USD761215S1 - Package for light-emitting diode - Google Patents

Package for light-emitting diode Download PDF

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Publication number
USD761215S1
USD761215S1 US29/526,628 US201529526628F USD761215S US D761215 S1 USD761215 S1 US D761215S1 US 201529526628 F US201529526628 F US 201529526628F US D761215 S USD761215 S US D761215S
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US
United States
Prior art keywords
package
emitting diode
light
disclosure
light emitting
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Active
Application number
US29/526,628
Inventor
Junpeng Shi
Pei-Song Cai
Zhenduan Lin
Hao Huang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Quanzhou Sanan Semiconductor Technology Co Ltd
Original Assignee
Xiamen Sanan Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xiamen Sanan Optoelectronics Technology Co Ltd filed Critical Xiamen Sanan Optoelectronics Technology Co Ltd
Assigned to XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD reassignment XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CAI, PEI-SONG, HUANG, HAO, LIN, ZHENDUAN, SHI, Junpeng
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Publication of USD761215S1 publication Critical patent/USD761215S1/en
Assigned to Quanzhou Sanan Semiconductor Technology Co., Ltd. reassignment Quanzhou Sanan Semiconductor Technology Co., Ltd. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
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Description

FIG. 1 is a front view of a package for light emitting diode according to a first embodiment of the disclosure;
FIG. 2 is a rear view of a package for light emitting diode according to the first embodiment of the disclosure;
FIG. 3 is a left side view of a package for light emitting diode according to the first embodiment of the disclosure;
FIG. 4 is a right side view of a package for light emitting diode according to the first embodiment of the disclosure;
FIG. 5 is a top view of a package for light emitting diode according to the first embodiment of the disclosure;
FIG. 6 is a bottom view of a package for light emitting diode according to the first embodiment of the disclosure;
FIG. 7 is a perspective view of a package for light emitting diode according to the first embodiment of the disclosure;
FIG. 8 is another perspective view of a package for light emitting diode according to the first embodiment of the disclosure;
FIG. 9 is a front view of a package for light emitting diode according to a second embodiment of the disclosure;
FIG. 10 is a rear view of a package for light emitting diode according to the second embodiment of the disclosure;
FIG. 11 is a left side view of a package for light emitting diode according to the second embodiment of the disclosure;
FIG. 12 is a right side view of a package for light emitting diode according to the second embodiment of the disclosure;
FIG. 13 is a top view of a package for light emitting diode according to the second embodiment of the disclosure;
FIG. 14 is a bottom view of a package for light emitting diode according to the second embodiment of the disclosure;
FIG. 15 is a perspective view of a package for light emitting diode according to the second embodiment of the disclosure;
FIG. 16 is another perspective view of a package for light emitting diode according to the second embodiment of the disclosure;
FIG. 17 is a front view of a package for light emitting diode according to a third embodiment of the disclosure;
FIG. 18 is a rear view of a package for light emitting diode according to the third embodiment of the disclosure;
FIG. 19 is a left side view of a package for light emitting diode according to the third embodiment of the disclosure;
FIG. 20 is a right side view of a package for light emitting diode according to the third embodiment of the disclosure;
FIG. 21 is a top view of a package for light emitting diode according to the third embodiment of the disclosure;
FIG. 22 is a bottom view of a package for light emitting diode according to the third embodiment of the disclosure;
FIG. 23 is a perspective view of a package for light emitting diode according to the third embodiment of the disclosure; and,
FIG. 24 is another perspective view of a package for light emitting diode according to the third embodiment of the disclosure.

Claims (1)

    CLAIM
  1. The ornamental design for a package for light-emitting diode, substantially as shown and described.
US29/526,628 2015-05-06 2015-05-12 Package for light-emitting diode Active USD761215S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201530129524 2015-05-06
CN201530129524 2015-05-06

Publications (1)

Publication Number Publication Date
USD761215S1 true USD761215S1 (en) 2016-07-12

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Family Applications (1)

Application Number Title Priority Date Filing Date
US29/526,628 Active USD761215S1 (en) 2015-05-06 2015-05-12 Package for light-emitting diode

Country Status (1)

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US (1) USD761215S1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD768095S1 (en) * 2015-10-08 2016-10-04 Xiameng Sanan Optoelectronics Technology Co., Ltd. Light-emitting diode package
USD825500S1 (en) * 2016-03-24 2018-08-14 Hamamatsu Photonics K.K. Optical semiconductor element
USD826184S1 (en) * 2016-03-24 2018-08-21 Hamamatsu Photonics K.K. Optical semiconductor element
USD831592S1 (en) * 2016-03-24 2018-10-23 Hamamatsu Photonics K.K. Optical semiconductor element
USD831593S1 (en) * 2016-03-24 2018-10-23 Hamamatsu Photonics K.K Optical semiconductor element
USD832802S1 (en) * 2016-03-24 2018-11-06 Hamamatsu Photonics K.K. Optical semiconductor element
USD906270S1 (en) * 2018-10-26 2020-12-29 Kingbright Electronics Co. Ltd. LED component

Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020123163A1 (en) * 2000-04-24 2002-09-05 Takehiro Fujii Edge-emitting light-emitting semiconductor device and method of manufacture thereof
USD476961S1 (en) * 2002-04-12 2003-07-08 Citizen Electronics Co., Ltd. Light-emitting diode
US6657238B2 (en) * 2001-01-25 2003-12-02 Rohm Co., Ltd. Light emitting diode and illuminator using the same
US6734536B2 (en) * 2001-01-12 2004-05-11 Rohm Co., Ltd. Surface-mounting semiconductor device and method of making the same
US7491977B2 (en) * 2004-02-04 2009-02-17 Citizen Electronics Co., Ltd. Light emitting diode
US20090057855A1 (en) * 2007-08-30 2009-03-05 Maria Clemens Quinones Semiconductor die package including stand off structures
US7586178B2 (en) * 2003-02-11 2009-09-08 Fairchild Semiconductor Corporation Alternative flip chip in leaded molded package design and method for manufacture
US20100059782A1 (en) * 2008-09-09 2010-03-11 Nichia Corporation Optical-semiconductor device and method for manufactruing the same
USD626097S1 (en) * 2009-10-16 2010-10-26 Kabushiki Kaisha Toshiba Light-emitting diode
USD626922S1 (en) * 2010-02-23 2010-11-09 Citizen Electronics Co., Ltd. Light-emitting diode
USD629767S1 (en) * 2010-03-19 2010-12-28 Kabushiki Kaisha Toshiba Light-emitting diode
US20120132933A1 (en) * 2010-11-25 2012-05-31 Kabushiki Kaisha Toshiba Led module and illumination apparatus
USD671509S1 (en) * 2011-07-22 2012-11-27 Rohm Co., Ltd. Light emitting diode module
USD676002S1 (en) * 2011-07-07 2013-02-12 Citizen Electronics Co., Ltd. Light-emitting diode
USD694201S1 (en) * 2012-03-30 2013-11-26 Citizen Electronics Co., Ltd. Light-emitting diode
USD698742S1 (en) * 2012-09-27 2014-02-04 Kabushiki Kaisha Toshiba Light-emitting diode
USD731989S1 (en) * 2014-06-06 2015-06-16 Genesis Photonics Inc. Light emitting diode chip
USD742554S1 (en) * 2013-01-27 2015-11-03 Citizen Electronics Co., Ltd. Lighting unit

Patent Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020123163A1 (en) * 2000-04-24 2002-09-05 Takehiro Fujii Edge-emitting light-emitting semiconductor device and method of manufacture thereof
US6734536B2 (en) * 2001-01-12 2004-05-11 Rohm Co., Ltd. Surface-mounting semiconductor device and method of making the same
US6657238B2 (en) * 2001-01-25 2003-12-02 Rohm Co., Ltd. Light emitting diode and illuminator using the same
USD476961S1 (en) * 2002-04-12 2003-07-08 Citizen Electronics Co., Ltd. Light-emitting diode
US7586178B2 (en) * 2003-02-11 2009-09-08 Fairchild Semiconductor Corporation Alternative flip chip in leaded molded package design and method for manufacture
US7491977B2 (en) * 2004-02-04 2009-02-17 Citizen Electronics Co., Ltd. Light emitting diode
US20090057855A1 (en) * 2007-08-30 2009-03-05 Maria Clemens Quinones Semiconductor die package including stand off structures
US20100059782A1 (en) * 2008-09-09 2010-03-11 Nichia Corporation Optical-semiconductor device and method for manufactruing the same
USD626097S1 (en) * 2009-10-16 2010-10-26 Kabushiki Kaisha Toshiba Light-emitting diode
USD626922S1 (en) * 2010-02-23 2010-11-09 Citizen Electronics Co., Ltd. Light-emitting diode
USD629767S1 (en) * 2010-03-19 2010-12-28 Kabushiki Kaisha Toshiba Light-emitting diode
US20120132933A1 (en) * 2010-11-25 2012-05-31 Kabushiki Kaisha Toshiba Led module and illumination apparatus
USD676002S1 (en) * 2011-07-07 2013-02-12 Citizen Electronics Co., Ltd. Light-emitting diode
USD671509S1 (en) * 2011-07-22 2012-11-27 Rohm Co., Ltd. Light emitting diode module
USD694201S1 (en) * 2012-03-30 2013-11-26 Citizen Electronics Co., Ltd. Light-emitting diode
USD698742S1 (en) * 2012-09-27 2014-02-04 Kabushiki Kaisha Toshiba Light-emitting diode
USD742554S1 (en) * 2013-01-27 2015-11-03 Citizen Electronics Co., Ltd. Lighting unit
USD731989S1 (en) * 2014-06-06 2015-06-16 Genesis Photonics Inc. Light emitting diode chip

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD768095S1 (en) * 2015-10-08 2016-10-04 Xiameng Sanan Optoelectronics Technology Co., Ltd. Light-emitting diode package
USD825500S1 (en) * 2016-03-24 2018-08-14 Hamamatsu Photonics K.K. Optical semiconductor element
USD826184S1 (en) * 2016-03-24 2018-08-21 Hamamatsu Photonics K.K. Optical semiconductor element
USD831592S1 (en) * 2016-03-24 2018-10-23 Hamamatsu Photonics K.K. Optical semiconductor element
USD831593S1 (en) * 2016-03-24 2018-10-23 Hamamatsu Photonics K.K Optical semiconductor element
USD832802S1 (en) * 2016-03-24 2018-11-06 Hamamatsu Photonics K.K. Optical semiconductor element
USD846512S1 (en) * 2016-03-24 2019-04-23 Hamamatsu Photonics K.K. Optical semiconductor element
USD846511S1 (en) * 2016-03-24 2019-04-23 Hamamatsu Photonics K.K. Optical semiconductor element
USD906270S1 (en) * 2018-10-26 2020-12-29 Kingbright Electronics Co. Ltd. LED component

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