CN111277731A

CN111277731A - Camera module and electronic equipment with camera module

Info

Publication number: CN111277731A
Application number: CN201811473751.XA
Authority: CN
Inventors: 赵波杰; 梅哲文
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2018-12-04
Filing date: 2018-12-04
Publication date: 2020-06-12

Abstract

The invention discloses a camera module and electronic equipment with the camera module, wherein the camera module comprises an optical lens, an optical filter, a circuit board, a photosensitive chip which is conductively connected with the circuit board and a combining part. The combination part is provided with a lower combination side, a top combination surface and a light path, wherein the lower combination side of the combination part is combined with the circuit board assembly, the combination part surrounds the periphery of a light sensing area of the light sensing chip, so that the light sensing area of the light sensing chip is exposed to the light path of the combination part, the periphery of the optical filter is combined with the top combination surface of the combination part, the optical filter is kept in a light sensing path of the light sensing chip through the combination part, and the optical lens is kept in the light sensing path of the light sensing chip.

Description

Camera module and electronic equipment with camera module

Technical Field

The present invention relates to the field of optical imaging, and in particular, to a camera module and an electronic device with the camera module.

Background

In recent years, smart devices, such as smart phones, are increasingly being developed toward light weight, thinness, and high performance, and this development trend of smart devices puts more stringent requirements on the size and imaging capability of a camera module, which is one of standard configurations of smart devices.

In terms of hardware, the imaging capability of the camera module depends on the number and size of electronic components in the circuit and parameters of the photosensitive chip, such as the size of the photosensitive surface of the photosensitive chip. That is, the number and size of the electronic components and the parameters of the photosensitive chip are the basis for improving the imaging capability of the camera module. However, the existing technology for packaging the camera module greatly increases the size of the camera module having a larger number of electronic components with a higher size and a better parameter of the photosensitive chip, thereby leading to the development trend of the size of the high-performance camera module and the development trend of the smart device to run counter to each other.

Fig. 1 shows a typical camera module of the prior art, which includes a circuit board 1P, a series of electronic components 2P, a photo sensor chip 3P, a lens holder 4P, a filter 5P, a lens holder 6P and a lens 7P. Firstly, a series of electronic components 2P are mounted on the circuit board 1P at intervals; secondly, the photosensitive chip 3P is attached to the circuit board 1P, and the photosensitive chip 3P is conductively connected to the circuit board 1P by at least one group of gold wires 8P, wherein a series of electronic components 2P surround the photosensitive chip 3P; thirdly, the lens seat 4P is attached to the circuit board 1P in a manner of surrounding the periphery of the photosensitive chip 3P, and a filter carrying arm 41P of the lens seat 4P protrudes from the inner wall of the lens seat 4P to extend towards the photosensitive path direction of the photosensitive chip 3P; fourthly, the optical filter 5P is mounted on the optical filter carrying arm 41P of the lens base 4P to keep the optical filter 5P on the photosensitive path of the photosensitive chip 3P; fifthly, the lens 7P is disposed on the lens bearing portion 6P, and the lens bearing portion 6P is mounted on the lens holder 4P, so as to maintain the lens 7P in the photosensitive path of the photosensitive chip 3P. In the camera module of the prior art, the filter 5P needs to be supported by the filter supporting arm 41P of the lens holder 4P, and therefore, the lens holder 4P must be designed to have the structure of the filter supporting arm 41P, which results in that the lens holder 4P needs to occupy more height space, so that the height dimension of the camera module is difficult to be reduced. In order to avoid contact between the filter carrying arm 41P of the lens holder 4P and the electronic component 2P, a space needs to be provided between the filter carrying arm 41P and the electronic component 2P, which also makes it difficult to reduce the height of the image pickup module.

Disclosure of Invention

An object of the present invention is to provide a camera module and an electronic apparatus with the camera module, in which the height dimension of the camera module can be reduced, so that the camera module is particularly suitable for being applied to an electronic apparatus which pursues slimness.

An object of the present invention is to provide a camera module and an electronic device with the camera module, wherein the filter of the camera module does not need to be held in the photosensitive path of the photosensitive chip in a manner of being supported by a lens holder, thereby saving the height space occupied by the lens holder to reduce the height size of the camera module.

An object of the present invention is to provide a camera module and an electronic apparatus with the camera module, in which the back focus size of the camera module can be reduced to effectively reduce the height size of the camera module. Specifically, in a preferred example of the camera module of the present invention, the back focus size of the camera module can be reduced to within 0.6mm, so as to effectively reduce the height size of the camera module.

An object of the present invention is to provide a camera module and an electronic apparatus with the camera module, wherein a distance between a mounting surface of a lens bearing portion of the camera module and a lower surface of the filter can be reduced to effectively reduce a height dimension of the camera module. Specifically, in another preferred example of the camera module of the present invention, the distance between the mounting surface of the lens holder and the lower surface of the filter can be reduced to within 0.2mm, thereby effectively reducing the height dimension of the camera module.

An object of the present invention is to provide a camera module and an electronic device with the camera module, wherein the camera module provides a combination portion, wherein the combination portion is used for combining the optical filter and the circuit board assembly of the camera module, so as to hold the optical filter on the photosensitive path of the photosensitive chip by the combination portion, in such a way, the optical filter does not need to be supported by the lens holder.

The invention aims to provide a camera module and an electronic device with the camera module, wherein the plane of the top combining surface of the combining part is higher than the plane of the photosensitive area of the photosensitive chip, and the height difference of the top combining surface and the photosensitive area is controlled within a proper range.

An object of the present invention is to provide a camera module and an electronic apparatus with the camera module, in which the width dimension of the coupling portion is controlled within a suitable range, in such a way that the packaging tolerance can be compensated, thereby ensuring the reliability of the camera module.

An object of the present invention is to provide a camera module and an electronic device with the camera module, wherein the top bonding surface of the bonding portion corresponds to a non-photosensitive region of the photosensitive chip, in such a way that the flatness of the top bonding surface of the bonding portion can be ensured, thereby ensuring the flatness between the optical filter and the photosensitive region of the photosensitive chip.

An object of the present invention is to provide a camera module and an electronic device with the camera module, wherein the top bonding surface of the bonding portion corresponds to an electronic component that is disposed at the same height, and in this way, the flatness of the top bonding surface of the bonding portion can be ensured, and thus the flatness between the optical filter and the photosensitive area of the photosensitive chip can be ensured.

An object of the present invention is to provide a camera module and an electronic apparatus with a camera module, in which the lower surface of the lens holder is bonded to the wiring board, and the inner surface of the lens holder is bonded to the bonding portion, in such a manner that the reliability of the camera module can be improved.

An object of the present invention is to provide a camera module and an electronic device having the camera module, wherein the lens holder has at least one notch, so that the adhesive material forming the joint portion can be discharged from the notch of the lens holder in the process that the lens holder is attached to the circuit board assembly and heated, thereby preventing excessive adhesive overflow from the inside to pollute the photosensitive area of the photosensitive chip.

An object of the present invention is to provide a camera module and an electronic device with the camera module, wherein during the process that the lens base is attached to the circuit board and heated, air between the glue material and the inner surface of the lens base can be exhausted from the gap to guide the glue material to expand towards the inner surface of the lens base, so as to avoid excessive glue overflow inwards to pollute the photosensitive area of the photosensitive chip.

An object of the present invention is to provide a camera module and an electronic device with the camera module, wherein the camera module is applied to an electronic device and is beneficial to improving the screen occupation ratio of the electronic device.

An object of the present invention is to provide a camera module and an electronic device with the camera module, wherein at least one side of the camera module forms a recessed portion, in such a way, the camera module can be closer to the edge of an electronic device body, thereby being beneficial to improving the screen occupation ratio of the electronic device.

According to one aspect of the present invention, a camera module is provided, which includes:

an optical lens;

a light filter;

a circuit board assembly, wherein the circuit board assembly comprises a circuit board and a photosensitive chip conductively connected to the circuit board; and

a bonding portion, wherein the bonding portion has a lower bonding side, a top bonding side and a light path, wherein the lower bonding side of the bonding portion is bonded to the circuit board assembly, and the bonding portion surrounds a periphery of a light sensing area of the light sensing chip, so that the light sensing area of the light sensing chip is exposed to the light path of the bonding portion, wherein a periphery of the optical filter is bonded to the top bonding side of the bonding portion, so as to hold the optical filter on the light sensing path of the light sensing chip by the bonding portion, and wherein the optical lens is held on the light sensing path of the light sensing chip.

According to an embodiment of the present invention, the lower bonding side of the bonding part is bonded to a non-photosensitive region of the photosensitive chip, and the top bonding side of the bonding part corresponds to the non-photosensitive region of the photosensitive chip.

According to one embodiment of the present invention, the lower bonding side of the bonding part is bonded to the circuit board and the non-photosensitive region of the photosensitive chip, and the top bonding surface of the bonding part corresponds to the non-photosensitive region of the photosensitive chip.

According to an embodiment of the invention, the circuit board assembly further comprises a series of electronic components, wherein at least three of the electronic components are arranged at equal height and are conductively connected to the circuit board, wherein the combining parts embed the electronic components, and the top combining surfaces of the combining parts correspond to the electronic components.

According to one embodiment of the invention, the plane of the top bonding surface of the bonding portion is lower than the plane of the top surface of the tallest electronic component.

According to one embodiment of the invention, the distance between the plane of the top bonding surface of the bonding part and the plane of the photosensitive area of the photosensitive chip is greater than or equal to 0.15 mm.

According to one embodiment of the present invention, the bonding portion has four sides, adjacent sides are connected end to end and perpendicular to each other to form the light path between the four sides, wherein at least one of the sides of the bonding portion has a width dimension greater than or equal to 0.15 mm.

According to an embodiment of the present invention, the camera module further includes a lens holder, wherein the lens holder has a lower surface, and the lower surface of the lens holder is attached to the circuit board.

According to an embodiment of the present invention, the camera module further includes a lens holder, wherein the lens holder has a lower surface, an upper surface corresponding to the lower surface, and an inner surface extending from the upper surface to the lower surface, wherein the lower surface of the lens holder is attached to the circuit board, and the inner surface of the lens holder is bonded to the bonding portion.

According to an embodiment of the present invention, the camera module further includes a lens holder, wherein the lens holder has a lower surface, an upper surface corresponding to the lower surface, and an inner surface extending from the upper surface to the lower surface, wherein the lower surface of the lens holder is bonded to the circuit board, and the inner surface of the lens holder is bonded to the bonding portion.

According to an embodiment of the present invention, the camera module further includes a lens holder, wherein the lens holder has a lower surface, an upper surface corresponding to the lower surface, and an inner surface extending from the upper surface to the lower surface, wherein the lower surface of the lens holder is bonded to the non-photosensitive areas of the circuit board and the photosensitive chip, and the inner surface of the lens holder is bonded to the bonding portion.

According to an embodiment of the present invention, the camera module has four side portions, wherein at least one of the side portions has a side surface, a bottom surface and a connecting surface connected to the side surface and the bottom surface, wherein a distance between a connecting point of the connecting surface and the side surface and a central axis of the camera module is greater than a distance between a connecting point of the connecting surface and the bottom surface and the central axis of the camera module.

According to an embodiment of the invention, said connection surface is an inclined plane; or the connecting surface is a convex cambered surface; or the connecting surface is a step surface.

According to an embodiment of the present invention, the connection face is formed on the lens holder and the wiring board.

According to an embodiment of the invention, the mirror base has at least one indentation extending from the lower surface of the mirror base in the direction of the upper surface, wherein a portion of the coupling portion is accommodated in the indentation of the mirror base.

According to an embodiment of the present invention, the camera module further includes a lens bearing portion, the lens bearing portion has a mounting surface, wherein the lens bearing portion is mounted on the lens holder in a manner that the mounting surface of the lens bearing portion is mounted on the upper surface of the lens holder, and the optical lens is disposed on the lens bearing portion.

According to an embodiment of the present invention, a range of a distance parameter D between the attaching surface of the lens bearing portion and the lower surface of the optical filter is: d is more than or equal to 0.1mm and less than or equal to 0.2 mm.

According to an embodiment of the present invention, a range of the back focal distance parameter L of the camera module is: l is more than or equal to 0.4mm and less than or equal to 0.6mm, wherein the back focal distance of the camera module is the distance between the lower surface of one lens of the optical lens, which is close to the photosensitive chip, and the photosensitive area of the photosensitive chip.

According to another aspect of the present invention, the present invention further provides an electronic device, including an electronic device body and at least one camera module disposed on the electronic device body, wherein the camera module includes:

an optical lens;

a light filter;

According to another aspect of the present invention, the present invention further provides a photosensitive assembly, comprising:

a light filter;

a bonding portion, wherein the bonding portion has a lower bonding side, a top bonding side and a light path, wherein the lower bonding side of the bonding portion is bonded to the circuit board assembly, and the bonding portion surrounds a periphery of a light sensing area of the light sensing chip, so that the light sensing area of the light sensing chip is exposed to the light path of the bonding portion, and wherein a periphery of the optical filter is bonded to the top bonding side of the bonding portion, so as to maintain the optical filter in the light sensing path of the light sensing chip by the bonding portion.

Drawings

Fig. 1 is a schematic diagram of a camera module according to the prior art.

Fig. 2 is a schematic cross-sectional view of a process for manufacturing a camera module according to a first preferred embodiment of the invention.

Fig. 3 is a schematic cross-sectional view of a second process for manufacturing the camera module according to the above preferred embodiment of the invention.

Fig. 4 is a perspective view of a third process of manufacturing the camera module according to the above preferred embodiment of the invention.

Fig. 5 is a schematic cross-sectional view of a fourth process of manufacturing the camera module according to the above preferred embodiment of the invention.

Fig. 6 is a schematic cross-sectional view illustrating a fifth manufacturing process of the camera module according to the above preferred embodiment of the invention.

Fig. 7 is a schematic cross-sectional view of a sixth manufacturing process of the camera module according to the above preferred embodiment of the invention, which shows a cross-sectional state of the camera module after being cut along an intermediate position.

Fig. 8 is a perspective view of the camera module according to the above preferred embodiment of the invention.

Fig. 9 is a perspective view illustrating an application state of the camera module according to the above preferred embodiment of the present invention.

Fig. 10 is a schematic cross-sectional view of a modified embodiment of the camera module according to the above preferred embodiment of the invention.

Fig. 11A is a schematic cross-sectional view of an application state of the camera module according to the above preferred embodiment of the invention.

Fig. 11B is a sectional view showing an applied state of a camera module according to the related art.

Fig. 12A to 12C are schematic diagrams illustrating different states of a relationship between the camera module and a housing of an electronic device body according to the above preferred embodiment of the invention.

Fig. 13 is a schematic cross-sectional view of another variant of the camera module according to the above preferred embodiment of the invention.

Fig. 14 is a schematic cross-sectional view of a process for manufacturing a camera module according to a second preferred embodiment of the invention.

Fig. 15 is a schematic cross-sectional view of a second process for manufacturing the camera module according to the above preferred embodiment of the invention.

Fig. 16 is a schematic cross-sectional view of a third process of manufacturing the camera module according to the above preferred embodiment of the invention.

Fig. 17 is a schematic cross-sectional view of a fourth process of manufacturing the camera module according to the above preferred embodiment of the invention.

Fig. 18 is a schematic cross-sectional view of a fifth manufacturing process of the camera module according to the above preferred embodiment of the invention.

Fig. 19 is a schematic cross-sectional view of a sixth manufacturing process of the camera module according to the above preferred embodiment of the invention, which shows a cross-sectional state of the camera module after being cut along an intermediate position.

Fig. 20 is a perspective view of the camera module according to the above preferred embodiment of the present invention.

Fig. 21 is a schematic cross-sectional view of a first variant of the camera module according to the above preferred embodiment of the invention.

Fig. 22 is a schematic cross-sectional view of a second variant of the camera module according to the above preferred embodiment of the invention.

Fig. 23 is a schematic cross-sectional view of a third variant of the camera module according to the above preferred embodiment of the invention.

Fig. 24 is a schematic cross-sectional view of a fourth variant of the camera module according to the above preferred embodiment of the invention.

Fig. 25 is a schematic cross-sectional view of a fourth variant of the camera module according to the above preferred embodiment of the invention.

Fig. 26 is a schematic cross-sectional view of a third variant of the camera module according to the above preferred embodiment of the invention.

Fig. 27 is a schematic cross-sectional view of a fourth variant of the camera module according to the above preferred embodiment of the invention.

Fig. 28 is a schematic cross-sectional view of a fourth variant of the camera module according to the above preferred embodiment of the invention.

Detailed Description

The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.

It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be constructed and operated in a particular orientation and thus are not to be considered limiting.

It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number.

Referring to fig. 2 to 8 of the drawings of the present specification, a camera module 1000 according to a first preferred embodiment of the present invention is disclosed and described in the following description, wherein the camera module 1000 includes a circuit board assembly 10, a combining portion 20, a filter 30 and an optical lens 40.

Referring to fig. 7 and 8, the circuit board assembly 10 includes a circuit board 11 and a series of electronic components 12 conductively connected to the circuit board 11, and a gap is formed between adjacent electronic components 12. The way in which the electronic component 12 is conductively connected to the circuit board 11 is not limited, and for example, in the specific example of the camera module 1000 shown in fig. 7 and 8, the electronic component 12 is conductively connected to the circuit board 11 in such a way as to be attached to the surface of the circuit board 11. Alternatively, the electronic component 12 is conductively connected to the wiring board 11 so that at least a part thereof is embedded in the wiring board 11.

With continued reference to fig. 7 and 8, the circuit board assembly 10 further includes a photosensitive chip 13 having a photosensitive area 131 and a non-photosensitive area 132 surrounding the photosensitive area 131, wherein the photosensitive chip 13 is conductively connected to the circuit board 11. The way in which the photosensitive chip 13 is conductively connected to the circuit board 11 is not limited, for example, in the specific example of the camera module 1000 shown in fig. 7 and 8, the photosensitive chip 13 is attached to the surface of the circuit board 11, and two ends of at least one set of lead wires 14 formed by a wire bonding process are electrically connected to the photosensitive chip 13 and the circuit board 11, respectively, so that the photosensitive chip 13 is conductively connected to the circuit board 11. Alternatively, the photo sensor Chip 13 is mounted on the circuit board 11 and conductively connected to the circuit board 11 by a Flip-Chip (Flip-Chip) process.

Specifically, in the camera module 1000 shown in fig. 7 and 8, a series of the electronic components 12 form two columns of the electronic components 12, where one column of the electronic components 12 is located on the left side of the photosensitive chip 13, and the other column of the electronic components 12 is located on the right side of the photosensitive chip 13. Optionally, a series of the electronic components 12 forms three columns of the electronic components 12, wherein the three columns of the electronic components 12 are respectively located on three sides of the light-sensing chip 13. Optionally, a series of the electronic components 12 form four columns of the electronic components 12, where four columns of the electronic components 12 are located on four sides of the light sensing chip 13. Alternatively, more than two rows of the electronic components 12 may be disposed on the same side of the photosensitive chip 13. Therefore, the relative arrangement of the electronic component 12 and the photosensitive chip 13 shown in fig. 2 to 7 is only used as a reference and should not be considered as limiting the content and scope of the image capturing module 1000 of the present invention.

The joining portion 20 is annular and has a lower joining side 21, a top joining surface 22 corresponding to the lower joining side 21, and a light path 23 extending from the top joining surface 22 to the lower joining side 21. The lower bonding side 21 of the bonding portion 20 is bonded to the circuit board assembly 10, the bonding portion 20 surrounds the periphery of the light sensing region 131 of the light sensing chip 13, the top bonding surface 22 of the bonding portion 20 is located on a plane higher than the plane of the light sensing region 131 of the light sensing chip 13, and the light sensing region 131 of the light sensing chip 13 corresponds to the light path 23 of the bonding portion 20. The periphery of the optical filter 30 is bonded to the top bonding surface 22 of the bonding part 20 to allow the optical filter 30 to be held in a photosensitive path of the photosensitive chip 13. The optical lens 40 is held in a light sensing path of the light sensing chip 13. In the preferred example of the camera module 1000 according to the present invention shown in fig. 7 and 8, the combining portion 20 has a square ring shape, that is, the combining portion 20 has four side edges 24, wherein two adjacent side edges 24 are connected end to end and perpendicular to each other, so that the light path 23 is formed between the combining portions 20 formed by the four side edges 24. Each of the side edges 24 of the bonding portion 20 is located outside the photosensitive region 131 of the photosensitive chip 13.

Preferably, the lower bonding side 21 of the bonding portion 20 is bonded to the non-photosensitive region 132 of the photosensitive chip 13, the bonding portion 20 extends upward from the non-photosensitive region 132 of the photosensitive chip 13 to a suitable height and forms the top bonding surface 22 of the bonding portion 20, and the top bonding surface 22 of the bonding portion 20 corresponds to the non-photosensitive region 132 of the photosensitive chip 13, in such a way, the flatness of the top bonding surface 22 of the bonding portion 20 can be ensured by the non-photosensitive region 132 of the photosensitive chip 13, thereby ensuring the flatness between the optical filter 30 and the photosensitive region 131 of the photosensitive chip 13.

The distance dimension (parameter H) between the plane of the top bonding surface 22 of the bonding portion 20 and the plane of the photosensitive region 131 of the photosensitive chip 13 is greater than or equal to 0.15mm, which is beneficial to reducing stray light generation and reducing dirty point imaging, thereby improving the imaging quality of the camera module 1000.

The width dimension (parameter W) of the side 24 of the bonding portion 20 is greater than or equal to 0.15mm, so that a packaging error can be compensated, and the bonding portion 20 can reliably support the optical filter 30 on the photosensitive path of the photosensitive chip 13.

In the present invention, the circuit board assembly 10, the combining portion 20 and the optical filter 30 form a photosensitive assembly, that is, the camera module 1000 includes the photosensitive assembly and the optical lens 40 held in a photosensitive path of the photosensitive chip 13 of the photosensitive assembly, wherein light entering the camera module 1000 from the optical lens 40 can be received by the photosensitive chip 13 and photoelectrically converted.

With continued reference to fig. 7 and 8, the camera module 1000 further includes a lens holder 50 and a lens holder 60 attached to the lens holder 50. The lens holder 50 has a lower surface 51, an upper surface 52 corresponding to the lower surface 51, and an inner surface 53 extending from the upper surface 52 to the lower surface 51. The lower surface 51 of the lens holder 50 is integrally bonded to the circuit board 11 and the non-photosensitive region 132 of the photosensitive chip 13, and the inner surface 53 of the lens holder 50 is integrally bonded to the bonding portion 20. The optical lens 40 is disposed on the lens bearing portion 60, the lens bearing portion 60 has a mounting surface 61, wherein the lens bearing portion 60 is mounted on the lens holder 50 in a manner that the mounting surface 61 of the lens bearing portion 60 is mounted on the upper surface 52 of the lens holder 50, so as to hold the optical lens 40 on the photosensitive path of the photosensitive chip 13 by the lens holder 50 and the lens bearing portion 60.

The type of the lens bearing portion 60 is selected according to the type of the camera module 1000. For example, when the camera module 1000 is a fixed focus camera module, the lens carrying part 60 is selected as a lens barrel, and accordingly, when the camera module 1000 is a zoom camera module, the lens carrying part 60 is selected as a motor, such as but not limited to a voice coil motor.

Referring to fig. 7, preferably, a distance parameter between the attaching surface 61 of the lens bearing part 60 and the lower surface of the optical filter 30 is D, where a value range of the parameter D is 0.1mm to 0.2mm (including 0.1mm and 0.2mm), so as to facilitate reducing a height dimension of the camera module 1000. It should be noted that in the camera module 1000 of the present invention, the optical filter 30 is held in the photosensitive path of the photosensitive chip 13 by the combining portion 20, and the lens bearing portion 60 is attached to the lens holder 50, so that compared with the camera module of the prior art, in this preferred example of the camera module 1000 of the present invention, the distance between the attaching surface 61 of the lens bearing portion 60 and the lower surface of the optical filter 30 can be closer, which is particularly important for reducing the height dimension of the camera module 1000.

With reference to fig. 7, in the preferred example of the camera module 1000 according to the present invention, the optical filter 30 is held in the photosensitive path of the photosensitive chip 13 by the joint portion 20, and the lens holder 60 is attached to the lens holder 50, so as to hold the optical lens 40 in the photosensitive path of the photosensitive chip 13 by the lens holder 60 and the lens holder 50. Since the lens holder 50 does not need to hold the optical filter 30 in the photosensitive path of the photosensitive chip 13, the height of the upper surface 52 of the lens holder 50 (the distance from the upper surface 52 to the photosensitive chip 13) can be reduced, and thus the distance between the optical lens 40 and the photosensitive area 131 of the photosensitive chip 13 can be reduced, in this way, the back focus size of the camera module 1000 can be reduced, which is beneficial to reducing the height size of the camera module 1000. The back focal length of the camera module 1000 is a distance between a surface of the optical lens 40 closest to the lens of the photosensitive chip 13 and the photosensitive area 131 of the photosensitive chip 13. If the back focal length parameter of the camera module 1000 is L, wherein the range of the parameter L is 0.4mm to 0.6mm (including 0.4mm and 0.6mm), compared with the back focal length of the camera module of 0.8mm in the prior art, the back focal length of the camera module 1000 of the present invention can be reduced in a large range, which is particularly beneficial to reducing the height dimension of the camera module 1000.

Alternatively, in an example of the camera module 1000, the lens bearing part 60 and the lens holder 50 may be an integral structure. In another example of the camera module 1000, the camera module 1000 may not be provided with the lens holder 60, and in this case, the camera module 1000 holds the optical lens 40 in the photosensitive path of the photosensitive chip 13 by directly mounting the optical lens 40 on the lens holder 50.

In the camera module 1000 shown in fig. 7 and 8, the lens holder 50 is not prefabricated, wherein the lens holder 50 can be integrally molded and combined with the circuit board assembly 10 and the combining portion 20 through a molding process, so as to allow the lower surface 51 of the lens holder 50 to be integrally combined with the circuit board 11 and the non-photosensitive area 132 of the photosensitive chip 13 and allow the inner surface 53 of the lens holder 50 to be integrally combined with the combining portion 20, in such a way, the combining reliability of the lens holder 50 with the circuit board 11, the photosensitive chip 13 and the combining portion 20 is higher, thereby being beneficial to ensuring the stability and reliability of the camera module 1000. Optionally, the lens holder 50 may be further integrally bonded to the peripheral edge of the optical filter 30.

The camera module 1000 adopts the microscope base 50 is integrally combined with the circuit board 11 and the photosensitive chip 13 in the non-photosensitive area 132, so that the packaging process of the camera module 1000 does not need to be prefabricated the microscope base 50, thereby being beneficial to reducing the management and control cost and the management and control risk of the parts of the camera module 1000.

The camera module 1000 adopts the microscope base 50 is combined in an organic whole the circuit board 11 with sensitization chip 13 the mode of non-sensitization region 132 is not only favorable to guaranteeing the circuit board 11 with the reliability of the laminating relation of sensitization chip 13, moreover the roughness of sensitization chip 13 no longer is restricted by the roughness of circuit board 11, wherein the roughness of sensitization chip 13 by microscope base 50 guarantees, thereby is favorable to guaranteeing the roughness of sensitization chip 13. Specifically, the way in which the lens holder 50 is integrally bonded to the circuit board 11 and the non-photosensitive area 132 of the photosensitive chip 13 by means of a molding die enables the top surface of the lens holder 50 to be more flat and free from the influence of the inclination or deformation of the circuit board 11, thereby reducing the accumulated tolerance in the subsequent assembly, which is advantageous for ensuring the coaxiality of the optical lens 40 and the photosensitive chip 13.

The camera module 1000 adopts the microscope base 50 is combined in an integrated manner with the circuit board 11 and the photosensitive chip 13 in the non-photosensitive area 132 mode, allowing the microscope base 50 to ensure the flatness of the photosensitive chip 13, and in such a manner, the circuit board 11 can be selected for use in a thinner size, thereby being beneficial to reducing the height size of the camera module 1000. Specifically, the lens holder 50 is integrally combined with the circuit board 11 through a molding process, so that the lens holder 50 can reinforce the circuit board 11, and thus the circuit board 11 can be thinner on the premise of ensuring the flatness of the circuit board 11, which is beneficial to reducing the overall height dimension of the camera module 1000.

The camera module 1000 adopts the microscope base 50 is integrally combined with the circuit board 11 and the photosensitive chip 13 in the non-photosensitive area 132, so that the adoption of glue for mounting the microscope base 50 on the circuit board 11 can be avoided, and the reduction of the height size of the camera module 1000 is facilitated.

Referring to fig. 7, in the image capturing module 1000, by using the manner that the combining portion 20 holds the optical filter 30 in the photosensitive path of the photosensitive chip 13, on one hand, the size of the optical filter 30 can be reduced to reduce the cost of the image capturing module 1000, and on the other hand, the lower surface of the optical filter 30 (the surface of the optical filter 30 facing the photosensitive chip 13) can be lower than the highest height of the top surface of the electronic component 12, so that, in cooperation with the improvement in the optical design of the image capturing module 1000, after the back focus of the image capturing module 1000 is reduced, the optical filter 30 of the image capturing module 1000 can be further close to the photosensitive chip 13, allowing the optical lens 40 to have the possibility of adjustment in the direction of the photosensitive chip 13, thereby being beneficial to reducing the height size of the image capturing module 1000.

Fig. 2 to 7 show a packaging process of the camera module 1000.

Referring to fig. 2, a series of electronic components 12 are mounted on the circuit board 11. The type of the electronic component 12 is not limited in the camera module 1000 of the present invention, for example, the electronic component 12 may be, but is not limited to, a resistor, a capacitor, a controller, and the like.

Referring to fig. 3, the photosensitive chip 13 is mounted on the circuit board 11, and at least one set of the lead wires 14, both ends of which are electrically connected to the photosensitive chip 13 and the circuit board 11, is formed through a wire bonding process, so as to form the circuit board assembly 10.

It should be noted that the stage shown in fig. 3 may precede the stage shown in fig. 2, that is, the photosensitive chip 13 is firstly mounted on the circuit board 11, and then a series of electronic components 12 are mounted on the circuit board 11, so as to form the circuit board assembly 10.

Referring to fig. 4, an annular projection 200 is formed around one side portion of the filter 30 to form a filter 300 with an annular projection. For example, in the preferred example of the camera module 1000 shown in fig. 7 and 8, the annular projection 200 can be formed around one side portion of the filter 30 by a screen printing process to form the filter 300 with the annular projection. Alternatively, an annular projection 200 may be formed around one side portion of the optical filter 30 by a photolithography process to form the optical filter 300 having the annular projection. The material forming the annular boss 200 may be, but is not limited to, glue.

It is worth mentioning that the order of forming the circuit board assembly 10 and forming the filter 300 with the annular boss is not limited.

Referring to fig. 5, first, the optical filter 300 with an annular projection is attached to the circuit board assembly 10, wherein the annular projection 200 is attached to the non-photosensitive region 132 of the photosensitive chip 13, for example, in one example, if the material of the annular projection 200 is a colloid material, the annular projection 200 may be directly attached to the non-photosensitive region 132 of the photosensitive chip 13, and in another example, if the material of the annular projection 200 is a non-colloid, the annular projection 200 needs to be attached to the non-photosensitive region 132 of the photosensitive chip 13 by glue or the like; next, the annular boss 200 is cured, so that the annular boss 200 forms the bonding portion 20 and the optical filter 30 is held in the photosensitive path of the photosensitive chip 13 by the bonding portion 20, wherein the surface of the annular boss 200 bonded to the photosensitive chip 13 forms the lower bonding side 21 of the bonding portion 20, the surface of the annular boss 200 bonded to the optical filter 30 forms the upper bonding surface 22 of the bonding portion 20, and the hollow portion in the middle of the annular boss 200 forms the light path 23 of the bonding portion 20.

It is worth mentioning that the manner of curing the annular boss 200 is not limited, and is selected according to the material forming the annular boss 200, and the bonding portion 20 may be formed by curing the annular boss 200 by means of heating or ultraviolet light irradiation, for example.

Referring to fig. 6, the mirror base 50 is formed on the circuit board assembly 10 and the bonding portion 20 by a molding process such that the lower surface 51 of the mirror base 50 is integrally bonded to the circuit board 11 and the photosensitive chip 13 of the circuit board assembly 10, and the inner surface 53 of the mirror base 50 is integrally bonded to the bonding portion 20. Preferably, the lens holder 50 embeds the electronic component 12 and the guide wire 14 protruding from the circuit board 11, in such a way that, firstly, no safety space needs to be reserved between the lens holder 50 and the electronic component 12, so as to facilitate reducing the height dimension of the camera module 1000; secondly, the lens seat 50 prevents the electronic component 12 from being exposed, so that the pollutants such as chips falling off from the surface of the electronic component 12 are prevented from polluting other electronic components 12 or polluting the photosensitive chip 13; thirdly, the upper surface 52 of the lens holder 50 has a higher flatness, so that after the optical lens 40 is held in the photosensitive path of the photosensitive chip 13 by the lens bearing part 60 in a manner of being attached to the upper surface 52 of the lens holder 50, the central axis of the optical lens 40 and the central axis of the photosensitive area 13 of the photosensitive chip 13 can be overlapped, so as to ensure the imaging quality of the camera module 1000; fourthly, the lens mount 50 can be filled between the adjacent electronic components 12 to isolate the adjacent electronic components 12 and avoid the undesirable phenomenon that the adjacent electronic components 12 interfere with each other, and in this way, the distance between the adjacent electronic components 12 can be smaller, so as to allow the camera module 1000 to be configured with a larger number of electronic components 12 having a larger size.

Referring to fig. 7 and 8, the optical lens 40 is mounted on the lens bearing portion 60 and the lens bearing portion 60 is mounted on the upper surface 52 of the lens holder 50 to maintain the optical lens 40 in the photosensitive path of the photosensitive chip 13, so as to obtain the image pickup module 1000.

Optionally, in another manufacturing process of the camera module 1000, first, the annular boss 200 is formed in the non-photosensitive region 132 of the photosensitive chip 13 through a screen printing process or a photolithography process; next, the optical filter 30 is attached to the annular boss 200, for example, the optical filter 30 may be attached to the annular boss 200 by glue or the like; then, the annular boss 200 is cured, so that the annular boss 200 forms the bonding portion 20 and the optical filter 30 is held on the photosensitive path of the photosensitive chip 13 by the bonding portion 20, wherein the surface of the annular boss 200 bonded to the photosensitive chip 13 forms the lower bonding side 21 of the bonding portion 20, the surface of the annular boss 200 bonded to the optical filter 30 forms the upper bonding surface 22 of the bonding portion 20, and the hollow portion in the middle of the annular boss 200 forms the light path 23 of the bonding portion 20.

Fig. 9 shows an application state of the camera module 1000, in which the camera module 1000 is disposed on an electronic device body 2000, so that the electronic device body 2000 and the camera module 1000 form an electronic device. It should be noted that the example of the electronic device shown in fig. 9 being a smart phone is merely an example, and does not limit the application range of the camera module 1000 of the present invention, for example, the type of the electronic device may be, but is not limited to, a tablet computer, a notebook computer, a personal digital assistant, and MP 3/4/5.

Fig. 10 shows a modified embodiment of the camera module 1000, and fig. 11A shows an application state of the camera module 1000. Unlike the camera module 1000 shown in fig. 7 and 8, in the specific example of the camera module 1000 shown in fig. 10, the camera module 1000 has four side portions 101, wherein at least one side portion 101 of the camera module 1000 further has a side surface 1011, a bottom surface 1012 and a connecting surface 1013 communicating with the side surface 1011 and the bottom surface 1012, wherein a distance L1 between a connecting point of the side surface 1011 and the connecting surface 1013 and a central axis of the camera module 1000 is greater than a distance L2 between a connecting point of the bottom surface 1012 and the connecting surface 1013 and a central axis of the camera module 1000, so that at least one side portion 101 of the camera module 1000 has a recessed portion to match a housing hinge of the electronic device body, in such a way that the optical lens 40 of the camera module 1000 can be closer to an edge of the housing 2001 of the electronic device body 2000, in order to facilitate an increase in the screen occupation ratio of the electronic device. Specifically, as can be seen from a comparison between the camera module of the prior art and the housing of the electronic device shown in fig. 11B, the distance between the camera module 1000 and the edge of the housing 2001 of the electronic device body 2000 is smaller, which is beneficial to improving the screen occupation ratio of the electronic device.

Fig. 12A shows a relationship between the camera module 1000 and the housing 2001 of the electronic apparatus body 2000 after the camera module 1000 is disposed on the electronic apparatus body to form the electronic apparatus, wherein the side portion 101 of the camera module 1000 having the locking portion corresponds to a turning point of the housing 2001 of the electronic apparatus body 2000, so that the optical lens 40 of the camera module 1000 can be closer to an edge of the housing 2001 of the electronic apparatus body 2000 to improve a screen occupation ratio of the electronic apparatus. The attachment surface 1013 of the camera module 1000 is an inclined plane, as shown in fig. 12A, or the attachment surface 1013 of the camera module 1000 is a convex arc surface, as shown in fig. 12B, wherein the attachment surface 1013 of the camera module 1000 can be formed by removing a portion of the circuit board 11 and/or a portion of the lens holder 50. For example, a portion of the wiring board 11 and a portion of the mirror mount 50 can be removed by cutting or grinding the wiring board 11 and/or the mirror mount 50. Alternatively, the connecting surface 1013 of the camera module 1000 is a step surface, and referring to fig. 12C, the connecting surface 1013 of the camera module 1000 may be formed by retracting the circuit board 11 during the process of packaging the camera module 1000. Alternatively, the connection surface 1013 of the camera module 1000 may be formed by removing a part of the circuit board 11 or removing a part of the circuit board 11 and the lens holder 50 after the camera module 1000 is packaged.

Fig. 13 shows another modified embodiment of the camera module 1000, which is different from the camera module 1000 shown in fig. 2 to 8, in the preferred example of the camera module shown in fig. 13, the camera module 1000 does not have the lens bearing part 60, wherein the lens holder 50 is attached to the circuit board 11 of the circuit board assembly 10, and the optical lens 40 is mounted on the lens holder 50, so as to hold the optical lens 40 in the photosensitive path of the photosensitive chip 13 through the lens holder 50.

Referring to fig. 14 to 20 of the drawings of the specification, a camera module 1000 according to a second preferred embodiment of the present invention is disclosed and described in the following description, wherein the camera module 1000 includes a circuit board assembly 10, a combining portion 20, a filter 30 and an optical lens 40.

Referring to fig. 19 and 20, the circuit board assembly 10 includes a circuit board 11 and a series of electronic components 12 conductively connected to the circuit board 11 with a gap between adjacent electronic components 12. The way in which the electronic component 12 is conductively connected to the circuit board 11 is not limited, and for example, in the specific example of the camera module 1000 shown in fig. 19 and 20, the electronic component 12 is conductively connected to the circuit board 11 so as to be attached to the surface of the circuit board 11. Alternatively, the electronic component 12 is conductively connected to the wiring board 11 so that at least a part thereof is embedded in the wiring board 11.

With continued reference to fig. 19 and 20, the circuit board assembly 10 further includes a photosensitive chip 13 having a photosensitive area 131 and a non-photosensitive area 132 surrounding the photosensitive area 131, wherein the photosensitive chip 13 is conductively connected to the circuit board 11. In addition, the height difference between the photosensitive region 131 and the non-photosensitive region 132 of the photosensitive chip 13 is not limited to the height difference shown in fig. 15 to 19. The way in which the photosensitive chip 13 is conductively connected to the circuit board 11 is not limited, for example, in the specific example of the camera module 1000 shown in fig. 19 and 20, the photosensitive chip 13 is attached to the surface of the circuit board 11, and two ends of at least one set of lead wires 14 formed by a wire bonding process are electrically connected to the photosensitive chip 13 and the circuit board 11, respectively, so that the photosensitive chip 13 is conductively connected to the circuit board 11. Alternatively, the photo sensor Chip 13 is mounted on the circuit board 11 and conductively connected to the circuit board 11 by a Flip-Chip (Flip-Chip) process.

Specifically, in the camera module 1000 shown in fig. 19 and 20, a series of the electronic components 12 form two columns of the electronic components 12, where one column of the electronic components 12 is located on the left side of the photosensitive chip 13, and the other side of the electronic components 12 is located on the right side of the photosensitive chip 13. Optionally, a series of the electronic components 12 forms three columns of the electronic components 12, wherein the three columns of the electronic components 12 are respectively located on three sides of the light-sensing chip 13. Optionally, a series of the electronic components 12 form four columns of the electronic components 12, where four columns of the electronic components 12 are located on four sides of the light sensing chip 13. Alternatively, more than two rows of the electronic components 12 may be disposed on the same side of the photosensitive chip 13. Therefore, the relative arrangement of the electronic component 12 and the photosensitive chip 13 shown in fig. 2 to 7 is only used as a reference and should not be considered as limiting the content and scope of the image capturing module 1000 of the present invention.

The combining portion 20 is annular and has a lower combining side 21, a top combining surface 22 corresponding to the lower combining side 21, and a light passage 23. The lower bonding side 21 of the bonding portion 20 is bonded to the circuit board assembly 10, and the bonding portion 20 surrounds the periphery of the light sensing region 131 of the light sensing chip 13, so that the light sensing region 131 of the light sensing chip 13 is exposed to the light beam passage 23 of the bonding portion 20, and the plane of the top bonding surface 22 of the bonding portion 20 is higher than the plane of the light sensing region 131 of the light sensing chip 13. The periphery of the optical filter 30 is bonded to the top bonding surface 22 of the bonding part 20 to allow the optical filter 30 to be held in a photosensitive path of the photosensitive chip 13. The optical lens 40 is held in a light sensing path of the light sensing chip 13. In the camera module 1000 of the present invention, the combining portion 20 is shaped like a square ring, that is, the combining portion 20 has four side edges 24, wherein two adjacent side edges 24 are connected end to end and perpendicular to each other, so that the light path 24 is formed between the combining portions 20 formed by the four side edges 24. Each of the side edges 24 of the bonding portion 20 is located outside the photosensitive region 131 of the photosensitive chip 13.

Preferably, referring to fig. 19, the lower bonding side 21 of the bonding portion 20 is bonded to the circuit board 11 of the circuit board assembly 10, the electronic component 12, the guide wire 14 and the non-photosensitive region 132 of the photosensitive chip 13, the bonding portion 20 extends upward from the circuit board assembly 10 to a suitable height and forms the top bonding surface 22 of the bonding portion 20, and the top bonding surface 22 of the bonding portion 20 corresponds to the electronic component 12 disposed at the same height, in such a way that the flatness of the top bonding surface 22 of the bonding portion 20 can be ensured by the electronic component 12 disposed at the same height, thereby ensuring the flatness between the optical filter 30 and the photosensitive region 131 of the photosensitive chip 13.

Alternatively, referring to fig. 21, the top bonding surface 22 of the bonding portion 20 may also correspond to the non-photosensitive region 132 of the photosensitive chip 13, in such a way that the flatness of the top bonding surface 22 of the bonding portion 20 can be ensured by the non-photosensitive region 132 of the photosensitive chip 13, so as to ensure the flatness between the optical filter 30 and the photosensitive region 131 of the photosensitive chip 13. With continued reference to fig. 21, the height of the top bonding surface 22 of the bonding portion 20 may be lower than the highest position of the bonding portion 20, for example, the height of the top bonding surface 22 of the bonding portion 20 may be lower than the height of the electronic component 12, so that the back focus of the camera module 1000 can be reduced in accordance with the improvement in the optical design of the camera module 1000, thereby further reducing the height dimension of the camera module 1000. In addition, the way that the optical filter 30 of the camera module 1000 of the present invention is further close to the photosensitive chip 13 allows the possibility of adjusting the optical lens 40 toward the photosensitive chip 13, which is beneficial to reducing the height dimension of the camera module 1000.

With continued reference to fig. 19, in the camera module 1000 according to the present invention, the types of the electronic components 12 may be, but are not limited to, resistors, capacitors, controllers, etc., and in general, the electronic components 12 of different types have different height dimensions, so that, in order to ensure that at least three electronic components 12 can be arranged at the same height, when the electronic components 12 are conducted to the circuit board 11, the electronic component 12 with a larger height dimension may be half-buried in the circuit board 11 and the electronic component 12 with a smaller height dimension may be attached to the surface of the circuit board 11, so that the electronic components 12 are arranged at the same height; alternatively, when the electronic components 12 are electrically connected to the circuit board 11, the electronic components 12 having a large height may be mounted on the surface of the circuit board 11, and the electronic components 12 having a small height may be arranged at the same height by adjusting the height of the electronic components 12 having a small height by an additional structure.

It is to be noted that, when the height of the electronic component 12 having a smaller height dimension is adjusted by the additional structure, the additional structure may be provided between the electronic component 12 and the circuit board 11, or may be provided above the electronic component 12.

The distance (parameter is H) between the plane of the top bonding surface 22 of the bonding portion 20 and the plane of the photosensitive region 131 of the photosensitive chip 13 is greater than or equal to 0.15mm, which is beneficial to reducing stray light and reducing dirty point imaging, thereby improving the imaging quality of the camera module 1000.

With continued reference to fig. 19 and 20, the camera module 1000 further includes a lens holder 50 and a lens carrying portion 60 attached to the lens holder 50. The lens holder 50 has a lower surface 51, an upper surface 52 corresponding to the lower surface 51, and an inner surface 53 extending from the upper surface 52 to the lower surface 51. The lower surface 51 of the lens holder 50 is attached to the circuit board 11, and the inner surface 53 of the lens holder 50 is bonded to the bonding portion 20. The optical lens 40 is disposed on the lens bearing portion 60, and the lens bearing portion 60 is attached to the upper surface 52 of the lens holder 50, so as to maintain the optical lens 40 in the photosensitive path of the photosensitive chip 13 through the lens holder 50 and the lens bearing portion 60.

Alternatively, in an example of the camera module 1000, the lens barrel bearing part 60 and the lens holder 50 may be an integral structure. In another example of the camera module 1000, the camera module 1000 may not be configured with the lens barrel carrier 60, and in this case, the camera module 1000 holds the optical lens 40 in the photosensitive path of the photosensitive chip 13 by directly mounting the optical lens 40 on the lens holder 50.

Fig. 14 to 19 show a packaging process of the camera module 1000.

Referring to fig. 14, a series of electronic components 12 are mounted on the circuit board 11. The type of the electronic component 12 is not limited in the camera module 1000 of the present invention, for example, the electronic component 12 may be, but is not limited to, a resistor, a capacitor, a controller, and the like.

Referring to fig. 15, the photosensitive chip 13 is mounted on the circuit board 11, and at least one set of the lead wires 14 with two ends electrically connected to the photosensitive chip 13 and the circuit board 11 are formed through a wire bonding process, so as to form the circuit board assembly 10.

It should be noted that the stage shown in fig. 15 may precede the stage shown in fig. 14, that is, the photosensitive chip 13 is firstly mounted on the circuit board 11, and then a series of electronic components 12 are mounted on the circuit board 11, so as to form the circuit board assembly 10.

Referring to fig. 16, a glue 400 is applied to the circuit board assembly 10, and the electronic component 12 is covered by the glue 400. Preferably, the adhesive material 400 applied to the circuit board assembly 10 further extends inward to cover the non-photosensitive region 132 of the photosensitive chip 13 and extends outward to cover the circuit board 11, and the adhesive material 400 covers the guide wire 14. More preferably, the adhesive material 400 applied to the circuit board assembly 10 is in a ring shape, such as a square ring shape, surrounding the periphery of the photosensitive region 131 of the photosensitive chip 13. In the preferred example of the camera module 1000 shown in fig. 19 and 20, the electronic component 12 coated with the glue 400 applied to the circuit board assembly 10 is the highest.

It should be noted that the glue 400 applied to the circuit board assembly 10 is the glue 400 with a relatively high viscosity, so as to avoid a bad phenomenon that the glue 400 flows after being applied to the circuit board assembly 10, and thus avoid contaminating the photosensitive region 131 of the photosensitive chip 13 during the process of packaging the camera module 1000.

Referring to fig. 17, the optical filter 30 is mounted on the top of the glue 400 applied to the circuit board assembly 10, so that the optical filter 30 is maintained in the photosensitive path of the photosensitive chip 13 by the glue 400. When the optical filter 30 is mounted on the top of the adhesive material 400 applied to the circuit board assembly 10, a force is applied to the optical filter 30 in a direction toward the photosensitive chip 13, so that a flat surface is formed on the top of the adhesive material 400 applied to the circuit board assembly 10, and the optical filter 30 and the photosensitive region 131 of the photosensitive chip 13 are kept flat. Because the adhesive 400 applied to the circuit board assembly 10 is the adhesive 400 with a relatively high viscosity, the relative positions of the optical filter 30 and the light sensing chip 13 are not changed after the optical filter 30 is applied to the top of the adhesive 400 of the circuit board assembly 10 and the external force applied to the optical filter 30 is removed.

Alternatively, in some other examples of the camera module 1000 according to the present invention, the glue material 400 may be applied along the extending direction of the electronic components 12, for example, if the electronic components 12 of the camera module 1000 are three rows, at this time, the glue material 400 is not applied in a state of surrounding the non-photosensitive area 131 of the photosensitive chip 13, that is, on the side of the photosensitive chip 13 where the electronic components 12 are not arranged, the glue material 400 is also not applied. After the photosensitive chip 30 is attached to the top of the adhesive material 400, a gap is formed between the optical filter 30 and the circuit board assembly 10, and then the gap formed between the optical filter 30 and the circuit board assembly 10 may be sealed by means of adhesive filling or the like.

Referring to fig. 18, the lens holder 50 is mounted on the circuit board 11 of the circuit board assembly 10. In the preferred example of the camera module 1000 of the present invention, the lower surface 51 of the lens holder 50 is attached to the circuit board 11 by the adhesive material 400, and the inner surface 53 of the lens holder 50 is attached to the adhesive material 400.

After the lens mount 50 is mounted on the circuit board 11, the glue 400 applied to the circuit board assembly 10 is cured to form the bonding portion 20 by the glue 400 applied to the circuit board assembly 10, so that the bonding portion 20 maintains the photosensitive path of the optical filter 30 on the photosensitive chip 13, wherein the glue 400 is bonded to the side portion of the circuit board assembly 10 to form the lower bonding side 21 of the bonding portion 20, and the glue 400 is bonded to the side portion of the optical filter 30 to form the top bonding surface 22, wherein the lower surface 51 of the lens mount 50 is bonded to the circuit board 11 through the glue 400, and the inner surface 53 of the lens mount 50 is bonded to the bonding portion 20.

It should be noted that the manner of curing the glue 400 applied to the circuit board assembly 10 is not limited in the camera module 1000 of the present invention, and is selected according to the type of the glue 400, for example, the glue 400 applied to the circuit board assembly 10 can be cured by heating or ultraviolet irradiation.

In the camera module 1000 of the present invention, the top bonding surface 22 of the bonding portion 20 corresponds to the electronic components 12 that are arranged at the same height, so that the flatness of the top bonding surface 22 of the bonding portion 20 is ensured by the electronic components 12 that are arranged at the same height, and thus the flatness of the optical filter 30 and the light sensing region 131 of the light sensing chip 13 is ensured.

Referring to fig. 19, the optical lens 40 is mounted on the lens holder 60 and the lens holder 60 is mounted on the upper surface 52 of the lens holder 50 to maintain the optical lens 40 in the photosensitive path of the photosensitive chip 13, so as to obtain the image pickup module 1000.

Fig. 22 shows a modified embodiment of the camera module 1000, which is different from the camera module 1000 shown in fig. 14 to 20, in the specific example of the camera module 1000 shown in fig. 22, the camera module 1000 is not provided with the lens bearing portion 60, but directly mounts the optical lens 40 on the lens holder 50, so as to hold the optical lens 40 on the photosensitive path of the photosensitive chip 13 by the lens holder 50. In the packaging process of the camera module 1000 shown in fig. 22, the optical lens 40 is firstly mounted on the lens holder 50, the lens holder 50 is secondly mounted on the circuit board 11 of the circuit board assembly 10, and then the adhesive 400 applied to the circuit board assembly 10 is cured to form the bonding portion 20 by the adhesive 400 applied to the circuit board assembly 10.

Fig. 23 shows a modified embodiment of the camera module 1000, which is different from the camera module 1000 shown in fig. 14 to 20, in the specific example of the camera module 1000 shown in fig. 23, the glue material 400 is applied only to the circuit board 11 of the circuit board assembly 10, so that the lower bonding side 21 of the bonding part 20 is only bonded to the circuit board 11 of the circuit board assembly 10 after the glue material 400 is cured.

In the modified embodiment of the camera module 1000 shown in fig. 24, different from the camera module 1000 shown in fig. 14 to 20, in the specific example of the camera module 1000 shown in fig. 24, the glue 400 is applied only to the non-photosensitive areas 132 of the photosensitive chips 13 of the circuit board assembly 10, so that after the glue 400 is cured, the lower bonding sides 21 of the bonding portions 20 are only bonded to the non-photosensitive areas 132 of the photosensitive chips 13 of the circuit board assembly 10. In the specific example of the camera module 1000 shown in fig. 24, the top bonding surface 22 of the bonding portion 20 corresponds to the non-photosensitive region 132 of the photosensitive chip 13, so that the flatness of the top bonding surface 22 of the bonding portion 20, and thus the flatness of the optical filter 30 and the photosensitive region 131 of the photosensitive chip 13, is ensured by the non-photosensitive region 132 of the photosensitive chip 13.

Fig. 25 shows a modified embodiment of the camera module 1000, which is different from the camera module 1000 shown in fig. 14 to 20, in the specific example of the camera module 1000 shown in fig. 25, the lower surface 51 of the lens holder 50 is attached to the circuit board 11, and the lens bearing portion 60 is attached to the upper surface 52 of the lens holder 50, so that the optical lens 40 is held in the photosensitive path of the photosensitive chip 13 by the lens holder 50 and the lens bearing portion 60. In the packaging process of the camera module 1000 shown in fig. 25, the glue 400 applied to the circuit board assembly 10 is first cured to form the bonding portion 20 by the glue 400 applied to the circuit board assembly 10, the lower surface 51 of the lens holder 50 is then attached to the circuit board 11, and the lens bearing portion 60 is then attached to the upper surface 52 of the lens holder 50, so that the optical lens 40 is maintained in the photosensitive path of the photosensitive chip 13 by the lens holder 50 and the lens bearing portion 60.

Fig. 26 shows a variant embodiment of the camera module 1000, which differs from the camera module 1000 shown in fig. 14 to 20, in that the lens holder 50 further has at least one notch 54, wherein the notch 54 extends from the lower surface 51 to the upper surface 52, wherein after the lens holder 54 is attached to the circuit board 11, a part of the glue 400 applied to the circuit board assembly 10 is received in the notch 54 of the lens holder 50, and in this way, when the glue 400 applied to the circuit board assembly 10 is cured, the notch 54 of the lens base 50 allows the glue 400 to overflow from the inside to the outside of the lens base 50, thereby preventing the glue material 400 from expanding inwards to contaminate the photosensitive area 131 of the photosensitive chip 13 or block the photosensitive path of the photosensitive chip 13. After the adhesive material 400 applied to the circuit board assembly 10 is cured to form the bonding portion 20, a portion of the bonding portion 20 is received in the notch 54 of the lens holder 50. That is, in this particular example of the camera module 1000 shown in fig. 26, the notch 54 of the lens holder 50 forms a glue overflow.

Fig. 27 shows a modified embodiment of the camera module 1000, which is different from the camera module 1000 shown in fig. 26, in the specific example of the camera module 1000 shown in fig. 27, the inner surface 53 of the side portion of the lens holder 50 provided with the notch 54 is not attached to the glue 400 applied to the circuit board assembly 10, but rather a gap is allowed to be reserved between the inner surface 53 of the lens holder 50 and the glue 400 applied to the circuit board assembly 10, in such a way that, when the glue 400 applied to the circuit board assembly 10 is cured, the notch 54 of the lens holder 50 allows air kept between the lens holder 50 and the glue 400 applied to the circuit board assembly 10 to escape, thereby allowing the glue 400 applied to the circuit board assembly 10 to expand toward the circuit board assembly 10 of the lens holder 50, thereby preventing the glue material 400 from expanding inwards to contaminate the photosensitive area 131 of the photosensitive chip 13 or block the photosensitive path of the photosensitive chip 13. After the adhesive 400 applied to the circuit board assembly 10 is cured to form the bonding portion 20, the notch 54 of the lens holder 50 is sealed by the adhesive 400 or other materials.

Fig. 28 shows a modified embodiment of the camera module 1000, and unlike the camera module 1000 shown in fig. 14 to 20, in the camera module 1000 shown in fig. 28, the lens holder 50 is integrally molded with the circuit board 11 and the coupling portion 20. Specifically, after the adhesive material 400 applied to the circuit board assembly 10 is cured to form the bonding portion 20, the lens holder 50 is formed by a molding process so that the lower surface 51 of the lens holder 50 is integrally bonded to the circuit board 11 and the inner surface 53 of the lens holder 50 is integrally bonded to the bonding portion 20, so as to obtain the image pickup module 1000 shown in fig. 28.

According to another aspect of the present invention, the present invention further provides a method for manufacturing the camera module 1000, wherein the method comprises the following steps:

(a) respectively combining the lower combining side 21 of the combining part 20 with the circuit board assembly 10 and the top combining side 22 of the filter 30 with the combining part 20 to maintain the filter 30 in the photosensitive path of the photosensitive chip 13 of the circuit board assembly 10; and

(b) the optical lens 40 is kept in the photosensitive path of the photosensitive chip 13 to manufacture the camera module 1000.

In a preferred example of the manufacturing method of the present invention, the step (a) further includes the steps of:

(a.1) applying the adhesive 400 to the circuit board assembly 10 around the photosensitive area 131 of the photosensitive chip 13;

(a.2) attaching the optical filter 30 on the top of the adhesive material 400; and

(a.3) curing the adhesive material 400 to form the bonding portion 20, wherein the adhesive material 400 is bonded to the side portion of the circuit board assembly 10 to form the lower bonding side 21 of the bonding portion 20, and the adhesive material 400 is bonded to the side portion of the optical filter 30 to form the top bonding side 22 of the bonding portion 20.

Preferably, in the step (a.1), the glue material 400 applied to the circuit board assembly 10 surrounds the light-sensing region 131 of the light-sensing chip 13, so that a sealed space is formed among the light filter 30, the glue material 400 and the light-sensing chip 13 after the light filter 30 is attached to the top of the glue material 400, and the light-sensing region 131 of the light-sensing chip 13 is maintained in the sealed space, so that during the process of packaging the camera module 1000, the bad phenomenon that contaminants such as dust fall into the light-sensing region 131 of the light-sensing chip 13 to cause a dirty spot can be avoided. Alternatively, in the step (a.1), the adhesive material 400 is applied only along the extending direction of the electronic components 12 of the circuit board assembly 10, and after the optical filter 30 is attached to the top of the adhesive material 400, the gap formed between the optical filter 30 and the circuit board assembly 10 is sealed. For example, the gap formed between the optical filter 30 and the circuit board assembly 10 may be sealed by the adhesive material 400 by means of adhesive filling.

In the step (a.2), the filter 30 is pressed toward the photosensitive chip 13 to attach the filter 30 to the top of the adhesive 400, so that the filter 30 can form a flat surface on the top of the adhesive 400, and at this time, the flatness between the filter 30 and the photosensitive region 131 of the photosensitive chip 13 can be ensured by the adhesive 400, so that the bonding portion 20 can ensure the flatness between the filter 30 and the photosensitive region 131 of the photosensitive chip 13 after the adhesive 400 is cured to form the bonding portion 20.

In a preferred example of the manufacturing method of the present invention, before the step (a.3), the step (a) further includes the steps of: mounting the lens holder 50 on the circuit board 11 of the circuit board assembly 10, so that in the step (a.3), the lower surface 51 of the lens holder 50 is bonded to the circuit board 11 and the inner surface 53 of the lens holder 50 is bonded to the bonding portion 20, and in this way, the packaging relationship among the lens holder 50, the bonding portion 20 and the circuit board assembly 10 is more reliable.

Preferably, the lens holder 50 is provided with the notch 54, so that in the process of curing the adhesive material 400, the adhesive material 400 is allowed to overflow from the notch 54 of the lens holder 50, thereby avoiding the adverse phenomenon that the adhesive material 400 expands towards the photosensitive area 131 of the photosensitive chip 13 to pollute the photosensitive area 131 of the photosensitive chip 13 or block the photosensitive path of the photosensitive chip 13. Optionally, when the lens holder 50 is mounted on the circuit board 11 of the circuit board 10, the inner surface 53 of the side portion of the lens holder 50 where the notch 54 is formed is not attached to the rubber material 400, so as to form a gap between the rubber material 400 and the inner surface 53 of the lens holder 50, and thus, in the process of curing the rubber material 400, air between the rubber material 400 and the inner surface 53 of the lens holder 50 is allowed to overflow from the notch 54 of the lens holder 50, so as to guide the rubber material 400 to expand toward the inner surface 53 of the lens holder 50, and in this way, the phenomenon that the rubber material 400 expands toward the photosensitive area 131 of the photosensitive chip 13 to contaminate the photosensitive area 131 of the photosensitive chip 13 or block the photosensitive path of the photosensitive chip 13 can be avoided.

(a.1') forming the annular projection 200 at the peripheral edge of the optical filter 30;

(a.2') mounting the annular boss 200 on the non-photosensitive region 132 of the photosensitive chip 13; and

(a.3') curing the annular boss 200 to form the bonding part 20, wherein the side of the annular boss 200 bonded to the non-photosensitive region 132 of the photosensitive chip 13 forms the lower bonding side 21 of the bonding part 20, and the side of the annular boss 200 bonded to the optical filter 30 forms the top bonding side 22 of the bonding part 20.

It will be appreciated by persons skilled in the art that the above embodiments are only examples, wherein features of different embodiments may be combined with each other to obtain embodiments which are easily conceivable in accordance with the disclosure of the invention, but which are not explicitly indicated in the drawings.

It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.

Claims

1. A photosensitive assembly, comprising:

a light filter;

2. The photosensitive assembly of claim 1, wherein the lower bonding side of the bonding portion is bonded to a non-photosensitive region of the photosensitive chip, and the top bonding side of the bonding portion corresponds to the non-photosensitive region of the photosensitive chip.

3. The photosensitive assembly of claim 1, wherein the lower bonding side of the bonding portion is bonded to a non-photosensitive region of the circuit board and the photosensitive chip, and the top bonding side of the bonding portion corresponds to the non-photosensitive region of the photosensitive chip.

4. The photosensitive assembly of claim 1, wherein the circuit board assembly further comprises a series of electronic components, wherein at least three of the electronic components are disposed at equal heights and conductively connected to the circuit board, wherein the bonding portions embed the electronic components, and the top bonding surfaces of the bonding portions correspond to the electronic components.

5. The photosensitive assembly of claim 4, wherein the top bonding surfaces of the bonding portions are located on a plane lower than a plane of a top surface of the tallest electronic component.

6. The photosensitive assembly according to any one of claims 1 to 5, wherein a distance dimension between a plane on which the top bonding surface of the bonding portion is located and a plane on which a photosensitive area of the photosensitive chip is located is greater than or equal to 0.15 mm.

7. The photosensitive assembly of claim 2, wherein said bonding portion has four sides, adjacent said sides being end-to-end and perpendicular to each other to form said light path between said four sides, wherein a width dimension of at least one of said sides of said bonding portion is greater than or equal to 0.15 mm.

8. A camera module, comprising:

an optical lens;

a light filter;

9. The camera module of claim 8, wherein the lower bonding side of the bonding portion is bonded to a non-photosensitive region of the photosensitive chip, and the top bonding side of the bonding portion corresponds to the non-photosensitive region of the photosensitive chip.

10. The camera module of claim 8, wherein the lower bonding side of the bonding portion is bonded to a non-photosensitive region of the wiring board and the photosensitive chip, and the top bonding surface of the bonding portion corresponds to the non-photosensitive region of the photosensitive chip.

11. The camera module of claim 8, wherein the circuit board assembly further comprises a series of electronic components, wherein at least three of the electronic components are disposed at equal heights and conductively coupled to the circuit board, wherein the bonding portions embed the electronic components, and wherein the top bonding surfaces of the bonding portions correspond to the electronic components.

12. The camera module of claim 11, wherein the top bonding surface of the bonding portion is located on a plane lower than a plane of a top surface of the tallest electronic component.

13. The camera module according to any one of claims 8 to 12, wherein a distance between a plane of the top bonding surface of the bonding portion and a plane of a photosensitive area of the photosensitive chip is greater than or equal to 0.15 mm.

14. The camera module of claim 9, wherein the joining portion has four sides, adjacent sides being end-to-end and perpendicular to each other to form the light path between the four sides, wherein at least one of the sides of the joining portion has a width dimension greater than or equal to 0.15 mm.

15. The camera module of any of claims 8-14, further comprising a lens mount, wherein the lens mount has a lower surface, and the lower surface of the lens mount is attached to the circuit board.

16. The camera module according to any one of claims 8 to 14, further comprising a lens holder, wherein the lens holder has a lower surface, an upper surface corresponding to the lower surface, and an inner surface extending from the upper surface to the lower surface, wherein the lower surface of the lens holder is attached to the circuit board, and the inner surface of the lens holder is bonded to the bonding portion.

17. The camera module according to any one of claims 8 to 14, further comprising a lens holder, wherein the lens holder has a lower surface, an upper surface corresponding to the lower surface, and an inner surface extending from the upper surface to the lower surface, wherein the lower surface of the lens holder is bonded to the circuit board, and the inner surface of the lens holder is bonded to the bonding portion.

18. The camera module according to claim 9, further comprising a lens holder, wherein the lens holder has a lower surface, an upper surface corresponding to the lower surface, and an inner surface extending from the upper surface to the lower surface, wherein the lower surface of the lens holder is bonded to the non-photosensitive areas of the circuit board and the photosensitive chip, and the inner surface of the lens holder is bonded to the bonding portion.

19. The camera module of claim 17, having four side portions, wherein at least one of the side portions has a side surface, a bottom surface, and a connecting surface connecting the side surface and the bottom surface, wherein a distance between a connection of the connecting surface and the side surface and a central axis of the camera module is greater than a distance between a connection of the connecting surface and the bottom surface and the central axis of the camera module.

20. The camera module of claim 18, having four side portions, wherein at least one of the side portions has a side surface, a bottom surface, and a connecting surface connecting the side surface and the bottom surface, wherein a distance between a connection of the connecting surface and the side surface and a central axis of the camera module is greater than a distance between a connection of the connecting surface and the bottom surface and the central axis of the camera module.

21. The camera module of claim 19, wherein said attachment surface is a slanted plane; or the connecting surface is a convex cambered surface; or the connecting surface is a step surface.

22. The camera module of claim 20, wherein said attachment surface is a slanted plane; or the connecting surface is a convex cambered surface; or the connecting surface is a step surface.

23. The camera module of claim 21, wherein the attachment face is formed on the lens mount and the circuit board.

24. The camera module of claim 22, wherein the attachment face is formed on the lens mount and the circuit board.

25. The camera module of claim 16, wherein the lens holder has at least one notch extending from the lower surface of the lens holder in a direction toward the upper surface, wherein a portion of the coupling portion is received in the notch of the lens holder.

26. The camera module according to any one of claims 15-25, further comprising a lens holder, the lens holder having a mounting surface, wherein the lens holder is mounted to the lens holder in such a manner that the mounting surface of the lens holder is mounted to the upper surface of the lens holder, and wherein the optical lens is disposed on the lens holder.

27. The camera module according to claim 26, wherein a range of a distance parameter D between the attachment surface of the lens bearing portion and the lower surface of the optical filter is: d is more than or equal to 0.1mm and less than or equal to 0.2 mm.

28. The camera module of any of claims 8-27, wherein the back focal length parameter L of the camera module has a range of values: l is more than or equal to 0.4mm and less than or equal to 0.6mm, wherein the back focal distance of the camera module is the distance between the lower surface of one lens of the optical lens, which is close to the photosensitive chip, and the photosensitive area of the photosensitive chip.

29. An electronic device, comprising:

an electronic device body; and

the at least one camera module of any one of claims 8-28, wherein the camera module is disposed on the electronic device body.