TW201613148A - Full color method of novel substrate packaging light-emitting diode (LED) - Google Patents

Full color method of novel substrate packaging light-emitting diode (LED)

Info

Publication number
TW201613148A
TW201613148A TW104101781A TW104101781A TW201613148A TW 201613148 A TW201613148 A TW 201613148A TW 104101781 A TW104101781 A TW 104101781A TW 104101781 A TW104101781 A TW 104101781A TW 201613148 A TW201613148 A TW 201613148A
Authority
TW
Taiwan
Prior art keywords
substrate
light emitting
led light
emitting chips
circuit
Prior art date
Application number
TW104101781A
Other languages
Chinese (zh)
Other versions
TWI570969B (en
Inventor
Wen Gong
Peng-Rui Shao
jiao-min Zhou
Original Assignee
Shenzhen Kinglight Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Kinglight Co Ltd filed Critical Shenzhen Kinglight Co Ltd
Publication of TW201613148A publication Critical patent/TW201613148A/en
Application granted granted Critical
Publication of TWI570969B publication Critical patent/TWI570969B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

Abstract

A full color method of a substrate packaging LED comprises: a substrate; a circuit arranged on the substrate, the circuit comprising a front face circuit arranged on the front face of the substrate and a back face circuit arranged on the back face of the substrate; a conductive hole arranged in the substrate for connecting the front face circuit and the back face circuit, and the conductive hole extending from the front face circuit to the back face circuit, and filled, sealed and packed by conductive metal materials; LED light emitting chips arranged on the front face circuit; packaging glue for packaging the LED light emitting chips; the full color method of a substrate packaging LED includes: (a) cleaning the substrate; (b) unfreezing die bonding primer; (c) uniformly expanding the distances among the LED light emitting chips, attaching the LED light emitting chips to the substrate through a die bonder and die bonding primer; (d) connecting the LED light emitting chips attached to the substrate with a bonding pad on the substrate through a welding wire machine and bonding wires; (e) compression molding of packaging glue and the front face of the substrate through a die manufacturing machine under a high temperature to protect the LED light emitting chips on the substrate.
TW104101781A 2014-09-19 2015-01-20 A New Method of Packaging LED Full Color TWI570969B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410479272.4A CN105428496A (en) 2014-09-19 2014-09-19 Novel substrate package LED full-color method

Publications (2)

Publication Number Publication Date
TW201613148A true TW201613148A (en) 2016-04-01
TWI570969B TWI570969B (en) 2017-02-11

Family

ID=55506550

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104101781A TWI570969B (en) 2014-09-19 2015-01-20 A New Method of Packaging LED Full Color

Country Status (3)

Country Link
CN (1) CN105428496A (en)
TW (1) TWI570969B (en)
WO (1) WO2016041366A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106549010A (en) * 2017-01-12 2017-03-29 东莞市春瑞电子科技有限公司 Three-color LED display unit and its production method
CN106784253A (en) * 2017-01-18 2017-05-31 苏州晶台光电有限公司 A kind of inverted structure LED core chip package for realizing the close display of superelevation
CN106847800A (en) * 2017-03-28 2017-06-13 山东晶泰星光电科技有限公司 QFN surface-adhered types RGB LED encapsulation modules and its manufacture method
CN106992169A (en) * 2017-04-27 2017-07-28 山东晶泰星光电科技有限公司 A kind of upside-down mounting RGB LED encapsulation modules and its display screen
CN107818972A (en) * 2017-10-18 2018-03-20 通元科技(惠州)有限公司 A kind of LED circuit board and preparation method of band COB package substrates
CN108091644A (en) * 2017-12-15 2018-05-29 深圳市晶台股份有限公司 A kind of encapsulating structure of the highly dense display light source devices of LED
CN111244247B (en) * 2020-01-16 2022-01-11 深圳市志金电子有限公司 Mini LED packaging substrate manufacturing process

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2011093405A1 (en) * 2010-02-01 2013-06-06 有限会社Ｍｔｅｃ Optical semiconductor device with chip size package
CN102148312B (en) * 2010-02-05 2015-01-07 亿光电子工业股份有限公司 Light emitting diode packaging structure, manufacturing method thereof and display device
US9039216B2 (en) * 2010-04-01 2015-05-26 Lg Innotek Co., Ltd. Light emitting device package and light unit having the same
TWI450425B (en) * 2010-12-31 2014-08-21 Ind Tech Res Inst Die structure, manufacture method thereof and substrate structure thereof
CN202888226U (en) * 2012-09-10 2013-04-17 深圳市宏啟光电有限公司 LED full-color display screen
CN103078044A (en) * 2013-01-09 2013-05-01 宏齐光电子(深圳)有限公司 Production method of ultrasmall-sized red-green-blue (RGB) full-color light emitting diode (LED) for high-definition display screen
CN203707176U (en) * 2014-01-21 2014-07-09 深圳路升光电科技有限公司 Full-color surface mounted element
CN104037168A (en) * 2014-05-15 2014-09-10 中山市川祺光电科技有限公司 LED three-in-one full-color lamp
CN104201272A (en) * 2014-08-22 2014-12-10 深圳市晶台股份有限公司 Light-emitting diode (LED) full-color chip on board (COB) mode packaging method

Also Published As

Publication number Publication date
WO2016041366A1 (en) 2016-03-24
TWI570969B (en) 2017-02-11
CN105428496A (en) 2016-03-23

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