CN203517438U - LED integrated encapsulation fluorescent lamp structure - Google Patents
LED integrated encapsulation fluorescent lamp structure Download PDFInfo
- Publication number
- CN203517438U CN203517438U CN201320661982.XU CN201320661982U CN203517438U CN 203517438 U CN203517438 U CN 203517438U CN 201320661982 U CN201320661982 U CN 201320661982U CN 203517438 U CN203517438 U CN 203517438U
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- China
- Prior art keywords
- led
- reflector
- led chip
- fluorescent lamp
- pcb board
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- Expired - Fee Related
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Abstract
An LED integrated encapsulation fluorescent lamp structure comprises a radiating substrate (1), a PCB (2), a reflector (3), an LED chip (4) and fluorescent glue (5). The PCB (2) is adhered to the radiating substrate (1). The reflector (3) is fixed on the PCB (2). The bonding pad of the LED chip (4) is directed encapsulated on the PCB (2) and corresponds to the groove on the reflector. The fluorescent glue (5) is encapsulated in the groove of the reflector where the LED chip (4) is. The LED integrated encapsulation fluorescent lamp structure has the advantages that the radiating performance of the LED chip is improved, the service life of an LED fluorescent lamp is prolonged, the distance of each LED chip can be accurate during production, production efficiency is increased, more LED lamps can be disposed in unit area, and production cost is lowered.
Description
Technical field
The utility model belongs to lighting field, particularly a kind of LED integration packaging fluorescent structure.
Background technology
LED is to the very sensitive light-emitting component of temperature, in the situation that operating temperature is lower, could obtain higher optical index.LED is the same with conventional light source, when luminous, can produce heat, and the luminance of current LED is 20%-30% only, and its complementary energy is converted into heat energy mostly, if a large amount of heat energy can not distribute in time, not only can affect the optical index of LED lamp, also can make its life-span reduce.Existing fluorescent lamp panel mainly adopts LED paster to be welded on pcb board, this mode is to be mainly welded on PCB by LED pin, because there is the existence of LED support to increase thermal resistance, the heat of the luminous generation of LED can not shed timely, can affect the service life of LED lamp, and in welding process, LED will pass through high-temperature soldering (about 260 degree), can cause the dead lamp of LED, split glue, in the long-time process of using of light fixture, weld also there will be the bad phenomenon such as get rusty, greatly affect the service life of light fixture, and this mode of production can not accurately guarantee the distance between LED paster on each light fixture product, affect the quality of production of light fixture, also make production efficiency reduce.
The technical problems to be solved in the utility model is to provide a kind of can enhancing productivity and service life, reduces the LED integration packaging fluorescent structure of enterprise's production cost.
Utility model content
Undesirable for solving above-mentioned prior art LED fluorescent lamp heat radiation effect, service life is short, the problem that production efficiency is low, the utility model adopts following technical scheme: the utility model provides a kind of LED integration packaging fluorescent structure, comprise heat-radiating substrate, pcb board, reflector, LED chip and fluorescent glue, described pcb board sticks on heat-radiating substrate, described reflector is fixed on described pcb board, the pad of described LED chip is directly encapsulated on described pcb board, corresponding with the groove on reflector, described fluorescent glue is encapsulated in the groove of reflector at described LED chip place.
As to improvement of the present utility model, on described reflector, there are two rows to be bowl-shape groove.
As to further improvement of the utility model, described heat-radiating substrate is aluminium alloy base plate.
The beneficial effects of the utility model are: by flip chip on solid on the reserved pcb board of reflector, sealing again, has avoided high temperature soldering tin technique, has stopped the phenomenon of the scaling powder corrosion support in soldering tin technique, improved the thermal diffusivity of LED wafer, the life-span that can improve LED fluorescent lamp; The distance that can guarantee in process of production each LED wafer is more accurate, also the corresponding production efficiency that improved; Make full use of the space of reflector, more LED lamp is set in unit are, improved intensity of illumination, also saved material, reduced production cost simultaneously.
Accompanying drawing explanation
Fig. 1 is the utility model internal structure schematic diagram.
Fig. 2 is the reflector structural representation separated with pcb board.
The specific embodiment
Below in conjunction with accompanying drawing, describe preferred embodiment of the present utility model in detail.
Refer to Fig. 1, Fig. 2, a kind of LED integration packaging fluorescent structure, comprise heat-radiating substrate 1, pcb board 2, reflector 3, LED chip 4 and fluorescent glue 5, described pcb board 2 sticks on heat-radiating substrate 1, described reflector 3 is fixed on described pcb board 2, the pad of described LED chip 4 is directly encapsulated on described pcb board 2, corresponding with the groove on described reflector 3, avoided high temperature soldering tin technique, stopped the phenomenon of the scaling powder corrosion support in soldering tin technique, improved the thermal diffusivity of LED wafer, improve the service life of LED fluorescent lamp, because the spacing of the slot opening on described reflector 3 is fixed, so in flip LED wafer, can accurately guarantee the spacing of each LED wafer, thereby the production efficiency of corresponding raising fluorescent lamp, described fluorescent glue 5 is encapsulated in the groove of reflector 3 at described LED chip 4 places, fluorescent glue is water whitely can reduce light scattering, improve LED light extraction efficiency (10%-20%), and can effectively improve photochromic quality.
In the utility model, on described reflector 3, there are two rows to be bowl-shape groove, can reach the object that improves light efficiency, realizes uniform condensing, thereby limited luminous flux has been made full use of to effective range of exposures, in reflector 3 unit ares, be provided with more LED lamp, improved intensity of illumination, also saved material, reduced production cost simultaneously.
In the utility model, described heat-radiating substrate is aluminium alloy base plate, and aluminium alloy base plate has good hardness and intensity, and has fabulous heat conductivity, thermal resistance can be dropped to minimumly, extends service life of light fixture.
Claims (3)
1. a LED integration packaging fluorescent structure, it is characterized in that: comprise heat-radiating substrate (1), pcb board (2), reflector (3), LED chip (4) and fluorescent glue (5), described pcb board (2) sticks on described heat-radiating substrate (1), described reflector (3) is fixed on described pcb board (2), the pad of described LED chip (4) is directly encapsulated on described pcb board (2), corresponding with the groove on reflector, described fluorescent glue (5) is encapsulated in the groove of reflector at described LED chip (4) place.
2. a kind of LED integration packaging fluorescent structure according to claim 1, is characterized in that: on described reflector (3), have two rows to be bowl-shape groove.
3. a kind of LED integration packaging fluorescent structure according to claim 1, is characterized in that: described heat-radiating substrate (1) is aluminium alloy base plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320661982.XU CN203517438U (en) | 2013-10-25 | 2013-10-25 | LED integrated encapsulation fluorescent lamp structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320661982.XU CN203517438U (en) | 2013-10-25 | 2013-10-25 | LED integrated encapsulation fluorescent lamp structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203517438U true CN203517438U (en) | 2014-04-02 |
Family
ID=50376368
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320661982.XU Expired - Fee Related CN203517438U (en) | 2013-10-25 | 2013-10-25 | LED integrated encapsulation fluorescent lamp structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203517438U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015154648A1 (en) * | 2014-04-08 | 2015-10-15 | 浙江聚光科技有限公司 | Weldable led substrate |
-
2013
- 2013-10-25 CN CN201320661982.XU patent/CN203517438U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015154648A1 (en) * | 2014-04-08 | 2015-10-15 | 浙江聚光科技有限公司 | Weldable led substrate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160115 Address after: 364000 hi tech Industrial Zone, Yongding District, Fujian, Longyan Patentee after: Fujian Dehui Industry Co., Ltd. Patentee after: Dahom (Fujian) Illumination Technology Co., Ltd. Address before: 364101 Yongding Industrial Park, Fujian, Longyan Patentee before: Dahom (Fujian) Illumination Technology Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140402 Termination date: 20171025 |