USD772181S1 - Light emitting diode package substrate - Google Patents

Light emitting diode package substrate Download PDF

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Publication number
USD772181S1
USD772181S1 US29/522,732 US201529522732F USD772181S US D772181 S1 USD772181 S1 US D772181S1 US 201529522732 F US201529522732 F US 201529522732F US D772181 S USD772181 S US D772181S
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US
United States
Prior art keywords
light emitting
emitting diode
package substrate
diode package
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/522,732
Inventor
Hao-Chung Lee
Yu-Feng Lin
Xun-Xain Zhan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Genesis Photonics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Genesis Photonics Inc filed Critical Genesis Photonics Inc
Priority to US29/522,732 priority Critical patent/USD772181S1/en
Assigned to GENESIS PHOTONICS INC. reassignment GENESIS PHOTONICS INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LEE, HAO-CHUNG, LIN, YU-FENG, ZHAN, XUN-XAIN
Priority to US29/568,703 priority patent/USD790487S1/en
Application granted granted Critical
Publication of USD772181S1 publication Critical patent/USD772181S1/en
Assigned to NICHIA CORPORATION reassignment NICHIA CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: GENESIS PHOTONICS INC.
Assigned to GENESIS PHOTONICS INC. reassignment GENESIS PHOTONICS INC. ADDRESS CHANGE REGISTRATION FORM Assignors: GENESIS PHOTONICS INC.
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Anticipated expiration legal-status Critical

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Description

FIG. 1 is a perspective view of a first embodiment of a light emitting diode package substrate showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is top view thereof;
FIG. 7 is a bottom view thereof; and,
FIG. 8 is a perspective view thereof with a light emitting diode chip mounted.
The broken lines are for the purpose of illustrating portions of the light emitting diode package substrate and the light emitting diode chips and form no part of the claimed design. The light shade lines on the surface portions indicate contour and not surface decoration.

Claims (1)

    CLAIM
  1. The ornamental design for a light emitting diode package substrate, as shown and described.
US29/522,732 2015-04-02 2015-04-02 Light emitting diode package substrate Active USD772181S1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US29/522,732 USD772181S1 (en) 2015-04-02 2015-04-02 Light emitting diode package substrate
US29/568,703 USD790487S1 (en) 2015-04-02 2016-06-21 Light emitting diode package substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/522,732 USD772181S1 (en) 2015-04-02 2015-04-02 Light emitting diode package substrate

Related Child Applications (1)

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US29/568,703 Division USD790487S1 (en) 2015-04-02 2016-06-21 Light emitting diode package substrate

Publications (1)

Publication Number Publication Date
USD772181S1 true USD772181S1 (en) 2016-11-22

Family

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US29/522,732 Active USD772181S1 (en) 2015-04-02 2015-04-02 Light emitting diode package substrate
US29/568,703 Active USD790487S1 (en) 2015-04-02 2016-06-21 Light emitting diode package substrate

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US29/568,703 Active USD790487S1 (en) 2015-04-02 2016-06-21 Light emitting diode package substrate

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD790487S1 (en) * 2015-04-02 2017-06-27 Genesis Photonics Inc. Light emitting diode package substrate
USD800678S1 (en) * 2016-04-28 2017-10-24 Citizen Electronics Co., Ltd. Light emitting diode
TWD188043S (en) 2016-09-29 2018-01-21 新世紀光電股份有限公司 Light emitting diode package
TWD191442S (en) 2016-09-29 2018-07-01 新世紀光電股份有限公司 Light emitting diode package
TWD191441S (en) 2016-09-29 2018-07-01 新世紀光電股份有限公司 Light emitting diode package
USD854195S1 (en) 2016-09-29 2019-07-16 Genesis Photonics Inc. Light emitting diode package
USD886751S1 (en) 2016-09-29 2020-06-09 Genesis Photonics Inc. Light emitting diode module

Citations (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD522466S1 (en) 2003-09-09 2006-06-06 Nichia Corporation Light emitting diode
US20060131600A1 (en) * 2004-03-05 2006-06-22 Junichi Nakaoka Light transmitting window member, semiconductor package provided with light transmitting window member and method for manufacturing light transmitting window member
US7081661B2 (en) * 2001-03-16 2006-07-25 Matsushita Electric Industrial Co., Ltd. High-frequency module and method for manufacturing the same
US20060220050A1 (en) * 2003-08-26 2006-10-05 Sumitomo Electric Industries, Ltd. Semiconductor light-emitting device mounting member, light-emitting diode constituting member using same, and light-emitting diode using same
USD566057S1 (en) * 2006-12-21 2008-04-08 Cree, Inc. LED chip
US20090108281A1 (en) * 2007-10-31 2009-04-30 Cree, Inc. Light emitting diode package and method for fabricating same
US7812363B2 (en) * 2007-05-24 2010-10-12 Koito Manufacturing Co., Ltd. Light emitting device module
US20110133217A1 (en) * 2009-12-03 2011-06-09 Toyoda Gosei Co., Ltd. Led light emitting apparatus and vehicle headlamp using the same
USD650343S1 (en) * 2011-01-31 2011-12-13 Cree, Inc. Multiple configuration light emitting device package
USD658139S1 (en) * 2011-01-31 2012-04-24 Cree, Inc. High-density emitter package
USD660257S1 (en) * 2011-01-31 2012-05-22 Cree, Inc. Emitter package
USD673125S1 (en) * 2011-02-24 2012-12-25 Cree, Inc. Light emitting diode
USD684549S1 (en) * 2011-10-28 2013-06-18 SemiLEDs Optoelectronics Co., Ltd. LED chip
US8581284B2 (en) * 2010-03-24 2013-11-12 Stanley Electric Co., Ltd. Semiconductor light-emitting device and manufacturing method
US20130322070A1 (en) * 2012-05-31 2013-12-05 Cree, Inc. Light emitter packages, systems, and methods
USD703624S1 (en) * 2012-04-06 2014-04-29 Cree, Inc. LED-array package
US8735914B2 (en) * 2010-05-17 2014-05-27 Sharp Kabushiki Kaisha Light emitting device having plural light-emitting sections with resin walls within resin frame
USD711841S1 (en) * 2012-08-23 2014-08-26 Cree, Inc. Light emitting diode (LED) package
US8827495B2 (en) * 2010-06-04 2014-09-09 Sharp Kabushiki Kaisha Light-emitting device
US8901596B2 (en) * 2010-11-15 2014-12-02 Lite-On Electronics (Guangzhou) Limited Lighting device and method for manufacturing the same
USD728491S1 (en) * 2012-12-12 2015-05-05 Nichia Corporation Light emitting diode
US9240528B2 (en) * 2013-10-03 2016-01-19 Cree, Inc. Solid state lighting apparatus with high scotopic/photopic (S/P) ratio
USD749051S1 (en) * 2012-05-31 2016-02-09 Cree, Inc. Light emitting diode (LED) package

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100110656A1 (en) * 2008-10-31 2010-05-06 Advanced Semiconductor Engineering, Inc. Chip package and manufacturing method thereof
US8212340B2 (en) * 2009-07-13 2012-07-03 Advanced Semiconductor Engineering, Inc. Chip package and manufacturing method thereof
US8030750B2 (en) * 2009-11-19 2011-10-04 Advanced Semiconductor Engineering, Inc. Semiconductor device packages with electromagnetic interference shielding
USD647491S1 (en) * 2010-07-30 2011-10-25 Everlight Electronics Co., Ltd. Light emitting diode
USD646646S1 (en) * 2010-07-30 2011-10-11 Everlight Electronics Co., Ltd. Light emitting diode
USD646644S1 (en) * 2010-07-30 2011-10-11 Everlight Electronics Co., Ltd. Light emitting diode
USD646647S1 (en) * 2010-07-30 2011-10-11 Everlight Electronics Co., Ltd. Light emitting diode
USD646645S1 (en) * 2010-07-30 2011-10-11 Everlight Electronics Co., Ltd. Light emitting diode
USD772181S1 (en) * 2015-04-02 2016-11-22 Genesis Photonics Inc. Light emitting diode package substrate

Patent Citations (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7081661B2 (en) * 2001-03-16 2006-07-25 Matsushita Electric Industrial Co., Ltd. High-frequency module and method for manufacturing the same
US20060220050A1 (en) * 2003-08-26 2006-10-05 Sumitomo Electric Industries, Ltd. Semiconductor light-emitting device mounting member, light-emitting diode constituting member using same, and light-emitting diode using same
USD522466S1 (en) 2003-09-09 2006-06-06 Nichia Corporation Light emitting diode
US20060131600A1 (en) * 2004-03-05 2006-06-22 Junichi Nakaoka Light transmitting window member, semiconductor package provided with light transmitting window member and method for manufacturing light transmitting window member
USD566057S1 (en) * 2006-12-21 2008-04-08 Cree, Inc. LED chip
US7812363B2 (en) * 2007-05-24 2010-10-12 Koito Manufacturing Co., Ltd. Light emitting device module
US20090108281A1 (en) * 2007-10-31 2009-04-30 Cree, Inc. Light emitting diode package and method for fabricating same
US20110133217A1 (en) * 2009-12-03 2011-06-09 Toyoda Gosei Co., Ltd. Led light emitting apparatus and vehicle headlamp using the same
US8581284B2 (en) * 2010-03-24 2013-11-12 Stanley Electric Co., Ltd. Semiconductor light-emitting device and manufacturing method
US8735914B2 (en) * 2010-05-17 2014-05-27 Sharp Kabushiki Kaisha Light emitting device having plural light-emitting sections with resin walls within resin frame
US8827495B2 (en) * 2010-06-04 2014-09-09 Sharp Kabushiki Kaisha Light-emitting device
US8901596B2 (en) * 2010-11-15 2014-12-02 Lite-On Electronics (Guangzhou) Limited Lighting device and method for manufacturing the same
USD660257S1 (en) * 2011-01-31 2012-05-22 Cree, Inc. Emitter package
USD658139S1 (en) * 2011-01-31 2012-04-24 Cree, Inc. High-density emitter package
USD650343S1 (en) * 2011-01-31 2011-12-13 Cree, Inc. Multiple configuration light emitting device package
USD673125S1 (en) * 2011-02-24 2012-12-25 Cree, Inc. Light emitting diode
USD684549S1 (en) * 2011-10-28 2013-06-18 SemiLEDs Optoelectronics Co., Ltd. LED chip
USD703624S1 (en) * 2012-04-06 2014-04-29 Cree, Inc. LED-array package
US20130322070A1 (en) * 2012-05-31 2013-12-05 Cree, Inc. Light emitter packages, systems, and methods
USD749051S1 (en) * 2012-05-31 2016-02-09 Cree, Inc. Light emitting diode (LED) package
USD711841S1 (en) * 2012-08-23 2014-08-26 Cree, Inc. Light emitting diode (LED) package
USD728491S1 (en) * 2012-12-12 2015-05-05 Nichia Corporation Light emitting diode
US9240528B2 (en) * 2013-10-03 2016-01-19 Cree, Inc. Solid state lighting apparatus with high scotopic/photopic (S/P) ratio

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
"Office Action of Taiwan Counterpart Application" , issued on Aug. 18, 2015, p. 1-p. 3.

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD790487S1 (en) * 2015-04-02 2017-06-27 Genesis Photonics Inc. Light emitting diode package substrate
USD800678S1 (en) * 2016-04-28 2017-10-24 Citizen Electronics Co., Ltd. Light emitting diode
TWD188043S (en) 2016-09-29 2018-01-21 新世紀光電股份有限公司 Light emitting diode package
TWD191442S (en) 2016-09-29 2018-07-01 新世紀光電股份有限公司 Light emitting diode package
TWD191441S (en) 2016-09-29 2018-07-01 新世紀光電股份有限公司 Light emitting diode package
USD825499S1 (en) 2016-09-29 2018-08-14 Genesis Photonics Inc. Light emitting diode package
USD854195S1 (en) 2016-09-29 2019-07-16 Genesis Photonics Inc. Light emitting diode package
USD886751S1 (en) 2016-09-29 2020-06-09 Genesis Photonics Inc. Light emitting diode module

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