CN102130114A - Surface mounted device (SMD) type light emitting diode (LED) device for outdoor display screen and display module using SMD type LED device - Google Patents
Surface mounted device (SMD) type light emitting diode (LED) device for outdoor display screen and display module using SMD type LED device Download PDFInfo
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- CN102130114A CN102130114A CN2010100444339A CN201010044433A CN102130114A CN 102130114 A CN102130114 A CN 102130114A CN 2010100444339 A CN2010100444339 A CN 2010100444339A CN 201010044433 A CN201010044433 A CN 201010044433A CN 102130114 A CN102130114 A CN 102130114A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Abstract
The invention relates to a surface mounted device (SMD) type light emitting diode (LED) device for an outdoor display screen, which comprises at least one LED chip, a lower substrate for loading the LED chips, an upper substrate combined with the lower substrate and packaging colloid arranged on the upper substrate, wherein the upper substrate is provided with steps; and the packaging colloid comprises a packaging matrix covering the steps and an optical lens arranged on the packaging matrix. In the SMD type LED device, the stepped upper substrate is combined with the packaging matrix with a certain height to reduce the size of the packaging colloid and optical loss, improve the light extraction efficiency and simplify the structure; moreover, light distribution with a wide viewing angle can be provided and the defects of a through-hole LED and a Top LED can be made up by arranging a stepped structure on the upper substrate and coving the packing colloid with a lens structure. Besides, the invention also provides a display module using the SMD type LED device for the outdoor display screen.
Description
Technical field
(Light Emitting Diode LED) and display screen, relates in particular to SMD type LED device that a kind of outdoor display screen uses and the demonstration module that uses this LED device to the present invention relates to light-emitting diode.
Background technology
Outdoor LED (LED) display screen is the novel information display media that develops rapidly in the whole world the late nineteen eighties, is to utilize the lattice module of LED formation or the display screen that pixel cell is formed.Its appearance has remedied magnetic turnover panel in the past, and the defective of information publication medium effects such as neon light has obtained using widely in railway, highway, square and megastore.
Usually, outdoor display screen needs waterproof, anti-sunlight direct projection, dustproof, anti-high temperature, windproof and anti-lightning strike etc., therefore requires the good environmental adaptability of its LED device.The direct insertion LED of many at present employings: direct insertion LED is encapsulated in led chip in the cup type epoxy resin mask, article two, pin is respectively both positive and negative polarity, have waterproof, anti-uv-ray and great heat radiation effect preferably, meet the application requirements of outdoor display screen.Yet there are many defectives in direct insertion LED product, has seriously limited the further raising of the quality and the output of outdoor display screen, and the defective of its existence is specific as follows:
1) consistency is poor: in the encapsulated moulding step of making direct insertion LED device, be difficult to control owing to have the degree of depth of the cup type support insertion mould of led chip, so it is inconsistent to occur the distance of led chip between each batch products and package lens easily, have a strong impact on the consistency of product luminosity and emission angle.
2) manufacturing process complexity, production efficiency are low: when making outdoor display screen, because direct insertion LED has the branch that pin and pin have positive and negative electrode, so the producer adopts manual mode that direct insertion LED is placed on the wiring board of display screen usually, production efficiency is lower; In addition, direct insertion LED also needs to cut out the unnecessary pin of circuit backboard portion after being welded on wiring board by wave-soldering, and process is loaded down with trivial details.
3) mounting process requires quality high, that be difficult to guarantee outdoor display screen: for direct insertion LED, will have enough technologies to guarantee that LED has consistent height perpendicular to pcb board with each LED of control when crossing stove; Any deviation all can influence the LED brightness uniformity that has set, and " mosaic " color lump of brightness irregularities occurs.
4) volume is big, is unfavorable for shortening the pel spacing of display screen, thereby has limited the raising of outdoor display screen resolution.
And surface mount (the SurfaceMounted Devices that is used for substituting direct insertion LED that occurs on the market in recent years, SMD) type LED device---" top light emitting LED (TopLED) ", belong to moisture-sensitive type device, the thermal expansion coefficient difference of packing colloid and reflector plastic material will cause peeling off of packing colloid and reflector easily, cause the moisture of external environment condition to enter device inside, thereby shorten the life-span of Top LED and influence its job stability.When Top LED was applied on the outdoor demonstration module, the embedding colloid only can be filled the space between the Top LED, and the plastic reflective cup upper surface of Top LED and packing colloid are exposed outside, so the embedding colloid can not play moistureproof windproof effect to the LED device.Secondly, owing to be difficult to control the height of the embedding colloid between each Top LED of full-filling, make the light-emitting area of casting glue body pollution TOP LED easily, thereby influence the light effect that of device.In addition, get final product because Top LED is the reflection cavity that directly fills up device with packing colloid, specific optical lens structure can not be provided, the visual angle is restricted, and is difficult to satisfy the wide visual angle requirement of outdoor display screen.
Summary of the invention
In view of this, the SMD type LED device that must provide a kind of visual angle simple in structure, wide, the effective outdoor display screen of bright dipping to use can remedy the deficiency of direct insertion LED and Top LED.
In addition, also need provide a kind of high conformity, technology is simple, volume is little, moistureproof ability is strong, the visual angle is wide demonstration module.
The SMD type LED device that a kind of outdoor display screen is used comprises at least one led chip, the bottom base of carrying led chip, and the top base that combines with described bottom base, and be arranged at packing colloid on the described top base.Wherein, described top base is provided with step.Described packing colloid comprises the encapsulation matrix that covers described step and is arranged at optical lens on the described encapsulation matrix.
A kind of demonstration module comprises: installation panel, surround the housing of described installation panel outward, and be mounted on a plurality of above-mentioned LED device on the described installation panel, and the embedding colloid between each LED device of full-filling.Wherein, described embedding colloid combines with the part packing colloid, and the top is between the upper surface and lower surface of encapsulation matrix.
SMD type LED device that outdoor display screen of the present invention is used and demonstration module compared with prior art have following beneficial effect:
1) do not sacrificing under volume that increases packing colloid and the prerequisite that reduces light extraction efficiency, SMD type LED device provided by the invention combines step-like top base with the encapsulation matrix with certain altitude, increased the packing colloid height of device.When this device application shows module out of doors; this structure will help the height that the producer controls the embedding colloid; and can guarantee that the packing colloid of device engages with the embedding colloid, can protect the structure that shows module and device inside, reach windproof dampproof effect.
2) by the set ledge structure of top base, cover packing colloid with lens arrangement, the light distribution with wide visual angle can be provided, improve the deficiency of traditional Top LED device, can replace direct insertion LED to be applied in the outdoor display screen field.
3) because LED device of the present invention belongs to surface attaching type, can directly install in batches by Reflow Soldering, enhance productivity, guarantee the height consistency of each device effectively, overcome " mosaic " phenomenon of the brightness disproportionation that exists based on the outdoor display screen of direct insertion LED.
4) the demonstration module of making based on SMD type LED device of the present invention; height by control embedding colloid; the complete packed colloid of pedestal and the embedding colloid that guarantee the LED device cover; do not expose outside air; technology is simple, helps protecting the LED device to avoid the influence of extraneous moisture, reaches moistureproof requirement; the height of guaranteeing the embedding colloid does not simultaneously influence exiting surface, makes the demonstration that shows that module has higher brightness.
Description of drawings
In order to be easy to explanation, the present invention is done to describe in detail by following preferred embodiment and accompanying drawing.
Fig. 1 a is the three-dimensional exploded view of the SMD type LED device used of the outdoor display screen of first embodiment of the invention;
Fig. 1 b is the stereogram of the SMD type LED device used of the outdoor display screen of first embodiment of the invention;
Fig. 1 c is the front section view of Fig. 1 b;
The front section view of the SMD type LED device that Fig. 2 uses for the outdoor display screen of second embodiment of the invention;
The front section view of the SMD type LED device that Fig. 3 uses for the outdoor display screen of third embodiment of the invention;
The front section view of the SMD type LED device that Fig. 4 uses for the outdoor display screen of four embodiment of the invention;
The three-dimensional exploded view of the SMD type LED device that Fig. 5 uses for the outdoor display screen of fifth embodiment of the invention;
Fig. 6 the present invention is based on the demonstration modular structure schematic diagram that SMD type LED device that outdoor display screen uses is made.
Embodiment
The present invention is further illustrated below in conjunction with the drawings and specific embodiments.
Fig. 1 a is depicted as the three-dimensional exploded view of the SMD type LED device that the outdoor display screen of first embodiment of the invention uses.Consult Fig. 1 b and Fig. 1 c simultaneously, wherein, Fig. 1 b is the stereogram of the SMD type LED device used of the outdoor display screen of first embodiment of the invention; Fig. 1 c is the front section view of Fig. 1 b.The SMD type LED device that this outdoor display screen is used comprises led chip 1, pedestal 2 and packing colloid 3.Wherein, pedestal 2 comprises bottom base 22 that carries led chip 1 and the top base 21 that combines with bottom base 22.In the embodiment of the present invention, combine by adhesive 20 (consulting Fig. 1 c) between top base 21 and the bottom base 22.
In the embodiment of the present invention, the quantity of led chip 1 is one, and its type can be wherein a kind of of red LED chip, green light LED chip, blue-light LED chip, purple LED chip.In other embodiments, the quantity of led chip 1 can be not limited to present embodiment for two or more.
The centre of top base 21 is provided with cup-shaped through hole 211, and the edge is provided with step 212.In the embodiment of the present invention, the longitudinal section of cup-shaped through hole 211 is trapezoidal (consulting Fig. 1 c), that is, the aperture (following aperture 211b) of an end of close bottom base 22 is greater than the aperture (going up aperture 211a) of the cup-shaped through hole other end.The inwall of cup-shaped through hole 211 is coated with reflecting material 211c, constitutes reflector.Wherein, reflecting material 211c is silver, chromium or reflective printing ink.Adopt the encapsulating structure of top base 21, bottom base 22 combinations, can allow the LED device have the surface attaching type characteristics on the one hand, on the other hand,, improve light extraction efficiency because of the reflector that adopts has the optically focused effect.
In other execution mode of the present invention, the longitudinal section of cup-shaped through hole 211 is rectangular or square, that is, the aperture (following aperture 211b) of an end of close bottom base 22 equals the aperture of the cup-shaped through hole other end (going up aperture 211a).
Consult Fig. 1 c, chip mount portion 221 comprises the heat-conducting layer 2211 that covers bottom base 22 upper and lower surfaces and at least one the heat conduction through hole 2212 that runs through bottom base 22.In the embodiment of the present invention, the quantity of heat conduction through hole 2212 is 3, and its inwall is provided with the heat-conducting layer 2211 into a single integrated structure with aforementioned heat-conducting layer 2211, and, be filled with the Heat Conduction Material 2213 into a single integrated structure with heat-conducting layer 2211.Wherein, heat-conducting layer 2211 is a copper, and Heat Conduction Material 2213 is silver slurry or copper powder.Adopt heat conduction through hole 2212, the heat that discharges during led chip 1 work can scatter and disappear to extraneous by Heat Conduction Material 2213 rapidly, has better heat radiating effect.
In other execution mode of the present invention, the quantity of heat conduction through hole 2212 can be 1, also can repeat no more here for more than 2 or 3; The heat conduction through-hole wall is not provided with heat-conducting layer 2211, only fills the Heat Conduction Material 2213 into a single integrated structure with heat-conducting layer 2211.
Positive electrode portion, negative electrode portion 222 comprise the conductive layer 2221 that covers bottom base 22 upper and lower surfaces and at least one conductive through hole 2222 that runs through bottom base 22 respectively.In the embodiment of the present invention, the total quantity of heat conduction through hole 2222 is 2.The inwall of conductive through hole 2222 is coated with or is filled with electric conducting material 2223.Wherein, conductive layer 2221 is a Copper Foil, and electric conducting material 2223 is silver slurry or copper powder, and is into a single integrated structure with conductive layer 2221.
In other execution mode of the present invention, the total quantity of conductive through hole 2222 also can be 3, perhaps more than 3, repeats no more here.
Among the present invention, top base 21 adopts ledge structure, and encapsulation matrix 31 covers the step 212 of top base 21, is equivalent to increase the height of encapsulation matrix 31.If top base 21 does not adopt ledge structure, and the direct packing colloid with optical lens that covers thereon, then the structure of packing colloid has following two kinds of situations: (1) packing colloid is the encapsulation matrix used of light modulation nothing but, perhaps the height of this encapsulation matrix is very little, so that casting glue body (consulting Fig. 6) exceeds the light modulation effect of the effect of altitude optical lens part of encapsulation matrix easily; (2) in order to overcome the problems referred to above, can increase the encapsulation matrix height that non-light modulation is used, but will increase packing colloid volume and since optical lens away from led chip, also further increase optical loss and the reduction light extraction efficiency.
Therefore, the SMD type LED device that outdoor display screen of the present invention is used combines step-like top base with the encapsulation matrix with certain altitude, reduce the volume of packing colloid, make optical lens close on led chip, reduce optical loss, strengthen light extraction efficiency, and, simple in structure.Secondly,, cover packing colloid, the light distribution with wide visual angle can be provided, improve the deficiency of traditional Top LED device, can replace direct insertion LED to be applied in the outdoor display screen field with lens arrangement by the set ledge structure of top base; In addition, because LED device of the present invention belongs to surface attaching type, can directly install in batches by Reflow Soldering, enhances productivity, guarantee the height consistency of each device effectively, overcome " mosaic " phenomenon of the brightness disproportionation that exists based on the outdoor display screen of direct insertion LED.
Figure 2 shows that the front section view of the SMD type LED device that the outdoor display screen of second embodiment of the invention is used.The structure of the LED device of this LED device and first execution mode is basic identical, difference is that the chip mount portion 221 of Fig. 2 comprises the through hole 2214 that is arranged on the bottom base 22, be assemblied in the through hole 2214, with through hole 2214 shapes be complementary heat sink 2215, and the little reflection cup 2216 that caves inward and form by heat sink 2215 upper surface.Wherein, heat sink 2215 can be interference fit or adopt adhesive with the fit of through hole 2214.Led chip 1 is placed in the little reflection cup 2216.In the embodiment of the present invention, heat sink 2215 be shaped as cylinder, material is a Heat Conduction Material, is preferably copper or aluminum metallic material.Adopt heat sink 2215 structure, with led chip 1 directly be placed in heat sink on, the heat that causes led chip 1 to send can come out by heat sink conduction rapidly, has splendid radiating effect.
In other execution mode of the present invention, heat sink 2215 shape can also be step-like, round table-like or I shape.
Figure 3 shows that the front section view of the SMD type LED device that the outdoor display screen of third embodiment of the invention is used.The structure of the LED device of this LED device and first execution mode is basic identical, and the chip mount portion 221 that difference is Fig. 3 is the upper surface that covers bottom base 22 and the electric conducting material that electrically connects with the routing portion 223 of the routing portion 223 of positive electrode or negative electrode.Led chip 1 is placed in this chip mount portion 221, and its electrode links to each other with the routing portion 223 of negative electrode or the routing portion 223 of positive electrode by metal lead wire 4.In the embodiment of the present invention, chip mount portion 221 is a Copper Foil, electrically connects with the routing portion 223 of positive electrode or the routing portion 223 of negative electrode.In the present embodiment, the routing portion 223 of the routing portion 223 of preferred chip mount portion 221 and positive electrode or negative electrode is into a single integrated structure.The aforesaid relatively LED device of the structure of this LED device simple in structure, cost is low, and the production efficiency height especially is fit to extensive the manufacturing.
Figure 4 shows that the front section view of the SMD type LED device that the outdoor display screen of four embodiment of the invention is used.The structure of the LED device of this LED device and first execution mode is basic identical, difference is that the exiting surface of the optical lens 32 in the packing colloid 3 of Fig. 4 is ball-cut shape 32b ' (among the figure shown in the solid line) or inverted U 32b " (among the figure shown in the dotted line), its peristome is concordant with the sidewall of encapsulation matrix 31.
Figure 5 shows that the three-dimensional exploded view of the SMD type LED device that the outdoor display screen of fifth embodiment of the invention is used.The structure of the LED device of this LED device and first execution mode is basic identical, and difference is that the bottom base of Fig. 5 is a support 23, and top base is a shell 24 of partly sealing this support 23.That is, the pedestal 2 of the LED device of Fig. 5 is made up of the support 23 of carrying led chip 1 and the shell 24 of partly sealing this support 23.The centre of shell 24 is provided with the cup-shaped through hole equally, and the inwall of cup-shaped through hole is coated with reflecting material, constitutes reflection cup 25.The edge of shell 24 then is provided with step 26, and same, the sidewall 26a of step 26 outermost is concordant with the sidewall 31a of encapsulation matrix 31.In the embodiment of the present invention, the material of shell 24 is plastics, by mould to support 23 mold moulding.Certainly, in other embodiments, the material of shell 24 can also be pottery.
In other execution mode of the present invention, chip mount portion 231 can also with the routing portion of positive electrode or routing portion 233 mutually insulateds of negative electrode.Led chip 1 is placed in the chip mount portion 231, and realizes the electric connection of the routing portion 233 of the routing portion of led chip electrodes and positive electrode or negative electrode by metal lead wire 4.
In addition, in the embodiment of the present invention, the quantity of led chip 1 is three, and its type is a kind of or its combination wherein of red LED chip, green light LED chip, blue-light LED chip, purple LED chip.
Certainly, in other execution mode of the present invention, the quantity of led chip also can for one, more than two or three, repeat no more here.
Figure 6 shows that and the present invention is based on demonstration module 5 structural representations that SMD type LED device that outdoor display screen uses is made.This demonstration module 5 comprises installation panel 51, surrounds the housing 52 of installation panel 51 outward, is mounted on a plurality of LED devices 6 on installation panel 51, and the embedding colloid 53 between each LED device of full-filling.Wherein, the SMD type LED device used for the outdoor display screen of above-mentioned arbitrary execution mode of this LED device 6.Embedding colloid 53 combines with part packing colloid 61, and the top guarantees that the pedestal 62 that packed colloid 61 covers does not expose outside embedding colloid 53 between the upper surface 610a and lower surface 610b of encapsulation matrix 610.
In the embodiment of the present invention, installation panel 51 is a wiring board, and by drawing lead 511 on this wiring board, links to each other with the external world, realizes the transmission of signal.
In the embodiment of the present invention, embedding colloid 53 is the colloid of weather resisteant, for example: the material modified or epoxy resin of silica gel, epoxy resin, silica gel material modified, wherein preferred acrylonitrile-butadiene-styrene copolymer (ABS glue) or Merlon (PC glue), can resist the influence of external conditions such as solar radiation, variations in temperature, wind and weather, reduce fade, probability that a series of phenomenons such as variable color, be full of cracks, efflorescence and intensity decreases occur.Again, the color of embedding colloid 53 is a black, has the uvioresistant effect, increases the contrast that shows module 5 simultaneously.Among the present invention, the thermal coefficient of expansion of the thermal coefficient of expansion of embedding colloid 53 and packing colloid 61 is approaching.Because the packing colloid 61 and the embedding colloid 53 of LED device 6 are bonded together, and both thermal coefficient of expansions are approaching, so the situation that splitting appears in both borders is less.Therefore, can avoid of the infringement of extraneous rainwater to LED device 6 inside.Simultaneously; because of LED device 6 inside by the packing colloid 61 of himself with show that the embedding colloid 53 of module 5 surrounds, and packing colloid 61 is bonded together with embedding colloid 53, so; even peel off, LED device 6 inside still are subjected to the protection of packing colloid 61 and embedding colloid 53.
Among the present invention, LED device 6 is the combination of the monochromatic LED device of monochromatic LED device, dual-colored LED device, three-color LED device or different-waveband.Say in detail, show that module 5 is provided with a plurality of light emitting pixel points, these light emitting pixel points are monochromatic SMD type LED devices, or based on the double-colored SMD type LED device of ruddiness and green light LED chip, or based on ruddiness, three look SMD type LED devices of green glow and blue-light LED chip, or (for example: 2R1G1B by the combination of the monochromatic SMD type LED device of different-waveband, R wherein represents ruddiness SMD type LED device, G represents green glow SMD type LED device, B represents blue light SMD type LED device, i.e. 2 ruddiness SMD type LED device+1 green glow SMD type LED device+1 blue light SMD type LED devices.Certainly, its compound mode also can be 1R1G1B, 2R1G or 3R6G.)。
Therefore, demonstration module of the present invention adopts SMD type LED device, technology is simple, can directly install in batches by Reflow Soldering, enhances productivity, guarantee the height consistency of each device effectively, overcome " mosaic " phenomenon of the brightness disproportionation that exists based on the outdoor display screen of direct insertion LED; Secondly, step-like top base is combined with the encapsulation matrix with certain altitude, reduce the volume of packing colloid, make optical lens close on led chip, reduce optical loss, strengthen light extraction efficiency; Simultaneously,, cover packing colloid, the light distribution with wide visual angle can be provided with lens arrangement by the set ledge structure of top base; In addition; height by control embedding colloid; the complete packed colloid of pedestal and the embedding colloid that guarantee the LED device cover; do not expose outside air; technology is simple, helps protecting the LED device to avoid the influence of extraneous moisture, reaches moistureproof requirement; the height of guaranteeing the embedding colloid does not simultaneously influence exiting surface, makes the demonstration that shows that module has higher brightness.
The embodiment of the above is a better embodiment of the present invention, is not to limit concrete practical range of the present invention with this, and scope of the present invention comprises and is not limited to this embodiment.The equivalence variation that all shapes according to the present invention, structure are done all comprises in protection scope of the present invention.
Claims (21)
1. SMD type LED device that outdoor display screen is used, comprise at least one led chip, the bottom base of carrying led chip, the top base that combines with described bottom base, and be arranged at packing colloid on the described top base, it is characterized in that described top base is provided with step, described packing colloid comprises the encapsulation matrix that covers described step and is arranged at optical lens on the described encapsulation matrix.
2. the SMD type LED device that outdoor display screen according to claim 1 is used is characterized in that the exiting surface of described optical lens is the ellipsoid bodily form, inverted U or ball-cut shape.
3. the SMD type LED device that outdoor display screen according to claim 1 is used is characterized in that described encapsulation matrix and optical lens are one-body molded.
4. the SMD type LED device that outdoor display screen according to claim 1 is used is characterized in that described step is arranged at the edge of described top base, and the centre of described top base is provided with the cup-shaped through hole.
5. the SMD type LED device that outdoor display screen according to claim 4 is used is characterized in that the sidewall of described step outermost is concordant with the sidewall of described encapsulation matrix.
6. the SMD type LED device that outdoor display screen according to claim 4 is used is characterized in that the longitudinal section of described cup-shaped through hole is rectangular, square or trapezoidal, and its inwall is coated with reflecting material.
7. the SMD type LED device that outdoor display screen according to claim 6 is used is characterized in that, described reflecting material is silver, chromium or reflective printing ink; The material of described packing colloid is an epoxy resin.
8. the SMD type LED device that outdoor display screen according to claim 1 is used is characterized in that, described bottom base is provided with the chip mount portion that mounts led chip and positive electrode portion, negative electrode portion.
9. the SMD type LED device that outdoor display screen according to claim 8 is used is characterized in that, described chip mount portion comprises the heat-conducting layer that covers the upper and lower surface of bottom base and at least one the heat conduction through hole that runs through bottom base.
10. the SMD type LED device that outdoor display screen according to claim 9 is used, it is characterized in that, the inwall of described heat conduction through hole is provided with the into a single integrated structure heat-conducting layer of heat-conducting layer with the upper and lower surface of described bottom base, and/or, be filled with the into a single integrated structure Heat Conduction Material of heat-conducting layer with the upper and lower surface of described bottom base.
11. the SMD type LED device that outdoor display screen according to claim 8 is used, it is characterized in that, described chip mount portion comprises the through hole that is arranged on the described bottom base, be assemblied in the described through hole, with shape of through holes be complementary heat sink, and the little reflection cup that caves inward and form by heat sink upper surface.
12. the SMD type LED device that outdoor display screen according to claim 11 is used is characterized in that, described heat sink be shaped as cylindric, step-like, round table-like or I shape.
13. the SMD type LED device that outdoor display screen according to claim 8 is used is characterized in that, described positive electrode portion, negative electrode portion are provided with the routing portion of positive electrode, the routing portion of negative electrode respectively; Described chip mount portion is the upper surface that covers bottom base and the electric conducting material that electrically connects with the routing portion of the routing portion of positive electrode or negative electrode.
14. the SMD type LED device that outdoor display screen according to claim 8 is used is characterized in that, described positive electrode portion, negative electrode portion comprise the conductive layer that covers the upper and lower surface of bottom base and at least one conductive through hole that runs through bottom base respectively; The inwall of described conductive through hole is coated with or is filled with and the into a single integrated structure electric conducting material of described conductive layer.
15. the SMD type LED device that outdoor display screen according to claim 1 is used, it is characterized in that, the material of described top base, bottom base is the glass fabric sill, and perhaps top base is pure resinous material, and bottom base is metal-cored pcb board or ceramic material; Described led chip is a kind of or its combination wherein of red LED chip, green light LED chip, blue-light LED chip, purple LED chip.
16. the SMD type LED device that outdoor display screen according to claim 1 is used is characterized in that described bottom base is a support, described top base is a shell of partly sealing this support.
17. the SMD type LED device that outdoor display screen according to claim 16 is used is characterized in that, described support is provided with the chip mount portion that mounts led chip and positive electrode portion, negative electrode portion; Described positive electrode portion, negative electrode portion are provided with the routing portion of positive electrode, the routing portion of negative electrode respectively; The routing portion of described chip mount portion and positive electrode or the routing portion of negative electrode electrically connect.
18. the SMD type LED device that outdoor display screen according to claim 16 is used is characterized in that the material of described shell is plastics or pottery.
19. one kind shows module, comprise: installation panel, the outer housing that surrounds described installation panel, it is characterized in that, described demonstration module also comprises and is mounted on a plurality of according to any described LED device in the claim 1 to 18 on the described installation panel and the embedding colloid between each LED device of full-filling; Described embedding colloid combines with the part packing colloid, and the top is between the upper surface and lower surface of encapsulation matrix.
20. demonstration module according to claim 19 is characterized in that, described embedding colloid is the colloid of weather resisteant, and the thermal coefficient of expansion of its thermal coefficient of expansion and packing colloid is approaching.
21. demonstration module according to claim 20 is characterized in that, the color of described embedding colloid is a black; Described LED device is the combination of the monochromatic LED device of monochromatic LED device, dual-colored LED device, three-color LED device or different-waveband.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010100444339A CN102130114A (en) | 2010-01-18 | 2010-01-18 | Surface mounted device (SMD) type light emitting diode (LED) device for outdoor display screen and display module using SMD type LED device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010100444339A CN102130114A (en) | 2010-01-18 | 2010-01-18 | Surface mounted device (SMD) type light emitting diode (LED) device for outdoor display screen and display module using SMD type LED device |
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| CN102130114A true CN102130114A (en) | 2011-07-20 |
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| CN2010100444339A Pending CN102130114A (en) | 2010-01-18 | 2010-01-18 | Surface mounted device (SMD) type light emitting diode (LED) device for outdoor display screen and display module using SMD type LED device |
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| CN102800787A (en) * | 2012-07-23 | 2012-11-28 | 惠州雷曼光电科技有限公司 | Surface mount type light-emitting diode (LED) bracket, surface mount type LED and display screen module |
| CN103117350A (en) * | 2011-11-17 | 2013-05-22 | 佛山市国星光电股份有限公司 | Surface-mounting highly-waterproof light emitting diode (LED) support used for outdoor display screen and products thereof |
| CN103824852A (en) * | 2014-03-10 | 2014-05-28 | 沈阳利昂电子科技有限公司 | Bare chip embedded back-light structure |
| CN104505448A (en) * | 2014-12-16 | 2015-04-08 | 何忠亮 | Manufacture method of reflective ceramic-based PCB (Printed Circuit Board) |
| CN104978905A (en) * | 2015-07-03 | 2015-10-14 | 广州沣雷交通科技有限公司 | Ultra-low power consumption LED information display screen and LED display module |
| CN106023828A (en) * | 2016-07-15 | 2016-10-12 | 深圳市九晟光电通讯科技有限公司 | Outdoor display screen unit board and manufacturing method thereof |
| CN106549091A (en) * | 2016-07-31 | 2017-03-29 | 深圳市微纳科学技术有限公司 | Reflection layer, the ceramic printed-circuit board encapsulated for LED and method are set inside |
| CN110447110A (en) * | 2017-08-25 | 2019-11-12 | 惠州科锐半导体照明有限公司 | Multiple LED light source lens designs in integration packaging |
| CN111179774A (en) * | 2020-01-21 | 2020-05-19 | 深圳市艾比森光电股份有限公司 | LED display module and LED display screen |
| CN113302757A (en) * | 2021-03-03 | 2021-08-24 | 泉州三安半导体科技有限公司 | LED packaging device and preparation method thereof |
| CN114122238A (en) * | 2022-01-21 | 2022-03-01 | 至芯半导体(杭州)有限公司 | Light-gathering type ultraviolet emitting device packaging structure |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103117350A (en) * | 2011-11-17 | 2013-05-22 | 佛山市国星光电股份有限公司 | Surface-mounting highly-waterproof light emitting diode (LED) support used for outdoor display screen and products thereof |
| CN102800787A (en) * | 2012-07-23 | 2012-11-28 | 惠州雷曼光电科技有限公司 | Surface mount type light-emitting diode (LED) bracket, surface mount type LED and display screen module |
| CN103824852A (en) * | 2014-03-10 | 2014-05-28 | 沈阳利昂电子科技有限公司 | Bare chip embedded back-light structure |
| CN104505448A (en) * | 2014-12-16 | 2015-04-08 | 何忠亮 | Manufacture method of reflective ceramic-based PCB (Printed Circuit Board) |
| CN104978905A (en) * | 2015-07-03 | 2015-10-14 | 广州沣雷交通科技有限公司 | Ultra-low power consumption LED information display screen and LED display module |
| CN106023828A (en) * | 2016-07-15 | 2016-10-12 | 深圳市九晟光电通讯科技有限公司 | Outdoor display screen unit board and manufacturing method thereof |
| CN106549091A (en) * | 2016-07-31 | 2017-03-29 | 深圳市微纳科学技术有限公司 | Reflection layer, the ceramic printed-circuit board encapsulated for LED and method are set inside |
| CN110447110A (en) * | 2017-08-25 | 2019-11-12 | 惠州科锐半导体照明有限公司 | Multiple LED light source lens designs in integration packaging |
| CN111179774A (en) * | 2020-01-21 | 2020-05-19 | 深圳市艾比森光电股份有限公司 | LED display module and LED display screen |
| CN113302757A (en) * | 2021-03-03 | 2021-08-24 | 泉州三安半导体科技有限公司 | LED packaging device and preparation method thereof |
| CN113302757B (en) * | 2021-03-03 | 2023-12-05 | 泉州三安半导体科技有限公司 | LED packaging device and preparation method thereof |
| CN114122238A (en) * | 2022-01-21 | 2022-03-01 | 至芯半导体(杭州)有限公司 | Light-gathering type ultraviolet emitting device packaging structure |
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Application publication date: 20110720 |