USD831593S1 - Optical semiconductor element - Google Patents

Optical semiconductor element Download PDF

Info

Publication number
USD831593S1
USD831593S1 US35/355,026 US35502668F USD831593S US D831593 S1 USD831593 S1 US D831593S1 US 35502668 F US35502668 F US 35502668F US D831593 S USD831593 S US D831593S
Authority
US
United States
Prior art keywords
optical semiconductor
sealing resin
board
parts
reproduction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US35/355,026
Other versions
USD854690S1 (en
USD837145S1 (en
USD836273S1 (en
USD820948S1 (en
USD832893S1 (en
USD832802S1 (en
USD841985S1 (en
USD835300S1 (en
USD836274S1 (en
USD822507S1 (en
USD823451S1 (en
USD817909S1 (en
USD836968S1 (en
USD836211S1 (en
USD818075S1 (en
USD817908S1 (en
USD822954S1 (en
USD821698S1 (en
USD836589S1 (en
USD844748S1 (en
USD833676S1 (en
USD851321S1 (en
USD816575S1 (en
USD858634S1 (en
USD847382S1 (en
USD856674S1 (en
USD818969S1 (en
USD817803S1 (en
USD837144S1 (en
USD843043S1 (en
USD823952S1 (en
USD831741S1 (en
USD851264S1 (en
USD851801S1 (en
USD819305S1 (en
USD823401S1 (en
USD826184S1 (en
USD822957S1 (en
USD827954S1 (en
USD832538S1 (en
USD836868S1 (en
USD831592S1 (en
USD823915S1 (en
USD846737S1 (en
USD830685S1 (en
USD841121S1 (en
USD827473S1 (en
USD822348S1 (en
USD824783S1 (en
USD851610S1 (en
USD822584S1 (en
USD868230S1 (en
USD838532S1 (en
USD851802S1 (en
USD836867S1 (en
USD825500S1 (en
USD821872S1 (en
USD820947S1 (en
USD848157S1 (en
USD830188S1 (en
USD823175S1 (en
USD817080S1 (en
USD823211S1 (en
USD839517S1 (en
Inventor
Fumitaka Nishio
Makio Kume
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hamamatsu Photonics KK
Original Assignee
Hamamatsu Photonics KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2016-006372 priority Critical
Priority to JPD2016-6373F priority patent/JP1563910S/ja
Priority to JP2016-006373 priority
Priority to JPD2016-6372F priority patent/JP1563811S/ja
Application filed by Hamamatsu Photonics KK filed Critical Hamamatsu Photonics KK
Assigned to HAMAMATSU PHOTONICS K.K. reassignment HAMAMATSU PHOTONICS K.K. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KUME, MAKIO, Nishio, Fumitaka
Publication of USD831593S1 publication Critical patent/USD831593S1/en
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

1. Optical semiconductor element
1.1 : Top perspective view
1.2 : Bottom perspective view
1.3 : Front
1.4 : Back
1.5 : Top
1.6 : Bottom
1.7 : Left
1.8 : Right
1.9 : Sectional view
1.10 : Sectional view
1.11 : Reference view showing the state in use
The article has a board part, a transparent sealing resin part and a light-shield sealing resin part; the board part has an entrance window in the center; the transparent sealing resin part covers an upper surface of the board part; the light-shield sealing resin part encapsulating a semiconductor light receiving element is positioned underneath the board part; the bottom center of the transparent sealing resin part is protruded and engaged with the entrance window of the board part; the article can be mounted onto a mount board; the parts shown as solid lines are parts for which design registration is sought; the lines consisting of alternating long and short dashes in the drawings only indicate lines dividing our inventive design claimed herein from other parts which are not claimed; the parts for which design registration is sought are a lower part of the transparent sealing resin part, the board part and an upper part of the light-shield sealing resin part; the transparent sealing resin part of the article is transparent; reproduction 1.9 is a cross-sectional view through the center of reproduction 1.5, and reproduction 1.10 is a cross-sectional view through the upper semicircular electrode parts of reproduction 1.5. In the reproductions, the dash-dot-dash broken lines are for the purpose of illustrating the boundaries of the claimed design. The evenly spaced broken lines are for the purpose of illustrating environment only and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for an optical semiconductor element, as shown and described.
US35/355,026 2016-03-24 2016-09-21 Optical semiconductor element Active USD831593S1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016-006372 2016-01-15
JPD2016-6373F JP1563910S (en) 2016-03-24 2016-03-24
JP2016-006373 2016-03-24
JPD2016-6372F JP1563811S (en) 2016-03-24 2016-03-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/645,559 USD846511S1 (en) 2016-03-24 2018-04-27 Optical semiconductor element

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US29/645,559 Division USD846511S1 (en) 2016-03-24 2018-04-27 Optical semiconductor element

Publications (1)

Publication Number Publication Date
USD831593S1 true USD831593S1 (en) 2018-10-23

Family

ID=63833010

Family Applications (2)

Application Number Title Priority Date Filing Date
US35/355,026 Active USD831593S1 (en) 2016-03-24 2016-09-21 Optical semiconductor element
US29/645,559 Active USD846511S1 (en) 2016-03-24 2018-04-27 Optical semiconductor element

Family Applications After (1)

Application Number Title Priority Date Filing Date
US29/645,559 Active USD846511S1 (en) 2016-03-24 2018-04-27 Optical semiconductor element

Country Status (1)

Country Link
US (2) USD831593S1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD846512S1 (en) * 2016-03-24 2019-04-23 Hamamatsu Photonics K.K. Optical semiconductor element
USD846511S1 (en) * 2016-03-24 2019-04-23 Hamamatsu Photonics K.K. Optical semiconductor element

Citations (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US750578A (en) 1904-01-26 Self-leveling furniture
USD511328S1 (en) * 2004-06-23 2005-11-08 Harvatek Corporation Light-emitting diode
USD512029S1 (en) * 2004-06-28 2005-11-29 Samsung Electro-Mechanics Co., Ltd. Light-emitting diode
USD568834S1 (en) * 2007-06-28 2008-05-13 Citizen Electronics Co., Ltd. Light-emitting diode for illuminating an object
USD574994S1 (en) * 2008-04-11 2008-08-12 Lsi Industries, Inc. Lighting fixture
USD576115S1 (en) * 2006-11-14 2008-09-02 Lg Innotek Co., Ltd. Light-emitting diode
USD585850S1 (en) * 2007-07-20 2009-02-03 Lg Innotek Co., Ltd Light-emitting diode (LED)
USD626097S1 (en) * 2009-10-16 2010-10-26 Kabushiki Kaisha Toshiba Light-emitting diode
USD626922S1 (en) * 2010-02-23 2010-11-09 Citizen Electronics Co., Ltd. Light-emitting diode
USD627314S1 (en) * 2010-02-01 2010-11-16 Foxsemicon Integrated Technology, Inc. Light-emitting diode
USD647864S1 (en) * 2010-12-22 2011-11-01 Lite-On Technology Corp. Light emitting diode carrier
USD654032S1 (en) * 2011-01-07 2012-02-14 Silitek Electronic (Guangzhou) Co., Ltd. Package of a light emitting diode
USD671674S1 (en) * 2012-02-23 2012-11-27 Wooree Lighting Co., Ltd. LED lamp
USD693317S1 (en) * 2012-05-29 2013-11-12 Kabushiki Kaisha Toshiba Light-emitting diode
USD693781S1 (en) * 2012-08-22 2013-11-19 Kabushiki Kaisha Toshiba Light-emitting diode
USD697876S1 (en) * 2012-11-20 2014-01-21 Lextar Electronics Corp. Light emitting diode lead-frame
USD725613S1 (en) * 2012-06-15 2015-03-31 Cree, Inc. LED package
USD728493S1 (en) * 2013-07-31 2015-05-05 Lextar Electronics Corporation Light-emitting diode lead-frame
USD728480S1 (en) * 2013-08-30 2015-05-05 Unity Opto Technology Co., Ltd. LED lamp holder
USD730303S1 (en) * 2014-06-10 2015-05-26 High Power Opto, Inc. LED chip
USD731989S1 (en) * 2014-06-06 2015-06-16 Genesis Photonics Inc. Light emitting diode chip
USD735683S1 (en) * 2013-05-03 2015-08-04 Cree, Inc. LED package
USD737784S1 (en) * 2014-07-30 2015-09-01 Kingbright Electronics Co., Ltd. LED component
USD738832S1 (en) * 2006-04-04 2015-09-15 Cree, Inc. Light emitting diode (LED) package
USD741821S1 (en) * 2014-04-10 2015-10-27 Kingbright Electronics Co., Ltd. LED component
USD742554S1 (en) * 2013-01-27 2015-11-03 Citizen Electronics Co., Ltd. Lighting unit
USD753612S1 (en) * 2012-09-07 2016-04-12 Cree, Inc. Light emitter device
USD757664S1 (en) * 2014-09-30 2016-05-31 Lite-On Opto Technology (Changzhou) Co., Ltd. Light emitting diode
USD758976S1 (en) * 2013-08-08 2016-06-14 Cree, Inc. LED package
USD761215S1 (en) * 2015-05-06 2016-07-12 Xiamen Sanan Optoelectronics Technology Co., Ltd. Package for light-emitting diode
USD763206S1 (en) * 2015-01-29 2016-08-09 Advanced Optoelectronic Technology, Inc. Light emitting diode package
JP1563811S (en) 2016-03-24 2016-11-21
JP1563910S (en) 2016-03-24 2016-11-21
USD773724S1 (en) * 2015-11-18 2016-12-06 Pilot, Inc. Cordless LED lamp
USD778849S1 (en) * 2015-11-05 2017-02-14 Dowa Electronics Materials Co., Ltd. Light emitting diode chip
US9620693B2 (en) * 2012-09-13 2017-04-11 Lg Innotek Co., Ltd. Light emitting device and lighting system having the same
USD783547S1 (en) * 2015-06-04 2017-04-11 Cree, Inc. LED package
US9634209B2 (en) * 2011-03-02 2017-04-25 Cree, Inc. Miniature surface mount device
USD794582S1 (en) * 2016-07-29 2017-08-15 Enraytek Optoelectronics Co., Ltd. LED chip
USD795492S1 (en) * 2015-12-24 2017-08-22 Semicon Light Co., Ltd. Mold for packaging semiconductor light emitting device
USD796456S1 (en) * 2015-04-02 2017-09-05 Genesis Photonics Inc. Light emitting diode package
USD800678S1 (en) * 2016-04-28 2017-10-24 Citizen Electronics Co., Ltd. Light emitting diode
USD800679S1 (en) * 2016-04-28 2017-10-24 Citizen Electronics Co., Ltd. Light emitting diode
USD805070S1 (en) * 2016-03-11 2017-12-12 Roe Visual Co., Ltd. LED display
USD805244S1 (en) * 2013-02-13 2017-12-12 Svv Technology Innovations, Inc. Light guide
USD805399S1 (en) * 2016-07-19 2017-12-19 Under Armour, Inc. Package

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101308349B1 (en) * 2006-11-15 2013-09-17 히타치가세이가부시끼가이샤 Process for producing heat curable resin composition for light reflection
US10033154B2 (en) * 2010-03-03 2018-07-24 Furukawa Electronic Co., Ltd. Semiconductor optical element, semiconductor laser element, and method for manufacturing semiconductor optical element and semiconductor laser element, and method for manufacturing semiconductor laser module and semiconductor element
US20140175505A1 (en) * 2011-07-14 2014-06-26 Ryosuke Yamazaki Sealing agent for optical semiconductor devices, and optical semiconductor device
US8748908B2 (en) * 2012-05-07 2014-06-10 Sufian Abedrabbo Semiconductor optical emission device
KR20140124110A (en) * 2013-04-16 2014-10-24 주식회사 포스코엘이디 Optical semiconductor illuminating apparatus
US10208206B2 (en) * 2013-05-08 2019-02-19 Asahi Kasei Chemicals Corporation Curable resin composition and cured product thereof, sealing material for optical semiconductor, die bonding material, and optical semiconductor light-emitting element
JP2016169358A (en) * 2014-07-24 2016-09-23 セントラル硝子株式会社 Curable silicone resin composition and cured product of the same, and optical semiconductor device using them
USD750578S1 (en) 2014-09-30 2016-03-01 Lite-On Opto Technology (Changzhou) Co., Ltd. Light emitting diode
USD826184S1 (en) * 2016-03-24 2018-08-21 Hamamatsu Photonics K.K. Optical semiconductor element
JP1563810S (en) * 2016-03-24 2016-11-21
JP1563908S (en) * 2016-03-24 2016-11-21
JP1563909S (en) * 2016-03-24 2016-11-21
USD831593S1 (en) * 2016-03-24 2018-10-23 Hamamatsu Photonics K.K Optical semiconductor element
JP2018181911A (en) * 2017-04-04 2018-11-15 浜松ホトニクス株式会社 Optical semiconductor device

Patent Citations (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US750578A (en) 1904-01-26 Self-leveling furniture
USD511328S1 (en) * 2004-06-23 2005-11-08 Harvatek Corporation Light-emitting diode
USD512029S1 (en) * 2004-06-28 2005-11-29 Samsung Electro-Mechanics Co., Ltd. Light-emitting diode
USD738832S1 (en) * 2006-04-04 2015-09-15 Cree, Inc. Light emitting diode (LED) package
USD576115S1 (en) * 2006-11-14 2008-09-02 Lg Innotek Co., Ltd. Light-emitting diode
USD568834S1 (en) * 2007-06-28 2008-05-13 Citizen Electronics Co., Ltd. Light-emitting diode for illuminating an object
USD585850S1 (en) * 2007-07-20 2009-02-03 Lg Innotek Co., Ltd Light-emitting diode (LED)
USD574994S1 (en) * 2008-04-11 2008-08-12 Lsi Industries, Inc. Lighting fixture
USD626097S1 (en) * 2009-10-16 2010-10-26 Kabushiki Kaisha Toshiba Light-emitting diode
USD627314S1 (en) * 2010-02-01 2010-11-16 Foxsemicon Integrated Technology, Inc. Light-emitting diode
USD626922S1 (en) * 2010-02-23 2010-11-09 Citizen Electronics Co., Ltd. Light-emitting diode
USD647864S1 (en) * 2010-12-22 2011-11-01 Lite-On Technology Corp. Light emitting diode carrier
USD654032S1 (en) * 2011-01-07 2012-02-14 Silitek Electronic (Guangzhou) Co., Ltd. Package of a light emitting diode
US9634209B2 (en) * 2011-03-02 2017-04-25 Cree, Inc. Miniature surface mount device
USD671674S1 (en) * 2012-02-23 2012-11-27 Wooree Lighting Co., Ltd. LED lamp
USD693317S1 (en) * 2012-05-29 2013-11-12 Kabushiki Kaisha Toshiba Light-emitting diode
USD725613S1 (en) * 2012-06-15 2015-03-31 Cree, Inc. LED package
USD693781S1 (en) * 2012-08-22 2013-11-19 Kabushiki Kaisha Toshiba Light-emitting diode
USD753612S1 (en) * 2012-09-07 2016-04-12 Cree, Inc. Light emitter device
US9620693B2 (en) * 2012-09-13 2017-04-11 Lg Innotek Co., Ltd. Light emitting device and lighting system having the same
USD697876S1 (en) * 2012-11-20 2014-01-21 Lextar Electronics Corp. Light emitting diode lead-frame
USD742554S1 (en) * 2013-01-27 2015-11-03 Citizen Electronics Co., Ltd. Lighting unit
USD805244S1 (en) * 2013-02-13 2017-12-12 Svv Technology Innovations, Inc. Light guide
USD735683S1 (en) * 2013-05-03 2015-08-04 Cree, Inc. LED package
USD728493S1 (en) * 2013-07-31 2015-05-05 Lextar Electronics Corporation Light-emitting diode lead-frame
USD758976S1 (en) * 2013-08-08 2016-06-14 Cree, Inc. LED package
USD728480S1 (en) * 2013-08-30 2015-05-05 Unity Opto Technology Co., Ltd. LED lamp holder
USD741821S1 (en) * 2014-04-10 2015-10-27 Kingbright Electronics Co., Ltd. LED component
USD763805S1 (en) * 2014-06-06 2016-08-16 Genesis Photonics Inc. Light emitting diode chip
USD731989S1 (en) * 2014-06-06 2015-06-16 Genesis Photonics Inc. Light emitting diode chip
USD730303S1 (en) * 2014-06-10 2015-05-26 High Power Opto, Inc. LED chip
USD737784S1 (en) * 2014-07-30 2015-09-01 Kingbright Electronics Co., Ltd. LED component
USD757664S1 (en) * 2014-09-30 2016-05-31 Lite-On Opto Technology (Changzhou) Co., Ltd. Light emitting diode
USD763206S1 (en) * 2015-01-29 2016-08-09 Advanced Optoelectronic Technology, Inc. Light emitting diode package
USD796456S1 (en) * 2015-04-02 2017-09-05 Genesis Photonics Inc. Light emitting diode package
USD761215S1 (en) * 2015-05-06 2016-07-12 Xiamen Sanan Optoelectronics Technology Co., Ltd. Package for light-emitting diode
USD783547S1 (en) * 2015-06-04 2017-04-11 Cree, Inc. LED package
USD778849S1 (en) * 2015-11-05 2017-02-14 Dowa Electronics Materials Co., Ltd. Light emitting diode chip
USD773724S1 (en) * 2015-11-18 2016-12-06 Pilot, Inc. Cordless LED lamp
USD795492S1 (en) * 2015-12-24 2017-08-22 Semicon Light Co., Ltd. Mold for packaging semiconductor light emitting device
USD805070S1 (en) * 2016-03-11 2017-12-12 Roe Visual Co., Ltd. LED display
JP1563811S (en) 2016-03-24 2016-11-21
JP1563910S (en) 2016-03-24 2016-11-21
USD800678S1 (en) * 2016-04-28 2017-10-24 Citizen Electronics Co., Ltd. Light emitting diode
USD800679S1 (en) * 2016-04-28 2017-10-24 Citizen Electronics Co., Ltd. Light emitting diode
USD805399S1 (en) * 2016-07-19 2017-12-19 Under Armour, Inc. Package
USD794582S1 (en) * 2016-07-29 2017-08-15 Enraytek Optoelectronics Co., Ltd. LED chip

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD846512S1 (en) * 2016-03-24 2019-04-23 Hamamatsu Photonics K.K. Optical semiconductor element
USD846511S1 (en) * 2016-03-24 2019-04-23 Hamamatsu Photonics K.K. Optical semiconductor element

Also Published As

Publication number Publication date
USD846511S1 (en) 2019-04-23

Similar Documents

Publication Publication Date Title
USD826184S1 (en) Optical semiconductor element
USD825500S1 (en) Optical semiconductor element
USD855210S1 (en) Substrate for spectroscopic analysis
USD855207S1 (en) Substrate for spectroscopic analysis
USD855206S1 (en) Substrate for spectroscopic analysis
USD855208S1 (en) Substrate for spectroscopic analysis
USD854184S1 (en) Substrate for spectroscopic analysis
USD859499S1 (en) Transparent cover for a camera
USD806701S1 (en) Electronic device
USD822872S1 (en) LED light fixture
USD805659S1 (en) LED module
USD779984S1 (en) Surface mount light
USD813677S1 (en) Bottle
USD832228S1 (en) Semiconductor module
USD790487S1 (en) Light emitting diode package substrate
USD831593S1 (en) Optical semiconductor element
USD832802S1 (en) Optical semiconductor element
USD831592S1 (en) Optical semiconductor element
USD832227S1 (en) Semiconductor module
USD829807S1 (en) Mounting ring with extensions on a tripod
USD855205S1 (en) Substrate for spectroscopic analysis
USD762596S1 (en) Light emitting diode package substrate
USD848077S1 (en) Cover lens frame
USD823143S1 (en) Combined cap and base of a sensor
USD843594S1 (en) Substrate for spectroscopic analysis