CN111818241A - Camera module, molded photosensitive assembly, manufacturing method of camera module and molded photosensitive assembly, and electronic equipment - Google Patents

Camera module, molded photosensitive assembly, manufacturing method of camera module and molded photosensitive assembly, and electronic equipment Download PDF

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Publication number
CN111818241A
CN111818241A CN201910292636.0A CN201910292636A CN111818241A CN 111818241 A CN111818241 A CN 111818241A CN 201910292636 A CN201910292636 A CN 201910292636A CN 111818241 A CN111818241 A CN 111818241A
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CN
China
Prior art keywords
molding
molded
mold
molding part
photosensitive assembly
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910292636.0A
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Chinese (zh)
Inventor
黄桢
栾仲禹
仰宗春
席逢生
许晨祥
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Sunny Opotech Co Ltd
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Ningbo Sunny Opotech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Ningbo Sunny Opotech Co Ltd filed Critical Ningbo Sunny Opotech Co Ltd
Priority to CN201910292636.0A priority Critical patent/CN111818241A/en
Priority to US17/603,183 priority patent/US11906879B2/en
Priority to PCT/CN2020/077380 priority patent/WO2020207145A1/en
Priority to EP20787862.0A priority patent/EP3955561A4/en
Publication of CN111818241A publication Critical patent/CN111818241A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Mechanical Engineering (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Studio Devices (AREA)

Abstract

A camera module, a molded photosensitive assembly, a manufacturing method of the camera module and the molded photosensitive assembly, and an electronic device are provided. The molding photosensitive assembly is used for assembling the imaging module with at least one optical lens. The molded photosensitive assembly includes an imaging assembly, a molded base, and a filtering member. The mold base includes a first mold portion and a second mold portion. The first molding portion encapsulates a portion of the imaging assembly. The second molding part is integrally formed on the first upper surface of the first molding part, wherein the second molding part has a second upper surface and a second outer side surface. The filtering component is attached to the second upper surface of the second molding part and corresponds to a photosensitive path of the imaging component. The second upper surface of the second molding portion is higher than the first upper surface of the first molding portion, so that an outer space is defined by the second outer side surface of the second molding portion and the first upper surface of the first molding portion.

Description

Camera module, molded photosensitive assembly, manufacturing method of camera module and molded photosensitive assembly, and electronic equipment
Technical Field
The invention relates to the technical field of optical imaging, in particular to a camera module, a molded photosensitive assembly, a manufacturing method of the camera module and the molded photosensitive assembly, and electronic equipment.
Background
In recent years, electronic products, smart devices, and the like are increasingly being developed toward light weight, thinness, and miniaturization, and the development trend of the electronic products and the smart devices puts more severe requirements on the size of a camera module, which is one of standard configurations of the electronic products and the smart devices. Under the requirement, a Molding process and an IOM (IR on Molding) process are gradually applied to a packaging process of the camera module, and the imaging assembly is first packaged by the Molding process to form a Molding base, and then the optical filter is directly attached to the Molding base to assemble the molded photosensitive assembly, so as to greatly reduce the thickness of the photosensitive assembly and further reduce the overall size of the camera module.
For example, as shown in fig. 1, the conventional camera module 1P generally includes an optical lens 2P and a molded photosensitive element 3P, wherein the molded photosensitive element 3P includes an imaging element 31P, a molding base 32P and a filter 33P, wherein the molding base 32P covers a portion of the imaging element 31P after molding, and the molding base 32P is recessed downward to form a groove 35P, wherein the filter 33P is directly attached to the groove 35P of the molding base 32P by glue, and after the glue is cured, a glue layer 34P for bonding the filter 33P and the molding base 32P is formed to assemble the molded photosensitive element 3P. Thus, the conventional camera module 1P can be assembled by directly mounting the optical lens 2P to the top surface of the mold base 32P without a lens mount, so that the overall size of the camera module can be reduced. Meanwhile, since the filter 33P is attached in the groove 35P of the mold base 32P, the distance between the filter 33P and the photosensitive chip 311P of the imaging assembly 31P is further reduced, which is helpful for further reducing the height of the camera module.
However, as shown in fig. 1, limited by the film (film) in the molding process, the corners of the recess 35P in the mold base 32P (i.e. the connection between the portion of the mold base 32P to which the filter 33P is attached and the portion where the optical lens 2P is mounted) are not perpendicular, but have a certain transition arc 351P, so that it is difficult for the mold base 32P to provide a flat attachment surface for the filter 33P. Therefore, the transition arc 351P of the groove 35P in the mold base 32P has to be avoided when attaching the filter 33P to ensure that the filter 33P is attached on a flat plane. However, this results in a smaller attachment area between the filter 33P and the mold base 32P, i.e., a smaller bottom supporting area provided by the mold base 32P for the filter 33P, which tends to reduce the connection strength between the filter 33P and the mold base 32P, and thus affects the reliability of the camera module.
Disclosure of Invention
An object of the present invention is to provide an image pickup module, a molded photosensitive element, a method of manufacturing the same, and an electronic apparatus, which can eliminate an adverse effect of a transition arc surface on a mold base on attaching a filter member by raising a portion of the mold base to which the filter member is attached.
Another object of the present invention is to provide a camera module, a molded photosensitive element, a method of manufacturing the same, and an electronic apparatus, which can increase the attachment area between the filter member and the molded base without avoiding a transition curved surface on the molded base when attaching the filter member, and which can contribute to improving the reliability of the camera module.
Another object of the present invention is to provide a camera module, a molded photosensitive component, a method for manufacturing the same, and an electronic apparatus, wherein in an embodiment of the present invention, an upper mold of a molding mold is designed to form a gap between a second molding portion and a third molding portion, so that the filter member does not need to avoid a transition arc surface on the molding base.
Another object of the present invention is to provide an image pickup module, a molded photosensitive component, a method for manufacturing the same, and an electronic apparatus, wherein in an embodiment of the present invention, a second molding portion of the molding base of the molded photosensitive component is integrally formed on the first molding portion of the molding base, so as to provide a flat attaching surface for the filter member through a second upper surface of the second molding portion, so as to ensure the attaching flatness of the filter member.
Another object of the present invention is to provide a camera module, a molded photosensitive element, a method for manufacturing the same, and an electronic device, wherein in an embodiment of the present invention, a third molding portion of the molding base of the molded photosensitive element is integrally formed on the first molding portion to cover an electronic component on a circuit board of the molded photosensitive element, which is helpful for reducing the thickness of the first molding portion, and further reducing the height of the camera module.
Another object of the present invention is to provide an image pickup module, a molded photosensitive component, a manufacturing method thereof, and an electronic apparatus, wherein in an embodiment of the present invention, the second molding portion and the third molding portion of the module base of the molded photosensitive component are disposed at an interval to reserve an external space between the second molding portion and the third molding portion, so that an edge of the filter element is as close to the third molding portion as possible without avoiding a transition arc surface between the third molding portion and the first molding portion, which is helpful for increasing a bottom supporting area of the filter element, thereby enhancing the attachment reliability of the filter element.
Another object of the present invention is to provide a camera module, a molded photosensitive component, a manufacturing method thereof, and an electronic device, wherein in an embodiment of the present invention, the second molding portion of the module base of the molded photosensitive component can ensure that the filter element is attached on a flat plane without avoiding a transition arc between the third molding portion and the first molding portion, which is helpful for improving the assembly quality of the camera module.
Another object of the present invention is to provide an image pickup module, a molded photosensitive element, a method for manufacturing the same, and an electronic device, wherein in an embodiment of the present invention, the second molding portion of the molding base is easy to be provided with a notch, so as to form an air escape hole during the process of attaching the filter member, thereby effectively preventing the filter element from being shifted or tilted due to the expansion of the air in the internal space of the molding base caused by heat.
Another objective of the present invention is to provide a camera module, a molded photosensitive device, a method for manufacturing the same, and an electronic apparatus, wherein in an embodiment of the present invention, the notch of the molded base of the molded photosensitive device transversely penetrates through the second molding portion to form the transverse air escape hole after attaching the optical filter element, so as to increase the difficulty of external dust entering the internal space of the molded base through the air escape hole, which is helpful for preventing the photosensitive chip from being contaminated.
Another object of the present invention is to provide an image pickup module, a molded photosensitive component, a manufacturing method thereof, and an electronic apparatus, wherein in an embodiment of the present invention, the molded base of the molded photosensitive component is provided with a molded reinforcing portion at the notch, wherein the molded reinforcing portion extends outward from the second molded portion so as to perform glue filling at the notch after the filter element is attached, which helps to enhance the attaching strength of the filter element at the notch to enhance the reliability of the image pickup module.
Another object of the present invention is to provide an image pickup module, a molded photosensitive component, a method for manufacturing the same, and an electronic apparatus, wherein in an embodiment of the present invention, the molded reinforcing portion of the module base of the molded photosensitive component can reinforce the connection strength between the second molded portion and the first molded portion at the notch, further enhancing the reliability of the image pickup module.
Another object of the present invention is to provide a camera module, a molded photosensitive component, a manufacturing method thereof, and an electronic apparatus, wherein in an embodiment of the present invention, the second upper surface of the second molded portion of the molded base is higher than the first upper surface of the first molded portion, so as to form an outer space around the second molded portion, allow an adhesive before curing to overflow outwards, and facilitate ensuring the imaging quality of the camera module.
Another object of the present invention is to provide a camera module, a molded photosensitive element, a method for manufacturing the same, and an electronic device, wherein in an embodiment of the present invention, an outer space is reserved on a molding base of the molded photosensitive element, which is helpful for guiding an adhesive before curing to overflow outwards, so as to alleviate the overflow of the adhesive before curing, and further reduce adverse effects of the adhesive on an imaging quality of the camera module.
Another object of the present invention is to provide an image pickup module, a molded photosensitive component, a method for manufacturing the same, and an electronic apparatus, wherein in an embodiment of the present invention, the third molding portion and the second molding portion of the molding base of the molded photosensitive component are disposed at an interval, so that the avoiding space between the third molding portion and the second molding portion is implemented as the outer space, thereby preventing the third molding portion from blocking the glue from overflowing.
Another object of the present invention is to provide an image pickup module, a molded photosensitive component, a manufacturing method thereof, and an electronic apparatus, wherein in an embodiment of the present invention, a third upper surface of the third molding portion of the molding base of the molded photosensitive component is higher than an upper surface of the filter element, so that the third molding portion blocks an optical lens from striking the filter element, which helps to reduce the risk of cracking of the filter element.
Another object of the present invention is to provide a camera module, a molded photosensitive component, a manufacturing method thereof and an electronic device, wherein in an embodiment of the present invention, a fourth molding portion of the molding base of the molded photosensitive component is designed according to a mounting height of an optical lens to meet a mounting requirement of the optical lens of the camera module.
Another object of the present invention is to provide a camera module, a molded photosensitive element, a method for manufacturing the same, and an electronic device, wherein in an embodiment of the present invention, the fourth molded portion of the molded base of the molded photosensitive element is recessed downward from the first molded portion, so as to reduce the installation height of the optical lens of the camera module, which is helpful for further reducing the height of the camera module.
It is another object of the present invention to provide a camera module, a molded photosensitive member, a method of manufacturing the same, and an electronic apparatus, wherein the use of expensive materials or complicated structures is not required in the present invention in order to achieve the above objects. Therefore, the present invention successfully and effectively provides a solution to not only provide a simple camera module and a molded photosensitive member, and a method of manufacturing the same, and an electronic apparatus, but also increase the practicality and reliability of the camera module and the molded photosensitive member, and the method of manufacturing the same, and the electronic apparatus.
To achieve at least one of the above objects and other objects and advantages, the present invention provides a molded photosensitive assembly for assembling with at least one optical lens to form a camera module, wherein the molded photosensitive assembly comprises:
an imaging assembly;
a molded base, wherein the molded base comprises:
a first molding, wherein the first molding encapsulates a portion of the imaging assembly, wherein the first molding has a first upper surface; and
a second molding, wherein the second molding is integrally formed on the first upper surface of the first molding, wherein the second molding has a second upper surface and a second outer side; and
a filter member, wherein the filter member is correspondingly disposed on the second upper surface of the second molding part;
wherein the second upper surface of the second molding part is higher than the first upper surface of the first molding part to define an outer space by the second outer side of the second molding part and the first upper surface of the first molding part.
In an embodiment of the present invention, the molding base further includes a third molding portion, wherein the third molding portion is integrally formed on the first upper surface of the first molding portion, the third molding portion is located outside the second molding portion, and the third molding portion is spaced apart from the second molding portion.
In an embodiment of the invention, the second upper surface of the second molding part is a flat surface.
In an embodiment of the present invention, a distance between a third inner side surface of the third molded part and the second outer side surface of the second molded part is not less than 0.01 mm.
In an embodiment of the present invention, a height difference between the second upper surface of the second molding part and the first upper surface of the first molding part is between 0.03 mm and 0.2 mm.
In an embodiment of the invention, the molding photosensitive assembly further includes an adhesive layer, wherein the adhesive layer is formed after the adhesive is cured, and the adhesive layer is located between a lower surface of the filter member and the second upper surface of the second molding portion to attach the filter member to the second upper surface of the second molding portion.
In an embodiment of the invention, the second inner side surface of the second molding part is located outside the first inner side surface of the first molding part to form an inner space inside the second molding part.
In an embodiment of the invention, the imaging assembly includes a circuit board, a photosensitive element conductively attached to the circuit board, and a set of electronic components conductively connected to the circuit board, wherein the third molding portion corresponds to the electronic components, and a third upper surface of the third molding portion is higher than a top surface of the electronic components.
In an embodiment of the invention, the first upper surface of the first mold portion of the mold base is lower than the top surface of the electronic component.
In an embodiment of the invention, a third outer side surface of the third molded part of the mold base is located inside the first outer side surface of the first molded part, so that a portion of the first upper surface of the first molded part located outside the third molded part is used for mounting the optical lens.
In an embodiment of the invention, the mold base further includes a fourth mold portion, wherein the fourth mold portion is recessed downward from the first upper surface of the first mold portion to form a peripheral groove at the outer periphery of the first mold portion, and a fourth upper surface of the fourth mold portion is used for providing a mounting surface for mounting the optical lens.
In an embodiment of the invention, the mold base further includes a fourth mold portion, wherein the fourth mold portion extends upward from the first upper surface of the first mold portion to form a peripheral protrusion on the outer periphery of the first mold portion, and a fourth upper surface of the fourth mold portion is used for providing a mounting surface for mounting the optical lens.
In an embodiment of the present invention, the third upper surface of the third molding portion of the molding base is higher than the second upper surface of the second molding portion.
In an embodiment of the present invention, the third upper surface of the third molding is higher than an upper surface of the filter member, and the third upper surface of the third molding is adapted to correspond to the optical lens.
In an embodiment of the present invention, the third molding portion is designed according to a size and a position of the electronic component.
In an embodiment of the invention, the adhesive layer is formed by curing a photo-curing adhesive or a thermosetting adhesive.
In an embodiment of the invention, the second molding portion of the molding base is provided with at least one notch, so that when the light filtering member is attached to the second upper surface of the second molding portion, an air escape hole is formed at the notch of the second molding portion, so as to communicate the internal space of the molding photosensitive assembly with the outside of the molding photosensitive assembly through the air escape hole.
In an embodiment of the invention, the second molding portion of the molding base is provided with at least one notch, so that when the filter member is adhered to the second upper surface of the second molding portion through the adhesive layer, an air escape hole is formed at the notch of the second molding portion, so as to communicate the internal space of the molding photosensitive element with the outside of the molding photosensitive element through the air escape hole.
In an embodiment of the invention, the notch of the second molding part extends transversely from the second inner side of the second molding part to the second outer side of the second molding part so as to form the air escape hole arranged transversely.
In an embodiment of the invention, the molding base further includes a molding reinforcement portion, wherein the molding reinforcement portion integrally extends outward from the second molding portion at the notch of the second molding portion.
In an embodiment of the invention, the molding photosensitive element, wherein the molding reinforcing part is integrally connected with the first molding part to form a reinforcing rib between the second outer side surface of the second molding part and the first upper surface of the first molding part.
In an embodiment of the invention, the molded photosensitive assembly further includes a reinforcing adhesive block, wherein the reinforcing adhesive block is formed by curing an adhesive applied to the notch of the second molded portion.
According to another aspect of the present invention, there is provided a camera module, comprising at least one optical lens; and
the molded photosensitive assembly of any one of the above, wherein each optical lens is correspondingly disposed on the molded photosensitive assembly, and the optical lens corresponds to a photosensitive path of the imaging assembly of the molded photosensitive assembly.
In an embodiment of the invention, the camera module further includes at least one driver, wherein each driver is assembled to the mold base of the mold photosensitive assembly, and each optical lens is assembled to the driver, respectively, so as to assemble the zoom camera module.
In an embodiment of the invention, each of the optical lenses includes a lens barrel and a lens group, wherein the lens barrel is disposed on the molding base of the molding photosensitive assembly, and each of the optical lenses is assembled to the lens barrel to form a fixed focus camera module.
According to another aspect of the present invention, the present invention further provides an electronic device comprising:
an electronic device body; and
at least one above-mentioned arbitrary camera module, wherein every camera module is set up in the electronic equipment body for obtain the image.
According to another aspect of the present invention, the present invention further provides a method for manufacturing a camera module, including the steps of:
a photosensitive element is conductively mounted on a circuit board to form an imaging component;
forming a molding base on the imaging component by using a forming mold, wherein the module base comprises a first molding part and a second molding part, the first molding part covers a part of the imaging component, the second molding part is integrally formed on a first upper surface of the first molding part, and a second upper surface of the second molding part is higher than the first upper surface of the first molding part, so that an outer space is defined by a second outer side surface of the second molding part and the first upper surface of the first molding part;
attaching the filter member to the second upper surface of the second molding part, wherein the filter member corresponds to the photosensitive path of the imaging assembly to assemble the molded photosensitive assembly; and
correspondingly, at least one optical lens is arranged on the molding photosensitive assembly.
In an embodiment of the present invention, before the step of forming a molding base on the imaging component by molding with a forming mold, the method further includes the steps of:
and mounting a group of electronic components on the circuit board at intervals, wherein each electronic component is respectively connected with the circuit board in a conducting manner.
In an embodiment of the present invention, in the step of forming a molding base on the imaging component by molding with a molding die:
the molding base further comprises a third molding part, wherein the third molding part is integrally formed on the first upper surface of the first molding part, the third molding part is positioned outside the second molding part, and the third molding part and the second molding part are arranged at a distance.
In an embodiment of the present invention, in the step of forming a molding base on the imaging component by molding with a molding die:
the second molding part of the molding base is provided with at least one notch, wherein the notch extends from the second inner side surface of the second molding part to the second outer side surface of the second molding part.
In an embodiment of the invention, the step of attaching the filter member to the second upper surface of the second molding portion to assemble the molded photosensitive assembly includes the steps of:
applying an adhesive to the second upper surface of the second molding part;
correspondingly arranging the light filtering component on the second molding part, and forming an air escape hole communicating the overflow space of the second molding part and the inner space of the first molding part through the notch of the second molding part; and
heating or irradiating light to form the adhesive layer between the lower surface of the filter member and the second upper surface of the second molding part.
In an embodiment of the invention, the step of attaching the filter member to the second upper surface of the second molding portion to assemble the molded photosensitive assembly includes the steps of:
applying an adhesive to the lower surface of the filter member;
correspondingly arranging the light filtering component on the second molding part, and forming an air escape hole communicating the overflow space of the second molding part and the inner space of the first molding part through the notch of the second molding part; and
heating or irradiating light to form the adhesive layer between the lower surface of the filter member and the second upper surface of the second molding part.
In an embodiment of the present invention, the step of correspondingly disposing at least one optical lens on the molded photosensitive assembly includes the steps of:
assembling the optical lens to a driver; and
correspondingly assembling the driver to the molding base of the molding photosensitive assembly so as to assemble the zoom camera module.
In an embodiment of the present invention, the step of correspondingly disposing at least one optical lens on the molded photosensitive assembly includes the steps of:
and assembling a lens barrel of the optical lens on the molding base of the molding photosensitive assembly, wherein a lens group of the optical lens corresponds to the photosensitive path of the imaging assembly so as to assemble a fixed-focus camera module.
Further objects and advantages of the invention will be fully apparent from the ensuing description and drawings.
These and other objects, features and advantages of the present invention will become more fully apparent from the following detailed description, the accompanying drawings and the claims.
Drawings
Fig. 1 is a schematic cross-sectional view of a conventional camera module.
Fig. 2 is a schematic perspective view of a camera module according to a first embodiment of the invention.
Fig. 3 shows a schematic cross-sectional view of the camera module according to the above-described first embodiment of the invention.
Fig. 4 is a perspective exploded view of the molded photosensitive member of the camera module according to the first embodiment of the present invention.
Fig. 5A and 5B show a first variant of the camera module according to the above-described first embodiment of the invention.
Fig. 6 shows a second variant of the camera module according to the above-described first embodiment of the invention.
Fig. 7 shows a third variant of the camera module according to the above-described first embodiment of the invention.
Fig. 8 shows a fourth variant of the camera module according to the above-described first embodiment of the invention.
Fig. 9 shows a fifth variant of the camera module according to the above-described first embodiment of the invention.
Fig. 10A is a schematic cross-sectional view of a camera module according to a second embodiment of the invention.
Fig. 10B shows a perspective exploded view of a molded camera module of the camera module according to the above-described second embodiment of the present invention.
Fig. 11A and 11B show a variant of the camera module according to the above-described second embodiment of the invention.
Fig. 12 is a schematic view showing one of the manufacturing steps of a camera module according to a third embodiment of the present invention.
Fig. 13A is a schematic view showing a second manufacturing step of the camera module according to the third embodiment of the present invention.
Fig. 13B shows a variant of the second manufacturing step of the camera module according to the third embodiment of the invention.
Fig. 14 shows a schematic view of a third manufacturing step of the camera module according to the third embodiment of the invention.
Fig. 15 is a flowchart illustrating a method for manufacturing a camera module according to an embodiment of the invention.
Fig. 16 is a schematic flow chart showing the bonding of the filter member in the method for manufacturing the camera module according to the present invention.
Fig. 17 is a schematic flow chart illustrating the process of assembling the optical lens in the method for manufacturing the image pickup module according to the present invention.
Fig. 18 is an example of an electronic apparatus provided with the camera module according to the present invention.
Detailed Description
The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.
It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be constructed and operated in a particular orientation and thus are not to be considered limiting.
In the present invention, the terms "a" and "an" in the claims and the description should be understood as meaning "one or more", that is, one element may be one in number in one embodiment, and the element may be more than one in number in another embodiment. The terms "a" and "an" should not be construed as limiting the number unless the number of such elements is explicitly recited as one in the present disclosure, but rather the terms "a" and "an" should not be construed as being limited to only one of the number.
In the description of the present invention, it is to be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "connected" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
With the increasing maturity of the Molding process, the IOM (IR on Molding) technology is also gradually applied to the packaging process of the camera module to follow the trend of miniaturization and lightness. In particular, as shown in fig. 1, in order to further reduce the height of the image capturing module 1P, the portion of the mold base 32P to which the filter 33P is attached is recessed downward to form the groove 35P, so that the portion of the mold base 32P to which the filter 33P is attached is lower than the portion to which the optical lens 2P is mounted, and the mold base 32P forms a concave step structure, so as to reduce the distance between the filter 33P and the photosensitive chip 311P of the imaging element 31P to the maximum.
However, since the corners of the recess 35P of the mold base 32P are not right-angled, a transition arc 351P is formed at the corners of the recess 35P by a film coating process during the molding process, so that the transition arc 351P inevitably affects the mold base 32P to provide a flat attachment surface, when attaching the filter 33P, the filter 33P has to avoid the transition arc 351P on the mold base 32P to ensure that the filter 33P is attached to the mold base 32P smoothly. However, in order to avoid the transition arc 351P of the groove 35P, the edge of the filter 22P has to be away from the outer sidewall of the groove 35P, so that the contact area between the filter 33P and the mold base 32P has to be reduced, that is, the bottom supporting area of the filter 33P has to be reduced, which results in a great reduction in the connection strength between the filter 33P and the mold base 32P, and further affects the reliability of the camera module.
Therefore, in order to solve the above problems, the present invention provides an image pickup module and a molded photosensitive element and a method of manufacturing the same, so as to eliminate the adverse effect of a transition curved surface generated by a coating film in a molding process on a filter member. Specifically, as shown in fig. 2 to 4, a camera module 1 according to a first embodiment of the present invention is illustrated, wherein the camera module 1 includes a molded photosensitive element 10 and at least one optical lens 20, wherein the molded photosensitive element 10 includes an imaging element 11, a molded base 12 and a filtering member 13, wherein the molded base 12 is molded on the imaging element 11, and the filtering member 13 is attached to the molded base 12; the optical lens 20 is correspondingly disposed on the module photosensitive assembly 10, and the optical lens 20 corresponds to the photosensitive path 110 of the imaging assembly 11, so as to assemble the camera module 1.
It should be noted that although the features and advantages of the camera module of the present invention are described in the following description and the accompanying fig. 2 to 4 by taking the camera module as an example including only one optical lens 20, it will be understood by those skilled in the art that the camera module disclosed in the following description and the accompanying fig. 2 to 4 is only an example and does not limit the content and scope of the invention, for example, in other examples of the camera module, the number of the optical lens 20 may be more than one to form an array camera module.
Specifically, as shown in fig. 3, the molding base 12 of the molding photosensitive element 10 includes a first molding portion 121, a second molding portion 122 and a third molding portion 123. The first molding part 121 covers a portion of the imaging assembly 11. The second molding part 122 is integrally formed on the first upper surface 1211 of the first molding part 121, wherein the second molding part 122 has a second upper surface 1221, and the second upper surface 1221 of the second molding part 122 is higher than the first upper surface 1211 of the first molding part 121, so as to define an outer space 1201 through the second outer side 1222 of the second molding part 122 and the first upper surface 1211 of the first molding part 121, that is, the molding base 12 provides an attaching surface higher than the first upper surface 1211 for the optical filter member 13 through the second upper surface 1221 of the second molding part 122, so as to facilitate attaching the optical filter member 13 to the second molding part 122 of the molding base 12. The third molding part 123 is integrally formed on the first upper surface 1211 of the first molding part 121, wherein the third molding part 123 is located at an outer side of the second molding part 122, and the third molding part 123 is disposed at a distance from the second molding part 122 to form the outer space 1201 between the third molding part 123 and the second molding part 122.
In other words, in this embodiment of the present invention, the second molding part 122 and the third molding part 123 each integrally extend upward from the first upper surface 1211 of the first molding part 121 to form the mold base 12 having an integral structure. That is, the second molding part 122 and the third molding part 123 can be integrally formed on the first upper surface 1211 of the first molding part 121 through a molding process, so that the entire mold base 12 has a unitary structure. It is understood that the inner portion of the first molding part 121 penetrates up and down to form the light window 120 of the molding base 12, wherein the second molding part 122 surrounds the light window 120 of the molding base 12, and the light window 120 of the molding base 12 corresponds to the photosensitive path 110 of the imaging component 11.
Thus, although a transition arc is still formed at the junction between the third inner side surface 1233 of the third molding part 123 and the first upper surface 1211 of the first molding part 121 due to the film coating during the molding process, since the second upper surface 1221 of the second molding part 122 is higher than the transition arc on the molding base 12, that is, the attachment surface of the filter member 13 is higher than the transition arc on the molding base 12, when the filter member 13 is attached to the attachment surface of the molding base 12, the edge of the filter member 13 can be located within the outer space 1201 without avoiding the transition arc on the molding base 12, so that the edge of the filter member 13 can be as close to the third inner side surface 1233 of the third molding part 123 as possible, which helps to increase the attachment area of the filter member 13, that is, the bottom supporting area of the filter member 13 is increased, which contributes to enhancing the connecting strength between the filter member 13 and the mold base 12, thereby improving the reliability of the camera module 1.
Further, as shown in fig. 3, since the second upper surface 1221 of the second molding portion 122 of the molding base 12 is higher than the first upper surface 1211 of the first molding portion 121, and there is no border between the second upper surface 1221 of the second molding portion 122 and the transition arc surface on the molding base 12, the molding base 12 can provide a flat attachment surface for the filtering member 13 through the second upper surface 1221 of the second molding portion 122.
Preferably, the second upper surface 1221 of the second molding part 122 is a flat surface, so as to attach the filter member 13 to the molding base 12 smoothly, and ensure that the filter member 13 has good attachment quality. It should be noted that, in consideration of the size of the mold ram of the molding process and the height of the camera module 1 itself, the height of the second upper surface 1221 of the second molding part 122 relative to the first upper surface 1211 of the first molding part 121 is preferably implemented in a range of 0.03 mm to 0.2 mm, i.e., the height difference h between the second upper surface 1221 of the second molding part 122 and the first upper surface 1211 of the first molding part 121 is between 0.03 mm and 0.2 mm (as shown in fig. 3). Therefore, the requirement of the size of the mold ram of the molding process can be met, and the problem that the installation height of the filter member 13 is large due to the fact that the second upper surface 1221 of the second molding part 122 is too high, and further the height of the camera module 1 is increased can be avoided.
Further, as shown in fig. 3 and 4, the third molding part 123 of the mold base 12 is located outside the second molding part 122, and the third molding part 123 is disposed apart from the second molding part 122 to reserve the outer space 1201 of the mold base 12 between the third molding part 123 and the second molding part 122. In other words, the third inner side 1233 of the third molding part 123 is located outside the second outer side 1222 of the second molding part 122, that is, the minimum distance r between the third inner side 1233 of the third molding part 123 and the photosensitive path 110 of the imaging component 113Is greater than the maximum distance R between the second outer side 1222 of the second mold portion 122 and the photosensitive path 110 of the imaging assembly 112I.e. r3＞R2A recess is formed in the mold base 12 by a height difference between the first upper surface 1211 of the first mold part 121 and the second upper surface 1221 of the second mold part 122 and the third upper surface 1231 of the third mold part 123, that is, the outer space 1201 of the mold base 12 is formed between the third inner side surface 1233 of the third mold part 123 and the second outer side surface 1222 of the second mold part 122, so that when the filter member 13 is attached, the edge of the filter member 13 can extend into the outer space 1201 to be close to the third inner side surface 1233 of the third mold part 123 without being affected by a transition arc surface between the third inner side surface 1233 of the third mold part 123 and the first upper surface 1211 of the first mold part 121.
Preferably, the distance d between the third inner side 1233 of the third molding part 123 and the second outer side 1222 of the second molding part 122 is not less than 0.01 mm (as shown in fig. 3) subject to the minimum mold ram size of the molding process, that is, the width of the outer space 1201 of the molding base 12 is not less than 0.01 mm.
Of course, in this embodiment of the present invention, since the interior of the first molding part 121 penetrates up and down, the first inner side surface 1213 of the first molding part 121 defines the optical window 120 of the mold base 12. Accordingly, as shown in fig. 3, a minimum distance r between the second inner side surface 1223 of the second molding part 122 and the photosensitive path 110 of the image forming assembly 112Not less than a maximum distance r between the first inner side surface 1213 of the first molding part 121 and the photosensitive path 110 of the image forming assembly 111I.e. r2≥r1So as to prevent the second molding part 122 from shielding the photosensitive path 110 of the imaging assembly 11.
It should be noted that, in the first embodiment of the present invention, as shown in fig. 3 and fig. 4, the imaging assembly 11 includes a circuit board 111 and at least one photosensitive element 112, wherein each photosensitive element 112 is conductively attached to a different position of the circuit board 111, and a photosensitive area of each photosensitive element 112 corresponds to the corresponding optical lens 20. Further, when the filter member 13 is correspondingly attached to the second molding portion 122 of the molding base 12, the filter member 13 corresponds to the photosensitive element 112, and an internal space 100 of the molding photosensitive assembly 10 is formed between the filter member 13 and the photosensitive element 112.
Further, as shown in fig. 3 and 4, the molding photosensitive assembly 10 may further include an adhesive layer 14, wherein the adhesive layer 14 is formed after the adhesive is cured, and the adhesive layer 14 is located between the lower surface 131 of the filter member 13 and the second upper surface 1221 of the second molding part 122 to firmly attach the filter member 13 to the molding part base 12, so that the filter member 13 corresponds to the photosensitive path 110 of the imaging assembly 11. More specifically, when the filter member 13 is attached to the second mold portion 122 of the mold base 12, the lower surface 131 of the filter member 13 faces downward to face the imaging component 11, and the upper surface 132 of the filter member 13 correspondingly faces upward to face the optical lens 20.
Since the adhesive forming the adhesive layer 14 has a certain fluidity before curing, especially when the filter member 13 is attached, the filter member 13 will press the adhesive before curing, so that the adhesive before curing will overflow inevitably, the existence of the outer space 1201 can also guide the adhesive to overflow outwards, so as to reduce the adhesive overflow inwards to a certain extent, so as to prevent the adhesive from flowing inwards to the first inner side surface 1213 of the first molding part 121 and the photosensitive element 112 of the imaging assembly 11, which helps to reduce the risk that the adhesive affects the imaging quality of the camera module 1.
In other words, precisely because the second upper surface 1221 of the second molding part 122 of the molding base 12 is higher than the first upper surface 1211 of the first molding part 121, so that the outer space 1201 of the molding base 12 is located around the second molding part 122 and serves as an overflow space for accommodating an adhesive on the molding base 12, when the filter member 13 is attached to the second upper surface 1221 of the second molding part 122 by the adhesive, the outer periphery of the second molding part 122 can be located in the outer space 1201 of the molding base 12, so that the adhesive before curing can overflow to the outer space 1201 of the molding base 12 (i.e., the outer space 1201 of the molding base 12 can serve as an overflow space of the molding base 12), so as to reduce the amount of the overflow of the adhesive, which helps reduce the influence on the image pickup module 1 due to the overflow of the adhesive to the photosensitive element 112 Is measured.
It is understood that, for the existing camera module 1P, as shown in fig. 1, although the provision of the groove 35P on the mold base 32P can further reduce the distance between the filter 33P and the photosensitive chip 311P, so as to minimize the thickness of the photosensitive assembly 30P, but after the filter 33P is attached to the groove 35P of the mold base 32P, not only there is no flash space around the filter 33P, the transition arc 351P of the groove 35P of the mold base 32P inevitably blocks the glue used for bonding the filter 33P from overflowing outwards, so that more glue will overflow inwards, which easily causes the glue to overflow inwards to the photosensitive chip 311P of the imaging assembly 31P, the photosensitive chip 311P is contaminated, and the imaging quality of the camera module is further affected. In the camera module 1 according to the first embodiment of the present invention, the mold base 12 of the mold photosensitive assembly 10 not only can provide a large enough and flat attaching surface for firmly and flatly attaching the filter member 13 without avoiding a transition arc surface; and can also provide the excessive space of outside overflow of adhesive to alleviate the inside overflow of adhesive before the solidification and influence the formation of image quality of the module of making a video recording.
It is noted that, in the above-mentioned first embodiment of the present invention, the adhesive layer 14 of the molded photosensitive assembly 10 can be, but is not limited to being, cured by glue such as heat-curing glue or the like, in other words, the adhesive forming the adhesive layer 14 can be, but is not limited to being, implemented by glue such as heat-curing glue or the like. Of course, in other examples of the present invention, the adhesive forming the adhesive layer 14 may also be implemented as other types of adhesive materials, such as a photo-curing adhesive, as long as the adhesive layer 14 can be formed to firmly attach the filter member 13 to the second upper surface 1221 of the second molding part 122, which is not described in detail herein.
According to the first embodiment of the present invention, as shown in fig. 3, the imaging assembly 11 of the molded photosensitive assembly 10 of the present invention further generally includes a set of electronic components 113, wherein each of the electronic components 113 may be mounted on the edge region of the circuit board 111 by a Surface Mount Technology (SMT) process, and each of the electronic components 113 is conductively connected to the circuit board 111. It is understood that each of the electronic components 113 may be located at the periphery of the light-sensing element 112, or located at the same side or opposite sides of the light-sensing element 112, for example, in a specific example, all the electronic components 113 may be divided into two rows and symmetrically disposed at two sides of the light-sensing element 112.
However, since the molding process has a minimum thickness, too small a molding thickness may cause difficulty in molding and imaging, in order to ensure that the molding base 12 can completely cover the electronic component 113, the third molding part 123 of the molding base 12 preferably corresponds to the electronic component 113 of the imaging assembly 11, and the third upper surface 1231 of the third molding part 123 is higher than the top surface of the electronic component 113, corresponding to the electronic component 113 of the imaging assembly 11, so as to ensure a sufficient molding thickness above the electronic component 113 through the third molding part 123.
In other words, as shown in fig. 3 and 4, the third molding part 123 is integrally formed at the first upper surface 1211 of the first molding part 121 such that the third upper surface 1231 of the third molding part 123 is higher than the first upper surface 1211 of the first molding part 121. In addition, since the third molding part 123 corresponds to the electronic component 113 of the imaging assembly 11, the first upper surface 1211 of the first molding part 121 may not be higher than the top surface of the electronic component 113 to completely cover the electronic component 113 through the third molding part 123 and the first molding part 121. It can be understood that the molding base 12 covers each electronic component 113 after molding, so that the molding base 12 isolates the adjacent electronic components 113 and isolates the electronic components 113 from the photosensitive element 112, so that the adjacent electronic components 113 do not interfere with each other, and even when the distance between the adjacent electronic components 113 is short, the imaging quality of the camera module 1 can be ensured. Therefore, a larger number of electronic components 113 can be mounted on the small-area circuit board 111, so that the structure of the molded photosensitive assembly 10 is more compact, and the imaging quality of the camera module 1 is improved on the basis of controlling the size of the camera module 1.
It should be noted that, just as the first upper surface 1211 of the first molding part 121 may be lower than the top surface of the electronic component 113, so that the second upper surface 1221 of the second molding part 122 may not be affected by the size of the electronic component 113, that is, the second upper surface 1221 of the second molding part 122 may also be lower than the top surface of the electronic component 113, so that the second upper surface 1221 of the second molding part 122 may also be lowered, so that the attaching height of the filter member 13 may be lowered, which is helpful for shortening the distance between the filter member 13 and the photosensitive element 112 of the imaging assembly 11, so as to reduce the back focus of the imaging module 1, and is beneficial for reducing the height of the imaging module 1.
It is worth mentioning that, in this first embodiment of the present invention, the filtering member 13 includes at least one filtering element, wherein each filtering element is correspondingly disposed on the photosensitive element 112 of the imaging assembly 11, so as to form each internal space 100 between each filtering element and the photosensitive element 112. In addition, the filter element is located between the optical lens 20 and the light sensing element 112, so that the light entering the camera module 1 from the optical lens 20 can be received by the light sensing area of the light sensing element 112 and photoelectrically converted after passing through the filter element, thereby improving the imaging quality of the camera module, for example, the filter element can filter the infrared part of the light entering the camera module 1 from the optical lens 20. Of course, in other examples of the present invention, the filter member 13 may further include an attached frame (not shown), wherein the attached frame is located at an edge of the filter element, so as to prevent the filter element from directly contacting the adhesive layer 14 through the attached frame, so as to prevent the filter element from being contaminated or corroded by the adhesive layer 14, and effectively prolong the service life of the filter element. It will be appreciated that in different examples of the camera module 1, the filter elements can be implemented in different types, for example as infrared cut-off filters, full-transmission-spectrum filters, and other filters or combinations of filters.
Furthermore, according to the first embodiment of the present invention, referring to fig. 2 and fig. 3, the camera module 1 may further include at least one driver 30, wherein each optical lens 20 is respectively assembled to each driver 30, and each driver 30 is respectively assembled to the third upper surface 1231 of the third molding part 123 of the molding base 12, so that each optical lens 10 is respectively held in the photosensitive path 110 of the imaging assembly 11 of the molding photosensitive assembly 10 to assemble a zoom camera module. In addition, when the camera module 1 is used, the driver 30 can drive the optical lens 20 to move back and forth along the photosensitive path 110 of the imaging assembly 11, so as to adjust the focal length of the camera module 1 by adjusting the distance between the optical lens 20 and the photosensitive element 112. The type of the driver 30 of the camera module of the present invention is not limited, and the driver 30 may be implemented as a voice coil motor, which can be electrically connected to the circuit board 111 to be in an operating state after receiving power and control signals to drive the optical lens 20 to move back and forth along the photosensitive path 110 of the imaging assembly 11. However, it will be understood by those skilled in the art that the type of the driver 30 is not limited as long as it can drive the optical lens 20 to move back and forth along the photosensitive path 110 of the imaging assembly 11.
Specifically, as shown in fig. 2 and 3, the optical lens 20 of the camera module 1 includes a lens barrel 21 and a lens group 22, wherein the lens barrel 21 is assembled to the actuator 30, and the lens group 22 is assembled to the lens barrel 21, wherein the actuator 30 is mounted on the third upper surface 1231 of the third molding portion 123 of the molding base 12, so that the lens group 22 of the optical lens 20 is held on the photosensitive path 110 of the imaging element 11 of the molding photosensitive element 10 by the actuator 30.
It is understood that, in other examples of the present invention, the camera module 1 may not include any driver 30, in other words, the lens barrel 21 of the optical lens 20 is directly assembled to the third upper surface 1231 of the third molding portion 123 of the molding base 12, wherein the lens group 22 is assembled to the lens barrel 21, so that the lens group 22 of the optical lens 20 is held on the photosensitive path 110 of the imaging element 11 of the molded photosensitive element 10 by the lens barrel 21. Of course, in another example of the present invention, the lens barrel 21 of the optical lens 20 and the third molding portion 123 of the molding base 12 may be integrally cured and molded by a molding material through a molding process, so as to enhance the stability and reliability of the camera module 1, which is not described in detail herein.
Fig. 5A and 5B show a first variant of the camera module 1 according to the above-described first embodiment of the invention. Specifically, the camera module 1 according to the first modified embodiment of the present invention differs from the above-described first embodiment of the present invention in that: a third outer side 1232 of the third molding part 123 of the molding base 12 is located inside the first outer side 1221 of the first molding part 121, that is, a maximum distance R between the third outer side 1232 of the third molding part 123 and the photosensitive path 110 of the imaging assembly 113Less than a minimum distance R between the first outer side surface 1221 of the first molding part 121 and the photosensitive path 110 of the image forming assembly 111I.e. R3＜R1An installation space is reserved for the driver 30 on the first upper surface 1211 of the first molding part 121 and outside the third molding part 123, so that the driver 30 is correspondingly installed on the first upper surface 1211 of the first molding part 121, which is helpful for reducing the overall height of the camera module 1.
In other words, as shown in fig. 5A, the third outer side 1232 of the third molding 123 of the mold base 12 is located inside the first outer side 1221 of the first molding 121, so that the driver 30 can be directly mounted to the first upper surface 1211 of the first molding 121 of the mold base 12. Since the first upper surface 1211 of the first molding part 121 is lower than the third upper surface 1231 of the third molding part 123, the installation height of the driver 30 is reduced, which helps to reduce the overall height of the camera module 1.
It should be noted that, in this modified embodiment of the present invention, since the third molding part 123 only needs to cover the top of the electronic component 113, that is, the position of the third molding part 123 only needs to correspond to the electronic component 113 of the imaging assembly 11, the third molding part 123 does not need to have a ring structure, and the position and the size of the third molding part 123 can be designed according to the position and the size of the electronic component 113. For example, as shown in fig. 5B, when all the electronic components 113 are located only outside the long sides of the filter member 13, the third molding part 123 may be implemented as two strip-shaped protrusions located outside the long sides of the filter member 13 to cover all the electronic components 113 with the strip-shaped protrusions, and the third molding part 123 is not located outside the short sides of the filter member 13 to reduce the weight of the mold base 12.
Preferably, as shown in fig. 5A, the third molding part 123 has a height greater than that of the second molding part 122, that is, the third upper surface 1231 of the third molding part 123 is higher than the second upper surface 1221 of the second molding part 122, so that the third molding part 123 is more easily molded. In particular, compared to the conventional camera module as shown in fig. 1, although there is still a transition arc at the junction of the third inner side surface 1233 of the third molding part 123 and the first upper surface 1211 of the first molding part 121, the second upper surface 1221 of the second molding part 122 is higher than the first upper surface 1211 of the first molding part 121 (i.e., the second upper surface 1221 of the second molding part 122 is located above the transition arc). In this way, when the filter member 13 is attached to the second upper surface 1221 of the second molding part 122, the edge of the filter member 13 does not need to be free from the transition arc surface, so that the edge of the filter member 13 can be closer to the third molding part 123, thereby maximizing the bottom supporting area of the filter member 13 and contributing to improving the reliability of the camera module 1.
More preferably, as shown in fig. 5A, the third upper surface 1231 of the third molding part 123 is higher than the upper surface 132 of the filter member 13, and the third upper surface 1231 of the third molding part 123 corresponds to the optical lens 20, so that a minimum distance between the third upper surface 1231 of the third molding part 123 and the optical lens 20 is smaller than a minimum distance between the upper surface 132 of the filter member 13 and the optical lens 20. In this way, during focusing or focusing of the image pickup module 1, when the optical lens 20 is driven by the driver 30 to approach the photosensitive element 112 of the imaging assembly 11, the third molding part 123 can also block the optical lens 20 from contacting the filter member 13 to prevent the optical lens 20 from colliding with the filter member 13, thereby effectively protecting the filter member 13 and the optical lens 20 from being damaged.
Most preferably, as shown in fig. 5A, the third upper surface 1231 of the third molding part 123 corresponds to only the lens barrel 22 of the optical lens 20, so that when the optical lens 20 is driven by the driver 30 to be close to the photosensitive element 112 of the imaging assembly 11, the third molding part 123 can only contact with the lens barrel 22 of the optical lens 20 to block the optical lens 20 from contacting the filter member 13, thereby avoiding the third molding part 123 from colliding with the lens group 21 of the optical lens 20, and helping to protect the lens group 21 of the optical lens 20.
Fig. 6 shows a second variant of the camera module 1 according to the above-described first embodiment of the invention. In particular, the camera module 1 according to the second variant embodiment of the invention differs from the first variant embodiment according to the invention in that: the mold base 12 of the mold photosensitive assembly 10 may further include a fourth mold part 124, wherein the fourth mold part 124 is recessed downward from the first upper surface 1211 of the first mold part 121, and the fourth mold part 124 is located outside the third mold part 123 to form a peripheral groove at an outer periphery of the first mold part 121, such that a bottom surface of the peripheral groove serves as a fourth upper surface 1241 of the fourth mold part 124, to provide a mounting surface for the actuator 30 (or the optical lens 20) through the fourth upper surface 1241 of the fourth mold part 124, such that the actuator 30 (or the optical lens 20) can be mounted to the fourth upper surface 1241 of the fourth mold part 124.
In other words, the fourth upper surface 1241 of the fourth molding part 124 is lower than the first upper surface 1211 of the first molding part 121, which helps to further reduce the installation height of the driver 30, and thus further reduce the overall height of the camera module 1. In particular, in this second variant embodiment of the present invention, the fourth molding part 124 is located at the outer periphery of the first molding part 121, so that the fourth upper surface 1241 of the fourth molding part 124 can be substantially lower than the top surface of the electronic component 113, which helps to reduce the mounting height of the driver 30 to the maximum extent, so that the height of the camera module 1 is minimized.
Preferably, as shown in fig. 6, the fourth upper surface 1241 of the fourth molding part 124 is matched with an end surface of the driver 30, so that when the driver 30 is mounted to the fourth upper surface 1241 of the fourth molding part 124, an outer peripheral surface of the driver 30 is flush with the first outer side surface 1221 of the first molding part 121 of the mold base 12, which helps to minimize the size of the camera module 1 and also helps to beautify the appearance of the camera module 1.
Fig. 7 shows a third variant of the camera module 1 according to the above-described first embodiment of the invention. Specifically, the camera module 1 according to the third modified embodiment of the present invention differs from the above-described first modified embodiment of the present invention in that: the molding base 12 of the molding photosensitive component 10 can further include a fourth molding portion 124 ', wherein the fourth molding portion 124 extends upward from the first upper surface 1211 of the first molding portion 121, and the fourth molding portion 124' is located outside the third molding portion 123 to form a peripheral protrusion on the outer periphery of the first molding portion 121, so as to provide a mounting surface for the driver 30 (or the optical lens 20) through a fourth upper surface 1241 'of the fourth molding portion 124', so as to meet the mounting requirement of the driver 30. In other words, the height of the fourth upper surface 1241 'of the fourth molding part 124' needs to be designed according to the installation requirements of the actuator 30 so as to fit the actuator 30 to the fourth upper surface 1241 'of the fourth molding part 124', limited by the installation requirements of the actuator 30 and the optical lens 20. For example, the fourth upper surface 1241 'of the fourth molding part 124' may be higher than the first upper surface 1211 of the first molding part 121 and lower than the third upper surface 1231 of the third molding part 123. Of course, in other examples of the present invention, the fourth upper surface 1241 'of the fourth molding part 124' may be higher than the third upper surface 1231 of the third molding part 123 to meet the installation requirement of the driver 30.
Fig. 8 shows a fourth variant of the camera module 1 according to the first embodiment of the invention described above. Specifically, the camera module 1 according to the fourth modified embodiment of the present invention differs from the above-described first embodiment of the present invention in that: the molding base 12 of the molded photosensitive assembly 10 does not include the third molding part 123, wherein the first upper surface 1211 of the first molding part 121 of the molding base 12 is higher than the top surface of the electronic component 113 of the imaging assembly 11 so as to completely wrap the electronic component 113 through the first molding part 121, wherein the driver 30 is directly mounted to the first upper surface 1211 of the first molding part 121.
Further, as shown in fig. 8, the second outer side 1222 of the second mold portion 122 is located inside the first outer side 1221 of the first mold portion 121, that is, a maximum distance R between the second outer side 1222 of the second mold portion 122 and the photosensitive path 110 of the image forming assembly 112Less than a minimum distance R between the first outer side surface 1221 of the first molding part 121 and the photosensitive path 110 of the image forming assembly 111I.e. R2＜R1So as to form an outer stepped structure on the mold base 12 by the first mold portion 121 and the second mold portion 122. The outer space 1201 of the mold base 12 is defined by the outer stepped structure of the mold base 12, that is, the outer side 1222 of the second mold part 122 and the first upper surface 1211 of the first mold part 121 define the outer space 1201 of the mold base 12, so that when the filter member 13 is attached to the second upper surface 1221 of the second mold part 122, the adhesive before curing can overflow to the outer space 1201 of the mold base 12 (as an overflow space of the mold base 12), so as to reduce the risk of the image quality of the image pickup module 1 being affected by the overflow of the adhesive to the photosensitive element 112.
Fig. 9 shows a fifth variant of the camera module 1 according to the above-described first embodiment of the invention. In particular, compared to the fourth variant embodiment of the invention described above, the camera module 1 according to the fifth variant embodiment of the invention differs in that: the second inner side surface 1223 of the second molded portion 122 of the mold base 12 of the molded photoreceptor assembly 10 is located outside the first inner side surface 1213 of the first molded portion 121, that is, the minimum distance r between the second inner side surface 1223 of the second molded portion 122 and the photoreceptor path 110 of the imaging assembly 112Is greater than the maximum distance r between the first inner side surface 1213 of the first molding part 121 and the photosensitive path 110 of the image forming assembly 111I.e. r2＞r1To pass through the second molding partThe second inner side surface 1223 of the second molding part 122 and the first upper surface 1211 of the first molding part 121 form an inner space 1202 of the molding base 12, wherein the inner space 1202 is located inside the second molding part 122 (to serve as an inner glue overflow space of the molding base 12), and is used for storing the adhesive overflowing from the second upper surface 1221 of the second molding part 122 inward, so as to prevent the adhesive from overflowing inward to the light sensing area of the light sensing element 112, which helps to ensure the imaging quality of the camera module 1.
It is worth mentioning that, after the filter member 13 is adhesively attached to the second upper surface 1221 of the second molding part 122 by the adhesive layer 14, the filter member 13 will seal the light window 120 of the molding base 12, so that the inner space 100 between the filter member 13 and the photosensitive element 112 of the imaging assembly 11 will form a closed space. When the adhesive forming the adhesive layer 14 is a heat-curable adhesive, after a ring of the heat-curable adhesive is applied between the filter member 13 and the second upper surface 1221 of the second molding portion 122 of the molding base 12, the heat-curable adhesive needs to be heated or baked to be completely cured to form the adhesive layer 14 having a ring-shaped structure. Thus, when the heat-curable adhesive is heated, the gas in the enclosed space between the filtering member 13 and the imaging assembly 11 will expand due to heating, and an outward force is applied to the filtering member 13, which may cause the filtering member 13 to shift or lift, and in severe cases, may cause the filtering member 13 to break. At the same time, the expansion of the gas in the enclosed space will also exert pressure on the photosensitive element 112, possibly causing damage to the photosensitive element 112, difficulty in assembling the camera module 1, and greatly reducing the reliability of the camera module 1.
Therefore, in order to solve the above problems, a second embodiment of the present invention provides a camera module and a molded photosensitive assembly. Specifically, as shown in fig. 10A and 10B, the image pickup module 1 according to the second embodiment of the present invention is different from the first embodiment according to the present invention in that: the second molding portion 122 of the molding base 12 of the molding photosensitive element 10 is provided with at least one notch 1224, so that when the filter element 13 is attached to the second upper surface 1221 of the second molding portion 122, an air escape hole 1203 of the module base 12 is formed at the notch 1224 of the second molding portion 122, so as to communicate the internal space 100 of the molding photosensitive element 10 with the outside of the molding photosensitive element 10 through the air escape hole 1203, so that the internal space 100 of the molding photosensitive element 10 forms a non-closed space.
Thus, when the adhesive is heated to be cured, the gas in the internal space 100 of the molding photosensitive assembly 10 can escape through the escape hole 1203, so that the gas pressure in the internal space 100 of the molding photosensitive assembly 10 is kept constant (equal to the atmospheric pressure), and the application of force to the filter element 13 and the photosensitive element 112 is avoided, which helps to protect the filter element 13 and the photosensitive element 112 from being damaged due to the expansion of the gas. Of course, after the adhesive is heated and cured, the gas in the internal space 100 of the molding photosensitive assembly 10 will reduce its volume due to cooling, and at this time, the gas outside the molding photosensitive assembly 10 can enter the internal space 100 of the molding photosensitive assembly 10 through the air escape hole 1203, so as to keep the gas pressure in the internal space 100 constant and prevent the filter element 13 and the photosensitive element 112 from being damaged due to heating or cooling.
It can be understood that, in the conventional camera module 1P as shown in fig. 1, since the filter 33P is directly attached to the recess 35P of the mold base 32P, it is extremely difficult to provide a notch on the mold base 32P to form an air escape hole, so that it is difficult to form an unclosed space in the inner space of the mold photosensitive element 3P. In the camera module 1 of the present invention, since the second molding portion 122 extends upward from the first molding portion 121 to form a protrusion on the first upper surface 1211 of the first molding portion 121, the second molding portion 122 is easy to be notched, and therefore the second molding portion 122 not only can provide a flat attaching surface for the filter member 13, but also can provide a convenient condition for forming the air escape hole 1203 on the molding base 12.
Further, as shown in fig. 10A and 10B, the gap 1224 of the second molded portion 122 extends transversely from the second inner side 1223 of the second molded portion 122 to the second outer side 1222 of the second molded portion 122 to form a transverse gap in the second molded portion 122. Thus, when the filter member 13 is adhered to the second upper surface 1221 of the second molding part 122 by the adhesive layer 14, the notches 1224 of the second molding part 122 form air escape holes 1203 arranged transversely, so as to increase the difficulty of dust entering the internal space 100 of the molded photosensitive assembly 10 through the air escape holes 1203, which is helpful for ensuring the working performance of the camera module 1.
Preferably, as shown in fig. 10A, the notch 1224 of the second molding part 122 corresponds to a long side of the filter member 13, so that both sides of the notch 1224 have the long adhesive layer 14 to adhere the filter member 13, so as to enhance the adhesive strength between the filter member 13 and the second molding part 122. Of course, in other examples of the present invention, the notch 1224 of the second molding portion 122 may be located at other positions corresponding to the filter member 13, as long as the air escape hole 1203 for communicating the internal space 100 of the molding photosensitive assembly 10 with the outside of the molding photosensitive assembly 10 can be formed, and details thereof are not repeated herein.
More preferably, as shown in fig. 10A, after the adhesive is cured to form the adhesive layer 14, the adhesive may be applied again at the notch 1224 of the second molding part 122 to form a reinforcing adhesive block 15 after the adhesive is cured, so that the adhesive strength between the filter member 13 and the second molding part 122 at the notch 1224 is enhanced by the reinforcing adhesive block 15 to ensure that the filter member 13 is firmly attached to the second molding part 122. In other words, an adhesive may be applied to the air escape holes 1203 of the mold base 12 to form the reinforcing adhesive block 15 for enhancing the adhesive strength between the filter member 13 and the second mold portion 122. In addition, the reinforcing adhesive block 15 can also seal the air escape hole 1203, so as to prevent external dust from entering the internal space 100 of the molded photosensitive assembly 10 through the air escape hole 1203, which is helpful for ensuring the imaging quality of the camera module 1. It is understood that although the reinforcing adhesive block 15 will block the air escape hole 1203, the filter member 13 is firmly attached to the molding base 12 by the adhesive layer 14, and the temperature change is small during the subsequent assembly and use, so that the air pressure change in the internal space 100 of the molding photosensitive assembly 10 is also small, and therefore the temperature change is not enough to substantially affect the filter member 13.
Fig. 11A and 11B show a modified embodiment of the camera module 1 according to the second embodiment of the present invention, wherein the mold base 12 of the mold photosensitive assembly 10 may further include a mold reinforcing portion 125, wherein the mold reinforcing portion 125 integrally extends outward from the second outer side 1222 of the second mold portion 122 at the notch 1224 of the second mold portion 122, so that the bonding area of the bonding layer 14 at the notch 1224 becomes larger, which helps to increase the bonding strength between the filter member 13 and the second mold portion 122 at the notch 1224, and prevent the filter member 13 from cracking at the notch 1224 of the second mold portion 122 due to insufficient bonding strength of the bonding layer 14.
Preferably, as shown in fig. 11A, the mold reinforcement part 125 is integrally connected with the first mold part 121 to form a reinforcing rib between the second outer side 1222 of the second mold part 122 and the first upper surface 1211 of the first mold part 121, which helps to enhance the connection strength of the second mold part 122 and the first mold part 121 at the notch 1224.
It is worth mentioning that in other examples of the present invention, the molding reinforcement part 125 may integrally extend from the second molding part 122 to the third molding part 123, such that one end of the molding reinforcement part 125 is integrally connected with the second molding part 122, and the other end of the molding reinforcement part 125 is integrally connected with the third molding part 123, which helps to further enhance the connection strength of the second molding part 122 at the notch 1224.
In addition, in this modified embodiment of the present invention, the molding reinforcement portion 123 will extend the length of the notch 1224 of the second molding portion 122, so that the length of the air escape hole 1203 of the molding base 12 is also lengthened, which helps to further increase the difficulty of external dust entering the internal space 100 of the molded photosensitive assembly 10 through the air escape hole 1203. It is understood that, as shown in fig. 11B, since the mold reinforcement portion 123 protrudes from the second outer side 1222 of the second mold portion 122, it helps guide a worker or a machine to apply an adhesive (e.g., a patch) at the mold reinforcement portion 123 to form the reinforcement adhesive block 15. In addition, the molding reinforcement portion 123 can prevent the adhesive before curing from flowing freely, so as to completely close the air escape hole 1203, and enhance the adhesive strength between the filter member 13 and the second molding portion 122 at the notch 1224 to the maximum extent. It should be noted that, in the second embodiment of the present invention, except for the above-mentioned structure, other structures of the camera module 1 are the same as those of the camera module 1 according to the first embodiment of the present invention, and the camera module 1 also has a modified embodiment similar or identical to that of the camera module 1 of the first embodiment, and are not repeated herein.
It should be noted that, referring to fig. 12 to 14, which are schematic diagrams illustrating a manufacturing process of a module photosensitive assembly 10 and a manufacturing process of a camera module 1 according to a third embodiment of the present invention, it should be understood by those skilled in the art that the manufacturing process of the molded photosensitive assembly 10 and the manufacturing process of the camera module 1 illustrated in fig. 12 to 14 are only examples to illustrate the features and advantages of the present invention, and do not limit the content and scope of the present invention.
Specifically, in fig. 12, the photosensitive element 112 is first conductively attached to the circuit board 111 to assemble the imaging assembly 11; then, the first molding part 121 of the molding base 12, the second molding part 122 having the notch 1224, and a third molding part 123 located outside the second molding part 122 are molded on the imaging component 11 by a molding mold, wherein the first upper surface 1211 of the first molding part 121 is lower than the second upper surface 1211 of the second molding part 122 in the height direction, and the third molding part 123 is spaced apart from the second molding part 122 to form an outer space 1201 between the third molding part 123 and the second molding part 122. It is understood that the present invention can effectively eliminate the adverse effect of the transition arc surface on the molding base 12 on the attachment of the filter member 13 by designing the upper mold of the forming mold (such as the position distribution and the size of the protrusion in the upper mold) to form a gap or a groove (i.e., the outer space 1201) between the second molding part 122 and the third molding part 123 when the molding base 12 is molded, so that the edge of the filter member 13 can be accommodated at the outer space 1201 without avoiding the transition arc surface on the molding base 12.
In fig. 13A, an adhesive is applied on the second upper surface 1211 of the second molding part 122 of the molding base 12, so that after the filter member 13 is correspondingly disposed on the light window 120 of the molding base 12, the adhesive is cured to form an adhesive layer 14 between the lower surface 131 of the filter member 13 and the second upper surface 1211 of the second molding part 122, so that the filter member 13 is firmly adhered to the second molding part 122 of the molding base 12 through the adhesive layer 14 to assemble the molded photosensitive assembly 10. Meanwhile, the air escape hole 1203 of the molding base 12 is formed at the notch 1224 of the second molding portion 122 to communicate the internal space 100 of the molding photosensitive assembly 10 with the outside of the molding photosensitive assembly 10 through the air escape hole 1203, so that the internal space 100 of the molding photosensitive assembly 10 is implemented as a non-closed space.
In a modified embodiment shown in fig. 13B, an adhesive may be applied on the lower surface 131 of the filter member 13, so that after the filter member 13 is disposed on the optical window 120 of the mold base 12, the adhesive is cured to form an adhesive layer 14 between the lower surface 131 of the filter member 13 and the second upper surface 1211 of the second mold part 122, so that the filter member 13 is firmly adhered to the second mold part 122 of the mold base 12 through the adhesive layer 14 to assemble the molded photosensitive assembly 10. Meanwhile, the air escape hole 1203 of the molding base 12 is formed at the notch 1224 of the second molding portion 122 to communicate the internal space 100 of the molding photosensitive assembly 10 with the outside of the molding photosensitive assembly 10 through the air escape hole 1203, so that the internal space 100 of the molding photosensitive assembly 10 is implemented as a non-closed space.
It is noted that in this embodiment of the present invention, a full circle of adhesive may be applied, but not limited to, continuously on the second molding part 22 or the filter member 13 to form the adhesive layer 14 having a ring-shaped structure after the adhesive is cured. Of course, in other examples of the present invention, an adhesive may be intermittently applied to the second molding part 22 or the filter member 13 to form the adhesive layer 14 having a non-annular structure after the adhesive is cured, so that air escape holes are also formed at the break of the adhesive layer 14.
In fig. 14, an adhesive is applied again to the air escape holes 1203 of the mold base 12 to form the reinforced adhesive blocks 15 for blocking the air escape holes 1203 after the adhesive is cured, so that the adhesive strength of the adhesive layer 14 at the notches 1224 of the second mold part 122 is enhanced by the reinforced adhesive blocks 15; then, the optical lens 20 is assembled to the actuator 30, and the actuator 30 is assembled to the third upper surface 1231 of the third molding part 123 of the molding base 12, so that the optical lens 20 is held on the photosensitive path 110 of the imaging module 11, thereby assembling the camera module 1.
According to another aspect of the present invention, referring to fig. 15 to 17, an embodiment of the present invention further provides a method for manufacturing a camera module. Specifically, as shown in fig. 15, the method for manufacturing the camera module 1 includes the steps of:
s410: conductively mounting a photosensitive element 112 on a circuit board 111 to form an imaging assembly 11;
s420, forming a mold base 12 on the imaging component 11 by a molding mold, wherein the mold base 12 includes a first mold portion 121 and a second mold portion 122, wherein the first mold portion 121 covers a portion of the imaging component 11, wherein the second mold portion 122 is integrally formed on a first upper surface 1211 of the first mold portion 121, and a second upper surface 1221 of the second mold portion 122 is higher than the first upper surface 1211 of the first mold portion 121, so as to define an outer space 1201 defined by a second outer side 1222 of the second mold portion 122 and the first upper surface 1211 of the first mold portion 121;
s430, attaching the light filtering member 13 to the second upper surface 1221 of the second molding part 122 to assemble the molded photosensitive assembly 10; and
s440, correspondingly disposing at least one optical lens 20 on the molded photosensitive element 10.
It is noted that, in this example of the present invention, as shown in fig. 15, before the step S420, the method for manufacturing the camera module 1 may further include the steps of:
s400: a set of electronic components 113 are mounted on the circuit board 111 at intervals, wherein each electronic component 113 is conductively connected to the circuit board 111.
Further, in an example of the present invention, the mold base 12 further includes a third mold portion 123, wherein the third mold portion 123 is integrally formed on the first upper surface 1211 of the first mold portion 121, wherein the third mold portion 123 is located outside the second mold portion 122, and the third mold portion 123 is spaced apart from the second mold portion 122 to form the outer space 1201 between a third inner side 1233 of the third mold portion 123 and a second outer side 1222 of the second mold portion 122.
In one example of the present invention, the second molded portion 122 of the molded base 12 is provided with at least one notch 1224, wherein the notch 1224 extends from the second inner side 1223 of the second molded portion 122 to the second outer side 1222 of the second molded portion 122.
It should be noted that, in an example of the present invention, as shown in fig. 16, the step S430 of the method for manufacturing the camera module 1 may include the steps of:
s431: applying an adhesive to the second upper surface 1221 of the second molding part 122;
s432: correspondingly disposing the light filtering member 13 on the second molding portion 122, and forming an air escape hole 1203 communicating the internal space 100 of the molding photosensitive assembly 10 and the outside of the molding photosensitive assembly 10 through the notch 1224 of the second molding portion 122; and
s433: the adhesive is heated or irradiated with light to form the adhesive layer 14 between the lower surface 131 of the filter member 13 and the second upper surface 1221 of the second molding part 122.
In another example of the present invention, as shown in fig. 16, the step S430 of the method for manufacturing the image pickup module 1 may include the steps of:
s431': applying an adhesive to the lower surface 131 of the filter member 13;
s432': correspondingly disposing the light filtering member 13 on the second molding portion 122, and forming an air escape hole 1203 communicating the internal space 100 of the molding photosensitive assembly 10 and the outside of the molding photosensitive assembly 10 through the notch 1224 of the second molding portion 122; and
s433': the adhesive is heated or irradiated with light to form the adhesive layer 14 between the lower surface 131 of the filter member 13 and the second upper surface 1221 of the second molding part 122.
It should be noted that, in an example of the present invention, as shown in fig. 17, the step S440 of the method for manufacturing the camera module 1 may include the steps of:
s441: assembling the optical lens 20 to an actuator 30; and
s442: correspondingly assembling the driver 30 to the mold base 12 to assemble the zoom camera module.
In another example of the present invention, as shown in fig. 17, the step S440 of the method for manufacturing the image pickup module 1 may include the steps of:
s441': a lens barrel 21 of the optical lens 20 is assembled on the molding base 12, and a lens group 22 of the optical lens 20 corresponds to the photosensitive path 110 of the imaging assembly 11 to assemble a fixed focus camera module.
Referring to fig. 18, according to another aspect of the present invention, the present invention further provides an electronic apparatus, wherein the electronic apparatus includes an electronic apparatus body 500 and at least one camera module 1, wherein each camera module 1 is respectively disposed on the electronic apparatus body 500 for obtaining an image. It should be noted that the type of the electronic device body 500 is not limited, for example, the electronic device body 500 may be any electronic device capable of being configured with the camera module 1, such as a smart phone, a tablet computer, a notebook computer, an electronic book, a personal digital assistant, a camera, and the like. It will be understood by those skilled in the art that although fig. 18 illustrates the electronic device body 500 implemented as a smart phone, it does not limit the content and scope of the invention.
It is noted that references to "upper", "lower", "inner", "outer", etc., in this disclosure are made based on the orientation or positional relationship shown in the drawings, which are for convenience in describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation. For example, the surface of the first molding part 121 away from the imaging component 11 is a first upper surface 1211 of the first molding part 121, and the surface of the first molding part 121 contacting the imaging component 11 is a lower surface of the first molding part 121 (as shown in fig. 3); for another example, a side of the first molding part 121 adjacent to the optical window 120 is a first inner side 1213 of the first molding part 121, and a side of the first molding part 121 away from the optical window 120 is a first outer side 1221 of the first molding part 121 (as shown in fig. 3).
It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.

Claims (34)

1. A molded photosensitive component, wherein said molded photosensitive component comprises:
an imaging assembly;
a molded base, wherein the molded base comprises:
a first molding, wherein the first molding encapsulates a portion of the imaging assembly, wherein the first molding has a first upper surface; and
a second molding, wherein the second molding is integrally formed on the first upper surface of the first molding, wherein the second molding has a second upper surface and a second outer side; and
a filter member, wherein the filter member is correspondingly disposed on the second upper surface of the second molding part;
wherein the second upper surface of the second molding part is higher than the first upper surface of the first molding part to define an outer space by the second outer side of the second molding part and the first upper surface of the first molding part.
2. The molded photosensitive assembly of claim 1, wherein said second upper surface of said second molded portion is a flat surface.
3. The molded photosensitive assembly of claim 1, wherein said mold base further comprises a third mold portion, wherein said third mold portion integrally extends upward from said first upper surface of said first mold portion, wherein said third mold portion is located outside said second mold portion, and wherein said third mold portion is spaced apart from said second mold portion.
4. The molded photosensitive assembly of claim 3, wherein a distance between a third inner side of said third molded portion and said second outer side of said second molded portion is not less than 0.01 millimeters.
5. The molded photosensitive assembly of claim 1, wherein a difference in height between said second upper surface of said second molded portion and said first upper surface of said first molded portion is between 0.03 millimeters and 0.2 millimeters.
6. The molding photosensitive assembly of claim 1, further comprising an adhesive layer, wherein the adhesive layer is formed after the adhesive is cured, wherein the adhesive layer is located between a lower surface of the filter member and the second upper surface of the second molding part to attach the filter member to the second upper surface of the second molding part.
7. The molded photosensitive assembly of claim 6, wherein the second inner side surface of the second molded portion is positioned outside the first inner side surface of the first molded portion to form an internal space inside the second molded portion.
8. The molded photosensitive assembly of claim 3, wherein the imaging assembly comprises a circuit board, a photosensitive element conductively attached to the circuit board, and a set of electronic components conductively connected to the circuit board, wherein the third molding portion corresponds to the electronic components, and the third upper surface of the third molding portion is higher than the top surface of the electronic components.
9. The molded photosensitive assembly of claim 8 wherein said first upper surface of said first mold portion of said mold base is lower than said top surface of said electronic component.
10. The molded photosensitive assembly of claim 8, wherein a third outer side of said third molded portion of said mold base is located inside said first outer side of said first molded portion such that a portion of said first upper surface of said first molded portion outside said third molded portion is used for mounting at least one optical lens.
11. The molded photosensitive assembly of claim 10, wherein said mold base further comprises a fourth molded portion, wherein said fourth molded portion is recessed downward from said first upper surface of said first molded portion to form a peripheral groove at an outer periphery of said first molded portion, and wherein a fourth upper surface of said fourth molded portion is used for providing a mounting surface for mounting the optical lens.
12. The molded photosensitive assembly of claim 10, wherein said mold base further comprises a fourth molding portion, wherein said fourth molding portion extends upward from said first upper surface of said first molding portion to form a peripheral protrusion at an outer periphery of said first molding portion, and wherein a fourth upper surface of said fourth molding portion is used for providing a mounting surface for mounting the optical lens.
13. The molded photosensitive assembly of claim 8, wherein said third upper surface of said third molded portion of said molded base is higher than said second upper surface of said second molded portion.
14. The molding photosensitive assembly of claim 13, wherein the third upper surface of the third molding portion is higher than an upper surface of the filter member, and the third upper surface of the third molding portion is adapted to correspond to at least one optical lens.
15. The molded photosensitive assembly of claim 8, wherein said third molding portion is designed according to the size and position of said electronic component.
16. The molded photosensitive assembly of claim 6 or 7, wherein the adhesive layer is cured from a photo-curable adhesive or a thermal-curable adhesive.
17. The molding photosensitive assembly according to any one of claims 1 to 15, wherein the second molding portion of the molding base is provided with at least one notch to form an escape hole at the notch of the second molding portion when the filter member is attached to the second upper surface of the second molding portion, so as to communicate an inner space of the molding photosensitive assembly with an outside of the molding photosensitive assembly through the escape hole.
18. The molding photosensitive assembly according to claim 16, wherein the second molding portion of the molding base is provided with at least one notch to form an escape hole at the notch of the second molding portion when the filter member is bonded to the second upper surface of the second molding portion by the adhesive layer, so as to communicate an inner space of the molding photosensitive assembly with an outside of the molding photosensitive assembly through the escape hole.
19. The molded photosensitive assembly of claim 18, wherein said notch of said second molded portion extends laterally from a second inner side of said second molded portion to a second outer side of said second molded portion to form said laterally disposed air escape aperture.
20. The molded photosensitive assembly of claim 19, wherein said mold base further comprises a mold reinforcement portion, wherein said mold reinforcement portion integrally extends outwardly from said second mold portion at said notch of said second mold portion.
21. The molded photosensitive assembly of claim 20, wherein said mold reinforcement portion is integrally connected with said first mold portion to form a reinforcing rib between said second outer side of said second mold portion and said first upper surface of said first mold portion.
22. The molded photosensitive assembly of claim 18, further comprising a reinforcing adhesive block, wherein said reinforcing adhesive block is cured by an adhesive applied at said gap of said second molded portion.
23. The utility model provides a module of making a video recording which characterized in that includes:
at least one optical lens; and
the molding photosensitive assembly of any one of claims 1 to 22, wherein each of the optical lenses is correspondingly disposed to the molding photosensitive assembly, and the optical lens corresponds to a photosensitive path of the imaging assembly of the molding photosensitive assembly.
24. The camera module of claim 23, further comprising at least one driver, wherein each driver is assembled to the molded base of the molded photosensitive element, and each optical lens is assembled to the driver, respectively, to assemble the zoom camera module.
25. The camera module of claim 23, wherein each of the optical lenses comprises a lens barrel and a lens group, wherein the lens barrel is disposed on the molded base of the molded photosensitive assembly, and each of the optical lenses is assembled to the lens barrel to form the fixed focus camera module.
26. An electronic device, comprising:
an electronic device body; and
at least one camera module according to any one of claims 23 to 25, wherein each camera module is disposed on the electronic device body for capturing images.
27. A method for manufacturing a camera module is characterized by comprising the following steps:
a photosensitive element is conductively mounted on a circuit board to form an imaging component;
forming a molding base on the imaging component by using a forming mold, wherein the module base comprises a first molding part and a second molding part, the first molding part covers a part of the imaging component, the second molding part is integrally formed on a first upper surface of the first molding part, and a second upper surface of the second molding part is higher than the first upper surface of the first molding part, so that an outer space is defined by a second outer side surface of the second molding part and the first upper surface of the first molding part;
attaching the light filtering member to the second upper surface of the second molding part to assemble the molded photosensitive assembly; and
correspondingly, at least one optical lens is arranged on the molding photosensitive assembly.
28. The method for manufacturing a camera module of claim 27, wherein before the step of molding a mold base on the imaging element by the molding die, the method further comprises the steps of:
and mounting a group of electronic components on the circuit board at intervals, wherein each electronic component is respectively connected with the circuit board in a conducting manner.
29. The method of claim 28, wherein in the step of molding a mold base on the imaging assembly with a mold, the step of:
the molding base further comprises a third molding part, wherein the third molding part is integrally formed on the first upper surface of the first molding part, the third molding part is positioned outside the second molding part, and the third molding part and the second molding part are arranged at a distance.
30. The method of claim 29, wherein in the step of molding a mold base on the imaging assembly with a mold, the step of:
the second molding part of the molding base is provided with at least one notch, wherein the notch extends from the second inner side surface of the second molding part to the second outer side surface of the second molding part.
31. The method of claim 30, wherein the step of attaching the filter member to the second top surface of the second mold portion to assemble the molded photosensitive assembly comprises the steps of:
applying an adhesive to the second upper surface of the second molding part;
correspondingly arranging the light filtering component on the second molding part, and forming an air escape hole communicating the inner space of the molding photosensitive assembly and the outside of the molding photosensitive assembly through the notch of the second molding part; and
heating or irradiating light to form the adhesive layer between the lower surface of the filter member and the second upper surface of the second molding part.
32. The method of claim 30, wherein the step of attaching the filter member to the second top surface of the second mold portion to assemble the molded photosensitive assembly comprises the steps of:
applying an adhesive to the lower surface of the filter member;
correspondingly arranging the light filtering component on the second molding part, and forming an air escape hole communicating the inner space of the molding photosensitive assembly and the outside of the molding photosensitive assembly through the notch of the second molding part; and
heating or irradiating light to form the adhesive layer between the lower surface of the filter member and the second upper surface of the second molding part.
33. The method for manufacturing a camera module according to any of claims 27-32, wherein the step of correspondingly disposing at least one optical lens on the molded photosensitive element comprises the steps of:
assembling the optical lens to a driver; and
correspondingly assembling the driver to the molding base of the molding photosensitive assembly so as to assemble the zoom camera module.
34. The method for manufacturing a camera module according to any of claims 27-32, wherein the step of correspondingly disposing at least one optical lens on the molded photosensitive element comprises the steps of:
and assembling a lens barrel of the optical lens on the molding base of the molding photosensitive assembly, wherein a lens group of the optical lens corresponds to the photosensitive path of the imaging assembly so as to assemble a fixed-focus camera module.
CN201910292636.0A 2019-04-12 2019-04-12 Camera module, molded photosensitive assembly, manufacturing method of camera module and molded photosensitive assembly, and electronic equipment Pending CN111818241A (en)

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Application Number Priority Date Filing Date Title
CN201910292636.0A CN111818241A (en) 2019-04-12 2019-04-12 Camera module, molded photosensitive assembly, manufacturing method of camera module and molded photosensitive assembly, and electronic equipment
US17/603,183 US11906879B2 (en) 2019-04-12 2020-03-02 Camera module, molded photosensitive assembly and manufacturing method thereof, and electronic device
PCT/CN2020/077380 WO2020207145A1 (en) 2019-04-12 2020-03-02 Camera module, molded photosensitive assembly and manufacturing method therefor, and electronic device
EP20787862.0A EP3955561A4 (en) 2019-04-12 2020-03-02 Camera module, molded photosensitive assembly and manufacturing method therefor, and electronic device

Applications Claiming Priority (1)

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CN201910292636.0A CN111818241A (en) 2019-04-12 2019-04-12 Camera module, molded photosensitive assembly, manufacturing method of camera module and molded photosensitive assembly, and electronic equipment

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