CN104421707A - Radiator for LED (Light Emitting Diode) lamp and lamp with radiator - Google Patents
Radiator for LED (Light Emitting Diode) lamp and lamp with radiator Download PDFInfo
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- CN104421707A CN104421707A CN201310411150.7A CN201310411150A CN104421707A CN 104421707 A CN104421707 A CN 104421707A CN 201310411150 A CN201310411150 A CN 201310411150A CN 104421707 A CN104421707 A CN 104421707A
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Abstract
The invention discloses a radiator for an LED (Light Emitting Diode) lamp and a lamp with the radiator. The radiator comprises a heat conductor, a radiating piece, a PCB (Printed Circuit Board) and a base plate, wherein a downward sunken driving chamber is arranged in the top end of the heat conductor; the radiating piece sleeves the heat conductor; the PCB is fit for mounting an electronic element of a driving circuit; the PCB is arranged on the surface of the driving chamber; the base plate is fit for mounting the LED lamp; the base plate is arranged on the lower surface of the heat conductor; the base plate is electrically connected with the PCB. According to the radiator for the LED lamp provided by the embodiment of the invention, the heat conductor is used for fixing the PCB, the radiator and the base plate, so that the radiator is simple and compact in structure, the occupied volume of the radiator is small and the applicability of the radiator is increased.
Description
Technical field
The present invention relates to field of radiating, especially relate to a kind of radiator for LED and there is its light fixture.
Background technology
Current LED lamp radiator uses metal material to make passive heat radiation device or active radiator usually, the main points of design design fin or the groove of different profile, and add ripple etc. in fin surface, can assist simultaneously and use heat pipe to coordinate fan etc. to do reinforcement heat radiation.
The complex structure of existing radiator, and between all parts of radiator, adopt bonding, welding and the fixing mode of screw to assemble, not only produce inconvenience and affect the production efficiency of light fixture, the mode that bonding and screw is fixed simultaneously adds the heat conducting thermal resistance between different parts, adds the possibility of inefficacy.
Summary of the invention
The present invention is intended at least to solve one of technical problem existed in prior art.
For this reason, one object of the present invention is to propose a kind of structure simply for the radiator of LED.
Another object of the present invention is to propose a kind of light fixture with above-mentioned radiator.
According to the radiator for LED of the embodiment of the present invention, comprising: heat-conducting piece, the top of described heat-conducting piece is provided with recessed actuator chamber downwards; Radiating piece, is enclosed within outside described radiating piece on described heat-conducting piece; Pcb board, described pcb board is suitable for the electronic devices and components installing drive circuit, and described pcb board is located on the surface of described actuator chamber; Substrate, described substrate is suitable for installing described LED, on the lower surface that described substrate is located at described heat-conducting piece and described substrate be electrically connected with described pcb board.
According to the radiator for LED of the embodiment of the present invention, by using heat-conducting piece to fix pcb board, radiating piece and substrate, thus make the structure of radiator simple, compact, and the volume that radiator takies is little, improves the applicability of radiator.
In addition, the radiator for LED according to the present invention also has following additional technical feature:
In some embodiments of the invention, the perisporium of described actuator chamber is made up of multiple inclined-plane, and each described inclined-plane tilts to extend along the direction towards the center of described actuator chamber on direction from top to bottom.Thus be convenient to the assembling of pcb board.
Preferably, the angle of inclination on described multiple inclined-plane is identical.
Alternatively, the perisporium of described actuator chamber is made up of four inclined-planes.
In examples more of the present invention, described pcb board is located on described inclined-plane.
In some embodiments of the invention, the inner surface of described radiating piece is provided with lug boss, and the outer surface of described heat-conducting piece is provided with the recess with described raised portion fits.Thus the anatomical connectivity intensity strengthened between radiating piece and heat-conducting piece.
In other embodiments of the present invention, the inner surface of described radiating piece is provided with recess, and the outer surface of described heat-conducting piece is provided with the lug boss coordinated with the female portion.Thus the anatomical connectivity intensity strengthened between radiating piece and heat-conducting piece.
According to some embodiments of the present invention, the lower surface of described substrate is provided with connector, and described connector is suitable for the covering colloid of fixing described LED.
Particularly, described connector is formed as annular.
Particularly, be provided with through hole in described heat-conducting piece, described through hole is used as the conductive path connecting described pcb board and described substrate.
In some embodiments of the invention, the outer surface of described radiating piece is provided with many radiating grooves, and described many radiating grooves are spaced apart around the circumference of described radiating piece.Thus improve the heat dispersion of radiating piece.
Preferably, described many radiating groove uniform intervals distribution.
In some examples of invention, the lower surface of described radiating piece is positioned at the below of the lower surface of described heat-conducting piece.
Particularly, described radiating piece is revolving body.
More specifically, described radiating piece periphery wall be along the recessed curved surface in the direction towards the central axis of described radiating piece at least partially.
Alternatively, described radiating piece is Al-alloy parts.
Alternatively, described substrate is ceramic member.
According to some embodiments of the present invention, described heat-conducting piece adopts the mode of in-mould injection to be connected with described pcb board, described heat-conducting piece with described radiating piece, described heat-conducting piece and described substrate respectively.Thus by adopting the mode of in-mould injection to be fixed on heat-conducting piece by pcb board, radiating piece and substrate, the production efficiency of radiator can be improved, reduce the heat conducting thermal resistance between parts, reduce the possibility that radiator lost efficacy.
According to the light fixture of the embodiment of the present invention, comprising: LED; Radiator, described radiator is the radiator for LED according to the above embodiment of the present invention, and described LED is fixing on the substrate.
Additional aspect of the present invention and advantage will part provide in the following description, and part will become obvious from the following description, or be recognized by practice of the present invention.
Accompanying drawing explanation
Above-mentioned and/or additional aspect of the present invention and advantage will become obvious and easy understand from accompanying drawing below combining to the description of embodiment, wherein:
Fig. 1 is the stereogram of the radiator for LED according to the embodiment of the present invention;
Fig. 2 is the front view of the radiator shown in Fig. 1;
Fig. 3 is the top view of the radiator shown in Fig. 1;
Fig. 4 is the upward view of the radiator shown in Fig. 1;
Fig. 5 is the profile of the radiator shown in Fig. 1.
Reference numeral:
Radiator 100, heat-conducting piece 1, actuator chamber 10, inclined-plane 11, radiating piece 2,
Lug boss 20, radiating groove 21, first component 22, second component 23,
Pcb board 3, substrate 4, connector 5
Detailed description of the invention
Be described below in detail embodiments of the invention, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has element that is identical or similar functions from start to finish.Being exemplary below by the embodiment be described with reference to the drawings, only for explaining the present invention, and can not limitation of the present invention being interpreted as.
In describing the invention, it will be appreciated that, term " " center ", " longitudinal direction ", " transverse direction ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", orientation or the position relationship of the instruction such as " outward " are based on orientation shown in the drawings or position relationship, only the present invention for convenience of description and simplified characterization, instead of indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore limitation of the present invention can not be interpreted as.In addition, term " first ", " second " only for describing object, and can not be interpreted as instruction or hint relative importance.
In describing the invention, it should be noted that, unless otherwise clearly defined and limited, term " installation ", " being connected ", " connection " should be interpreted broadly, and such as, can be fixedly connected with, also can be removably connect, or connect integratedly; Can be mechanical connection, also can be electrical connection; Can be directly be connected, also indirectly can be connected by intermediary, can be the connection of two element internals.For the ordinary skill in the art, concrete condition above-mentioned term concrete meaning in the present invention can be understood.In addition, in describing the invention, except as otherwise noted, the implication of " multiple " is two or more.
Describe a kind of radiator 100 for LED according to the embodiment of the present invention below with reference to Fig. 1-Fig. 5, radiator 100 is arranged on for dispelling the heat to LED in LED, and LED and radiator 100 are assembled into light fixture.
As Figure 1-Figure 5, comprise according to the radiator 100 of the embodiment of the present invention: heat-conducting piece 1, radiating piece 2, pcb board 3 and substrate 4.The top of heat-conducting piece 1 is provided with recessed actuator chamber 10 downwards, and actuator chamber 10 is for holding the electronic devices and components above drive circuit, and drive circuit is used for driving LED lamp and runs.
Be enclosed within heat-conducting piece 1 outside radiating piece 2, as shown in Figure 5, the inner surface of radiating piece 2 and the exterior surface of heat-conducting piece 1.Particularly, radiating piece 2 is Al-alloy parts.
Pcb board 3 is suitable for the electronic devices and components installing drive circuit, and pcb board 3 is located on the surface of actuator chamber 10.Wherein, the size of drive circuit is by the power decision of LED, and power is larger, and drive circuit is larger, and pcb board 3 is also larger, thus drives the space needed larger, according to the LED of different capacity, can arrange the actuator chamber 10 of different volumes.Particularly, if low power LED, pcb board 3 just can be placed on the bottom of actuator chamber 10, if high-power LED lamp, now can increase the volume of actuator chamber 10, and is placed on by pcb board 3 on the sidewall of actuator chamber 10.Certainly it should be noted that, in a preferred embodiment of the invention, for the ease of the placement of pcb board 3, no matter the power of LED is high-power or small-power, and pcb board 3 is all established can on the sidewall of actuator chamber 10.
In examples more of the present invention, pcb board 3 adopts aluminium oxide or aluminium nitride to be base material, particularly, aluminium oxide or aluminium nitride material is adopted to carry out processing to form pottery, chemical plating is carried out again to form metal level after the surface of pottery is activated, the shape of metal level is consistent with activation pattern, after generation on base material has high-precision conductive path, then represents that the pcb board 3 of drive circuit machines.Thus improve thermal conductivity and the heat-resisting quantity of pcb board 3, and pcb board 3 short circuit can be prevented.
Substrate 4 is suitable for mounted LED lamp, on the lower surface that substrate 4 is located at heat-conducting piece 1 and substrate 4 be electrically connected with pcb board 3.Particularly, be provided with through hole (scheming not shown) in heat-conducting piece 1, through hole is used as the conductive path of connecting PCB board 3 and substrate 4, is namely electrically connected by the circuit through through hole between pcb board 3 and substrate 4.In a particular embodiment of the present invention, substrate 4 is ceramic member.
Specifically, heat-conducting piece 1 plays the effect being connected and fixed pcb board 3, radiating piece 2 and substrate 4, and simultaneously heat-conducting piece 1 also can be used as main fixing skeleton, for fixing lamp holder and lampshade to be assembled into light fixture.
According to the radiator 100 for LED of the embodiment of the present invention, pcb board 3, radiating piece 2 and substrate 4 is fixed by using heat-conducting piece 1, thus make the structure of radiator 100 simple, compact, and the volume that radiator 100 takies is little, improves the applicability of radiator 100.
In a particular embodiment of the present invention, as shown in Figure 3 and Figure 5, the perisporium of actuator chamber 10 is made up of multiple inclined-plane 11, each inclined-plane 11 tilts to extend along the direction towards the center of actuator chamber 10 on direction from top to bottom, and namely the cross-sectional area of actuator chamber 10 reduces gradually on direction from top to bottom.Now particularly, pcb board 3 is located on inclined-plane 11.Thus the installation being convenient to pcb board 3 is fixed.Preferably, the angle of inclination on multiple inclined-plane 11 is identical.Thus the cosmetic look of heat-conducting piece 1 can be improved, and be convenient to the machine-shaping of heat-conducting piece 1.In example of the present invention, as shown in Figure 3, the perisporium of actuator chamber 10 is made up of four inclined-planes 11.
In order to strengthen the anatomical connectivity intensity between radiating piece 2 and heat-conducting piece 1, in some embodiments of the invention, as shown in Figure 5, the inner surface of radiating piece 2 is provided with lug boss 20, and the outer surface of heat-conducting piece 1 is provided with the recess coordinated with lug boss 20.Preferably, lug boss 20 extends to be formed as annular lug boss 20 along the circumference of radiating piece 2, and recess extends to be formed as annular recess along the circumference of heat-conducting piece 1.Wherein, lug boss 20 can be multiple, and recess is that multiple and multiple recess coordinates correspondingly with multiple lug boss 20.In the example of hgure 5, lug boss 20 is two, and recess is two.
Certainly the present invention is not limited thereto, in other embodiments of the present invention, the inner surface of radiating piece 2 is provided with recess, and the outer surface of heat-conducting piece 1 is provided with the lug boss coordinated with recess.Preferably, lug boss extends to be formed as annular lug boss along the circumference of heat-conducting piece 1, and recess extends to be formed as annular recess along the circumference of radiating piece 2.Wherein, lug boss can be multiple, and recess is that multiple and multiple recess and multiple lug boss one_to_one corresponding are arranged.
In some embodiments of the invention, as shown in Figure 1, Figure 4 and Figure 5, the lower surface of substrate 4 is provided with connector 5, connector 5 is suitable for the covering colloid of fixed L ED lamp, that is, connector 5 as the fixture of the covering colloid of LED, thus is convenient to the fixing of LED.Wherein, the shape of connector 5 is identical with the shape of the covering colloid of LED.In the example of Fig. 1 and Fig. 4, connector 5 is formed as annular.
In order to strengthen the contact area of the external heat sink such as radiating piece 2 and air, strengthen the heat exchange with external heat sink, improve the heat dispersion of radiating piece 2, in some embodiments of the invention, as shown in Figure 1-Figure 3, the outer surface of radiating piece 2 is provided with many radiating grooves 21, many radiating groove 21 is spaced apart around the circumference of radiating piece 2, particularly, as shown in Figure 1-Figure 3, every bar radiating groove 21 forms the groove inwardly concaved from the outer surface of radiating piece 2, and the upper surface of radiating piece 2 is run through in one end of every bar groove.Preferably, many radiating groove 21 uniform intervals distributions.Thus the cosmetic look of radiator 100 can be improved.
As Figure 1-Figure 5, in a particular embodiment of the present invention, radiating piece 2 is revolving body, thus is convenient to the machine-shaping of radiating piece 2, and improves the cosmetic look of radiator 100.Further, radiating piece 2 periphery wall be along the recessed curved surface in the direction towards the central axis of radiating piece 2 at least partially.In the example of Fig. 1-Fig. 5, radiating piece 2 comprises Part I 22 and Part II 23, Part I 22 upwards extends from the upper surface of Part II 23, and the lower surface of Part I 22 is identical with the shape of the upper surface of Part II 23, the outer surface of Part I 22 is curved surface, and the cross-sectional area of Part I 22 increases gradually on direction from top to bottom.The outer surface of Part II 23 is cylinder, and Part I 22 and Part II 23 are formed in one part.In the example of hgure 5, lug boss 20 is formed on the inner surface of Part I 22, in the example of fig. 1, the outer surface that every bar radiating groove 21 is located at Part I 22 runs through Part I 22.
As shown in Figure 1 and Figure 5, the lower surface of radiating piece 2 is positioned at the below of the lower surface of heat-conducting piece 1.Thus the volume of radiator 100 can be reduced further.
According to some embodiments of the present invention, heat-conducting piece 1 adopts the mode of in-mould injection to be connected with pcb board 3, heat-conducting piece 1 with radiating piece 2, heat-conducting piece 1 and substrate 4 respectively.Particularly, the mode of first time in-mould injection can be adopted heat-conducting piece 1, pcb board 3 and radiating piece 2 to be injection molded into one, then the mode of second time in-mould injection is adopted heat-conducting piece 1 and substrate 4 to be injection molded into one, wherein, it should be noted that, the principle of in-mould injection, known by those skilled in the art, is just not described in detail here.Thus by adopting the mode of in-mould injection to be fixed on heat-conducting piece 1 by pcb board 3, radiating piece 2 and substrate 4, the production efficiency of radiator 100 can be improved, reduce the heat conducting thermal resistance between parts, reduce the possibility that radiator 100 lost efficacy.
Wherein, LED chip can be integrated on radiator 100, and namely LED chip is directly fixed on the substrate 4 of radiator 100, and LED and radiator 100 are integrated connection, decrease the resistance between LED and radiator 100.And drive circuit can also be integrated on radiator 100, drive circuit and radiator 100 are integrated connection, decrease the thermal resistance between drive circuit and radiator 100, drive circuit can be avoided simultaneously to adopt the mode of traditional casting glue heat radiation to dispel the heat, significantly reduce the weight of light fixture.Thus radiator 100 of the present invention, avoid traditional welding connecting mode, the high temperature impact avoiding LED to be subject to traditional welding causing, greatly strengthen the reliability of LED.
According to the light fixture of the embodiment of the present invention, comprise LED and radiator, radiator is the radiator 100 for LED according to the above embodiment of the present invention, and LED is fixed on substrate 4.
According to the light fixture of the embodiment of the present invention, by being provided with the radiator of above-described embodiment in LED, not only can reduce the volume of light fixture, and the reliability of LED can be enhanced, improve the production efficiency of light fixture.
In the description of this description, specific features, structure, material or feature that the description of reference term " embodiment ", " some embodiments ", " illustrative examples ", " example ", " concrete example " or " some examples " etc. means to describe in conjunction with this embodiment or example are contained at least one embodiment of the present invention or example.In this manual, identical embodiment or example are not necessarily referred to the schematic representation of above-mentioned term.And the specific features of description, structure, material or feature can combine in an appropriate manner in any one or more embodiment or example.
Although illustrate and describe embodiments of the invention, those having ordinary skill in the art will appreciate that: can carry out multiple change, amendment, replacement and modification to these embodiments when not departing from principle of the present invention and aim, scope of the present invention is by claim and equivalents thereof.
Claims (19)
1. for a radiator for LED, it is characterized in that, comprising:
Heat-conducting piece, the top of described heat-conducting piece is provided with recessed actuator chamber downwards;
Radiating piece, is enclosed within outside described radiating piece on described heat-conducting piece;
Pcb board, described pcb board is suitable for the electronic devices and components installing drive circuit, and described pcb board is located on the surface of described actuator chamber;
Substrate, described substrate is suitable for installing described LED, on the lower surface that described substrate is located at described heat-conducting piece and described substrate be electrically connected with described pcb board.
2. the radiator for LED according to claim 1, is characterized in that, the perisporium of described actuator chamber is made up of multiple inclined-plane, and each described inclined-plane tilts to extend along the direction towards the center of described actuator chamber on direction from top to bottom.
3. the radiator for LED according to claim 2, is characterized in that, the angle of inclination on described multiple inclined-plane is identical.
4. the radiator for LED according to claim 2, is characterized in that, the perisporium of described actuator chamber is made up of four inclined-planes.
5. the radiator for LED according to claim 2, is characterized in that, described pcb board is located on described inclined-plane.
6. the radiator for LED according to claim 1, is characterized in that, the inner surface of described radiating piece is provided with lug boss, and the outer surface of described heat-conducting piece is provided with the recess with described raised portion fits.
7. the radiator for LED according to claim 1, is characterized in that, the inner surface of described radiating piece is provided with recess, and the outer surface of described heat-conducting piece is provided with the lug boss coordinated with the female portion.
8. the radiator for LED according to claim 1, is characterized in that, the lower surface of described substrate is provided with connector, and described connector is suitable for the covering colloid of fixing described LED.
9. the radiator for LED according to claim 8, is characterized in that, described connector is formed as annular.
10. the radiator for LED according to claim 1, is characterized in that, is provided with through hole in described heat-conducting piece, and described through hole is used as the conductive path connecting described pcb board and described substrate.
11. radiators for LED according to claim 1, it is characterized in that, the outer surface of described radiating piece is provided with many radiating grooves, described many radiating grooves are spaced apart around the circumference of described radiating piece.
12. radiators for LED according to claim 11, is characterized in that, described many radiating groove uniform intervals distribution.
13. radiators for LED according to claim 1, is characterized in that, the lower surface of described radiating piece is positioned at the below of the lower surface of described heat-conducting piece.
14. radiators for LED according to claim 1, is characterized in that, described radiating piece is revolving body.
15. radiators for LED according to claim 14, is characterized in that, the periphery wall of described radiating piece be along the recessed curved surface in the direction towards the central axis of described radiating piece at least partially.
16. radiators for LED according to claim 1, is characterized in that, described radiating piece is Al-alloy parts.
17. radiators for LED according to claim 1, is characterized in that, described substrate is ceramic member.
18. radiators for LED according to any one of claim 1-17, it is characterized in that, described heat-conducting piece adopts the mode of in-mould injection to be connected with described pcb board, described heat-conducting piece with described radiating piece, described heat-conducting piece and described substrate respectively.
19. 1 kinds of light fixtures, is characterized in that, comprising:
LED;
Radiator, described radiator is the radiator for LED according to any one of claim 1-18, and described LED is fixing on the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310411150.7A CN104421707A (en) | 2013-09-10 | 2013-09-10 | Radiator for LED (Light Emitting Diode) lamp and lamp with radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310411150.7A CN104421707A (en) | 2013-09-10 | 2013-09-10 | Radiator for LED (Light Emitting Diode) lamp and lamp with radiator |
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| Publication Number | Publication Date |
|---|---|
| CN104421707A true CN104421707A (en) | 2015-03-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310411150.7A Pending CN104421707A (en) | 2013-09-10 | 2013-09-10 | Radiator for LED (Light Emitting Diode) lamp and lamp with radiator |
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| CN201547559U (en) * | 2009-10-15 | 2010-08-11 | 宜兴市新得利电子有限公司 | High-power LED lamp |
| CN201851905U (en) * | 2010-08-09 | 2011-06-01 | 东莞市博阳光电科技有限公司 | LED (Light Emitting Diode) lamp |
| CN102460007A (en) * | 2009-06-15 | 2012-05-16 | 欧司朗股份有限公司 | Cooling member for semiconductor light emitting elements |
| CN103032721A (en) * | 2011-10-05 | 2013-04-10 | 秦彪 | Light-emitting diode (LED) optical engine and LED illuminating lamp |
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2013
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101377293A (en) * | 2008-09-29 | 2009-03-04 | 沈锦祥 | Lamp cup of LED light fitting and LED light fitting using the same |
| CN102460007A (en) * | 2009-06-15 | 2012-05-16 | 欧司朗股份有限公司 | Cooling member for semiconductor light emitting elements |
| CN201547559U (en) * | 2009-10-15 | 2010-08-11 | 宜兴市新得利电子有限公司 | High-power LED lamp |
| CN201851905U (en) * | 2010-08-09 | 2011-06-01 | 东莞市博阳光电科技有限公司 | LED (Light Emitting Diode) lamp |
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Application publication date: 20150318 |