230. a data transmission line; 240. a power line; 250. sounding; 260. a sound adjusting knob; 270. a screen brightness adjusting knob; 300. a spectacle frame; 310. a light-shielding cavity; 400. adjusting the support frame; 500. a nose bridge support; 1000. a head-mounted device.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly or indirectly secured to the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positions based on the orientations or positions shown in the drawings, and are for convenience of description only and not to be construed as limiting the technical solution. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.
Referring to fig. 1 to 4, the present embodiment provides a display screen 100, including: a CMOS integrated circuit driving substrate 110, a Micro LED light emitting chip 120 and an optical sealant 130; the Micro LED light emitting chip 120 is disposed on one side of the CMOS integrated circuit driving substrate 110 and electrically connected to the CMOS integrated circuit driving substrate 110; the optical sealant 130 is arranged on one side of the light emitting surface of the Micro LED light emitting chip 120, and the optical sealant 130 is used for sealing the Micro LED light emitting chip 120.
The working principle and the beneficial effects of the display screen 100 provided by the embodiment are as follows:
the display screen 100 provided by the embodiment is used for being arranged on the head-mounted device 1000, after the Micro LED light-emitting chip 120 is arranged and electrically connected on the CMOS integrated circuit driving substrate 110, then the optical sealant 130 is arranged on one side of the light-emitting surface of the Micro LED light-emitting chip 120, the optical sealant 130 is used for sealing the Micro LED light-emitting chip 120, after the optical sealant 130 is adopted for sealing the sealant, the Micro LED light-emitting chip 120 can be protected mechanically and protected from oxygen and water, and the phenomenon of light reflection is reduced. Meanwhile, the Micro LED light-emitting chip 120 has the characteristics of small size, high integration level and self-luminescence, so that the display brightness of the display screen can be improved, the resolution ratio can be improved, the pixel density can reach more than 1500PPI, the energy consumption can be reduced, the cruising ability can be improved, and the service life can be prolonged.
In one embodiment, the size of the Micro LED light emitting chip 120 is not greater than 8um, so that the pixel density of the display screen can reach more than 1500PPI, preferably, the pixel density of the display screen is 2000PPI to 4000PPI, and the size of the display screen with a resolution of 4K is only about 2 inches.
In one embodiment, a pad site is disposed on one side of the CMOS integrated circuit driving substrate 110 close to the Micro LED light emitting chip 120, the pad site is provided with a UBM pad 111, the UBM pad 111 is connected to the CMOS integrated circuit driving substrate 110, and the UBM pad 111 is connected to the Micro LED light emitting chip 120. The UBM pad 111 is made of a multi-layer metal material such as indium, titanium, molybdenum, gold, etc., and when the metal material generates light reflection, the optical sealant 130 can reduce the occurrence of light reflection. The UBM bonding pad 111 is used as a welding material of the Micro LED light-emitting chip 120, the welding temperature of the subsequent massive transfer of the Micro LED light-emitting chip 120 can be reduced due to the low melting point of the alloy material, and the Micro LED light-emitting chip 120 can be better protected and prevented from being damaged due to the low-temperature welding because the thicknesses of the CMOS integrated circuit driving substrate 110 and the Micro LED light-emitting chip 120 are thinner. When the Micro LED light emitting chip 120 is transferred, the Micro LED light emitting chip 120 is transferred to the CMOS integrated circuit driving substrate 110 by a bulk transfer method, and low temperature soldering is performed to fix the Micro LED light emitting chip 120 on the CMOS integrated circuit driving substrate 110 and realize circuit connection.
Optionally, the optical sealant 130 is optical resin, or the optical sealant 130 is optical silica gel.
Optionally, the optical sealant 130 may be mixed with melanin such as carbon powder to increase contrast.
Optionally, the surface of the optical sealant 130 is matte, so that the matte surface can reduce glare, and improve image quality and viewing effect.
In one embodiment, the display screen 100 further includes a supporting plate 140, the supporting plate 140 is disposed on a side of the CMOS integrated circuit driving substrate 110 away from the Micro LED light emitting chip 120, and the supporting plate 140 is connected to the CMOS integrated circuit driving substrate 110 through a glue 150. A supporting plate 140 is further disposed on a side of the CMOS integrated circuit driving substrate 110 away from the Micro LED light emitting chip 120 and fixed by glue 150, so that the CMOS integrated circuit driving substrate 110 and the supporting plate 140 can be connected very firmly and the connection manner is simple. Because the thicknesses of the CMOS integrated circuit driving substrate 110 and the Micro LED light emitting chip 120 are relatively thin, the supporting plate 140 can support the whole CMOS integrated circuit driving substrate 110, so as to improve the strength of the whole display screen 100, and meanwhile, the supporting plate 140 can also be used for manufacturing display screens 100 with different shapes.
In one embodiment, the support plate 140 is a curved support plate. When the display screen 100 needs to be manufactured, the supporting plate 140 is manufactured into a curved supporting plate or the manufactured curved supporting plate is selected, the substrate of the CMOS integrated circuit driving substrate 110 is thinned, and then the CMOS integrated circuit driving substrate 110 on which the Micro LED light emitting chip 120 and the optical sealant 130 are manufactured is placed on the curved supporting plate and attached to the curved supporting plate, so that the formed display screen 100 is the display screen 100.
In one embodiment, the supporting plate 140 is a resin sheet, and the material of the supporting plate 140 is a resin material, which can reduce the weight of the entire display screen 100.
In another embodiment, the supporting plate 140 is a glass plate, and the material of the supporting plate 140 is a glass material, which can reduce the weight of the entire display screen 100.
Referring to fig. 5 in combination with fig. 1 to 4, the present embodiment further provides a method for manufacturing a display screen 100, for manufacturing the display screen 100, including the following steps:
step S101, providing the CMOS integrated circuit driving substrate 110: the CMOS integrated circuit driving substrate 110 is provided with a pad position;
step S102, manufacturing a UBM pad 111: fabricating UBM pads 111 at the pad sites;
step S103, bulk transfer of Micro LED light emitting chips 120: transferring the Micro LED light-emitting chip 120 onto the CMOS integrated circuit driving substrate 110, and fixing the Micro LED light-emitting chip 120 on the CMOS integrated circuit driving substrate 110 by using the UBM bonding pad 111 through low-temperature welding and electrically connecting the Micro LED light-emitting chip with the CMOS integrated circuit driving substrate 110;
step S104, sealing glue: an optical sealant 130 is arranged on one side of the light emitting surface of the Micro LED light emitting chip 120, and the optical sealant 130 seals the Micro LED light emitting chip 120 to form a Micro LED display panel.
The preparation method of the display screen 100 provided by the embodiment has the following beneficial effects:
in the manufacturing method of the display screen 100 provided by this embodiment, the UBM pad 111 is disposed at the pad position of the CMOS integrated circuit driving substrate 110, and the UBM pad 111 is made of multiple layers of metal materials such as indium, titanium, molybdenum, and gold, and when the Micro LED light emitting chip 120 is fixed, because the thicknesses of the CMOS integrated circuit driving substrate 110 and the Micro LED light emitting chip 120 are relatively thin, the UBM pad 111 is welded at a low temperature, so that the Micro LED light emitting chip 120 can be better protected and prevented from being damaged. Meanwhile, the Micro LED light emitting chip 120 is adopted in the embodiment, and the Micro LED light emitting chip 120 has the characteristics of small size, high integration level and self-luminescence, so that the display brightness of the display screen can be improved, the resolution ratio can be improved, the pixel density can reach more than 1500PPI, the energy consumption can be reduced, the cruising ability can be improved, and the service life can be prolonged. The Micro LED light-emitting chip 120 is sealed by the optical sealant 130, and the Micro LED light-emitting chip 120 can be protected mechanically, protected from oxygen and water after being sealed by the optical sealant 130, and the phenomenon of light reflection is reduced.
In one embodiment, referring to fig. 5, after the step of encapsulating, the method further includes:
step S105, attaching the formed Micro LED display panel to the supporting plate 140: the manufactured Micro LED display panel is placed on a support plate 140, and then the substrate of the CMOS integrated circuit driving substrate 110 is bonded to the support plate 140 by glue 150.
The Micro LED display panel formed by manufacturing is placed on the supporting plate 140, the supporting plate 140 can support the Micro LED display panel due to the fact that the thicknesses of the CMOS integrated circuit driving substrate 110 and the Micro LED light-emitting chip 120 are small, and the substrate of the CMOS integrated circuit driving substrate 110 is bonded with the supporting plate 140 through glue 150, so that the CMOS integrated circuit driving substrate 110 is connected with the supporting plate 140 very firmly, and the connecting mode is simple.
When a curved display screen needs to be manufactured, the supporting plate 140 is manufactured into a curved supporting plate or the manufactured curved supporting plate is selected, the substrate of the CMOS integrated circuit driving substrate 110 is thinned, and then the Micro LED display panel (the CMOS integrated circuit driving substrate 110 on which the Micro LED light emitting chip 120 and the optical sealant 130 are manufactured) is placed on the curved supporting plate and attached to the curved supporting plate, so that the formed display screen 100 is the curved display screen. It can be seen that the support plate 140 can also be used to manufacture the display screen 100 with different shapes.
Referring to fig. 6, the embodiment further provides a head-mounted device 1000, which includes the display screen 100; the head-mounted device 1000 further comprises a helmet support 200 and an eyeglass support 300; the glasses bracket 300 is convexly arranged on the helmet bracket 200, the display screen 100 is arranged on one side of the glasses bracket 300 far away from the helmet bracket 200, the display direction of the display screen 100 faces the eyes of a helmet wearer, and a shading cavity 310 is arranged between the helmet bracket 200 and the display screen 100. To ensure normal use, the display screen 100 is oriented toward the eyes of the helmet wearer. The helmet support 200 is provided with a control circuit board 210, and the control circuit board 210 is electrically connected to the CMOS integrated circuit driving substrate 110 of the display screen 100. Optionally, the head-mounted device 1000 is AR glasses or VR glasses.
The head-mounted device 1000 provided by the embodiment has the following beneficial effects:
(1) the Micro LED light emitting chip 120 of the display screen 100 and the head-mounted device 1000 provided by this embodiment have the advantages of small size, high integration level and self-luminescence, so that the display brightness of the display screen can be improved, the resolution can be improved, the pixel density can reach more than 1500PPI, the 4K ultra-high definition display is realized, the contrast is high, the color gamut is high, the image viewing effect and the sound effect are vivid, and the full immersion experience of the film is realized. Meanwhile, the energy consumption can be reduced, the cruising ability can be improved, and the service life can be prolonged.
The display screen 100 further adopts the optical sealant 130 to seal the Micro LED light emitting chip 120, and after the optical sealant 130 is used for sealing, the Micro LED light emitting chip 120 can be protected mechanically, protected from oxygen and water, and the phenomenon of light reflection is reduced.
(2) According to the head-mounted device 1000 provided by the embodiment, the shading cavity 310 is arranged between the helmet support 200 and the display screen 100, the shading cavity 310 is the full shading cavity 310, the shading cavity 310 can be used as shading, a certain visual distance can be reserved between the display screen 100 and eyes of a user, and the head-mounted device is simple in structure, light, easy to carry and free of site limitation.
In one embodiment, the helmet cradle 200 and the glasses cradle 300 are made of plastic material, so that the whole head-mounted device 1000 is light, improves the user experience, and is low in cost.
In one embodiment, the head-mounted device 1000 further includes an FPC board (not shown, the same applies below), and one end of the FPC board is electrically connected to the CMOS integrated circuit driving substrate 110, and the other end of the FPC board is electrically connected to the control circuit board 210. The CMOS integrated circuit driving substrate 110 is electrically connected to the control circuit board 210 through the FPC board.
In an embodiment, please continue to refer to fig. 6, the head-mounted device 1000 further includes a bluetooth module 220, the bluetooth module 220 is electrically connected to the control circuit board 210, and the bluetooth module 220 is configured to perform bluetooth connection with an external device. The control circuit board 210 can complete wireless reception of audio and video signals of the external device through the bluetooth module 220.
In one embodiment, the head-mounted device 1000 further comprises a data transmission line 230, one end of the data transmission line 230 is electrically connected to the control circuit board 210, and the other end of the data transmission line 230 is used for data connection with an external device. The control circuit board 210 may complete the reception of the audio/video signal of the external device through the data transmission line 230.
In one embodiment, the head-mounted device 1000 further includes a power cord 240, one end of the power cord 240 is electrically connected to the control circuit board 210, and the other end of the power cord 240 is used for electrically connecting to an external charging cradle. Power to the head-mounted device 1000 is provided through a power cord 240.
In one embodiment, the head-mounted device 1000 further comprises a sound device 250, the sound device 250 is disposed on the helmet support 200, and the sound device 250 is electrically connected to the control circuit board 210. The audio 250 is arranged to play sound.
Optionally, the number of the speakers 250 is two, and the two speakers 250 are respectively disposed at two ear positions on both sides of the helmet support 200. Optionally, the stereo 250 is a miniature surround stereo.
In one embodiment, the head-mounted device 1000 further comprises a sound adjusting knob 260, the sound adjusting knob 260 is disposed on the helmet support 200, and the sound adjusting knob 260 is electrically connected to the control circuit board 210. The sound adjusting knob 260 is provided to facilitate the user to adjust the magnitude of the sound.
In one embodiment, the head-mounted device 1000 further includes a screen brightness adjusting knob 270, the screen brightness adjusting knob 270 is disposed on the helmet bracket 200, and the screen brightness adjusting knob 270 is electrically connected to the control circuit board 210. The screen brightness adjusting knob 270 is provided to facilitate the user to adjust the brightness of the display screen.
In one embodiment, the head-mounted device 1000 further comprises an adjusting support 400, and the adjusting support 400 is arranged on the top of the helmet support 200. The adjustable support frame 400 is a strip-shaped support capable of adjusting tightness, so that users with different head sizes can adjust the size conveniently.
In one embodiment, the head-mounted device 1000 further comprises a nose bridge support 500, the nose bridge support 500 is connected to the helmet support 200, and the nose bridge support 500 is wrapped with a leather pad. The setting up of bridge of the nose support frame 500 makes things convenient for wearing of whole head-mounted apparatus 1000, and the parcel has the leather pad (not shown in the figure, the same down) simultaneously on bridge of the nose support frame 500, can improve the comfort that the user wore.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. A display screen, comprising:
a CMOS integrated circuit driving substrate;
the Micro LED light-emitting chip is arranged on one side of the CMOS integrated circuit driving substrate and is electrically connected with the CMOS integrated circuit driving substrate;
the optical sealant is arranged on one side of the light emitting surface of the Micro LED light emitting chip and used for sealing the Micro LED light emitting chip.
2. The display screen of claim 1, wherein a bonding pad is arranged on one side of the CMOS integrated circuit driving substrate close to the Micro LED light-emitting chip, the bonding pad is provided with a UBM bonding pad, the UBM bonding pad is connected with the CMOS integrated circuit driving substrate, and the UBM bonding pad is connected with the Micro LED light-emitting chip.
3. The display screen of claim 1, further comprising a support plate, wherein the support plate is disposed on a side of the CMOS integrated circuit driving substrate away from the Micro LED light emitting chip, and the support plate is connected to the CMOS integrated circuit driving substrate by glue.
4. A display screen in accordance with claim 3, wherein the support plate is a curved support plate.
5. The display screen of claim 3, wherein the support plate is a resin sheet; alternatively, the support plate is a glass sheet.
6. The display screen of claim 1, wherein the Micro LED light emitting chips are no larger than 8um in size.
7. A method for manufacturing a display screen, which is used for manufacturing the display screen of any one of claims 1 to 6, and is characterized by comprising the following steps:
providing a CMOS integrated circuit driving substrate, wherein the CMOS integrated circuit driving substrate is provided with a pad position;
manufacturing a UBM bonding pad at the bonding pad position;
transferring the Micro LED light-emitting chip to the CMOS integrated circuit driving substrate, wherein the UBM bonding pad is welded at low temperature so as to fix the Micro LED light-emitting chip on the CMOS integrated circuit driving substrate and be electrically connected with the CMOS integrated circuit driving substrate;
and arranging an optical sealant on one side of the light emitting surface of the Micro LED light emitting chip, and sealing the Micro LED light emitting chip by the optical sealant to form a Micro LED display panel.
8. The method for manufacturing a display screen according to claim 7, wherein an optical sealant is arranged on one side of the light emitting surface of the Micro LED light emitting chip, and the optical sealant seals the Micro LED light emitting chip to form the Micro LED display panel, and further comprises the following steps:
and placing the manufactured Micro LED display panel on a support plate, and bonding the substrate of the CMOS integrated circuit drive substrate with the support plate through glue.
9. A head-mounted apparatus comprising the display screen according to any one of claims 1 to 6;
the head-mounted equipment further comprises a helmet bracket and a glasses bracket;
the glasses bracket is convexly arranged on the helmet bracket, the display screen is arranged on one side of the glasses bracket, which is far away from the helmet bracket, the display direction of the display screen faces to the eyes of a helmet wearer, and a shading cavity is arranged between the helmet bracket and the display screen;
the helmet support is provided with a control circuit board, and the control circuit board is electrically connected with the CMOS integrated circuit driving substrate of the display screen.
10. The headgear of claim 9, wherein the helmet mount and the eyewear mount are each made of a plastic material;
and/or the head-mounted equipment further comprises an FPC (flexible printed circuit) circuit board, wherein one end of the FPC circuit board is electrically connected with the CMOS integrated circuit driving substrate, and the other end of the FPC circuit board is electrically connected with the control circuit board;
and/or the head-mounted equipment further comprises a Bluetooth module, the Bluetooth module is electrically connected with the control circuit board, and the Bluetooth module is used for carrying out Bluetooth connection with external equipment;
and/or the head-mounted equipment further comprises a data transmission line, one end of the data transmission line is electrically connected with the control circuit board, and the other end of the data transmission line is used for carrying out data connection with external equipment;
and/or the head-mounted equipment further comprises a power line, one end of the power line is electrically connected with the control circuit board, and the other end of the power line is used for being electrically connected with an external charging seat;
and/or the head-mounted equipment further comprises a sound box, wherein the sound box is arranged on the helmet bracket and is electrically connected with the control circuit board;
and/or the head-mounted equipment further comprises a sound adjusting knob, wherein the sound adjusting knob is arranged on the helmet bracket and is electrically connected with the control circuit board;
and/or the head-mounted equipment further comprises a screen brightness adjusting knob, the screen brightness adjusting knob is arranged on the helmet bracket and is electrically connected with the control circuit board;
and/or the head-mounted equipment further comprises an adjusting support frame, and the adjusting support frame is arranged at the top of the helmet support;
and/or the head-mounted equipment further comprises a nose bridge support frame, the nose bridge support frame is connected with the helmet support frame, and a leather pad wraps the nose bridge support frame.
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| CN202111321222.XA CN113885211A (en) | 2021-11-09 | 2021-11-09 | Display screen, preparation method of display screen and head-mounted device |
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| CN202111321222.XA CN113885211A (en) | 2021-11-09 | 2021-11-09 | Display screen, preparation method of display screen and head-mounted device |
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