CN106549010A - Three-color LED display unit and its production method - Google Patents
Three-color LED display unit and its production method Download PDFInfo
- Publication number
- CN106549010A CN106549010A CN201710022843.5A CN201710022843A CN106549010A CN 106549010 A CN106549010 A CN 106549010A CN 201710022843 A CN201710022843 A CN 201710022843A CN 106549010 A CN106549010 A CN 106549010A
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- Prior art keywords
- chips
- display unit
- circuits
- color led
- led display
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Device Packages (AREA)
Abstract
The present invention discloses a kind of three-color LED display unit and its production method, include PCB substrate unit, PCB substrate unit is wherein simultaneously formed with R, G, B circuit and common line, R, G, B chip is respectively welded between common line and R, G, B circuit, and the surrounding in the face is compounded with the upper strata Slab element with medium pore, in medium pore, note envelope has the epoxy resin for encapsulating R, G, B chip, and the corner of another side is formed with the scolding tin disk for being respectively communicated with R, G, B circuit and common line.The pcb board for making array arrangement with unit first being produced, top plate being then combined on pcb board, then then fixed and welding R, G, B chip in the medium pore of top plate is noted envelope epoxy resin, be finally divided into three-color LED display unit.The present invention can effectively improving production efficiency and product quality, and then reduce production cost.And the three-color LED display unit being divided into is conducive to the electrical detection stepping of display unit, the display quality for showing top plate is improved with this.
Description
Technical field
The present invention relates to LED technology field, refers in particular to the LED display unit for display screen.
Background technology
At present in the production technology of the three-color LED display unit of display screen, such as number of patent application is
LED disclosed in 201610377143.3 shows top plate, and its production method is that elder generation is combined top plate, top plate in PCB substrate
The each display unit of correspondence opens up a medium pore, that is, be similar to the bowl of PLCC structures, then die bond bonding wire, finally on medium pore
Note envelope epoxy resin.However, as LED display develops towards high density direction, the size of device is less and less, medium pore
I.e. the size of bowl will limit the space of die bond and bonding wire, it is impossible to realize small size device and high density display screen,
The content of the invention
The technical problem to be solved in the present invention is to provide a kind of three-color LED display unit for being conducive to producing and its producer
Method.
By solving the technical scheme that above-mentioned technical problem is adopted：A kind of three-color LED display unit, it is characterised in that：Bag
PCB substrate unit is included, PCB substrate unit is wherein simultaneously formed with R circuits, G circuits, B circuits and common line, public
R chips, G chips and B chips are respectively welded between circuit and R circuits, G circuits and B circuits, and the surrounding in the face is combined
There is note envelope in the upper strata Slab element with medium pore, medium pore to have the asphalt mixtures modified by epoxy resin for encapsulating R chips, G chips and B chips
Fat, the corner of another side are formed with the scolding tin disk for being respectively communicated with R circuits, G circuits, B circuits and common line.
By solving the another technical scheme that above-mentioned technical problem is adopted：Characterized in that, comprising the following steps：
A, production make the pcb board of array arrangement with the PCB substrate unit；
B, the top plate for making array arrangement with the upper strata Slab element is compounded on pcb board；；
C, then fixed on the relevant position of each PCB substrate unit and welding R chips, G chips and B chips, so
Note in the medium pore of each upper strata Slab element afterwards and seal epoxy resin；
D, three-color LED display unit is divided into unit demarcation line finally.
The beneficial effect brought using the present invention：The present invention can effectively improving production efficiency and product quality, and then drop
Low production cost.And the three-color LED display unit being divided into is conducive to the electrical detection stepping of display unit, to lift display
The display quality of top plate.
Description of the drawings
Fig. 1 is the positive structure schematic of three-color LED display unit of the present invention；
Fig. 2 is the bottom surface structure schematic diagram of three-color LED display unit of the present invention.
Specific embodiment
As shown in Figure 1-2, a kind of three-color LED display unit, includes PCB substrate unit 1, and PCB substrate unit 1 is wherein
R circuits 2, G circuits 3, B circuits 4 and common line 5, common line 5 and R circuits 2, G circuits 3 and B circuits are formed with simultaneously
R chips 6, G chips 7 and B chips 8 are respectively welded between 4, and the surrounding in the face is compounded with the top plate with medium pore 9
Unit 10, in medium pore 9, note envelope has the epoxy resin for encapsulating R chips 6, G chips 7 and B chips 8, the corner of another side
It is formed with the scolding tin disk 11 for being respectively communicated with R circuits 2, G circuits 3, B circuits 4 and common line 5.R chips 6, G chips 7 and B
Chip 8 is red, green, blue three-color LED luminescence chip respectively.At present, three-color LED luminescence chip mainly has several packaged types, and one
Plant is that three-color LED luminescence chip adopts flip-chip；One kind is green and blue luminescence chip adopts flip-chip, red to send out
Optical chip adopts non-flip-chip.The emitting red light chip of non-upside-down mounting is divided into two kinds again, and one kind is that substrate is positive pole, and another kind is
Substrate is negative pole, and the substrate of emitting red light chip will be fixed in the line pad of correspondence polarity, the circuit of top and another pole
Gold thread is welded between pad.Fig. 1 is one kind therein.
The production method of above-mentioned three-color LED display unit is mainly included the following steps that：
The pcb board that A, production are arranged using above-mentioned PCB substrate unit 1 as cell array；
B, will be compounded on pcb board using above-mentioned top plate unit 10 as the top plate that cell array is arranged；
C, then fixed on the relevant position of each PCB substrate unit 1 and welding R chips 6, G chips 7 and B chips
8, then envelope epoxy resin is noted in the medium pore 9 of each upper strata Slab element 10；
D, three-color LED display unit is divided into unit demarcation line finally.
The present invention can effectively improving production efficiency and product quality, and then reduce production cost.And what is be divided into is trichroism
LED display unit is conducive to the electrical detection stepping of display unit, improves the display quality for showing top plate with this.
Claims (2)
1. a kind of three-color LED display unit, it is characterised in that：Include PCB substrate unit, the wherein one side of PCB substrate unit
R circuits, G circuits, B circuits and common line are formed with, are welded between common line and R circuits, G circuits and B circuits respectively
R chips, G chips and B chips are connected to, and the surrounding in the face is compounded with note in the upper strata Slab element with medium pore, medium pore
Envelope has the epoxy resin for encapsulating R chips, G chips and B chips, and the corner of another side is formed with and is respectively communicated with R circuits, G
The scolding tin disk of circuit, B circuits and common line.
2. a kind of production method of three-color LED display unit according to claim 1, it is characterised in that including following step
Suddenly：
A, production make the pcb board of array arrangement with the PCB substrate unit；
B, the top plate for making array arrangement with the upper strata Slab element is compounded on pcb board；；
C, then fixed on the relevant position of each PCB substrate unit and welding R chips, G chips and B chips, Ran Hou
Note envelope epoxy resin in the medium pore of each upper strata Slab element；
D, three-color LED display unit is divided into unit demarcation line finally.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710022843.5A CN106549010A (en) | 2017-01-12 | 2017-01-12 | Three-color LED display unit and its production method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710022843.5A CN106549010A (en) | 2017-01-12 | 2017-01-12 | Three-color LED display unit and its production method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106549010A true CN106549010A (en) | 2017-03-29 |
Family
ID=58397515
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710022843.5A Pending CN106549010A (en) | 2017-01-12 | 2017-01-12 | Three-color LED display unit and its production method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106549010A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108564890A (en) * | 2017-12-29 | 2018-09-21 | 西安智盛锐芯半导体科技有限公司 | Virtual LED display module based on three vitta shape LED chips and 6 times of frequency displaying methods |
Citations (8)
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|---|---|---|---|---|
| JP2001118868A (en) * | 1997-07-24 | 2001-04-27 | Kyowa Kasei Kk | Surface-mounting part and manufacturing method thereof |
| CN101440941A (en) * | 2007-11-20 | 2009-05-27 | 南京汉德森科技股份有限公司 | Multiple-in-one LED display screen module surface paste and display screen module |
| US20110207253A1 (en) * | 2010-02-23 | 2011-08-25 | Yueh-Hsun Yang | Flip-chip led module fabrication method |
| US20120104426A1 (en) * | 2010-11-03 | 2012-05-03 | Cree Hong Kong, Ltd. | White ceramic led package |
| CN203659372U (en) * | 2014-01-03 | 2014-06-18 | 深圳市奥蕾达光电技术有限公司 | LED display screen and full color LED light emitting panel |
| CN105428496A (en) * | 2014-09-19 | 2016-03-23 | 深圳市晶台股份有限公司 | Novel substrate package LED full-color method |
| CN105810115A (en) * | 2016-05-30 | 2016-07-27 | 深圳市奥蕾达科技有限公司 | Novel chip on board (COB) full color light-emitting diode (LED) light-emitting panel and manufacturing method thereof |
| CN206432263U (en) * | 2017-01-12 | 2017-08-22 | 东莞市春瑞电子科技有限公司 | Three-color LED display unit |
-
2017
- 2017-01-12 CN CN201710022843.5A patent/CN106549010A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001118868A (en) * | 1997-07-24 | 2001-04-27 | Kyowa Kasei Kk | Surface-mounting part and manufacturing method thereof |
| CN101440941A (en) * | 2007-11-20 | 2009-05-27 | 南京汉德森科技股份有限公司 | Multiple-in-one LED display screen module surface paste and display screen module |
| US20110207253A1 (en) * | 2010-02-23 | 2011-08-25 | Yueh-Hsun Yang | Flip-chip led module fabrication method |
| US20120104426A1 (en) * | 2010-11-03 | 2012-05-03 | Cree Hong Kong, Ltd. | White ceramic led package |
| CN203659372U (en) * | 2014-01-03 | 2014-06-18 | 深圳市奥蕾达光电技术有限公司 | LED display screen and full color LED light emitting panel |
| CN105428496A (en) * | 2014-09-19 | 2016-03-23 | 深圳市晶台股份有限公司 | Novel substrate package LED full-color method |
| CN105810115A (en) * | 2016-05-30 | 2016-07-27 | 深圳市奥蕾达科技有限公司 | Novel chip on board (COB) full color light-emitting diode (LED) light-emitting panel and manufacturing method thereof |
| CN206432263U (en) * | 2017-01-12 | 2017-08-22 | 东莞市春瑞电子科技有限公司 | Three-color LED display unit |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108564890A (en) * | 2017-12-29 | 2018-09-21 | 西安智盛锐芯半导体科技有限公司 | Virtual LED display module based on three vitta shape LED chips and 6 times of frequency displaying methods |
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