USD831592S1 - Optical semiconductor element - Google Patents

Optical semiconductor element Download PDF

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Publication number
USD831592S1
USD831592S1 US35/355,026 US35502667F USD831592S US D831592 S1 USD831592 S1 US D831592S1 US 35502667 F US35502667 F US 35502667F US D831592 S USD831592 S US D831592S
Authority
US
United States
Prior art keywords
semiconductor element
optical semiconductor
part
sealing resin
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US35/355,026
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Inventor
Fumitaka Nishio
Makio Kume
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hamamatsu Photonics KK
Original Assignee
Hamamatsu Photonics KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JPD2016-6371F priority Critical patent/JP1563909S/ja
Priority to JP2016-006371 priority
Application filed by Hamamatsu Photonics KK filed Critical Hamamatsu Photonics KK
Assigned to HAMAMATSU PHOTONICS K.K. reassignment HAMAMATSU PHOTONICS K.K. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KUME, MAKIO, Nishio, Fumitaka
Application granted granted Critical
Publication of USD831592S1 publication Critical patent/USD831592S1/en
Application status is Active legal-status Critical
Anticipated expiration legal-status Critical

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Description

1. Optical semiconductor element

1.1 : Top perspective view

1.2 : Bottom perspective view

1.3 : Front

1.4 : Back

1.5 : Top

1.6 : Bottom

1.7 : Left

1.8 : Right

1.9 : Sectional view

1.10 : Reference view showing the state in use

This article has a board part, a transparent sealing resin part and a light-shield sealing resin part; the board part has a rectangular entrance window in the center; the transparent sealing resin part covers an upper surface of the board part; the light-shield sealing resin part encapsulating a semiconductor light receiving element is positioned underneath the board part; the bottom center of the transparent sealing resin part is protruded and engaged with the rectangular entrance window of the board part; the article can be mounted onto a mount board; the parts shown as solid lines are parts for which design registration is sought; the lines consisting of alternating long and short dashes in the drawings only indicate lines dividing our inventive design claimed herein from other parts which are not claimed; the parts for which design registration is sought are lower parts of the side surfaces of the transparent sealing resin part including the protruding part, and the board part including the rectangular entrance window part; the transparent sealing resin part of the article is transparent; reproduction 1.9 is a cross-sectional view through the upper semicircular electrode parts of reproduction 1.5.

In the reproductions, the dash-dot-dash broken lines are for the purpose of illustrating the boundaries of the claimed design. The evenly spaced broken lines are for the purpose of illustrating environment only and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for an optical semiconductor element, as shown and described.
US35/355,026 2016-03-24 2016-09-21 Optical semiconductor element Active USD831592S1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JPD2016-6371F JP1563909S (en) 2016-03-24 2016-03-24
JP2016-006371 2016-03-24

Publications (1)

Publication Number Publication Date
USD831592S1 true USD831592S1 (en) 2018-10-23

Family

ID=57321899

Family Applications (1)

Application Number Title Priority Date Filing Date
US35/355,026 Active USD831592S1 (en) 2016-03-24 2016-09-21 Optical semiconductor element

Country Status (2)

Country Link
US (1) USD831592S1 (en)
JP (1) JP1563909S (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD846512S1 (en) * 2016-03-24 2019-04-23 Hamamatsu Photonics K.K. Optical semiconductor element
USD846511S1 (en) * 2016-03-24 2019-04-23 Hamamatsu Photonics K.K. Optical semiconductor element

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USD728493S1 (en) * 2013-07-31 2015-05-05 Lextar Electronics Corporation Light-emitting diode lead-frame
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USD730303S1 (en) * 2014-06-10 2015-05-26 High Power Opto, Inc. LED chip
USD731989S1 (en) * 2014-06-06 2015-06-16 Genesis Photonics Inc. Light emitting diode chip
USD735683S1 (en) * 2013-05-03 2015-08-04 Cree, Inc. LED package
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USD761215S1 (en) * 2015-05-06 2016-07-12 Xiamen Sanan Optoelectronics Technology Co., Ltd. Package for light-emitting diode
USD763206S1 (en) * 2015-01-29 2016-08-09 Advanced Optoelectronic Technology, Inc. Light emitting diode package
JP1563910S (en) 2016-03-24 2016-11-21
USD773724S1 (en) * 2015-11-18 2016-12-06 Pilot, Inc. Cordless LED lamp
USD778849S1 (en) * 2015-11-05 2017-02-14 Dowa Electronics Materials Co., Ltd. Light emitting diode chip
USD783547S1 (en) * 2015-06-04 2017-04-11 Cree, Inc. LED package
US9620693B2 (en) * 2012-09-13 2017-04-11 Lg Innotek Co., Ltd. Light emitting device and lighting system having the same
US9634209B2 (en) * 2011-03-02 2017-04-25 Cree, Inc. Miniature surface mount device
USD794582S1 (en) * 2016-07-29 2017-08-15 Enraytek Optoelectronics Co., Ltd. LED chip
USD795492S1 (en) * 2015-12-24 2017-08-22 Semicon Light Co., Ltd. Mold for packaging semiconductor light emitting device
USD796456S1 (en) * 2015-04-02 2017-09-05 Genesis Photonics Inc. Light emitting diode package
USD800679S1 (en) * 2016-04-28 2017-10-24 Citizen Electronics Co., Ltd. Light emitting diode
USD800678S1 (en) * 2016-04-28 2017-10-24 Citizen Electronics Co., Ltd. Light emitting diode
USD805244S1 (en) * 2013-02-13 2017-12-12 Svv Technology Innovations, Inc. Light guide
USD805070S1 (en) * 2016-03-11 2017-12-12 Roe Visual Co., Ltd. LED display
USD805399S1 (en) * 2016-07-19 2017-12-19 Under Armour, Inc. Package

Patent Citations (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD511328S1 (en) * 2004-06-23 2005-11-08 Harvatek Corporation Light-emitting diode
USD512029S1 (en) * 2004-06-28 2005-11-29 Samsung Electro-Mechanics Co., Ltd. Light-emitting diode
USD738832S1 (en) * 2006-04-04 2015-09-15 Cree, Inc. Light emitting diode (LED) package
USD576115S1 (en) * 2006-11-14 2008-09-02 Lg Innotek Co., Ltd. Light-emitting diode
USD568834S1 (en) * 2007-06-28 2008-05-13 Citizen Electronics Co., Ltd. Light-emitting diode for illuminating an object
USD585850S1 (en) * 2007-07-20 2009-02-03 Lg Innotek Co., Ltd Light-emitting diode (LED)
USD574994S1 (en) * 2008-04-11 2008-08-12 Lsi Industries, Inc. Lighting fixture
USD626097S1 (en) * 2009-10-16 2010-10-26 Kabushiki Kaisha Toshiba Light-emitting diode
USD627314S1 (en) * 2010-02-01 2010-11-16 Foxsemicon Integrated Technology, Inc. Light-emitting diode
USD626922S1 (en) * 2010-02-23 2010-11-09 Citizen Electronics Co., Ltd. Light-emitting diode
USD647864S1 (en) * 2010-12-22 2011-11-01 Lite-On Technology Corp. Light emitting diode carrier
USD654032S1 (en) * 2011-01-07 2012-02-14 Silitek Electronic (Guangzhou) Co., Ltd. Package of a light emitting diode
US9634209B2 (en) * 2011-03-02 2017-04-25 Cree, Inc. Miniature surface mount device
USD671674S1 (en) * 2012-02-23 2012-11-27 Wooree Lighting Co., Ltd. LED lamp
USD693317S1 (en) * 2012-05-29 2013-11-12 Kabushiki Kaisha Toshiba Light-emitting diode
USD725613S1 (en) * 2012-06-15 2015-03-31 Cree, Inc. LED package
USD693781S1 (en) * 2012-08-22 2013-11-19 Kabushiki Kaisha Toshiba Light-emitting diode
USD753612S1 (en) * 2012-09-07 2016-04-12 Cree, Inc. Light emitter device
US9620693B2 (en) * 2012-09-13 2017-04-11 Lg Innotek Co., Ltd. Light emitting device and lighting system having the same
USD697876S1 (en) * 2012-11-20 2014-01-21 Lextar Electronics Corp. Light emitting diode lead-frame
USD742554S1 (en) * 2013-01-27 2015-11-03 Citizen Electronics Co., Ltd. Lighting unit
USD805244S1 (en) * 2013-02-13 2017-12-12 Svv Technology Innovations, Inc. Light guide
USD735683S1 (en) * 2013-05-03 2015-08-04 Cree, Inc. LED package
USD728493S1 (en) * 2013-07-31 2015-05-05 Lextar Electronics Corporation Light-emitting diode lead-frame
USD758976S1 (en) * 2013-08-08 2016-06-14 Cree, Inc. LED package
USD728480S1 (en) * 2013-08-30 2015-05-05 Unity Opto Technology Co., Ltd. LED lamp holder
USD741821S1 (en) * 2014-04-10 2015-10-27 Kingbright Electronics Co., Ltd. LED component
USD731989S1 (en) * 2014-06-06 2015-06-16 Genesis Photonics Inc. Light emitting diode chip
USD763805S1 (en) * 2014-06-06 2016-08-16 Genesis Photonics Inc. Light emitting diode chip
USD730303S1 (en) * 2014-06-10 2015-05-26 High Power Opto, Inc. LED chip
USD737784S1 (en) * 2014-07-30 2015-09-01 Kingbright Electronics Co., Ltd. LED component
USD750578S1 (en) 2014-09-30 2016-03-01 Lite-On Opto Technology (Changzhou) Co., Ltd. Light emitting diode
USD757664S1 (en) * 2014-09-30 2016-05-31 Lite-On Opto Technology (Changzhou) Co., Ltd. Light emitting diode
USD763206S1 (en) * 2015-01-29 2016-08-09 Advanced Optoelectronic Technology, Inc. Light emitting diode package
USD796456S1 (en) * 2015-04-02 2017-09-05 Genesis Photonics Inc. Light emitting diode package
USD761215S1 (en) * 2015-05-06 2016-07-12 Xiamen Sanan Optoelectronics Technology Co., Ltd. Package for light-emitting diode
USD783547S1 (en) * 2015-06-04 2017-04-11 Cree, Inc. LED package
USD778849S1 (en) * 2015-11-05 2017-02-14 Dowa Electronics Materials Co., Ltd. Light emitting diode chip
USD773724S1 (en) * 2015-11-18 2016-12-06 Pilot, Inc. Cordless LED lamp
USD795492S1 (en) * 2015-12-24 2017-08-22 Semicon Light Co., Ltd. Mold for packaging semiconductor light emitting device
USD805070S1 (en) * 2016-03-11 2017-12-12 Roe Visual Co., Ltd. LED display
JP1563910S (en) 2016-03-24 2016-11-21
USD800679S1 (en) * 2016-04-28 2017-10-24 Citizen Electronics Co., Ltd. Light emitting diode
USD800678S1 (en) * 2016-04-28 2017-10-24 Citizen Electronics Co., Ltd. Light emitting diode
USD805399S1 (en) * 2016-07-19 2017-12-19 Under Armour, Inc. Package
USD794582S1 (en) * 2016-07-29 2017-08-15 Enraytek Optoelectronics Co., Ltd. LED chip

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD846512S1 (en) * 2016-03-24 2019-04-23 Hamamatsu Photonics K.K. Optical semiconductor element
USD846511S1 (en) * 2016-03-24 2019-04-23 Hamamatsu Photonics K.K. Optical semiconductor element

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