CN201035859Y - High-density full function LED display screen module - Google Patents
High-density full function LED display screen module Download PDFInfo
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- CN201035859Y CN201035859Y CNU2006200742549U CN200620074254U CN201035859Y CN 201035859 Y CN201035859 Y CN 201035859Y CN U2006200742549 U CNU2006200742549 U CN U2006200742549U CN 200620074254 U CN200620074254 U CN 200620074254U CN 201035859 Y CN201035859 Y CN 201035859Y
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- led display
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- high density
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Abstract
The utility model provides an LED display screen module with high density and full function. The module uses a printed circuit board with two to six layers as the carrier, two-dimensional lattice points are arranged on the upper surface of the printed circuit board, each lattice point is provided with a pad, and an LED chip with single color or double colors of three primary colors is attached or welded in the lattice point; the outer surface of the LED chip is coated with silica gel or epoxide-resin glue provided with diffusant or UV glue which is surface protection glue and a light outgoing lens of the LED; through holes with very small apertures are arranged on the printed circuit board, and the through holes are filled with metallic copper or other heat conductive materials; the bottom surface layer of the printed circuit board is provided with a controlling and driving element and a connecting element; the point lattice mode of the module can be 6 * 32 or 32 * 32 or 32 * 64. The utility model can be utilized to be combined into the LED display screen with small size, compact structure, good heat radiation effect, long service life, and excellent image quality.
Description
Technical field
It is the display panel module of luminophor that the utility model relates to semiconductor light-emitting-diode (LED), relates in particular to a kind of high density global function LED display module, belongs to LED display technique field.
Background technology
In recent years, LED display replaces the CRT video wall substantially; The composition mode of LED display: be packaged into 8 * 8 digital lattice modules by led chip, the more digital lattice module of some LED be assembled on the control circuit board, combine by some control circuit boards at last.
8 * 8 digital dot matrix display modules as shown in Figure 1, the module package pattern as shown in Figure 2, led chip 5 is fixed in above the circuit board 2, in the plastic reflective of again printed circuit board (PCB) 2 being packed into the lid 3, irritate with epoxide-resin glue 4, baking molding, thus form lattice point 1.With some LED 8 * 8 digital lattice modules, be assembled on the control circuit board by the 6 usefulness solderings of metal needle web member, the double action that metal needle plays conduction and conducts heat; Control circuit board in advance welded and installed the components and parts and the web member of this module of controlling and driving, again some control circuit boards are installed on the frame of display screen, connect appurtenances such as power supply, data communication interface, heat dissipation ventilation fan again, be combined into LED display at last.
The LED display of LED 8 * 8 digital lattice module combinations, its thickness is thicker, and power consumption is bigger during work.The heat conductivility of epoxide-resin glue is poor, and the heat that led chip produces when luminous in the module can't conduct rapidly by epoxide-resin glue, can only lean on the metal needle web member slowly to derive, and the led chip internal high temperature will cause luminescence efficiency to descend; To a certain degree can cause LED to lose efficacy when the led chip internal temperature rises to, shorten the serviceable life of led chip.The reflection lid material of the digital lattice module of LED mostly is the PC plastics in addition, adopts the moulding of injection moulding mode; Encapsulate used epoxy resin, its glass transition temperature Tg than higher, under this temperature, around the reflection of the PC material lid microdeformation can take place, when being assembled into large display screen, will influence the aesthetic property of display screen.
Minute crack, warpage can appear in the LED display of traditional LED 8 * 8 digital lattice module combinations, occur serious problems such as aberration, flower screen, dead point, color distortion in use for some time.
Summary of the invention
The purpose of this utility model is to overcome the deficiencies in the prior art, a kind of high density global function LED display module is provided, utilizes that this module can be combined into that volume is little, the LED display of compact conformation, good heat dissipation effect, long service life, picture quality excellence.
The purpose of this utility model is achieved through the following technical solutions:
High density global function LED display module is characterized in that: the carrier of this module is 2～6 layers a printed circuit board (PCB), and the upper surface layer of printed circuit board (PCB) is provided with two-dimentional lattice point, and each lattice point is provided with pad, mounts or be welded with led chip in the lattice point; The led chip outside surface scribbles protection glue, forms the luminous lens of curve form, perhaps is buckled with the plastic preforms of the hollow transparent of truncated rectangular pyramids shape, and hollow space is marked with protection glue; The bottom surface layer of printed circuit board (PCB) is equipped with controlling and driving components and parts and web member.
Further, above-mentioned high density global function LED display module, described interlattice point distance is 2.54～7.62mm, and line number is 8～32 row, and columns is 8～64 row.Described led chip is monochromatic or double-colored or three primary colours.Described printed circuit board (PCB) is provided with the through hole that the aperture is Φ 0.1～0.3mm, is filled with metallic copper or other Heat Conduction Material in the through hole.
Again further, high density global function LED display module, described protection glue is the epoxide-resin glue or the UV glue of silica gel or band diffusant.The gap of lens scribbles again black glue.
Further, high density global function LED display module, the dot pattern of described module is 16 * 32 or 32 * 32 or 32 * 64.
The outstanding substantive distinguishing features and the obvious improvement of technical solutions of the utility model is mainly reflected in:
(1) high density global function LED display module is that led chip directly is packaged on the multilayer circuit board, technical maturity, and production cost is lower.Multilayer board possesses multinomial functions such as fixed L ED chip, connection line and heat radiation simultaneously, and module thickness is thin, volume is little, combination is easy, and conserve space both can singlely have been used, use also capable of being combined.As basic components, can easily be assembled into large LED display screen.
(2) the utility model is based on the multilayer control circuit board, the machinery and the better heat stability of the material that adopts, product adaptation wider range.The Heat Conduction Material of multilayer circuit board metallization circuit via hole and landfill all helps led chip and dispels the heat by multi-path, has improved radiating effect.
(3) the led chip outside surface covers the epoxy resin glue or the UV glue of silica gel or band diffusant, is surface protective glue, also is the luminous lens of LED; Can adjust rising angle, improve light extraction efficiency.
(4) scale of display panel module array is big, and lattice distance is little, has increased display pixel, significantly improves the sharpness of display image, and under same application background, its production cost obviously reduces, and yield rate increases substantially.
(5) the utility model can carry out burn-in test in manufacturing process, and bad chip is reprocessed immediately, and the display image quality is guaranteed preferably.
Description of drawings
Below in conjunction with accompanying drawing technical solutions of the utility model are described further:
Fig. 1: 8 * 8 digital dot matrix display module synoptic diagram in the background technology;
Fig. 2: 8 * 8 digital lattice module encapsulation mode synoptic diagram in the background technology;
Fig. 3: high density global function LED display module diagram;
Fig. 4: the partial view of high density global function LED display module;
Fig. 5: the partial schematic diagram of the another kind of form of high density global function LED display module
Wherein: printed circuit board (PCB) 11; Led chip 12; Black again glue 13; Lens 14; Mechanical fixed component 15; Components and parts 16; External communication interface 17; Plastic preforms 21; Led chip 22; Luminous lens 23; Black again glue 24;
Embodiment
The utility model provides a kind of high density global function LED display module, makes in packaging technology COB mode on the led chip direct circuit plate; Utilize that this module combinations becomes that volume is little, the LED display of compact conformation, good heat dissipation effect, long service life, picture quality excellence.
As shown in Figure 3, Figure 4; the utility model high density global function LED display module; with 2～6 layers printed circuit board (PCB)s 11 as carrier; mount led chip 12 in evenly distributed array center; chip outer surface drop silica gel also covers chip with as surface protection; in the process of solidifying, utilize specific processing mold that the glue face is carried out post forming and form optical lens 14.The printed circuit board (PCB) bottom surface layer adopts the SMT process Installation that ic component 16, external communication interface 17, and the mechanical fixed component 15 of module of controlling and driving are arranged.Install the printed circuit board (PCB) of whole parts qualified after testing after, at the black glue 13 of the gap of each luminous point lens 14 coated, obscure again with the light that reduces each luminous point.
Fig. 5 is another form partial schematic diagram of the utility model high density global function LED display module, on led chip 22, buckle transparent plastic preforms 21 in advance, the pre-workpieces of these plastics inside is hollow, profile is the truncated rectangular pyramids shape, hollow space injects the epoxy resin glue or the UV glue of silica gel or band diffusant, solidifies the luminous lens 23 that back and transparent plastic prefabricated component are combined into LED.For the light that reduces each luminous point is obscured, again in the gap of each luminous point transparent plastic prefabricated component root, coated is deceived glue 24.
High density global function LED display module, the multilayer board 11 that mainly adopts particular design are as carrier, and upper surface layer designs the two-dimentional lattice point of marshalling, and each lattice point position is equipped with pad, mounts one group of led chip 12 in each lattice point.According to user demand, design shows that the interlattice point distance scope is 2.54～7.62mm, and the array line number of design is 8～32 row, and columns is 8～64 row.The chip that mounts or weld can be the led chip of single look, shows to provide monochromatic; Also can be the led chip of two kinds of colors, so that double-colored demonstration to be provided; Also can be the led chip of three primary colours, so that full-color demonstration to be provided.The through hole that the some diameters of processing are very thin on the multilayer board of high density global function LED display module (aperture Φ 0.1～0.3mm), a part of through hole inside makes through hole become the conductive channel of printed circuit board (PCB) interlayer through deposition and plated metal copper; Heat-transfer matcrial is inserted in another part through hole inside, with the heat of conduction led chip.
The LED bare chip all mounts at printed circuit board (PCB) and finishes, and led chip and circuit is electrically connected under the effect of ultrasonic, hot pressing with the wire ball welding machine, after the test passes, seals up resin glue again.First kind of mode of led chip outside surface sealing is: the epoxy resin glue or the UV glue that adopt full-automatic glue-dropping machine drop silica gel or band diffusant, cover chip with as surface protection, be cured through ultraviolet ray, the surface protective glue of institute's drop also is the luminous lens of LED; In the epoxy resin glue or UV glue is transformed into solidity by plasticity process of silica gel or band diffusant, utilize specific processing mold that the secondary lens moulding is carried out on the glue surface, form the luminous lens 14 of unisurf shape, thereby obtain best rising angle and effect.The another kind of mode of led chip outside surface sealing: on led chip, buckle the pre-workpieces of transparent plastics in advance, the pre-workpieces of these plastics inside is hollow, profile is the truncated rectangular pyramids shape, at the epoxy resin glue or the UV glue of hollow space injection silica gel or band diffusant, after ultraviolet curing, be combined into the luminous lens 14 of LED with the pre-workpieces of plastics.
The bottom surface layer employing SMT technology of multilayer board mounts the ic component 16 of controlling and driving led chip dot matrix, so that each luminous point is implemented control; External communication interface parts 17 are installed, are guaranteed the message exchange between module and the display screen.In addition, go back make-up machinery fixed part 15, use as the installation and the expansion of display panel module.The printed circuit board (PCB) that installs whole parts is again through visual inspection, energising and detection.
High density global function LED display module array scale can substantially exceed 8 * 8, and dot pattern commonly used is 16 * 32 or 32 * 32 or 32 * 64, and the spacing of array can be done very for a short time.Module can singlely be used, use also capable of being combined; Be combined into large tracts of land, the high definition ultrathin LED display screen of monochrome, double-colored or full color as basic components.
Certainly, more than only be concrete exemplary applications of the present utility model, protection domain of the present utility model is not constituted any limitation.All employing equivalents or equivalence are replaced and the technical scheme of formation, all drop within the utility model rights protection scope.
Claims (7)
1. high density global function LED display module, it is characterized in that: the carrier of this module is 2～6 layers a printed circuit board (PCB), and the upper surface layer of printed circuit board (PCB) is provided with two-dimentional lattice point, and each lattice point is provided with pad, mounts or be welded with led chip in the lattice point; The led chip outside surface scribbles protection glue, forms the luminous lens of curve form, perhaps is buckled with the plastic preforms of the hollow transparent of truncated rectangular pyramids shape, and hollow space is marked with protection glue; The bottom surface layer of printed circuit board (PCB) is equipped with controlling and driving components and parts and web member.
2. high density global function LED display module according to claim 1, it is characterized in that: described interlattice point distance is 2.54～7.62mm, and line number is 8～32 row, and columns is 8～64 row.
3. high density global function LED display module according to claim 1 is characterized in that: described led chip is monochromatic or double-colored or three primary colours.
4. high density global function LED display module according to claim 1, it is characterized in that: described printed circuit board (PCB) is provided with the through hole that the aperture is Φ 0.1～0.3mm, is filled with metallic copper in the through hole.
5. high density global function LED display module according to claim 1 is characterized in that: described protection glue is the epoxide-resin glue or the UV glue of silica gel or band diffusant.
6. high density global function LED display module according to claim 1 is characterized in that: the gap of lens scribbles again black glue.
7. high density global function LED display module according to claim 1, it is characterized in that: the dot pattern of described module is 16 * 32 or 32 * 32 or 32 * 64.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2006200742549U CN201035859Y (en) | 2006-06-26 | 2006-06-26 | High-density full function LED display screen module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2006200742549U CN201035859Y (en) | 2006-06-26 | 2006-06-26 | High-density full function LED display screen module |
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| CN201035859Y true CN201035859Y (en) | 2008-03-12 |
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| CNU2006200742549U Expired - Lifetime CN201035859Y (en) | 2006-06-26 | 2006-06-26 | High-density full function LED display screen module |
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Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101515426B (en) * | 2009-03-09 | 2011-01-05 | 李博航 | System for improving image display effect |
| CN102044196A (en) * | 2009-10-22 | 2011-05-04 | 夏普株式会社 | Display apparatus |
| CN102194384A (en) * | 2011-05-20 | 2011-09-21 | 深圳市钧多立实业有限公司 | LED (Light Emitting Diode) light emitting board and LED display screen |
| CN103165028A (en) * | 2011-12-09 | 2013-06-19 | 上海本星电子科技有限公司 | Embedded light emitting diode (LED) display screen and manufacture process thereof |
| CN103730072A (en) * | 2014-01-03 | 2014-04-16 | 深圳市奥蕾达光电技术有限公司 | LED display screen, full-color LED light-emitting panel and manufacturing method of full-color LED light-emitting panel |
| CN103943038A (en) * | 2014-04-03 | 2014-07-23 | 吴光 | Outdoor display unit module based on integrated series unit board |
| CN104269118A (en) * | 2014-10-30 | 2015-01-07 | 广东威创视讯科技股份有限公司 | Optical interference elimination structure and method applied to LED display screen |
| CN105243969A (en) * | 2015-10-27 | 2016-01-13 | 安徽天众电子科技有限公司 | Small spacing integrated LED display screen |
| CN105810115A (en) * | 2016-05-30 | 2016-07-27 | 深圳市奥蕾达科技有限公司 | Novel chip on board (COB) full color light-emitting diode (LED) light-emitting panel and manufacturing method thereof |
| CN106132152A (en) * | 2016-08-13 | 2016-11-16 | 上海小糸车灯有限公司 | Vehicle led signal lamp control module |
| CN106205401A (en) * | 2016-07-21 | 2016-12-07 | 长春希达电子技术有限公司 | A kind of integration packaging LED display module and preparation method thereof |
| CN106297578A (en) * | 2016-10-26 | 2017-01-04 | 上海得倍电子技术有限公司 | Glueballs packaged type display panel module |
| CN106530978A (en) * | 2016-11-18 | 2017-03-22 | 曾广祥 | LED display screen and manufacturing method thereof |
| CN106683578A (en) * | 2016-12-01 | 2017-05-17 | 长春希达电子技术有限公司 | LED display screen capable of eliminating color difference among modules and manufacturing method of LED display screen |
| CN111105726A (en) * | 2020-01-14 | 2020-05-05 | 深圳市生辉煌电子有限公司 | LED display screen with visual angle |
| CN117691028A (en) * | 2024-01-29 | 2024-03-12 | 长春希龙显示技术有限公司 | Display unit with high diffusion degree and preparation method thereof |
-
2006
- 2006-06-26 CN CNU2006200742549U patent/CN201035859Y/en not_active Expired - Lifetime
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101515426B (en) * | 2009-03-09 | 2011-01-05 | 李博航 | System for improving image display effect |
| CN102044196A (en) * | 2009-10-22 | 2011-05-04 | 夏普株式会社 | Display apparatus |
| CN102044196B (en) * | 2009-10-22 | 2013-12-25 | 夏普株式会社 | Display apparatus |
| CN102194384A (en) * | 2011-05-20 | 2011-09-21 | 深圳市钧多立实业有限公司 | LED (Light Emitting Diode) light emitting board and LED display screen |
| CN103165028A (en) * | 2011-12-09 | 2013-06-19 | 上海本星电子科技有限公司 | Embedded light emitting diode (LED) display screen and manufacture process thereof |
| CN103730072A (en) * | 2014-01-03 | 2014-04-16 | 深圳市奥蕾达光电技术有限公司 | LED display screen, full-color LED light-emitting panel and manufacturing method of full-color LED light-emitting panel |
| CN103943038A (en) * | 2014-04-03 | 2014-07-23 | 吴光 | Outdoor display unit module based on integrated series unit board |
| CN104269118A (en) * | 2014-10-30 | 2015-01-07 | 广东威创视讯科技股份有限公司 | Optical interference elimination structure and method applied to LED display screen |
| CN105243969A (en) * | 2015-10-27 | 2016-01-13 | 安徽天众电子科技有限公司 | Small spacing integrated LED display screen |
| CN105810115A (en) * | 2016-05-30 | 2016-07-27 | 深圳市奥蕾达科技有限公司 | Novel chip on board (COB) full color light-emitting diode (LED) light-emitting panel and manufacturing method thereof |
| CN105810115B (en) * | 2016-05-30 | 2019-08-20 | 深圳市奥蕾达科技有限公司 | All-colour LED luminescent panel |
| CN106205401A (en) * | 2016-07-21 | 2016-12-07 | 长春希达电子技术有限公司 | A kind of integration packaging LED display module and preparation method thereof |
| CN106132152A (en) * | 2016-08-13 | 2016-11-16 | 上海小糸车灯有限公司 | Vehicle led signal lamp control module |
| CN106297578A (en) * | 2016-10-26 | 2017-01-04 | 上海得倍电子技术有限公司 | Glueballs packaged type display panel module |
| CN106530978A (en) * | 2016-11-18 | 2017-03-22 | 曾广祥 | LED display screen and manufacturing method thereof |
| CN106683578A (en) * | 2016-12-01 | 2017-05-17 | 长春希达电子技术有限公司 | LED display screen capable of eliminating color difference among modules and manufacturing method of LED display screen |
| CN111105726A (en) * | 2020-01-14 | 2020-05-05 | 深圳市生辉煌电子有限公司 | LED display screen with visual angle |
| CN117691028A (en) * | 2024-01-29 | 2024-03-12 | 长春希龙显示技术有限公司 | Display unit with high diffusion degree and preparation method thereof |
| CN117691028B (en) * | 2024-01-29 | 2024-05-03 | 长春希龙显示技术有限公司 | Display unit with high diffusion degree and preparation method thereof |
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| C14 | Grant of patent or utility model | ||
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| CX01 | Expiry of patent term |
Granted publication date: 20080312 |
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| EXPY | Termination of patent right or utility model |