TWD188043S - Light emitting diode package - Google Patents

Light emitting diode package

Info

Publication number
TWD188043S
TWD188043S TW105305761F TW105305761F TWD188043S TW D188043 S TWD188043 S TW D188043S TW 105305761 F TW105305761 F TW 105305761F TW 105305761 F TW105305761 F TW 105305761F TW D188043 S TWD188043 S TW D188043S
Authority
TW
Taiwan
Prior art keywords
emitting diode
design
diode package
light emitting
parts
Prior art date
Application number
TW105305761F
Other languages
Chinese (zh)
Inventor
劉顓籲
詹勳賢
曾春銘
吳囿蓉
林育鋒
Original Assignee
新世紀光電股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新世紀光電股份有限公司 filed Critical 新世紀光電股份有限公司
Priority to TW105305761F priority Critical patent/TWD188043S/en
Priority to US29/598,778 priority patent/USD825499S1/en
Publication of TWD188043S publication Critical patent/TWD188043S/en
Priority to US29/638,942 priority patent/USD843957S1/en

Links

Abstract

【物品用途】;本設計是一種發光二極體封裝，用於提供照明。;【設計說明】;本設計之設計特點在於封裝基板頂部的晶粒及封裝膠體的形狀。圖式所揭露之虛線部分，為本案不主張設計之部分。【Item Usage】;This design is a light-emitting diode package used to provide lighting. ;[Design Description];The design feature of this design lies in the shape of the die and packaging colloid on the top of the packaging substrate. The dotted line parts revealed in the diagram are the parts that are not designed in this case.

Description

發光二極體封裝LED package

本設計是一種發光二極體封裝，用於提供照明。This design is a light emitting diode package for providing illumination.

本設計之設計特點在於封裝基板頂部的晶粒及封裝膠體的形狀。圖式所揭露之虛線部分，為本案不主張設計之部分。The design features of this design are the shape of the die on the top of the package substrate and the encapsulant. The dotted line section disclosed in the figure is not part of the design of this case.

TW105305761F 2016-09-29 2016-09-29 Light emitting diode package TWD188043S (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW105305761F TWD188043S (en) 2016-09-29 2016-09-29 Light emitting diode package
US29/598,778 USD825499S1 (en) 2016-09-29 2017-03-28 Light emitting diode package
US29/638,942 USD843957S1 (en) 2016-09-29 2018-03-02 Light emitting diode package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW105305761F TWD188043S (en) 2016-09-29 2016-09-29 Light emitting diode package

Publications (1)

Publication Number Publication Date
TWD188043S true TWD188043S (en) 2018-01-21

Family

ID=63079169

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105305761F TWD188043S (en) 2016-09-29 2016-09-29 Light emitting diode package

Country Status (2)

Country Link
US (2) USD825499S1 (en)
TW (1) TWD188043S (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD188042S (en) 2016-09-29 2018-01-21 新世紀光電股份有限公司 Portion of light emitting diode package
TWD188043S (en) * 2016-09-29 2018-01-21 新世紀光電股份有限公司 Light emitting diode package
TWD186014S (en) * 2016-09-29 2017-10-11 新世紀光電股份有限公司 Portion of light emitting diode module
USD892068S1 (en) * 2018-04-13 2020-08-04 Seoul Semiconductor Co., Ltd. Light emitting diode package
USD892067S1 (en) * 2018-04-13 2020-08-04 Seoul Semiconductor Co., Ltd. Light emitting diode package
USD919582S1 (en) * 2018-04-13 2021-05-18 Seoul Semiconductor Co., Ltd. Light emitting diode package
USD889422S1 (en) * 2018-04-13 2020-07-07 Seoul Semiconductor Co., Ltd. Light emitting diode package
USD889421S1 (en) * 2018-04-13 2020-07-07 Seoul Semiconductor Co., Ltd. Light emitting diode package
USD894853S1 (en) * 2018-10-12 2020-09-01 Seoul Semiconductor Co., Ltd. Light emitting diode package
USD881143S1 (en) * 2018-10-12 2020-04-14 Seoul Semiconductor Co., Ltd. Light emitting diode package
USD881142S1 (en) * 2018-10-12 2020-04-14 Seoul Semiconductor Co., Ltd. Light emitting diode package

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Publication number Priority date Publication date Assignee Title
USD749051S1 (en) 2012-05-31 2016-02-09 Cree, Inc. Light emitting diode (LED) package
USD772181S1 (en) 2015-04-02 2016-11-22 Genesis Photonics Inc. Light emitting diode package substrate

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USD646647S1 (en) * 2010-07-30 2011-10-11 Everlight Electronics Co., Ltd. Light emitting diode
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TWI657597B (en) * 2015-03-18 2019-04-21 新世紀光電股份有限公司 Edge lighting light emitting diode structure and method of manufacturing the same
TWD173073S (en) 2015-04-02 2016-01-11 新世紀光電股份有限公司 Portion of light emitting diode package
USD761214S1 (en) * 2015-04-02 2016-07-12 Genesis Photonics Inc. Light emitting diode package
TWD174515S (en) 2015-04-02 2016-03-21 新世紀光電股份有限公司 Portion of light emitting diode package substrate
USD762596S1 (en) * 2015-04-02 2016-08-02 Genesis Photonics Inc. Light emitting diode package substrate
TWD176421S (en) 2015-04-02 2016-06-11 新世紀光電股份有限公司 Portion of light emitting diode package substrate
USD761213S1 (en) * 2015-04-02 2016-07-12 Genesis Photonics Inc. Light emitting diode module
TWD188043S (en) * 2016-09-29 2018-01-21 新世紀光電股份有限公司 Light emitting diode package
CN108269899B (en) * 2016-12-30 2020-06-05 光宝光电(常州)有限公司 Light emitting diode packaging structure and manufacturing method thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD749051S1 (en) 2012-05-31 2016-02-09 Cree, Inc. Light emitting diode (LED) package
USD772181S1 (en) 2015-04-02 2016-11-22 Genesis Photonics Inc. Light emitting diode package substrate

Also Published As

Publication number Publication date
USD825499S1 (en) 2018-08-14
USD843957S1 (en) 2019-03-26

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