CN103050604A - Manufacturing method of MLCOB (Multi Lens Chips On Board) light source module - Google Patents

Manufacturing method of MLCOB (Multi Lens Chips On Board) light source module Download PDF

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Publication number
CN103050604A
CN103050604A CN2012105013884A CN201210501388A CN103050604A CN 103050604 A CN103050604 A CN 103050604A CN 2012105013884 A CN2012105013884 A CN 2012105013884A CN 201210501388 A CN201210501388 A CN 201210501388A CN 103050604 A CN103050604 A CN 103050604A
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China
Prior art keywords
substrate
light source
mlcob
source module
glue
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CN2012105013884A
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CN103050604B (en
Inventor
吴乾
石超
周志勇
黄巍
王跃飞
李国平
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Hongli Zhihui Group Co Ltd
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Guangzhou Hongli Tronic Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

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Abstract

The invention relates to a manufacturing method of an MLCOB (Multi Lens Chips On Board) light source module. The method comprises the steps of: (1) preparing a substrate; (2) curing crystal and welding lines in a welding pad area on the substrate; (3) placing the substrate in a dispensing clamp and placing in an oven for pre-heating treatment; (4), after pre-heating treatment of the substrate, rapidly placing the substrate on a pre-heating area on a heating platform of a dispensing table; then, slowing conveying the substrate to a dispensing area of the heating platform of the dispensing table through a conveyer belt, wherein the dispensing clamp which is thermally stable is heated in the pre-heating area; (5) in the dispensing process, temperature in the dispensing area of the heating platform is constant within 130-250 DEG C, and delivery of the dispensing head is uniform; (6) quickly curing glue within 0-5 seconds after dispensing and forming a lens; and (7) conveying the substrate from a plate delivery area of the heating platform of the dispensing machine to the oven to roast and cure. The lens is directly moulded through dispensing, so that the manufacturing process is simple and the cost is low.

Description

A kind of manufacture method of MLCOB light source module
Technical field
The present invention relates to the LED field, especially the manufacture method of MLCOB led light source module is refered in particular to the manufacture method for application product MLCOB led light source modules such as fluorescent lamp, Panel light, desk lamps.
Background technology
In recent years, led light source gets most of the attention in the application of lighting field.It is large that traditional incandescent lamp consumes electric energy, electromagnetic interference and electromagnetic pollution that fluorescent lamp brings are more serious, and the stability of high-voltage gas discharging light and fail safe are all relatively poor, by contrast, LED as lighting source have Superstrong energy-saving, environmental protection, low pressure, easily control, not fragile, without absolute predominances such as ultraviolet rays, it will become the light source of new generation of the conventional light source such as replace incandescent, fluorescent lamp and high-voltage gas discharging light.
Led light source comes minute to mainly contain two kinds of discrete part light source and integrated form light sources (referring generally to the COB led light source) according to integrated level.Traditional LED fluorescent tube light source module is the discrete part led light sources such as use 3528,3014,5050, and the mode of process SMT is welded on moulding on the substrate.But this manufacture craft is loaded down with trivial details, and led light source needed Reflow Soldering, is prone to degradation bad phenomenon under dead lamp, open circuit, the photoelectric parameter, and processing cost is high.Therefore now increasing commercial lighting, lighting of home are brought into use luminous high conformity, without zebra-stripe, and the COB LED product of no color differnece.COB LED product is surface source luminescence, have bright dipping soft, do not hinder the points such as eye, power saving, light nature etc. are excellent, power saving, light nature, and COB LED product need not be made pcb board in addition, can save assembling and cost of labor, reduce the application product process procedure, accelerated life cycle of the product.
COB LED product is divided into two large classes at present: a class is traditional integrated COB product, namely makes the fence dam at substrate, forms a large bowl cup, multiple chips is installed and is carried out circuit with wire bonds to connect in cup, applies fluorescent material and sealing again.Another kind of is that many glasss of integrated COB(also are MCOB, the english abbreviation of Multiple Chips On Board) product, namely make a plurality of bowls of cups at substrate, minimum installation one chips in each bowl cup, carry out circuit connection or chip with wire bonds between the chip and carry out circuit with substrate with wire bonds and be connected, carry out again the fluorescent material sealing.Its advantage is that the silica gel consumption is less, surface source luminescence, and photochromic high conformity, light extraction efficiency is higher than traditional integrated COB, and it is relatively better to dispel the heat.
Substrate and the structure of the integrated COB product of tradition generally have two kinds of forms: the first is to make the fence dam, then carries out chip in specific zone and installs, and carries out circuit with lead-in wire again and connects, and applies fluorescent glue in zone, fence dam.Its advantage is that technique is simple and convenient, surface source luminescence, and photochromic consistency is controlled easily.But this product light efficiency is relatively low, because chip is installed concentratedly, there is larger problem in heat radiation.And more to encapsulating material demands such as fluorescent material, casting glues, also need to make the fence dam, cause whole product cost relatively high.The second is the MCPCB thin slice of making first with circuit, adopt variety of way to be bonded in metallic substrate surfaces and form substrate, make the fence dam overseas the enclosing of the solid welding zone of substrate, then carrying out chip in specific zone installs, carry out circuit with lead-in wire again and connect, in zone, fence dam, apply fluorescent glue.Its advantage is to have adopted metal substrate, and heat conduction is relatively good, but this substrate needs substrate bottom surface and sidewall that very high reflectivity is arranged, and the substrate cost is high.More to encapsulating material demands such as fluorescent material, casting glues, also need to make the fence dam, cause whole product cost relatively high.
The substrate of MCOB product and three kinds of forms of modular structure general existence of present stage:
A kind of is the substrate of making in advance with circuit, adopts injection molding to form the bowl cup at substrate, and fixed chip in the bowl cup adopts lead-in wire to carry out circuit and connects, and applies fluorescent glue in the bowl cup.Its advantage is the bowl cup high conformity of moulding, produces in enormous quantities easily, and shortcoming is that the die sinking price is high, and injection moulding matter material and substrate associativity are poor, is prone to Lou the bad phenomenon such as glue.
The second is that the metal material substrate adopts and to drag for the hole mode and form the bowl cup, makes circuit above metal, and fixed chip in the bowl cup adopts lead-in wire to carry out circuit with the line layer of substrate surface and is connected, and applies fluorescent glue in the bowl cup.Its advantage is that the capacity of heat transmission is strong, easily processing; Shortcoming is because circuit is produced on the outer metal surface of bowl cup; with lead-in wire during connecting circuit one end in the bowl cup on the chip electrode; one end is outside the bowl cup on the line layer of metal surface; in the bowl cup, apply fluorescent glue; protect exposed lead-in wire at bowl cup external demand point one deck glue, in manufacturing process, be prone to the bad phenomenon such as short circuit, broken string.Simultaneously, in bowl cup manufacturing process, be difficult to guarantee the evenness of bowl cup bottom surface and sidewall surfaces, cause reflectivity low, affect light extraction efficiency, this type substrate price is higher.
The third is that the metal material substrate adopts stamping forming mode to form the bowl cup.The inner fixedly multiple chips of bowl cup adopts wire bonds to form circuit between the chip, be connected with the line layer that is embedded in the metal substrate two ends again, realizes the connection to external circuit, applies fluorescent glue in the bowl cup again above chip.Its advantage is that the substrate capacity of heat transmission is strong, easily moulding.Shortcoming is that appearance is bad easily in the substrate course of processing, and embedded line layer complex process, and the circuit ease of connection causes failure welding between chip and the chip, affects properties of product.
The MLCOB product is the third-largest class in the COB product, and the thought of its product is to adopt chip directly to be fixed on the substrate, its manufacture craft letter, with low cost its can be larger the raising light efficiency.
Summary of the invention
Technical problem to be solved by this invention provides a kind of manufacture method of MLCOB light source module, simple, with low cost and the raising light efficiency that can be larger of its manufacture craft.
For solving the problems of the technologies described above, technical scheme of the present invention is: a kind of manufacture method of MLCOB light source module may further comprise the steps:
(1) makes substrate;
(2) carry out the die bond bonding wire in the welding disking area on substrate;
(3) substrate is placed in the plastic clip tool, then puts into baking box and carry out the pre-heat treatment;
(4) after basal plate preheating is processed, be positioned over fast on the preheating zone of point gum machine platform heating platform, then slowly be sent to the glue application region of point gum machine platform heating platform by conveyer belt, during heated by the preheating zone and to come the thermally-stabilised of holding point plastic clip tool;
(5) in a glue process, heating platform glue application region temperature constant is between 130 ℃ ~ 250 ℃, and the plastic emitting of Glue dripping head is wanted evenly;
(6) the glue rapid curing forms lens in the complete 0-5S of some glue;
(7) substrate is transported to baking box from the ejecting plate district of point gum machine heating platform and carries out baking-curing.
MLCOB led light source module manufacture method of the present invention need not the bowl cup, a plurality of point-source of lights distribute on the substrate, simultaneously on each light source with lens, form multi-point source and poly-lens, form a MLCOB led light source module, this structure has finally been created a kind of MLCOB led light source module of new construction.The lens moulding process of this light source module is simple, cost is low, precision is high.
As improvement, described substrate comprises insulating barrier, line layer, the welding resisting layer that is arranged in order from bottom to up; The white oil layer thickness is 0.01 ~ 0.1mm; Described welding disking area adopts plated metal or chemical precipitation technique to process.Adopt the ink coats of high reflectance to form the white oil layer at substrate surface, the light that this white oil layer can make the light source side send reflects at substrate, increased the rising angle of light source module, made light source energy bright dipping in approximate 180 degree scopes, thereby improve light extraction efficiency.
As improvement, described oven temperature is set to 100 ~ 200 ℃, and described substrate is carried out 10 ~ 30min the pre-heat treatment.
As improvement, described preheating zone temperature is between 100 ~ 150 ℃.
As improvement, described glue application region temperature is at 130 ℃ ~ 250 ℃, and described preheating zone and ejecting plate district temperature so just can better guarantee consistency and the production efficiency of lens bulb all than low 10 ℃ ~ 50 ℃ of glue application region.
As improvement, in the described step (7), oven temperature is 150 ℃, and substrate need to toast 2 hours.
As improvement, before the some glue, with fluorescent material so that (ratio of 1:5 ~ 1:15) is mixed and fully stirred in special glue material, vacuumizes again, then pours syringe into to vacuumize again, guarantees without being installed on the point gum machine platform behind the bubble; The main content of described special glue material is the silicone oil polymer, the VMQ resin, and polymethyl siloxane, and platinum catalyst, wherein the platinum catalyst content ratio is greater than 0.1%.
As improvement, described lens diameter is less than 8mm.
As improvement, described glue speed is greater than 0.3s/PCS, and less than 5s/PCS, some glue speed is decided according to the heating station variations in temperature.
The beneficial effect that the present invention compared with prior art brings is:
MLCOB led light source module manufacture method of the present invention need not the bowl cup, a plurality of point-source of lights distribute on the substrate, lens on each light source are by the directly moulding on substrate of some glue simultaneously, form multi-point source and poly-lens, form a MLCOB led light source module, this structure has finally been created a kind of MLCOB led light source module of new construction.The lens moulding process of this light source module is simple, cost is low, precision is high.
Description of drawings
Fig. 1 is the product structure schematic diagram.
Fig. 2 is the manufacture method flow chart.
Embodiment
The invention will be further described below in conjunction with Figure of description.
As shown in Figure 1, 2, a kind of manufacture method of MLCOB light source module may further comprise the steps:
(1) makes substrate; Described substrate comprises insulating barrier 1, line layer 2, the welding resisting layer 3 that is arranged in order from bottom to up; Its manufacture method is: choose glass mat and make substrate master material, make line layer 2 at substrate, printing white printing forms the white oil layer on line layer 2, and reserved area is made pad on the floor 2 of final online road; The white oil layer thickness is 0.01 ~ 0.1mm on the substrate, adopt the ink coats of high reflectance to form the white oil layer at substrate surface, the light that this white oil layer can make the light source side send reflects at substrate, increased the rising angle of light source module, make light source energy bright dipping in approximate 180 degree scopes, thereby improve light extraction efficiency; Be distributed with pad on the line layer 2, pad adopts plating or chemical plating process to process;
(2) carry out the die bond bonding wire in the welding disking area on substrate; Chip 5 is installed in welding disking area, and is adopted gold thread to carry out the circuit connection that chip 5 is connected with line layer;
(3) constant temperature roaster is placed near the point gum machine platform, the substrate that admittedly welds is positioned in the plastic clip tool, more whole some plastic clip tool put into baking box and carry out 10 ~ 30min the pre-heat treatment, oven temperature is set to 100 ~ 200 ℃;
(4) after basal plate preheating is processed, be positioned over fast on the preheating zone of point gum machine platform heating platform, described preheating zone temperature is between 100 ~ 150 ℃; Then slowly be sent to the glue application region of point gum machine platform heating platform by conveyer belt, during heated by the preheating zone and to come the thermally-stabilised of holding point plastic clip tool;
(5) in a glue process, heating platform glue application region temperature constant is between 130 ℃ ~ 250 ℃, and the plastic emitting of Glue dripping head is wanted evenly, and some glue speed is greater than 0.3s/PCS, less than 5s/PCS; The large low height of the lens of pointing out according to the correlative factors such as syringe needle height, gel quantity and decide, general syringe needle height is easy to the raising of lens moulding and production efficiency less than 10mm;
(6) the glue rapid curing forms lens 4 in the complete 0 ~ 5S of some glue, and lens 4 diameters are less than 8mm;
(7) substrate is transported to baking box from the ejecting plate district of point gum machine heating platform and carries out baking-curing.
The making of described some plastic clip tool need to be decided according to the product material size, point plastic clip tool area is less than heating platform heating region area, and width is less than the transmission track width, and some plastic clip tool material can be the high-thermal conductive metals such as copper, aluminium, thickness is easy to heating platform heat conduction less than 1 centimetre.
Heating platform divides three parts: preheating zone, glue application region, ejecting plate district, the preheating zone is all hanged down 10 ℃-50 ℃ than glue application region with ejecting plate district temperature, so just can better guarantee consistency and the production efficiency of lens bulb.
Before the some glue, with fluorescent material so that (ratio of 1:5 ~ 1:15) is mixed and fully stirred in special glue material, vacuumizes again, then pours syringe into to vacuumize again, guarantees without being installed on the point gum machine platform behind the bubble; The main content of described special glue material is the silicone oil polymer, the VMQ resin, and polymethyl siloxane, and platinum catalyst, wherein the platinum catalyst content ratio is greater than 0.1%.

Claims (10)

1. the manufacture method of a MLCOB light source module is characterized in that, may further comprise the steps:
(1) makes substrate;
(2) carry out the die bond bonding wire in the welding disking area on substrate;
(3) substrate is placed in the plastic clip tool, then puts into baking box and carry out the pre-heat treatment;
(4) after basal plate preheating is processed, be positioned over fast on the preheating zone of point gum machine platform heating platform, then slowly be sent to the glue application region of point gum machine platform heating platform by conveyer belt, during heated by the preheating zone and to come the thermally-stabilised of holding point plastic clip tool;
(5) in a glue process, heating platform glue application region temperature constant is between 130 ℃ ~ 250 ℃, and the plastic emitting of Glue dripping head is wanted evenly;
(6) the glue rapid curing forms lens in the complete 0-5S of some glue;
(7) substrate is transported to baking box from the ejecting plate district of point gum machine heating platform and carries out baking-curing.
2. the manufacture method of a kind of MLCOB light source module according to claim 1, it is characterized in that: described substrate comprises insulating barrier, line layer, the welding resisting layer that is arranged in order from bottom to up; The white oil layer thickness is 0.01 ~ 0.1mm; Described welding disking area adopts plated metal or chemical precipitation technique to process.
3. the manufacture method of a kind of MLCOB light source module according to claim 1, it is characterized in that: described oven temperature is set to 100 ~ 200 ℃, and described substrate is carried out 10 ~ 30min the pre-heat treatment.
4. the manufacture method of a kind of MLCOB light source module according to claim 1, it is characterized in that: described preheating zone temperature is between 100 ~ 150 ℃.
5. the manufacture method of a kind of MLCOB light source module according to claim 1, it is characterized in that: described glue application region temperature is at 130 ℃ ~ 250 ℃.
6. the manufacture method of a kind of MLCOB light source module according to claim 1 is characterized in that: described preheating zone and ejecting plate district temperature are all than low 10 ℃ ~ 50 ℃ of glue application region.
7. the manufacture method of a kind of MLCOB light source module according to claim 1, it is characterized in that: in the described step (7), oven temperature is 150 ℃, and substrate need to toast 2 hours.
8. according to the manufacture method of a kind of MLCOB light source module claimed in claim 1, it is characterized in that: before the some glue, with fluorescent material so that (ratio of 1:5 ~ 1:15) is mixed in special glue material and fully stirred, vacuumize again, then pour syringe into and vacuumize again, guarantee without being installed on the point gum machine platform behind the bubble; The main content of described special glue material is the silicone oil polymer, the VMQ resin, and polymethyl siloxane, and platinum catalyst, wherein the platinum catalyst content ratio is greater than 0.1%.
9. according to the manufacture method of a kind of MLCOB light source module claimed in claim 1, it is characterized in that: described lens diameter is less than 8mm.
10. according to the manufacture method of a kind of MLCOB light source module claimed in claim 1, it is characterized in that: described glue speed is greater than 0.3s/PCS, less than 5s/PCS.
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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103296183A (en) * 2013-05-28 2013-09-11 惠州市大亚湾永昶电子工业有限公司 LED (light-emitting diode) lens forming method with temperature and glue control
CN103354268A (en) * 2013-05-28 2013-10-16 惠州市大亚湾永昶电子工业有限公司 Planar LED one-step lens forming method
CN103441206A (en) * 2013-08-22 2013-12-11 中山市光圣半导体科技有限责任公司 Method for improving color consistency of white-light LED devices
CN104339509A (en) * 2013-07-25 2015-02-11 上海华银电器有限公司 Full automatic glue injection machine
CN104659190A (en) * 2015-01-26 2015-05-27 华中科技大学 Fluorescent powder glue coating method and application thereof
WO2015078003A1 (en) * 2013-11-29 2015-06-04 广州市鸿利光电股份有限公司 Manufacturing method for mlcob light source module
CN106252338A (en) * 2016-09-26 2016-12-21 江苏稳润光电有限公司 A kind of method for packing of high heat conduction MCOB
CN107146839A (en) * 2017-05-04 2017-09-08 厦门大学 A kind of continuous crystal solidifying apparatus of LED and its die-bonding method
CN109742215A (en) * 2019-01-10 2019-05-10 广东品美电子科技有限公司 A kind of LED support preparation process
CN112090699A (en) * 2020-09-02 2020-12-18 哈威光电科技(苏州)有限公司 LED dispensing automatic production line and working method thereof

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CN102185042A (en) * 2011-03-28 2011-09-14 北京大学深圳研究生院 Light-emitting diode (LED) packaging method, packaging device and light adjusting method and system
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KR20120077125A (en) * 2010-12-30 2012-07-10 엘지디스플레이 주식회사 Backlight unit
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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103296183A (en) * 2013-05-28 2013-09-11 惠州市大亚湾永昶电子工业有限公司 LED (light-emitting diode) lens forming method with temperature and glue control
CN103354268A (en) * 2013-05-28 2013-10-16 惠州市大亚湾永昶电子工业有限公司 Planar LED one-step lens forming method
CN104339509A (en) * 2013-07-25 2015-02-11 上海华银电器有限公司 Full automatic glue injection machine
CN103441206A (en) * 2013-08-22 2013-12-11 中山市光圣半导体科技有限责任公司 Method for improving color consistency of white-light LED devices
WO2015078003A1 (en) * 2013-11-29 2015-06-04 广州市鸿利光电股份有限公司 Manufacturing method for mlcob light source module
CN104659190A (en) * 2015-01-26 2015-05-27 华中科技大学 Fluorescent powder glue coating method and application thereof
CN106252338A (en) * 2016-09-26 2016-12-21 江苏稳润光电有限公司 A kind of method for packing of high heat conduction MCOB
CN107146839A (en) * 2017-05-04 2017-09-08 厦门大学 A kind of continuous crystal solidifying apparatus of LED and its die-bonding method
CN109742215A (en) * 2019-01-10 2019-05-10 广东品美电子科技有限公司 A kind of LED support preparation process
CN112090699A (en) * 2020-09-02 2020-12-18 哈威光电科技(苏州)有限公司 LED dispensing automatic production line and working method thereof

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Address after: 510890 Huadu District, Guangdong, Guangzhou Flower Town, SAST Road, No. 1, No. 1

Patentee after: Hongli Newell group Limited by Share Ltd

Address before: 510800 Dongfeng Road West, automobile city, Huadu District, Guangdong, Guangzhou

Patentee before: Guangzhou Hongli Tronic Co., Ltd.