CN113811076A - Display drive packaging and protecting system based on flexible printed circuit board - Google Patents
Display drive packaging and protecting system based on flexible printed circuit board Download PDFInfo
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- CN113811076A CN113811076A CN202110888095.5A CN202110888095A CN113811076A CN 113811076 A CN113811076 A CN 113811076A CN 202110888095 A CN202110888095 A CN 202110888095A CN 113811076 A CN113811076 A CN 113811076A
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- circuit board
- printed circuit
- colloid
- flexible printed
- glue
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 21
- 239000000084 colloidal system Substances 0.000 claims abstract description 33
- 239000003292 glue Substances 0.000 claims abstract description 32
- 238000000034 method Methods 0.000 claims abstract description 24
- 238000003825 pressing Methods 0.000 claims abstract description 10
- 239000000853 adhesive Substances 0.000 claims abstract description 8
- 230000001070 adhesive effect Effects 0.000 claims abstract description 8
- 229920002799 BoPET Polymers 0.000 claims description 8
- 238000001723 curing Methods 0.000 claims description 7
- 238000002360 preparation method Methods 0.000 claims description 5
- 238000003848 UV Light-Curing Methods 0.000 claims description 4
- 239000004519 grease Substances 0.000 claims description 4
- 238000007599 discharging Methods 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 238000005192 partition Methods 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims description 2
- 238000003491 array Methods 0.000 claims 1
- 230000003287 optical effect Effects 0.000 abstract description 10
- 229920000139 polyethylene terephthalate Polymers 0.000 abstract description 6
- 239000005020 polyethylene terephthalate Substances 0.000 abstract description 6
- 239000002313 adhesive film Substances 0.000 abstract description 4
- 230000007797 corrosion Effects 0.000 abstract description 3
- 238000005260 corrosion Methods 0.000 abstract description 3
- -1 polyethylene terephthalate Polymers 0.000 abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 3
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229920001690 polydopamine Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The application discloses display driver encapsulates and protection system based on flexible printed circuit board, and this system includes: the lamp panel consists of a back plate, a plurality of light-emitting areas and UV glue; the lamp panel is formed by connecting the plurality of light emitting areas in parallel, and the UV adhesive is used for protecting the LED display driving chips; the display driving chip packaging and protecting system has the technical key points that the thickness of an adhesive film is ensured by a dam method, air bubbles in the adhesive can be controlled and eliminated in the leveling process, the air tightness of the adhesive film is ensured, the corrosion of air and water vapor in the air to the display driving chip is eliminated, and the service life of a product is prolonged; on the other hand, the height of the colloid and the surface flatness of the colloid are ensured by a dam-leveling method and a PET (polyethylene terephthalate) film pressing method, so that optical signals obtained after light is refracted, scattered and reflected in the colloid are basically controllable, and the integral light intensity of the reflecting plate is more uniform.
Description
Technical Field
The invention belongs to the field of flexible printed circuit boards, and particularly relates to a display drive packaging and protecting system based on a flexible printed circuit board.
Background
The flexible printed circuit board is also called a flexible circuit board, a flexible circuit board and a flexible board, and is a special printed circuit board; it is characterized by light weight, thin thickness, flexibility and bending; the display screen is mainly used for a plurality of products such as mobile phones, notebook computers, PDAs, digital cameras, liquid crystal display screens and the like; the flexible printed circuit board also comprises a flexible printed circuit board with a Mini-LED chip;
the traditional Mini-LED chip is affected by oxidation and thermal expansion effect, and has the problem of uneven color due to the fact that an insufficient protection structure is provided, even if glue is used for protection, the traditional glue sealing method is generally a whole-surface coating method, on one hand, the thickness of glue cannot be guaranteed, the optical effect of a product is affected, and on the other hand, bubbles possibly remain in the glue sealing process, and the service life of the chip is affected.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a display driver packaging and protecting system based on a flexible printed circuit board, which solves the problems mentioned in the prior art.
(II) technical scheme
In order to achieve the purpose, the invention is realized by the following technical scheme:
display driver encapsulation and protection system based on flexible printed circuit board, this system includes: the lamp panel consists of a back plate, a plurality of light-emitting areas and UV glue;
the LED display lamp is characterized in that the light emitting areas comprise a plurality of LED chips, the LED chips are connected in series, the lamp panel is formed by connecting the light emitting areas in parallel, and the UV glue is used for protecting the LED display driving chips.
Further, positive and negative connection circuit pad on the LED chip, and the clearance between the pad is 110um, the specification of pad is 180um 80 um.
Furthermore, the system arranges a display driving array on the circuit board, the chip size is 320um to 200um, the driving distance is adjusted according to the LED backlight partition, and after the steps of surface mounting and crystal fixing, UV glue is evenly coated on the surface of the flexible printed circuit board.
The use method of the UV glue in the system comprises the following steps:
firstly, dispensing treatment is carried out:
s1, using a first dispenser to pressurize through a single valve, pulling out a rectangular box dam along the edge of the surface of the circuit board, and using a UV lamp to irradiate the glue body uninterruptedly in the dispensing process;
s2, adding air pressure by using a double valve of a second dispenser, and discharging glue inside the box dam by adding air pressure by using double needles;
then, carrying out pre-curing treatment for 5 min;
s3, sticking a PET film on the surface of the circuit board by using a film pressing machine, and pressing the film;
s4, sending the mixture into a UV curing furnace to completely cure the colloid;
and S5, removing grease on the surface of the PET film, and attaching the MCF film to complete the preparation.
Further, before the dispensing process is performed,
and a plurality of display driving chips are attached to the surface of the flexible printed circuit board through SMT.
Further, in the S2,
the colloid is liquid under the condition that the UV lamp is not irradiated, the colloid is gradually filled in the box dam until the height of the colloid is equal to that of the box dam, and the surface smoothness of the colloid is observed at the moment;
if the surface is smooth, precuring for 5 min; curing the surface of the colloid;
if it is not flat, the operation in S2 is performed again.
(III) advantageous effects
Firstly, because the low volatility of the UV adhesive playing a packaging role provides consistent optical transmittance before/after reliability test, the whole optical system of the backlight plate can be ensured not to be damaged, and colored light can be uniformly emitted by the flexible printed circuit board;
secondly, the system can realize mechanical and automatic packaging, thereby not only reducing the labor input, but also greatly improving the reliability of the display drive packaging and protecting system, improving the production efficiency of the product and shortening the production period of the product;
thirdly, the display driving chip packaging and protecting system ensures the thickness of the glue film through a dam method, can control and eliminate bubbles in the glue body in the leveling process, ensures the air tightness of the glue film, eliminates the corrosion of air and water vapor in the air to the display driving chip, and prolongs the service life of the product;
on the other hand, the height of the colloid and the surface flatness of the colloid are ensured by a dam-leveling method and a PET (polyethylene terephthalate) film pressing method, so that optical signals obtained after light is refracted, scattered and reflected in the colloid are basically controllable, and the integral light intensity of the reflecting plate is more uniform.
Drawings
FIG. 1 is a schematic view of a flexible printed circuit board according to the present invention;
FIG. 2 is a schematic diagram of a display driver packaging and protection system according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. In addition, for the convenience of description, the terms "upper", "lower", "left" and "right" are used to refer to the same direction as the upper, lower, left, right, etc. of the drawings, and the terms "first", "second", etc. are used for descriptive distinction and have no special meaning.
Aiming at the problems in the prior art, the invention provides a display drive packaging and protecting system based on a flexible printed circuit board, which comprises: the lamp panel consists of a back plate, a plurality of light-emitting areas and UV glue;
the luminous region contains a plurality of LED chips, and establishes ties each other between each LED chip, and the lamp plate is formed by a plurality of luminous regions parallelly connected, and the UV glues the protection that is used for LED display driver chip.
The display driving packaging and protecting system based on the flexible printed circuit board (the circuit board can adopt a Mini-LED flexible printed circuit board) can effectively protect the Mini-LED chip from being influenced by oxidation and thermal expansion effect, and simultaneously effectively solves the problem of uneven color existing in the traditional Mini-LED.
In a specific application scenario, in order to meet the requirements of high resolution and high brightness, a 4K product is labeled, the array density of a chip matrix is high, thousands or even tens of thousands of chips are generally required to be arranged on a 31.5inch substrate, and one of the thousands of chips is defective, which causes the entire Mini-LED backlight plate to be reworked or scrapped;
therefore, the display driving packaging and protecting system based on the Mini-LED flexible printed circuit board is directly related to the production yield of the Mini-LED backlight board.
As shown in fig. 1 and 2, the LED chip has positive and negative connection circuit pads, and the gap between the pads is 110um, and the specification of the pads is 180um 80 um.
As shown in fig. 1 and 2, the system arranges a display drive array on a circuit board, the chip size is 320um to 200um, the drive spacing is adjusted according to the LED backlight partition, and after the steps of surface mounting and die bonding, the UV glue is evenly coated on the surface of the flexible printed circuit board.
The UV adhesive is an integrated, transparent, low-modulus, low-shrinkage, enhanced ultraviolet stability and ultraviolet curing resin, the UV curing energy condition is that each square centimeter is more than 4,000 millijoules, the refractive index at 589.3nm of the UV adhesive is 1.53, and the transmittance at the thickness of 200um is higher than 99%;
by adopting the technical scheme:
since the low volatility of the UV glue, which acts as a package, provides a consistent optical transmission before/after reliability testing, it can be ensured that the overall optical system of the backlight is not damaged and colored light will be emitted uniformly by the flexible printed circuit board.
The use method of the UV glue in the system comprises the following steps:
firstly, dispensing treatment is carried out:
s1, using a first dispenser to pressurize by a single valve, pulling out a rectangular surrounding dam along the edge of the surface of the circuit board, and continuously irradiating the colloid by a UV lamp in the dispensing process to solidify the colloid surrounding dam on the surface of the circuit board (the traditional preparation method does not add the surrounding dam, and the height of the colloid can be limited by the advanced solidification of the surrounding dam);
and S2, adding air pressure by using a double valve of a second dispenser, and simultaneously discharging glue in the box dam by adding air pressure by using double needles to solidify the surface of the glue. (in the traditional preparation method, a box dam is not added, glue is directly discharged to coat the surface of the circuit board, the height of the glue cannot be ensured, the height of the glue can be limited by utilizing the box dam, the refraction, scattering and reflection efficiency of light can be better calculated, and the mastering accuracy of optical signals is increased);
then, carrying out pre-curing treatment for 5 min;
s3, a film pressing machine is used, a PET film is pasted on the surface of the circuit board, film pressing is carried out, and the flatness of the surface of the colloid is protected, (the flatness of the surface of the colloid can be ensured through the film pressing of the PET film, and compared with the traditional method that a MCF film is directly added, the situation that the optical signal calculation is wrong due to the unevenness of the surface of the colloid can be effectively reduced, namely the situation that a single point or local parts are too bright and too dark is existed on the backlight plate);
s4, sending the mixture into a UV curing furnace to completely cure the colloid;
and S5, removing grease on the surface of the PET film, and attaching the MCF film to complete preparation (the grease on the surface of the PET film cannot be removed in a traditional mode, so that the attached MCF film is not firmly adhered, and the service life of the backlight plate is shortened).
Before the dispensing process is carried out, the adhesive is removed,
and a plurality of display driving chips are attached to the surface of the flexible printed circuit board through SMT.
In the step of S2, the user is allowed to perform,
the colloid is in a liquid state under the condition that the UV lamp is not irradiated, the colloid is gradually filled in the box dam until the height of the colloid is equal to that of the box dam, and the surface smoothness of the colloid is observed at the moment;
if the surface is smooth, precuring for 5 min; curing the surface of the colloid;
if it is not flat, the operation in S2 is performed again.
By adopting the technical scheme:
the system can realize mechanical and automatic packaging, thereby not only reducing the labor input, but also greatly improving the reliability of the display drive packaging and protecting system, improving the production efficiency of products and shortening the production period of the products;
the display driving chip packaging and protecting system ensures the thickness of the adhesive film through a dam method, can control and eliminate bubbles in the adhesive body in the leveling process, ensures the air tightness of the adhesive film, eliminates the corrosion of air and water vapor in the air to the display driving chip, and prolongs the service life of the product;
on the other hand, the height of the colloid and the surface flatness of the colloid are ensured by a dam-leveling method and a PET (polyethylene terephthalate) film pressing method, so that optical signals obtained after light is refracted, scattered and reflected in the colloid are basically controllable, and the integral light intensity of the reflecting plate is more uniform.
The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Claims (6)
1. Display driver encapsulation and protection system based on flexible printed circuit board, its characterized in that, this system includes: the lamp panel consists of a back plate, a plurality of light-emitting areas and UV glue;
the LED display lamp is characterized in that the light emitting areas comprise a plurality of LED chips, the LED chips are connected in series, the lamp panel is formed by connecting the light emitting areas in parallel, and the UV glue is used for protecting the LED display driving chips.
2. The flexible printed circuit board based display driver packaging and protection system of claim 1, wherein: positive and negative connection circuit pad on the LED chip, and the clearance between the pad is 110um, the specification of pad is 180um 80 um.
3. The flexible printed circuit board-based display driver packaging and protection system of claim 1, wherein the system arranges the display driver arrays on the circuit board with a chip size of 320um 200um, adjusts the driving pitch according to the LED backlight partition, and after the mounting and die bonding steps, evenly coats the UV glue on the surface of the flexible printed circuit board.
4. The flexible printed circuit board based display driver packaging and protection system of claim 1, wherein: the use method of the UV glue in the system comprises the following steps:
firstly, dispensing treatment is carried out:
s1, using a first dispenser to pressurize through a single valve, pulling out a rectangular box dam along the edge of the surface of the circuit board, and using a UV lamp to irradiate the glue body uninterruptedly in the dispensing process;
s2, adding air pressure by using a double valve of a second dispenser, and discharging glue inside the box dam by adding air pressure by using double needles;
then, carrying out pre-curing treatment for 5 min;
s3, sticking a PET film on the surface of the circuit board by using a film pressing machine, and pressing the film;
s4, sending the mixture into a UV curing furnace to completely cure the colloid;
and S5, removing grease on the surface of the PET film, and attaching the MCF film to complete the preparation.
5. The method for using the UV glue in the flexible printed circuit board based display driving packaging and protecting system according to claim 4, wherein: before the dispensing process is carried out, the adhesive is removed,
and a plurality of display driving chips are attached to the surface of the flexible printed circuit board through SMT.
6. The method for using the UV glue in the flexible printed circuit board based display driving packaging and protecting system according to claim 4, wherein: in the above-mentioned S2, the method,
the colloid is liquid under the condition that the UV lamp is not irradiated, the colloid is gradually filled in the box dam until the height of the colloid is equal to that of the box dam, and the surface smoothness of the colloid is observed at the moment;
if the surface is smooth, precuring for 5 min; curing the surface of the colloid;
if it is not flat, the operation in S2 is performed again.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110888095.5A CN113811076A (en) | 2021-08-03 | 2021-08-03 | Display drive packaging and protecting system based on flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110888095.5A CN113811076A (en) | 2021-08-03 | 2021-08-03 | Display drive packaging and protecting system based on flexible printed circuit board |
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| CN113811076A true CN113811076A (en) | 2021-12-17 |
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| CN202110888095.5A Pending CN113811076A (en) | 2021-08-03 | 2021-08-03 | Display drive packaging and protecting system based on flexible printed circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115038254A (en) * | 2022-06-24 | 2022-09-09 | 深圳市南极光电子科技股份有限公司 | Mini/Micro backlight lamp panel protective adhesive film pressing process |
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Application publication date: 20211217 |