TW201824590A - Method for packaging remote sensor capable of providing excellent bonding capability and relatively long sensing distance - Google Patents

Abstract

A method for packaging a remote sensor includes the steps of: providing a substrate, and disposing a light-emitting chip and a sensing chip separately on a bearing surface of the substrate; using two encapsulation bodies to respectively encapsulate the light-emitting chip and the sensing chip, and simultaneously separating the encapsulation bodies from each other; and disposing a pre-formed sealing cover on the bearing surface of the substrate and above each of the encapsulation bodies, and using adhesive colloid to fix the sealing cover to the bearing surface of the substrate and each of the encapsulation bodies.

Description

Packaging method for remote sensor

The invention relates to a packaging method, in particular to a packaging method for a long-range sensor.

The conventional long-range sensor package structure is provided with a light-emitting chip and a sensor chip on a substrate, and then the two packaging colloids respectively cover the light-emitting chip and the sensor chip through a molding process. A semi-spherical lens portion is formed on the top surface of each of the packaging colloids to correspond to the light-emitting chip and the sensing chip. Finally, a cover is also disposed on the substrate and each of the packaging colloids through a molding process to complete the entire packaging process. It is mentioned that the cover usually has a light emitting hole and a light receiving hole respectively for receiving the lens portions.

However, this method of forming each of the packaging colloid and the cover through a secondary molding process has a poor bonding between the cover and each of the packaging colloid and the substrate, and this method of forming the cover using the molding process In this way, because the molding die cannot approach each of the lens parts, the cover cannot be closer to each of the lens parts, so that the sensing distance of the long-range sensor is shorter. Therefore, the conventional long-range sensor package structure and Its packaging method still has its shortcomings and needs to be improved.

To sum up the above description, the main object of the present invention is to provide a packaging structure for a long-range sensor, which has the advantages of better bonding of packaging materials and a longer sensing distance.

The packaging structure of the long-range sensor includes a substrate, a light-emitting chip, a sensing chip, two packaging gels, and a cover. The substrate has a bearing surface, and the light-emitting chip and the sensing chip are separated from each other. On the carrying surface, the two encapsulating adhesive systems respectively cover the light emitting chip and the sensing chip and are separated from each other. The cover is disposed on the carrying surface and each of the encapsulating colloids, and is fixed to the carrying colloid by an adhesive colloid. The carrying surface and each of the packaging colloids, the cover is provided with a light emitting hole and a light receiving hole, and the light emitting hole and the light receiving hole are respectively located above the light emitting chip and the sensing chip.

Thereby, the cover can be fixed to the bearing surface and each of the encapsulating colloids by an adhesive colloid, thereby improving the material bonding degree of the encapsulating structure.

A secondary object of the present invention is to provide a method for packaging a long-distance sensor, including the following steps: (a) providing a substrate, and disposing a light emitting chip and a sensing chip separately from each other on a bearing surface of the substrate; (B) covering the light-emitting chip and the sensing chip with two encapsulating colloids and separating the encapsulating colloids from each other at the same time; and (c) placing a pre-formed cover on the bearing surface of the substrate and each Above the encapsulating gel, the cover is fixed to the bearing surface of the substrate and each of the encapsulating gel by an adhesive gel.

Preferably, in step (b), the light-emitting chip and the sensing chip are respectively covered by two packaging colloids by a molding method.

Therefore, since the cap is pre-formed, it can be directly adhered and fixed to each of the encapsulating colloid and the bearing surface by an adhesive colloid, and the conventional technique can be used to form the encapsulating colloid and the encapsulation separately by two moldings. Cap, which causes the cap to be inaccessible to the encapsulant, thereby reducing the disadvantage of the sensing distance.

The detailed structure and features provided by the present invention will be described in the detailed description of the subsequent embodiments. However, those having ordinary knowledge in the art should be able to understand that the detailed descriptions and the specific embodiments listed in the implementation of the present invention are only used to illustrate the present invention and are not intended to limit the scope of the patent application of the present invention.

Please refer to FIGS. 1 and 2, which show the package structure 10 of the long-distance sensor provided by the first preferred embodiment of the present invention, which includes a substrate 20, a light-emitting chip 30, a sensing chip 40, and two packages. Colloid 50 and a cover 60.

The substrate 20 in this preferred embodiment can be a printed circuit board (commonly referred to as PCB), a double maleimide triazine substrate (commonly referred to as BT), a glass fiber substrate (commonly referred to as FR4), or a direct copper-clad substrate (commonly referred to as DBC ) However, it is not limited to this, whereby the production cost of the substrate 20 is low, and the substrate 20 has a bearing surface 22.

The light emitting chip 30 is disposed on the bearing surface 22 and can be electrically connected to the substrate 20 through a wire bonding process. In the preferred embodiment, the light emitting chip 30 is an LED chip and can be used to emit a light source.

The sensing chip 40 is disposed on the bearing surface 22 and is separated from the light emitting chip 30. The sensing chip 40 can also be electrically connected to the substrate 20 by a wire bonding process. The sensing chip 40 can be used to sense the light emitted by the light emitting chip 30. Light source.

The two packaging gels 50 are formed by molding and cover the light emitting chip 30 and the sensing chip 40 respectively. The two packaging gels 50 are separated from each other and form a groove 51 between each other. The top surface of each packaging gel 50 There is a lens portion 52 and a shoulder portion 54. In the preferred embodiment, the shoulder portion 54 on the top surface of each packaging gel 50 surrounds the lens portion 52, and the lens portion 52 on the top surface of each packaging gel 50 is hemispherical. In addition, the curvature of the lens portion 52 on the top surface of each of the packaging colloids 50 can be adjusted during manufacturing as required. Each of the packaging colloids 50 is made of a light-transmitting material, such as a transparent epoxy resin (Epoxy Resin).

The cover 60 is disposed on the bearing surface 22 and each of the packaging gels 50, and is fixed to the bearing surface 22 and each of the packaging gels 50 by an adhesive gel 70. The cover 60 is provided with a light emitting hole 72 and a light receiving hole. 74. The light emitting hole 72 and the light receiving hole 74 are respectively located above the light emitting chip 30 and the sensing chip 40. Furthermore, the cover 60 includes a lateral section 76 and a plurality of extending sections 78 extending downward from the lateral section 76. The horizontal section 76 is provided with a light emitting hole 72 and a light receiving hole 74. The horizontal section 76 is fixed to the shoulder 54 of the top surface of each packaging gel 50 by an adhesive gel 70, and the light emitting hole 72 and the light receiving hole 74 are respectively located above the lens portion 52 on the top surface of each of the packaging colloids 50, and the lens portions 52 on the top surface of each of the packaging colloids 50 are respectively accommodated in the light emitting holes 72 and the light receiving holes 74, and the respective extensions 78 are respectively located in the grooves 51 And the outer periphery of each encapsulating gel 50 is fixed to the bearing surface 22 through the adhesive gel 70.

The cover 60 is made of an opaque material, such as Epoxy Resin.

Please refer to FIGS. 4A to 4D, which is a packaging method of the packaging structure 10 of the remote sensor according to the first preferred embodiment of the present invention. The packaging method includes the following steps:

Step (a): Provide the substrate 20, and place the light-emitting wafer 30 and the sensing wafer 40 on the bearing surface 22 of the substrate 20 separately from each other.

Step (b): the two encapsulating colloids 50 respectively cover the light-emitting chip 30 and the sensing chip 40 and separate the encapsulating colloids 50 from each other. It is worth mentioning that in the preferred embodiment, molding is used. The two encapsulating colloids 50 respectively cover the light-emitting chip 30 and the sensing chip 40, and the encapsulating colloids 50 are separated from each other by using direct compression molding. In addition, in this step, when forming each encapsulating colloid 50, A lens portion 52 and a shoulder portion 54 can be formed on the top surface of each of the packaging gels 50 at the same time.

Step (c): a pre-formed cover 60 is disposed on the bearing surface 22 of the substrate 20 and each of the encapsulation gels 50, and the cover 60 is fixed to the bearing surface 22 of the substrate 20 and the adhesive gel 70 Each of the packaging colloids 50, more specifically, in this step, a viscous colloid 70 (such as an opaque epoxy resin) can be coated on the bearing surface 22 of the substrate 20 and each package through a dispensing process (Dispensing). The shoulder portion 54 of the top surface of the gel body 50 is then provided with the cover 60 on the bearing surface 22 of the substrate 20 and each of the packaging gels 50, and the cover 60 is fixed to the bearing surface 22 of the substrate 20 through a baking process. And a shoulder 54 on the top surface of each of the encapsulants 50.

Please refer to FIGS. 5A to 5E, which are packaging methods for the packaging structure 10 'of the remote sensor according to the second preferred embodiment of the present invention. It is worth mentioning that step (a) of the second preferred embodiment It is the same as step (a) of the first preferred embodiment, with the difference that in step (b) of the second preferred embodiment, a single encapsulant 55 is used to cover the light-emitting chip 30 and The sensor chip 40 is formed with two lens portions 52 on the top surface of the single package colloid 55. Each lens portion 52 is located above the light emitting chip 30 and the sensor chip 40, and then the single package colloid 55 is cut by a cutting method. It is cut into two packaging gels 50 ′ separated from each other, wherein each of the packaging gels 50 ′ respectively covers the light emitting chip 30 and the sensing chip 40.

Then, in step (c) of the second preferred embodiment, first, a viscous colloid 70 (such as a solder paste) is applied to the bottom of the cover 60 by screen printing, and at the same time, each of the encapsulating gels 50 is coated. The top surface of the shoulder portion 54 and each of the encapsulating colloids 50 are coated with an adhesive colloid 70 (such as an opaque epoxy resin) by a dispensing process, and the cover 60 is disposed on the bearing surface 22 of the substrate 20 and Above each of the packaging gels 50 ′, the cover 60 is fixed to the bearing surface 22 of the substrate 20 and the shoulder 54 of the top surface of each of the packaging gels 50 ′ through a baking process.

After the above steps, please refer to FIG. 3, which is a packaging structure 10 'of a long-range sensor made by the packaging method of the second preferred embodiment.

To sum up, the cover 60 can be fixed to the bearing surface 22 and each of the packaging gels (50, 50 ') by the adhesive gel 70, which improves the material bonding of the packaging structure (10, 10'). The cover 60 is formed in advance. When the cover 60 is manufactured, the light emitting holes 72 and the light receiving holes 74 can be made close to each lens portion 52, and then the cover 60 is directly fixed to the adhesive 60 by the adhesive 70. Since the light emitting holes 72 and the light receiving holes 74 can be close to the lens portions 52 on the bearing surface 22 and each of the packaging colloids (50, 50 '), the sensing distance of the long-range sensor can be increased.

Finally, it must be stated again that the constituent elements disclosed in the previously disclosed embodiments of the present invention are merely examples, and are not intended to limit the scope of the present case. The replacement or change of other equivalent elements shall also be covered by the scope of the patent application for this case. Covered.

10, 10’‧‧‧ package structure

20‧‧‧ substrate

30‧‧‧light emitting chip

40‧‧‧sensing chip

50, 50’‧‧‧ encapsulated colloid

55‧‧‧ encapsulated colloid

60‧‧‧Cap

22‧‧‧ bearing surface

51‧‧‧Ditch

52‧‧‧Lens section

54‧‧‧Shoulder

70‧‧‧ sticky colloid

72‧‧‧light emitting hole

74‧‧‧light receiving hole

76‧‧‧ horizontal section

78‧‧‧ extension

FIG. 1 is a top view of a first preferred embodiment of the present invention. Figure 2 is a sectional view taken along line 2-2 of Figure 1. Figure 3 is a sectional view of a second preferred embodiment of the present invention. 4A to 4D are manufacturing flowcharts of the first preferred embodiment of the present invention. 5A to 5E are manufacturing flowcharts of the second preferred embodiment of the present invention.

Claims (3)

A method for packaging a long-distance sensor includes the following steps: (a) providing a substrate, and placing a light emitting chip and a sensing chip separately on a bearing surface of the substrate; (b) separating two packaging colloids separately Encapsulating the light emitting chip and the sensing chip, forming a lens portion and a shoulder portion on the top surface of each of the packaging colloids, and separating each of the packaging colloids from each other; and (c) printing the adhesive colloid on a screen (Screen Printing) method is coated on the bottom of a pre-formed cover, and at the same time, the adhesive colloid is dispensed on the shoulder of the top surface of each packaging colloid and between the packaging colloids, and then The cover is disposed on the bearing surface of the substrate and each of the packaging colloids, and the cover is fixed to the bearing surface of the substrate and a shoulder of the top surface of each of the packaging colloids after a baking process. According to the method for packaging a long-distance sensor described in item 1 of the scope of patent application, in step (b), the two encapsulating colloids are respectively used to cover the light-emitting chip and the sensing chip by means of molding. According to the method for packaging a long-distance sensor described in item 1 of the scope of patent application, in step (b), each of the packaging colloids is separated from each other by cutting or direct molding.