TWD192227S - Part of the LED package - Google Patents
Part of the LED packageInfo
- Publication number
- TWD192227S TWD192227S TW106301365F TW106301365F TWD192227S TW D192227 S TWD192227 S TW D192227S TW 106301365 F TW106301365 F TW 106301365F TW 106301365 F TW106301365 F TW 106301365F TW D192227 S TWD192227 S TW D192227S
- Authority
- TW
- Taiwan
- Prior art keywords
- design
- led package
- packaging
- parts
- emitting diode
- Prior art date
Links
- 239000000758 substrate Substances 0.000 abstract description 2
- 238000004806 packaging method and process Methods 0.000 abstract 2
- 239000000084 colloidal system Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 abstract 1
- 239000013078 crystal Substances 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
Abstract
【物品用途】;本設計是一種發光二極體封裝，用於提供照明。;【設計說明】;本設計之設計特點在於封裝基板頂部的晶粒排列方式及封裝膠體的形狀。;圖式所揭露之虛線部分，為本案不主張設計之部分。【Item Usage】;This design is a light-emitting diode package used to provide lighting. ;[Design Description];The design features of this design lie in the arrangement of the grains on the top of the packaging substrate and the shape of the packaging colloid. ;The dotted line parts disclosed in the diagram are the parts of this case that are not intended to be designed.
Description
本設計是一種發光二極體封裝，用於提供照明。 This design is a light emitting diode package for providing illumination.
本設計之設計特點在於封裝基板頂部的晶粒排列方式及封裝膠體的形狀。 The design features of this design are the arrangement of the crystal grains on the top of the package substrate and the shape of the encapsulant.
圖式所揭露之虛線部分，為本案不主張設計之部分。 The dotted line section disclosed in the figure is not part of the design of this case.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106301365F TWD192227S (en) | 2017-03-16 | 2017-03-16 | Part of the LED package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106301365F TWD192227S (en) | 2017-03-16 | 2017-03-16 | Part of the LED package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD192227S true TWD192227S (en) | 2018-08-11 |
Family
ID=89071556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106301365F TWD192227S (en) | 2017-03-16 | 2017-03-16 | Part of the LED package |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWD192227S (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD202891S (en) | 2019-08-20 | 2020-02-21 | 鼎元光電科技股份有限公司 | The part of the light-emitting diode |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD778851S1 (en) | 2014-05-15 | 2017-02-14 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
-
2017
- 2017-03-16 TW TW106301365F patent/TWD192227S/en unknown
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD778851S1 (en) | 2014-05-15 | 2017-02-14 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD202891S (en) | 2019-08-20 | 2020-02-21 | 鼎元光電科技股份有限公司 | The part of the light-emitting diode |
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