CN214378490U

CN214378490U - Single crystal large chip high brightness lamp panel

Info

Publication number: CN214378490U
Application number: CN202120235666.0U
Authority: CN
Inventors: 李广会
Original assignee: Liaoning Dikangyuan Health Technology Co ltd
Current assignee: Liaoning Dikangyuan Health Technology Co ltd
Priority date: 2021-01-28
Filing date: 2021-01-28
Publication date: 2021-10-08
Anticipated expiration: 2031-01-28

Abstract

The application discloses big chip hi-lite lamp plate of single crystal includes: the chip comprises a single crystal chip, gold wires, a support, colloid, a diode, a resistor, a negative electrode pin, a positive electrode pin and a PCB. The single crystal chip is arranged in the center of the bracket; the support is a single crystal special support; the bracket is communicated with the negative electrode pin; the gold wire is communicated with the single crystal chip to the positive electrode pin; the colloid is encapsulated inThe single crystal chip, the gold wire, the bracket and the positive and negative pins form a 5050 type lamp bead; the whole lamp bead is arranged on the upper surface of the PCB through an SMT process; the diode is arranged above the back surface of the PCB; the resistor is arranged below the back surface of the PCB. The size of the designed single crystal chip is 20_μmThe LED lamp has the advantages of high brightness, long range, good heat dissipation performance of the special support, capability of solving the heat dissipation problem of a large-size single crystal chip, long irradiation distance, good light gathering performance, easiness in integral packaging of the lamp panel and low manufacturing cost, and the colloid is designed by secondary glue dispensing at an angle of 30 degrees.

Description

Single crystal large chip high brightness lamp panel

Technical Field

The application relates to the technical field of LEDs, in particular to a single crystal large chip high-brightness lamp panel.

Background

The LED lamp has the advantages of high energy conversion efficiency, high switching reaction speed, long service life, high safety factor, low energy consumption, difficult visual fatigue caused by stroboflash and the like, thereby being widely applied to various occasions.

When high brightness is needed, a high-power LED lamp panel or a plurality of lamp beads is usually adopted, so that the high brightness requirement is met. However, when the high-power lamp beads are adopted, the temperature of the lamp beads can be continuously increased, and the generated heat can not be timely dissipated in continuous lighting work, so that the LED lamp can be damaged. Sometimes, a plurality of lamp panels are adopted, so that the manufacturing cost is increased, unnecessary waste is caused, and in addition, when one lamp panel is damaged, the whole body stops working, and unnecessary cost and working expenditure are caused.

Disclosure of Invention

A single crystal large chip high brightness lamp panel includes: the chip comprises a single crystal chip 1, gold wires 2, a support 3, a colloid 4, a diode 5, a resistor 6, a negative electrode pin 7, a positive electrode pin 8 and a PCB 9. The single crystal chip 1 is arranged in the center of the bracket 3; the support 3 is a single crystal special support; the bracket 3 is communicated with a negative electrode pin 7; the gold wire 2 is communicated with the single crystal chip 1 to the anode pin 8; the colloid 4 is encapsulated at the parts of the single crystal chip 1, the gold wire 2, the bracket 3, the negative electrode pin 7 and the positive electrode pin 8 to form a 5050 type lamp bead; the colloid 4 is made of silica gel and is encapsulated by transparent silica gel; the colloid 4 is subjected to secondary dispensing, the inside of the colloid 4 forms an angle of 30 degrees, and the size of the single crystal chip 1 is 20_μm。The whole lamp bead is arranged on the upper surface of the PCB 9 through an SMT process; the diode 5 is arranged above the back surface of the PCB 9; the resistor 6 is arranged below the back surface of the PCB.

Further, the wavelength range of the light emitted by the single crystal chip 1 is 650nm-980 nm;

further, the support 3 is a single crystal support, and the single crystal support can help a chip to dissipate heat.

Further, the whole surface of arranging PCB board 9 in through SMT technology of lamp pearl is whole, and the circuit of being convenient for switches on wholly, plays the effect of guard lamp pearl, when the lamp pearl damaged, can switch on the circuit of single lamp plate simultaneously, makes whole product still can normally work.

Further, the resistor 6 is arranged below the back surface of the PCB 9 and plays a role of protecting a circuit by limiting current.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.

FIG. 1 is a schematic overall structure diagram of an embodiment of the present application;

FIG. 2 is a schematic top view of an embodiment of the present application;

FIG. 3 is a rear view of an embodiment of the present application.

In the figure: 1. the chip comprises a single crystal chip, 2, gold wires, 3, a support, 4, colloid, 5, a diode, 6, a resistor, 7, a negative electrode pin, 8, an anode pin, 9 and a PCB.

Detailed Description

In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only partial embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.

Referring to fig. 1, a single crystal large chip high brightness lamp panel includes: the chip comprises a single crystal chip 1, gold wires 2, a support 3, a colloid 4, a diode 5, a resistor 6, a negative electrode pin 7, a positive electrode pin 8 and a PCB 9. The single crystal chip 1 is arranged in the center of the bracket 3; the support 3 is a single crystal special support; the bracket 3 is communicated with the negative electrode pin; the gold wire 2 is communicated with the single crystal chip to the anode pin 8; the colloid 4 is encapsulated on the single crystal chip 1, the gold wire 2, the bracket 3, the negative electrode pin 7 and the positive electrode pin 8 to form a 5050 type lamp bead; the whole lamp bead is arranged on the upper surface of the PCB 9 through an SMT process; the diode 5 is arranged above the back surface of the PCB 9; the resistor 6 is arranged below the back surface of the PCB;

the application has the advantages that:

1、20_{of μm}The large-size single crystal chip 1 has high brightness, long range and wavelength range of 650nm-980nm, and the support 3 special for the single crystal has excellent heat dissipation, so that the heat dissipation problem of the large-size single crystal chip 1 can be well solved; the colloid 4 forms an angle of 30 degrees inside the colloid 4 through secondary dispensing, and the high light transmittance of the silica gel special material with excellent light condensation is combined, so that the light condensation is more excellent. The LED lamp can meet the product requirement requiring high brightness, and is low in cost and easy to package.

2. The colloid 4 encapsulates the single crystal chip 1, the gold wire 2, the special bracket 3, the negative electrode pin 7 and the positive electrode pin 8, and the 5050 type lamp bead is formed, so that the light condensation performance is good. The diode 5 arranged on the back of the PCB 9 plays a role of protecting the lamp beads, and prevents the lamp beads from being damaged by overcurrent; while the back-mounted resistor 6 acts as a protection circuit by limiting the current. The whole is safe and stable.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A single crystal large chip high brightness lamp panel includes: single crystal chip (1), gold thread (2), support (3), colloid (4), diode (5), resistance (6), negative pole pin (7), anodal pin (8) and PCB board (9), its characterized in that: the colloid (4) is encapsulated in the single crystal chip (1), the gold wire (2), the support (3), the negative electrode pin (7) and the positive electrode pin (8) form a 5050-type lamp bead, the colloid (4) is made of silica gel, the colloid (4) is subjected to secondary dispensing, an angle of 30 degrees is formed inside the colloid (4), and the size of the single crystal chip (1) is 20 micrometers.

2. The single crystal large chip high brightness lamp panel according to claim 1, characterized in that: the wavelength range of the light emitted by the single crystal chip (1) is 650nm-980 nm.

3. The single crystal large chip high brightness lamp panel according to claim 1, characterized in that: the support (3) is a single crystal special support.

4. The single crystal large chip high brightness lamp panel according to claim 1, characterized in that: the whole lamp bead is arranged on the upper surface of the PCB (9) through an SMT process.

5. The single crystal large chip high brightness lamp panel according to claim 1, characterized in that: the resistor (6) is arranged below the back surface of the PCB (9).