CN109719381A - A kind of process of automatic welding bonding gold thread - Google Patents
A kind of process of automatic welding bonding gold thread Download PDFInfo
- Publication number
- CN109719381A CN109719381A CN201910131123.1A CN201910131123A CN109719381A CN 109719381 A CN109719381 A CN 109719381A CN 201910131123 A CN201910131123 A CN 201910131123A CN 109719381 A CN109719381 A CN 109719381A
- Authority
- CN
- China
- Prior art keywords
- gold thread
- pad
- welding
- rectangular recess
- gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The invention discloses a kind of processes of automatic welding bonding gold thread, method includes the following steps, rectangular recess is suppressed on the pad of chip, gold thread is cut short to equal with recess width, and gold thread is soldered to rectangular recess bottom position, pad is placed on welding table top, gold thread is put into the gold thread placing tube in automatic soldering device, so that gold thread end is located above the rectangular recess of pad, it is evacuated in automatic soldering device, it is using ultrasonic bonding head that the firing of gold thread end is spherical, when only needing to connect single gold thread on pad, user need to only weld a gold thread, the present invention suppresses rectangular recess on the pad of chip, when avoiding the process using solder bonds gold thread, the process of solder bonds gold thread is not easy to increase the solder sphere of welding gold thread and the contact area of pad, simultaneously, also inconvenient The problem of being welded while Yu Duogen gold thread, influencing the welding effect of the process of solder bonds gold thread.
Description
Technical field
The invention belongs to be bonded welding method technical field, and in particular to a kind of technique side of automatic welding bonding gold thread
Method.
Background technique
In the method for connecting golden (Au) alloy bonding line, mainly using the bonding of ultrasonic wave combination hot pressing in the first bonding
Method.In the method, fine discharge is carried out and heating melting by the front end to the line exposed from capillary front end, and passes through table
Face tension and after forming round, bulb portion is crimped what engagement (sphere bonding) was heated in the range of 150-300 DEG C
On the electrode of semiconductor element, the second subsequent bonding for crimped by ultrasonic wave bonding line directly engage (wedge shape combination) in
Outer lead side.In order to come as semiconductors such as transistor or IC using after above-mentioned bonding line bonding, to protect as mesh
, with epoxy resin sealing semiconductor chips, bonding line and the lead frame of part for being mounted with semiconductor chip etc..
When using the process of solder bonds gold thread at present, the process of solder bonds gold thread is not easy to increase welding
The solder sphere of gold thread and the contact area of pad, meanwhile, it is also not easy to welding while more gold threads, influences solder bonds gold thread
Process welding effect, meanwhile, using solder bonds gold thread process when, the process of solder bonds gold thread
It is difficult to after welding, whether test welding in time succeeds, and influences the effect of the process welding gold thread of solder bonds gold thread
Rate.
Summary of the invention
The purpose of the present invention is to provide a kind of processes of automatic welding bonding gold thread, to solve to make using existing
When with the process of ice-cold formula solder bonds gold thread, the process of solder bonds gold thread is not easy to increase the weldering of welding gold thread
The contact area received with pad, and, the process of solder bonds gold thread is difficult to after welding, in time test welding
Whether successful problem.
To achieve the above object, the invention provides the following technical scheme: a kind of automatic welding is bonded the process of gold thread,
It is characterized in that, method the following steps are included:
Step 1: rectangular recess is suppressed on the pad of chip；
Step 2: gold thread is cut short to equal with recess width, and gold thread is soldered to rectangular recess bottom position；
Step 3: pad is placed on welding table top, and gold thread is put into the gold thread placing tube in automatic soldering device,
So that gold thread end is located above the rectangular recess of pad, it is evacuated in automatic soldering device；
Step 4: using ultrasonic bonding head that the firing of gold thread end is spherical；
Step 5: when only needing to connect single gold thread on pad, when carrying out step 2, user need to only weld one
Gold thread, and the middle position that a gold thread is placed into the rectangular recess on pad top can be by gold thread when carrying out step 3
Gold thread position in the spherical pad alignment rectangular recess of end, then carry out the welding process in step 6；When being needed on pad
When connecting two gold threads, when carrying out step 2, user need to only weld a gold thread, and a gold thread is placed into pad
The spherical pad of gold thread end can be respectively aligned to by the middle position of the rectangular recess on top when carrying out step 3
The two sides of gold thread, then carry out the welding process in step 6；When needing to connect N root gold thread on pad, when carrying out step 2,
User need to weld N-1 root gold thread, and N-1 root gold thread installation rectangular array is evenly distributed on to the rectangular recess on pad top
It is interior, when carrying out step 3, the spherical pad of gold thread end can be respectively aligned to the rectangular recess on pad top by gold thread point
In the different grooves cut, then carry out the welding process in step 6；
Step 6: pressing plate is moved at the spherical pad of gold thread end by driving mechanism, and the drop bar of stretching of driving mechanism will
It is pushed away under pressing plate, the spherical pad of gold thread end is pressed onto the rectangular recess on pad by pressing plate；
Step 7: after the completion of welding, the side connecting test line of pad, p-wire can be connected to automatic welding by user
On the binding post of the bottom of the device, meanwhile, the power supply of gold thread end is connected, at this point, the thermal infrared imager of automatic soldering device bottom end
The heating region figure of pad is shot, the heat condition that user observes pad judges whether welding succeeds, the weldering that will be welded successfully
Disk takes out for use, welds unsuccessful pad and takes out, the pad of gold thread is heated, gold thread is rejected, step 1 is returned to
Again it is welded.
Preferably, the automatic soldering device in the step 3 includes: device seal closure, the inside of described device seal closure
Bottom end is equipped with welding table top and gold thread placing tube.
Preferably, the gold thread placing tube is provided with several, and the gold thread placing tube circular array shape is distributed in weldering
Around consecutive face, the inner lower edge of described device seal closure is equipped with thermal infrared imager, and the thermal infrared imager is located at welding
The side of the lower position of table top, the welding table top is equipped with p-wire, and the bottom end of described device seal closure, which is provided with, to be connect
The end of terminal, the p-wire is connected with binding post.
Preferably, electric lifting rod is installed, the top of the electric lifting rod passes through on the inside of described device seal closure
Mounting rack is fixedly installed with ultrasonic bonding head, and the end of the ultrasonic bonding head is connected to ultrasonic bonding by connecting line
Device.
Preferably, the inside top of described device seal closure slidably connects driving device by sliding slot.
Preferably, the driving device includes mounting rack, and the interior side of the mounting rack is fixedly installed with driving motor,
The side of the driving motor is rotatably connected to lead screw by shaft.
Preferably, the outer sheath of the lead screw is equipped with ball screw assembly, and changes set, and the ball screw assembly, changes the bottom end peace of set
Equipped with electric telescopic rod, the bottom end of the electric telescopic rod is fixedly installed with pressing plate.
Preferably, the top of described device seal closure is equipped with thermal imaging display screen.
Preferably, the top of described device seal closure is connected with negative pressure pump, the side of described device seal closure by pipeline
Hermatic door is installed.
Compared with the prior art, the present invention has the following beneficial effects:
(1) present invention suppresses rectangular recess on the pad of chip, gold thread is cut short to equal with recess width, and will be golden
Wire bonding is connected to rectangular recess bottom position, pad is placed on welding table top, gold thread is put into the gold in automatic soldering device
In line placing tube, so that gold thread end is located above the rectangular recess of pad, when only needing to connect single gold thread on pad,
When carrying out step 2, user need to only weld a gold thread, and a gold thread is placed into the rectangular recess on pad top
Between at position, when carrying out step 3, the spherical pad of gold thread end can be directed to the gold thread position in rectangular recess, then into
Welding process in row step 6；When needing to connect two gold threads on pad, when carrying out step 2, user only needs to weld
A piece gold thread, an and gold thread is placed into the middle position of the rectangular recess on pad top can will when carrying out step 3
The spherical pad of gold thread end is respectively aligned to the two sides of gold thread, then carries out the welding process in step 6；When being needed on pad
When connecting N root gold thread, when carrying out step 2, user need to weld N-1 root gold thread, and N-1 root gold thread is installed rectangle battle array
Column are evenly distributed in the rectangular recess on pad top, when carrying out step 3, can be distinguished the spherical pad of gold thread end
It is aligned in the different grooves that the rectangular recess on pad top is divided by gold thread, then carries out the welding process in step 6, automatic welding
It is evacuated in connection device, when avoiding the process using solder bonds gold thread, the process of solder bonds gold thread is not
Convenient for increasing the solder sphere of welding gold thread and the contact area of pad, meanwhile, it is also not easy to welding while more gold threads, is influenced
The problem of welding effect of the process of solder bonds gold thread.
(2) after the completion of present invention welding, the side connecting test line of pad, p-wire can be connected to automatic welding by user
On the binding post of connection device bottom end, meanwhile, the power supply of gold thread end is connected, at this point, the infrared thermal imagery of automatic soldering device bottom end
Instrument shoots the heating region figure of pad, and the heat condition that user observes pad judges whether welding succeeds, by what is be welded successfully
Pad takes out for use, welds unsuccessful pad and takes out, the pad of gold thread is heated, gold thread is rejected, step is returned to
One is welded again, and when avoiding the process using solder bonds gold thread, the process of solder bonds gold thread is difficult to
After welding, whether test welding in time succeeds, and influences the efficiency of the process welding gold thread of solder bonds gold thread
Problem.
Detailed description of the invention
Fig. 1 is the structural diagram of the present invention；
Fig. 2 is the plate top view that is slidably installed of the invention；
Fig. 3 is the welding schematic diagram of two gold threads of the invention；
Fig. 4 is the welding schematic diagram of single gold thread of the invention.
In figure: 1- electric lifting rod, 2- p-wire, 3- welding table top, 4- thermal infrared imager, 5- gold thread placing tube, 6- are negative
It is super that press pump, 7- binding post, 8- driving motor, 9- lead screw, 10- ball screw assembly, change set, 11- electric telescopic rod, 12- pressing plate, 13-
Sound wave plumb joint, 14- device seal closure, 15- mounting rack, 16- thermal imaging display screen.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
It please refers to shown in Fig. 1-4, the invention provides the following technical scheme: a kind of technique side of automatic welding bonding gold thread
Method, which is characterized in that method the following steps are included:
Step 1: rectangular recess is suppressed on the pad of chip；
Step 2: gold thread is cut short to equal with recess width, and gold thread is soldered to rectangular recess bottom position；
Step 3: pad is placed on welding table top, and gold thread is put into the gold thread placing tube in automatic soldering device,
So that gold thread end is located above the rectangular recess of pad, it is evacuated in automatic soldering device；
Step 4: using ultrasonic bonding head that the firing of gold thread end is spherical；
Step 5: when only needing to connect single gold thread on pad, when carrying out step 2, user need to only weld one
Gold thread, and the middle position that a gold thread is placed into the rectangular recess on pad top can be by gold thread when carrying out step 3
Gold thread position in the spherical pad alignment rectangular recess of end, then carry out the welding process in step 6；
When needing to connect two gold threads on pad, when carrying out step 2, user need to only weld a gold thread, and will
A piece gold thread is placed into the middle position of the rectangular recess on pad top, can be by the ball of gold thread end when carrying out step 3
Shape pad is respectively aligned to the two sides of gold thread, then carries out the welding process in step 6；
When needing to connect N root gold thread on pad, when carrying out step 2, user need to weld N-1 root gold thread, and by N-
1 gold thread installation rectangular array is evenly distributed in the rectangular recess on pad top, can be by gold thread end when carrying out step 3
Spherical pad be respectively aligned in the different grooves that the rectangular recess on pad top is divided by gold thread, then carry out in step 6
Welding process；
Step 6: pressing plate is moved at the spherical pad of gold thread end by driving mechanism, and the drop bar of stretching of driving mechanism will
It is pushed away under pressing plate, the spherical pad of gold thread end is pressed onto the rectangular recess on pad by pressing plate；
Step 7: after the completion of welding, the side connecting test line of pad, p-wire can be connected to automatic welding by user
On the binding post of the bottom of the device, meanwhile, the power supply of gold thread end is connected, at this point, the thermal infrared imager of automatic soldering device bottom end
The heating region figure of pad is shot, the heat condition that user observes pad judges whether welding succeeds, the weldering that will be welded successfully
Disk takes out for use, welds unsuccessful pad and takes out, the pad of gold thread is heated, gold thread is rejected, step 1 is returned to
Again it is welded.
Automatic soldering device in step 3 includes: device seal closure 14, and the inner lower edge of device seal closure 14 is equipped with
Weld table top 3 and gold thread placing tube 5.
Gold thread placing tube 5 is provided with several, and 5 circular array shape of gold thread placing tube is distributed in around welding table top 3,
The inner lower edge of device seal closure 14 is equipped with thermal infrared imager 4, and thermal infrared imager 4 is located at the lower position of welding table top 3,
The side of welding table top 3 is equipped with p-wire 2, and the bottom end of device seal closure 14 is provided with binding post 7, and the end of p-wire 2 connects
It is connected to binding post 7.
The inside of device seal closure 14 is equipped with electric lifting rod 1, and the top of electric lifting rod 1 is pacified by the way that mounting rack is fixed
Equipped with ultrasonic bonding head 13, the end of ultrasonic bonding head 13 is connected to ultrasonic brazing unit by connecting line.
The inside top of device seal closure 14 slidably connects driving device by sliding slot.
Driving device includes mounting rack 15, and the interior side of mounting rack 15 is fixedly installed with driving motor 8, driving motor 8
Side lead screw 9 is rotatably connected to by shaft.
The outer sheath of lead screw 9 is equipped with ball screw assembly, and changes set 10, and the bottom end that ball screw assembly, changes set 10 is equipped with electronic stretch
Contracting bar 11, the bottom end of electric telescopic rod 11 are fixedly installed with pressing plate 12.
The top of device seal closure 14 is equipped with thermal imaging display screen 16.
The top of device seal closure 14 is connected with negative pressure pump 6 by pipeline, and the side of device seal closure 14 is equipped with sealing
Door.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.In the absence of more restrictions.By sentence " element limited including one ..., it is not excluded that
There is also other identical elements in the process, method, article or apparatus that includes the element ".
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (9)
1. a kind of process of automatic welding bonding gold thread, which is characterized in that method the following steps are included:
Step 1: rectangular recess is suppressed on the pad of chip；
Step 2: gold thread is cut short to equal with recess width, and gold thread is soldered to rectangular recess bottom position；
Step 3: pad is placed on welding table top, and gold thread is put into the gold thread placing tube in automatic soldering device, so that
Gold thread end is located above the rectangular recess of pad, is evacuated in automatic soldering device；
Step 4: using ultrasonic bonding head that the firing of gold thread end is spherical；
Step 5: when only needing to connect single gold thread on pad, when carrying out step 2, user need to only weld a gold
Line, and a gold thread is placed into the middle position of the rectangular recess on pad top, it, can be by gold thread end when carrying out step 3
Gold thread position in the spherical pad alignment rectangular recess at end, then carry out the welding process in step 6；When being needed on pad
When connecting two gold threads, when carrying out step 2, user need to only weld a gold thread, and a gold thread is placed into pad top
The spherical pad of gold thread end can be respectively aligned to gold when carrying out step 3 by the middle position of the rectangular recess at end
The two sides of line, then carry out the welding process in step 6；When needing to connect N root gold thread on pad, when carrying out step 2, make
User need to weld N-1 root gold thread, and N-1 root gold thread installation rectangular array is evenly distributed in the rectangular recess on pad top,
When carrying out step 3, the rectangular recess that the spherical pad of gold thread end is respectively aligned to pad top can be divided by gold thread
In different grooves, then carry out the welding process in step 6；
Step 6: pressing plate is moved at the spherical pad of gold thread end by driving mechanism, and driving mechanism stretches drop bar for pressing plate
Under push away, the spherical pad of gold thread end is pressed onto the rectangular recess on pad by pressing plate；
Step 7: after the completion of welding, the side connecting test line of pad, p-wire can be connected to automatic soldering device by user
On the binding post of bottom end, meanwhile, the power supply of gold thread end is connected, at this point, the thermal infrared imager of automatic soldering device bottom end is shot
The heating region figure of pad, the heat condition that user observes pad judge whether welding succeeds, and the pad being welded successfully is taken
It is stand-by out, it welds unsuccessful pad and takes out, the pad of gold thread is heated, gold thread is rejected, return to step 1 progress
Again it welds.
2. a kind of process of automatic welding bonding gold thread according to claim 1, which is characterized in that the step 3
In automatic soldering device include: device seal closure (14), the inner lower edge of described device seal closure (14) is equipped with welding bench
Face (3) and gold thread placing tube (5).
3. a kind of process of automatic welding bonding gold thread according to claim 2, which is characterized in that the gold thread is put
It sets cylinder (5) and is provided with several, gold thread placing tube (5) the circular array shape is distributed in around welding table top (3), described
The inner lower edge of device seal closure (14) is equipped with thermal infrared imager (4), and the thermal infrared imager (4) is located at welding table top (3)
Lower position, it is described welding table top (3) side be equipped with p-wire (2), the bottom end of described device seal closure (14) is set
It is equipped with binding post (7), the end of the p-wire (2) is connected with binding post (7).
4. a kind of process of automatic welding bonding gold thread according to claim 2, which is characterized in that described device is close
It is equipped on the inside of sealing cover (14) electric lifting rod (1), the top of the electric lifting rod (1) is fixedly installed with by mounting rack
The end of ultrasonic bonding head (13), the ultrasonic bonding head (13) is connected to ultrasonic brazing unit by connecting line.
5. a kind of process of automatic welding bonding gold thread according to claim 2, which is characterized in that described device is close
The inside top of sealing cover (14) slidably connects driving device by sliding slot.
6. a kind of process of automatic welding bonding gold thread according to claim 5, which is characterized in that the driving dress
It sets including mounting rack (15), the interior side of the mounting rack (15) is fixedly installed with driving motor (8), the driving motor
(8) side is rotatably connected to lead screw (9) by shaft.
7. a kind of process of automatic welding bonding gold thread according to claim 6, which is characterized in that the lead screw
(9) outer sheath is equipped with ball screw assembly, and changes set (10), and the bottom end that the ball screw assembly, changes set (10) is equipped with electric expansion
The bottom end of bar (11), the electric telescopic rod (11) is fixedly installed with pressing plate (12).
8. a kind of process of automatic welding bonding gold thread according to claim 7, which is characterized in that described device is close
The top of sealing cover (14) is equipped with thermal imaging display screen (16).
9. a kind of process of automatic welding bonding gold thread according to claim 8, which is characterized in that described device is close
The top of sealing cover (14) is connected with negative pressure pump (6) by pipeline, and the side of described device seal closure (14) is equipped with hermatic door.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910131123.1A CN109719381A (en) | 2019-02-21 | 2019-02-21 | A kind of process of automatic welding bonding gold thread |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910131123.1A CN109719381A (en) | 2019-02-21 | 2019-02-21 | A kind of process of automatic welding bonding gold thread |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109719381A true CN109719381A (en) | 2019-05-07 |
Family
ID=66301653
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910131123.1A Pending CN109719381A (en) | 2019-02-21 | 2019-02-21 | A kind of process of automatic welding bonding gold thread |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109719381A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112872530A (en) * | 2020-12-27 | 2021-06-01 | 新沂市宏展电子科技有限公司 | Automatic tin soldering device for multimedia interface line and working method thereof |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040007711A1 (en) * | 2002-07-09 | 2004-01-15 | Kyocera Corporation | Apparatus carrying electronic device |
| US20050051600A1 (en) * | 2003-09-10 | 2005-03-10 | Texas Instruments Incorporated | Method and system for stud bumping |
| JP2006202812A (en) * | 2005-01-18 | 2006-08-03 | Mitsui High Tec Inc | Process for manufacturing lead frame and lead frame |
| CN1827280A (en) * | 2005-03-02 | 2006-09-06 | 东丽工程株式会社 | Ultrasonic connection head and device employing same |
| CN101872727A (en) * | 2009-04-24 | 2010-10-27 | 国碁电子(中山)有限公司 | Chip welding method and structure |
| CN102254893A (en) * | 2011-07-29 | 2011-11-23 | 天水华天科技股份有限公司 | Quadrilateral flat leadless package with double convex points and production method thereof |
| US20130001777A1 (en) * | 2011-06-30 | 2013-01-03 | Stmicroelectronics (Grenoble 2) Sas | Copper wire receiving pad |
| CN103286426A (en) * | 2013-05-20 | 2013-09-11 | 马鞍山市晨光高耐磨科技发展有限公司 | Novel alloy welding process |
| CN105397263A (en) * | 2015-12-30 | 2016-03-16 | 重庆永富电线电缆有限公司 | Cold-pressing welding equipment |
| CN106024744A (en) * | 2009-05-20 | 2016-10-12 | 瑞萨电子株式会社 | Semiconductor device |
| CN207239425U (en) * | 2017-09-19 | 2018-04-17 | 东莞市晶源精密焊接设备有限公司 | Bull hot welding press |
| CN208173577U (en) * | 2018-06-07 | 2018-11-30 | 上海滢立电子科技有限公司 | A kind of encapsulating structure of chip |
| CN109192840A (en) * | 2018-09-14 | 2019-01-11 | 惠州市鑫永诚光电科技有限公司 | A kind of die pressing type LED structure and its packaging method |
-
2019
- 2019-02-21 CN CN201910131123.1A patent/CN109719381A/en active Pending
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040007711A1 (en) * | 2002-07-09 | 2004-01-15 | Kyocera Corporation | Apparatus carrying electronic device |
| US20050051600A1 (en) * | 2003-09-10 | 2005-03-10 | Texas Instruments Incorporated | Method and system for stud bumping |
| JP2006202812A (en) * | 2005-01-18 | 2006-08-03 | Mitsui High Tec Inc | Process for manufacturing lead frame and lead frame |
| CN1827280A (en) * | 2005-03-02 | 2006-09-06 | 东丽工程株式会社 | Ultrasonic connection head and device employing same |
| CN101872727A (en) * | 2009-04-24 | 2010-10-27 | 国碁电子(中山)有限公司 | Chip welding method and structure |
| CN106024744A (en) * | 2009-05-20 | 2016-10-12 | 瑞萨电子株式会社 | Semiconductor device |
| US20130001777A1 (en) * | 2011-06-30 | 2013-01-03 | Stmicroelectronics (Grenoble 2) Sas | Copper wire receiving pad |
| CN102254893A (en) * | 2011-07-29 | 2011-11-23 | 天水华天科技股份有限公司 | Quadrilateral flat leadless package with double convex points and production method thereof |
| CN103286426A (en) * | 2013-05-20 | 2013-09-11 | 马鞍山市晨光高耐磨科技发展有限公司 | Novel alloy welding process |
| CN105397263A (en) * | 2015-12-30 | 2016-03-16 | 重庆永富电线电缆有限公司 | Cold-pressing welding equipment |
| CN207239425U (en) * | 2017-09-19 | 2018-04-17 | 东莞市晶源精密焊接设备有限公司 | Bull hot welding press |
| CN208173577U (en) * | 2018-06-07 | 2018-11-30 | 上海滢立电子科技有限公司 | A kind of encapsulating structure of chip |
| CN109192840A (en) * | 2018-09-14 | 2019-01-11 | 惠州市鑫永诚光电科技有限公司 | A kind of die pressing type LED structure and its packaging method |
Non-Patent Citations (1)
| Title |
|---|
| 杨兵等: "多排焊盘外壳封装IC金丝球焊键合技术", 《电子与封装》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112872530A (en) * | 2020-12-27 | 2021-06-01 | 新沂市宏展电子科技有限公司 | Automatic tin soldering device for multimedia interface line and working method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR0139870B1 (en) | Semiconductor device including a semiconductor element mounted on a substrate using bump-shaped connecting electrodes | |
| CN100414679C (en) | Thermal ultrasonic reverse chip key binder | |
| CN103377958B (en) | The hot compression bonding of semiconductor chip | |
| KR101294419B1 (en) | Camera module and manufacturing method thereof | |
| CN102272911B (en) | Wire bonding apparatus and wire bonding method | |
| CN109719381A (en) | A kind of process of automatic welding bonding gold thread | |
| CN102136436B (en) | Welding column welding method for integrated circuit package | |
| CN102151927A (en) | Welding method for welding columns of encapsulated integrated circuit (IC) | |
| CN111106104A (en) | Manufacturing process of 18-28GHZ T assembly | |
| CN106981434B (en) | Full-automatic adhesive sheet bonding equipment and adhesive sheet bonding method | |
| CN105472215A (en) | Camera module group with electrical support, and assembly method and application of camera module group | |
| TWI590401B (en) | Method for checking the coated state of flux onto flip chip | |
| CN101740429A (en) | Flip chip bonding process for base plate | |
| US5614113A (en) | Method and apparatus for performing microelectronic bonding using a laser | |
| CN110935978A (en) | Intelligent auxiliary device for improving welding efficiency of integrated circuit board | |
| CN204792795U (en) | Terminal equipment | |
| WO2021082898A1 (en) | Cof encapsulation method | |
| CN104465429B (en) | A kind of welding method of flat-four-side pin-less packaging part | |
| KR101753066B1 (en) | A film comprising conductive particle and the manufacturing method of flip chip package using the same | |
| CN210136846U (en) | Heating jig for QFN (quad Flat No-lead) packaging | |
| JP3966516B2 (en) | Mounting method and apparatus | |
| CN110739228A (en) | method for quickly mounting BGA chip | |
| CN105489734A (en) | Chip on board (COB) production process free from wire binding | |
| JP2009004462A (en) | Method of mounting semiconductor device | |
| US20060163330A1 (en) | Site flattening tool and method for circuit board repair |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190507 |