CN201547559U - High-power LED lamp - Google Patents
High-power LED lamp Download PDFInfo
- Publication number
- CN201547559U CN201547559U CN2009202359757U CN200920235975U CN201547559U CN 201547559 U CN201547559 U CN 201547559U CN 2009202359757 U CN2009202359757 U CN 2009202359757U CN 200920235975 U CN200920235975 U CN 200920235975U CN 201547559 U CN201547559 U CN 201547559U
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- silica gel
- light
- powder layer
- led lamp
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Abstract
The utility model discloses a high-power LED lamp, comprising a shell, a copper pole arranged in the shell, a light-emitting chip arranged in the copper pole, a fluorescent powder layer above the light-emitting chip and positive and negative wiring terminals connected with the copper pole; a high-heat-conducting silver adhesive layer is arranged between the contact surfaces of the light-emitting chip and the copper pole; a high-refraction silica gel layer is filled between the light-emitting chip and the fluorescent powder layer; and an outer sealing silica gel layer is arranged above the fluorescent powder layer. The high-power LED lamp has the benefits that: the high-refraction silica gel layer is filled between the chip and the fluorescent powder layer, the outer sealing surface adopts a model forming outer sealing silica gel layer to replace the capping LENS technology, thus leading the LED product to obtain satisfied effect on the aspects of light emergent efficiency and light spot consistency, solving the bottleneck that the technical difficulty of the welding problem restricts the application of large-scale production, simultaneously improving the production efficiency and reducing the production cost.
Description
Technical field
The utility model relates to the lamp that a kind of lighting field uses, the high-powered LED lamp of particularly a kind of light extraction efficiency, hot spot high conformity.
Background technology
The high-power product of tradition is directly to apply fluorescence coating at chip surface, and the covering surface is adopted and added a cover plastics PC material lens LENS, injects a kind of packing forms of silica gel then in LENS.
The product light extraction efficiency that conventional solution is produced is lower, hot spot is inhomogeneous, also be subjected to the welding restriction because of encapsulation technique outside the surface in the application link.
And traditional welding restricts the production in enormous quantities in the application, and production efficiency is lower, production cost is higher, can't adapt to the demand that present country uses LED product large-scale promotion.
Summary of the invention
Goal of the invention: technical problem to be solved in the utility model is at the deficiencies in the prior art, and a kind of high-powered LED lamp is provided.
Technical scheme: the utility model discloses a kind of high-powered LED lamp, comprise housing, be arranged on the copper post in the housing, be arranged on luminescence chip, phosphor powder layer above luminescence chip in the copper post and the positive and negative binding post that is connected with the copper post, between the contact-making surface of luminescence chip and copper post, be provided with a floor height heat conduction elargol layer, between luminescence chip and phosphor powder layer, fill high refraction layer of silica gel, above phosphor powder layer, be provided with the covering layer of silica gel.
In the utility model, preferably, described housing is the PPA shell.
Beneficial effect: the utility model is to fill floor height refraction layer of silica gel between chip and phosphor powder layer, the covering surface adopts model moulding covering layer of silica gel to replace the LENS technology of adding a cover, make the LED product all obtain satisfied effect aspect light extraction efficiency, the hot spot uniformity, solved because of the restriction of Welding Problems technical difficulty and used the bottleneck of producing in enormous quantities, enhanced productivity, reduced production cost simultaneously.
Description of drawings
Below in conjunction with the drawings and specific embodiments the utility model is done further to specify, above-mentioned and/or otherwise advantage of the present utility model will become apparent.
Be illustrated as the utility model structural representation.
The specific embodiment:
As shown in the figure, the utility model discloses a kind of high-powered LED lamp, comprise housing 1, be arranged on the copper post 2 in the housing 1, be arranged on luminescence chip 3, phosphor powder layer above luminescence chip 34 in the copper post 2 and the positive and negative binding post 8,9 that is connected with copper post 2, between the contact-making surface of luminescence chip 3 and copper post 2, be provided with a floor height heat conduction elargol layer 5, between luminescence chip 3 and phosphor powder layer 4, fill high refraction layer of silica gel 6, above phosphor powder layer 4, be provided with covering layer of silica gel 7.Described housing 1 is the PPA shell.
A kind of high-powered LED lamp described in the utility model mainly comprises following four steps aborning:
Step 1, solid brilliant: Gu crystalline substance has certain directionality, be beneficial to unified processing procedure standard and enhance productivity, luminescence chip directly is fixed on the metal level by conducting resinl, and thermal resistance is low, and heat conduction is rapid.
Step 2, bonding wire: because the solid brilliant directionality of leading portion is reasonable, the short circuit phenomenon can not appear intersecting in the both positive and negative polarity bonding wire of luminescence chip, makes smooth.
The utility model provides a kind of thinking and method of high-powered LED lamp; the method and the approach of this technical scheme of specific implementation are a lot; the above only is a preferred implementation of the present utility model; should be understood that; for those skilled in the art; under the prerequisite that does not break away from the utility model principle, can also make some improvements and modifications, these improvements and modifications also should be considered as protection domain of the present utility model.The all available prior art of each part not clear and definite in the present embodiment is realized.
Claims (2)
1. high-powered LED lamp, comprise housing (1), be arranged on the copper post (2) in the housing (1), be arranged on luminescence chip (3), the phosphor powder layer (4) above luminescence chip (3) and the positive and negative binding post that is connected with copper post (2) in the copper post (2), it is characterized in that, between the contact-making surface of luminescence chip (3) and copper post (2), be provided with a floor height heat conduction elargol layer (5), between luminescence chip (3) and phosphor powder layer (4), fill high refraction layer of silica gel (6), be provided with covering layer of silica gel (7) in phosphor powder layer (4) top.
2. a kind of high-powered LED lamp according to claim 1 is characterized in that, described housing (1) is the PPA shell.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009202359757U CN201547559U (en) | 2009-10-15 | 2009-10-15 | High-power LED lamp |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009202359757U CN201547559U (en) | 2009-10-15 | 2009-10-15 | High-power LED lamp |
Publications (1)
Publication Number | Publication Date |
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CN201547559U true CN201547559U (en) | 2010-08-11 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2009202359757U Expired - Fee Related CN201547559U (en) | 2009-10-15 | 2009-10-15 | High-power LED lamp |
Country Status (1)
Country | Link |
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CN (1) | CN201547559U (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102486265A (en) * | 2010-12-03 | 2012-06-06 | 安德瑞国际有限公司 | Improvement of light-emitting diode (LED) module and lighting fixture structure |
CN102623621A (en) * | 2012-04-12 | 2012-08-01 | 深圳雷曼光电科技股份有限公司 | Packaging process for light-emitting diode (LED) with fluorescent glue film and LED packaging |
CN104347605A (en) * | 2013-08-06 | 2015-02-11 | 惠州市华阳光电技术有限公司 | Light-emitting diode packaging process |
CN104421707A (en) * | 2013-09-10 | 2015-03-18 | 比亚迪股份有限公司 | Radiator for LED (Light Emitting Diode) lamp and lamp with radiator |
-
2009
- 2009-10-15 CN CN2009202359757U patent/CN201547559U/en not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102486265A (en) * | 2010-12-03 | 2012-06-06 | 安德瑞国际有限公司 | Improvement of light-emitting diode (LED) module and lighting fixture structure |
CN102486265B (en) * | 2010-12-03 | 2014-04-23 | 安德瑞国际有限公司 | Light-emitting diode (LED) module and lighting fixture structure |
CN102623621A (en) * | 2012-04-12 | 2012-08-01 | 深圳雷曼光电科技股份有限公司 | Packaging process for light-emitting diode (LED) with fluorescent glue film and LED packaging |
CN104347605A (en) * | 2013-08-06 | 2015-02-11 | 惠州市华阳光电技术有限公司 | Light-emitting diode packaging process |
CN104421707A (en) * | 2013-09-10 | 2015-03-18 | 比亚迪股份有限公司 | Radiator for LED (Light Emitting Diode) lamp and lamp with radiator |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100811 Termination date: 20121015 |