CN113014752B

CN113014752B - Optical assembly, photosensitive assembly, camera module and preparation method of optical assembly

Info

Publication number: CN113014752B
Application number: CN202010136290.8A
Authority: CN
Inventors: 陈烈烽; 梅哲文; 叶林敏; 孟楠; 方银丽; 王天一
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2019-12-20
Filing date: 2020-03-02
Publication date: 2022-08-26
Anticipated expiration: 2040-03-02
Also published as: CN113014751B; CN113009749A; WO2021120954A1; CN114982215A; CN113014752A; CN113009668A; CN113009749B; CN113093365A; CN113014751A; CN113009668B

Abstract

The application discloses optical assembly, photosensitive assembly, camera module and optical assembly's preparation method. The optical assembly includes: the light-filtering device comprises a light-filtering element, a bracket for bearing the light-filtering element and a dielectric layer, wherein the dielectric layer is arranged between the circuit board and the photosensitive chip and has preset flexibility for preventing the stress value borne by the light-filtering element from exceeding a preset threshold value. Therefore, the dielectric layer is arranged between the filter element and the supporting part of the filter element in the camera module, so that the phenomenon that the deformation quantity generated by the filter element exceeds a preset threshold value due to the fact that the stress generated by the deformation of the supporting part of the filter element is concentrated on the filter element, the damage of the filter element is caused, and the imaging quality of the camera module is reduced is avoided.

Description

Optical assembly, photosensitive assembly, camera module and preparation method of optical assembly

Technical Field

The application relates to the field of camera modules, and more specifically relates to an optical assembly, a photosensitive assembly, a camera module and a preparation method of the optical assembly, wherein a dielectric layer is arranged between a filter element and a supporting part of the filter element in the camera module, so that the phenomenon that the stress generated by the deformation of the supporting part of the filter element is concentrated on the filter element to cause the deformation generated by the filter element to exceed a preset threshold value, and the damage of the filter element and the reduction of the imaging quality of the camera module are avoided.

Background

With the popularization of mobile electronic devices, technologies related to camera modules applied to mobile electronic devices for helping users to obtain images (e.g., videos or images) have been rapidly developed and advanced, and in recent years, camera modules have been widely applied to various fields such as medical treatment, security, industrial production, and the like.

In order to meet the increasingly wide market demands, a high-pixel, large-chip, small-size and large-aperture camera module is an irreversible development trend of the existing camera module. As the size of the photosensitive chip is gradually increased, the size of the filter element matched with the photosensitive chip is also increased correspondingly.

It will be appreciated by those skilled in the art that filter elements are sensitive and fragile components, which sensitivity and fragility will further increase with increasing size. In practical industrial applications, a number of problems have arisen following an increase in the size of the filter element, for example, the filter element is more susceptible to breakage or even breakage, the filter element is tilted with respect to the photo-sensing chip, and the like.

Therefore, an effective solution is needed to ensure the stability of the filter element.

Disclosure of Invention

The main objective of the present application is to provide an optical assembly, a photosensitive assembly, a camera module and a method for manufacturing the optical assembly, wherein a dielectric layer is disposed between a filter element and a supporting portion of the filter element in the camera module, so as to prevent the stress generated by deformation of the supporting portion of the filter element from concentrating on the filter element and causing the amount of deformation generated by the filter element to exceed a predetermined threshold, thereby causing damage to the filter element and reduction of imaging quality of the camera module.

According to an aspect of the present application, there is provided an optical assembly including:

a filter element;

the bracket is used for bearing the filter element; and

and the dielectric layer is arranged between the bracket and the filter element and has predetermined flexibility for preventing the deformation of the filter element from exceeding a predetermined threshold value.

In an optical module according to the present application, the filter element is mounted to the holder through the dielectric layer.

In the optical assembly according to the present application, the optical assembly further includes a support disposed on the bracket, the support and the surface of the bracket form a receiving cavity, wherein the dielectric layer is formed by curing an adhesive applied in the receiving cavity.

In an optical assembly according to the present application, the optical assembly further includes an adhesive member, and the dielectric layer is connected to the holder and the filter element through the adhesive member, respectively.

In an optical module according to the present application, the optical module further includes an adhesive member, wherein the dielectric layer is integrally formed with the holder, and the dielectric layer is connected to the filter element by the adhesive member.

In an optical module according to the present application, the optical module further includes an adhesive member, wherein the dielectric layer is integrally formed on a lower surface of the filter element, and the dielectric layer is connected to the bracket by the adhesive member.

In an optical assembly according to the present application, the dielectric layer is made of a flexible material having a shore hardness of 10HSA-70 HSA.

In the optical assembly according to the present application, the dielectric layer is made of any one material selected from foam, a combination of plastic and foam, soft gel and silica gel.

In the optical component according to the present application, when the dielectric layer is made of foam, the thickness of the dielectric layer is 80um to 130 um.

In the optical assembly according to the present application, when the dielectric layer is made of soft glue, the thickness of the dielectric layer is 20um-100 um.

In an optical assembly according to the present application, the dielectric layer has a thickness of 50um to 100 um.

In the optical component according to the present application, the deformation amount that can occur in the dielectric layer is 5% to 50% of its thickness.

In an optical module according to the present application, the holder includes a support portion and a suspended portion extending inward from the support portion, and the filter element is attached to the suspended portion.

In an optical module according to the present application, an upper surface of the suspending portion is lower than an upper surface of the supporting portion, and an upper surface of the filter element is lower than an upper surface of the supporting portion.

According to another aspect of the present application, there is also provided a photosensitive assembly, including:

a circuit board;

the photosensitive chip is electrically connected with the circuit board; and

the optical assembly as described above, wherein the optical assembly is disposed on the circuit board, and the filter element is located in a photosensitive path of the photosensitive chip.

In the photosensitive assembly according to the application, the photosensitive assembly further comprises a base arranged on the circuit board, wherein the optical assembly is arranged on the base.

According to still another aspect of the present application, there is also provided a camera module, including:

an optical lens; and

a photosensitive assembly, the optical lens being held in a photosensitive path of the photosensitive assembly, wherein the photosensitive assembly comprises the optical assembly as described above.

According to still another aspect of the present application, there is also provided a method of manufacturing an optical component, including:

providing a filter element and a support; and

a dielectric layer is formed between the support and the filter element.

In a manufacturing method according to the present application, forming a dielectric layer between the support and the filter element includes: forming the dielectric layer on the support; and mounting the filter element on the dielectric layer.

In a manufacturing method according to the present application, forming a dielectric layer between the support and the filter element includes: forming the dielectric layer on the lower surface of the light filtering element; and attaching the filter element with the dielectric layer to the bracket.

In a manufacturing method according to the present application, forming the dielectric layer on the support includes: applying an adhesive to the support; and attaching the medium layer to the adhesive member to form the medium layer on the support.

In a manufacturing method according to the present application, forming the dielectric layer on the support includes: and integrally forming the dielectric layer on the support.

In a manufacturing method according to the present application, mounting the filter element on the dielectric layer includes:

applying a bonding piece on the dielectric layer; and mounting the filter element on the bonding piece so as to mount the filter element on the dielectric layer.

In a manufacturing method according to the present application, forming a dielectric layer between the support and the filter element includes: arranging a support piece on the bracket, wherein the support piece and the surface of the bracket form an accommodating cavity; applying an adhesive in the accommodating cavity; attaching the filter element to the adhesive; and curing the adhesive to form a dielectric layer between the support and the filter element.

In the production method according to the present application, the method further comprises: removing the support member.

Further objects and advantages of the present application will become apparent from an understanding of the ensuing description and drawings.

These and other objects, features and advantages of the present application will become more fully apparent from the following detailed description, the accompanying drawings and the claims.

Drawings

The above and other objects, features and advantages of the present application will become more apparent by describing in more detail embodiments of the present application with reference to the attached drawings. The accompanying drawings are included to provide a further understanding of the embodiments of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. In the drawings, like reference numbers generally represent like parts or steps.

Fig. 1 is a schematic diagram illustrating a filter element of a conventional camera module being tilted with respect to a photosensitive chip.

FIG. 2 illustrates a schematic diagram of an optical assembly according to an embodiment of the present application.

Fig. 3 illustrates a schematic diagram of a deformation of the optical assembly according to an embodiment of the application.

FIG. 4 illustrates a schematic diagram of an optical assembly according to another embodiment of the present application.

Fig. 5 illustrates a schematic view of a variant embodiment of the optical assembly according to another embodiment of the present application.

Fig. 6 illustrates a schematic view of another variant embodiment of the optical assembly according to another embodiment of the present application.

Fig. 7 illustrates a schematic diagram of a camera module according to an embodiment of the present application.

Fig. 8 illustrates a schematic diagram of a variant implementation of the camera module according to an embodiment of the present application.

Detailed Description

Hereinafter, example embodiments according to the present application will be described in detail with reference to the accompanying drawings. It should be understood that the described embodiments are only some embodiments of the present application and not all embodiments of the present application, and that the present application is not limited by the example embodiments described herein.

Summary of the application

As described above, in order to meet the more and more extensive market demands, the development trend of the conventional camera module is high pixel, large chip, small size and large aperture, and the size of the filter element matched with the size of the photosensitive chip is increased along with the gradual increase of the size of the photosensitive chip. The filter element is a sensitive and fragile component, and the sensitivity and the fragility of the filter element are further increased with the increase of the size of the filter element. In practical industrial applications, a number of problems have arisen following an increase in the size of the filter element, for example, the filter element is more susceptible to breakage or even breakage, the filter element is tilted with respect to the photo-sensing chip, and the like.

In the camera module (for example, the conventional camera module, the periscopic camera module, the fingerprint module, and the TOF depth information camera module), the filter element 1P has important filtering and stray light preventing functions, and along with the increase of the area size thereof, the thickness size thereof is also limited by the demand for miniaturization of the camera module, that is, the area of the filter element 1P gradually increases, and meanwhile, the thickness size thereof tends to become smaller, so that the ratio of the area to the thickness of the filter element 1P will increase. Physically, the filter element 1P having an increased area-to-thickness ratio is more easily deformed and more fragile.

Due to the fact that the Coefficient of Thermal Expansion (CTE) of the support 2P for carrying the filter element 1P differs from the CTE of the filter element 1P by too much, when the ambient temperature changes, stress generated by deformation of the support 2P will act on the filter element 1P, when the amount of deformation of the filter element 1P exceeds a predetermined threshold due to the stress on the filter element exceeds the predetermined threshold, the filter element 1P will break or even crack, and through experimental tests, the predetermined threshold of the amount of deformation of the filter element 1P is 4000 μ e, that is, when the amount of deformation exceeds 4000 μ e, the filter element 1P will break or even crack. Furthermore, it will be appreciated by those skilled in the art that during the production process, the filter element 1P itself has micro-cracks which concentrate the stress and increase the chance of breakage or cracking.

Moreover, due to the large thermal expansion coefficient of the support 2P, under the condition of large environmental temperature change, the deformation of the support 2P itself is often uneven, which causes uneven deformation of the portion of the upper surface of the support 2P for supporting the filter element 1P, that is, a plane of the support 2P for mounting the filter element 1P may generate a height difference due to uneven deformation, and the filter element 1P may tilt relative to the photosensitive chip, as shown in fig. 1. Fig. 1 is a schematic diagram illustrating a filter element 1P of a conventional camera module being tilted with respect to a photosensitive chip. The filter element 1P installed obliquely causes a change in the focal length of the imaging system to produce an image shift. Moreover, the filter tilt also causes a difference between an incident angle of the external light incident on the filter element 1P and an ideal incident angle, which is likely to increase stray light. Moreover, the uneven surface of the holder 2P reduces the supporting area of the filter element 1P, which increases the risk of breakage of the filter element 1P.

To above-mentioned technical problem, the basic idea of this application is through setting up the dielectric layer between the filter element in the module of making a video recording and support portion thereof, to avoid filter element leads to the reduction of damage and the module of making a video recording imaging quality because of the deformation of self.

Based on this, this application has proposed a photosensitive assembly, and it includes: the optical filter comprises a filter element, a bracket for bearing the filter element and a dielectric layer, wherein the dielectric layer is arranged between the circuit board and the photosensitive chip and has preset flexibility for preventing deformation of the filter element from exceeding a preset threshold value. Therefore, the dielectric layer is arranged between the filter element and the supporting part of the filter element in the camera module, so that the phenomenon that the deformation quantity generated by the filter element exceeds a preset threshold value due to the fact that the stress generated by the deformation of the supporting part of the filter element is concentrated on the filter element, the damage of the filter element is caused, and the imaging quality of the camera module is reduced is avoided.

Having described the general principles of the present application, various non-limiting embodiments of the present application will now be described with reference to the accompanying drawings.

Example one

FIG. 2 illustrates a schematic diagram of an optical assembly according to an embodiment of the present application. In the optical assembly as illustrated in fig. 2, the optical assembly 10 includes a filter element 11, a dielectric layer 12 and a bracket 13, the filter element 11 is mounted on the bracket 13 through the dielectric layer 12, and the dielectric layer 12 can effectively absorb stress acting on the filter element 11 due to deformation of the bracket 13, so as to prevent the stress generated by deformation of the support portion of the filter element 11 from concentrating on the filter element 11, which causes the amount of deformation of the filter element 11 to exceed a predetermined threshold, and further causes breakage of the filter element 11. As described above, the preset threshold is 4000 μ e. That is, even if the holder 13 of the optical module 10 is deformed during a temperature rise or a temperature fall or an external stress is applied to the holder to cause the holder to be deformed, the dielectric layer 12 ensures stability of the filter element 11.

Further, in the embodiment of the present application, the dielectric layer 12 is preferably implemented as a flexible material having a predetermined flexibility for preventing the deformation amount of the filter element 11 from exceeding a predetermined threshold, that is, the predetermined flexibility of the filter element 11 is not a specific value, and it is only necessary to prevent the deformation amount of the filter element caused by the stress from being lower than 4000 μ e. In particular, in the present application, the shore hardness of the flexible material may be 10HSA-70HSA, for example, 20HSA or 30HSA, which can be compressed by 5% to 50% (preferably, 30% to 50%) of its own thickness or stretched by 5% to 50% (preferably, 30% to 50%) of its own thickness when being subjected to an external force, wherein 10HSA represents the shore hardness value of 10 as measured by a shore hardness meter type a, and 70HSA, 20HSA or 30HSA are known in the same manner. In addition, in this embodiment, the upper surface of the dielectric layer 12 corresponds to the filter element 11, and the lower surface corresponds to the support 13, so that when the environmental temperature changes or external stress acts on the support to cause the support 13 to deform, the deformation force of the support 13 drives the lower surface of the dielectric layer 12 to deform. Since the dielectric layer 12 can compress 5% -50% (preferably, 30% -50%) of its thickness or stretch 5% -50% (preferably, 30% -50%) of its thickness, its upper surface will not bend and still be close to a plane, and the deformation force of the support 13 will not act on the filter element 11, as shown in fig. 3, so that the light-sensitive surface of the filter element 11 can maintain a good flatness and can reduce light divergence, where the flatness of the light-sensitive surface of the filter element 11 can be 0.01 λ -0.2 λ (λ is the sign of light wavelength), or the flatness of the light-sensitive surface of the filter element 11 is below 0.16 um. It is also understood that the rigidity of the filter element 11 is greater than that of the dielectric layer 12, so that deformation (bending) of the filter element 11 can be suppressed by deformation of the dielectric layer 12.

Further, in the embodiment of the present application, the material of the dielectric layer 12 may be implemented as foam, PET (polyethylene terephthalate, a kind of plastic material) + PU (PU is foam), soft glue, silica gel, etc., where PET + PU may be understood as foaming on the PET material to form a PU layer, where PET may also be implemented as other plastic materials, and even PET may be replaced by metal, i.e., foaming on metal to form a PU layer.

In the embodiment of the present application, as shown in fig. 2, the optical assembly 10 further includes at least one adhesive member 14, the dielectric layer 12 is connected to the support 13 and the filter element 11 through the adhesive member 14, and the adhesive member 14 may be implemented as an adhesive tool such as glue, double-sided tape, etc. That is, in the embodiment of the present application, the adhesive 14 is first disposed on the dielectric layer 12, the filter element 11, or the support 13, and then the dielectric layer 12, the support 13, and the filter element 11 are fixed by the adhesive 14 to form the optical assembly 10.

Particularly, when the dielectric layer 12 is foam, the thickness of the foam is 80 to 130um, preferably 100um, and at this time, the thickness of the filter element 11 is 0.15 to 2.5mm, preferably 1 to 2 mm; the thickness of the adhesive member 14 is 20um to 40 um. When the dielectric layer 12 is implemented as soft rubber, the thickness of the soft rubber is 20 to 100um, preferably 50um, and at this time, the thickness of the filter element 11 is 0.15 to 2.5mm, preferably 1mm to 2 mm.

In a variant of the above embodiment, the dielectric layer 12 may be formed integrally with the support 13, i.e. the dielectric layer 12 and the support 13 are of a unitary structure. For example, the dielectric layer 12 may be formed on the support 13 by coating, spraying, printing, foaming, or the like. For example, when the medium layer 12 is a foam layer, the medium layer 12 may be formed by foaming a material preset on the bracket 13. Therefore, the foam layer (i.e., the medium layer 12) is not required to be fixed to the support 13 through the adhesive member 14, so that errors caused by the adhesive member 14 can be further effectively controlled, and the accuracy of the optical assembly 10 can be improved. It should be noted that, in this modified embodiment, the parameters and properties of the dielectric layer 12 are the same as or similar to those of the above embodiment.

That is, in this modified embodiment, the manufacturing process of the optical component 10 may be: the dielectric layer 12 is formed on the support 13, and the filter element 11 and the dielectric layer 12 are fixed by the adhesive 14 to form the optical assembly 10.

In another modified embodiment of the above embodiment, the dielectric layer 12 is formed integrally with the filter element 11, that is, the dielectric layer 12 and the filter element 11 have an integral structure, for example, the dielectric layer 12 may be formed on the filter element 11 by a coating, spraying, printing, foaming, or the like process.

Further, as shown in fig. 2, in the embodiment of the present application, the bracket 13 includes a supporting portion 131 and a suspending portion 132 extending inward from the supporting portion 131, and the filter element 11 is mounted on the suspending portion 132. In order to protect the filter element, preferably, the upper surface of the supporting portion 131 is higher than the upper surface of the suspending portion 132, that is, a drop height exists between the suspending portion 132 and the supporting portion 131, so as to form a protection cavity for accommodating the filter element 11. More preferably, when the filter element 11 is attached to the protection cavity, the upper surface of the filter element 11 is lower than the upper surface of the support portion 131.

It should be noted that, in the embodiment of the present application, the filter element 11 may be implemented as various types of filter elements, including but not limited to an infrared cut filter, a full-transmission spectrum filter, and other filters or a combination of filters. Specifically, for example, when the filter element 11 is implemented as a combination of an infrared cut filter and a full transmission spectrum filter, that is, the infrared cut filter and the full transmission spectrum filter can be switched to be selectively located on the photosensitive path of the filter element 11, so that, when used in an environment with sufficient light, such as daytime, the infrared cut filter can be switched to the photosensitive path of the filter element 11 to filter, by the infrared cut filter, infrared rays in light reflected by an object entering the filter element 11, and, when used in an environment with low light, such as night, the full transmission spectrum filter can be switched to the photosensitive path of the filter element 11 to allow infrared rays in light reflected by the object entering the filter element 11 to be partially transmitted.

Example two

As shown in fig. 4, in this embodiment, the optical assembly 10 is composed of the filter element 11, the adhesive 14 and the bracket 13, wherein the thickness of the adhesive 14 is 50um to 100um (including 50um and 100 um). That is, in this embodiment, the adhesive 14 functions as a two-in-one of the dielectric layer 12 and the adhesive 14 in embodiment 1, or the dielectric layer 12 in embodiment 1 is formed by curing an adhesive having a thickness of 50um to 100 um. It should be noted that, because the conventional adhesive such as glue has fluidity, it is not able to apply glue with a thickness of 50um to 100um on the filter element 11 or the bracket 13, in this embodiment, a supporting element 15 is further provided, the supporting element 15 is disposed on the bracket 13, the supporting element 15 and the upper surface of the bracket 13 form a receiving cavity 150, the adhesive 14 (glue) is disposed in the receiving cavity 150, the filter element 11 is attached to the adhesive 14, and then the adhesive 14 is cured by baking or other processes to form the optical device 10. As shown in fig. 4, in this embodiment, the support 15 includes an inner support unit 151 and an outer support unit 152, the receiving cavity 150 is formed between the inner side surface of the inner support unit 151 and the inner side surface of the outer support unit 152, and the inner support unit 151 and the outer support unit 152 each have a ring-shaped structure. It should be noted that in this embodiment, the height of the outer supporting unit 152 is higher than that of the inner supporting unit 151, and of course, the heights of the inner supporting unit 151 and the outer supporting unit 152 may also be equal, which is not limited in this application.

In this embodiment, the bonding element 14 is preferably a glue having a certain flexibility, where after curing the bonding element 14 still has a certain flexibility. The upper surface of bonding piece 14 is to filtering element 11, its lower surface subtend support 13, lead to when ambient temperature changes support 13 takes place deformation, the power of support 13 deformation drives bonding piece 14's lower surface deformation, because bonding piece 14 has certain flexibility and has 50um-100 um's thickness, its upper surface then can not receive the influence and takes place the bending so, still is close the plane, the power of support 13 deformation also can not be used in filtering element 11, consequently, filtering element 11 can keep better plane degree.

Further, in this embodiment, the adhesive member 14 has a large deformation capability, and specifically, the adhesive member 14 can be compressed by 5% to 50% (preferably, 30% to 50%) of its thickness or stretched by 5% to 50% (preferably, 30% to 50%) of its thickness when subjected to an external force. Correspondingly, when the environmental temperature changes and leads to the support 13 deforms, the deformed force of the support 13 drives the lower surface of the bonding piece 14 to deform, and since the dielectric layer 12 can compress 5% -50% (preferably, 30% -50%) of the thickness of the support, or stretch 5% -50% (preferably, 30% -50%) of the thickness of the support, the upper surface of the support cannot be bent and still is close to a plane, and the deformed force of the support 13 cannot act on the filter element 11, so that the reflecting surface of the filter element 11 can keep a good flatness and can reduce light divergence.

It should be noted that in the embodiment of the present application, the thickness of the adhesive member 14 is lower than the height of the supporting member 15. That is, during the preparation process, the thickness of the glue is smaller than the height of the supporting member 15, so that the glue is completely contained in the containing cavity 150, and at the same time, the filter element 11 is also contained in the containing cavity 150.

In a variant of the above embodiment, the thickness of the glue may also be greater than or equal to the height of the support 15. In this variant embodiment, as shown in fig. 5, the thickness of the adhesive member 14 (glue) is greater than the height of the supporting member 15, and it can be understood that, because the glue has a certain viscosity, the glue will not overflow from the receiving cavity 150 even if the difference between the thickness of the glue and the height of the supporting member 15 is within a certain range during the preparation process.

It should also be mentioned that in other variants of the above-described embodiment, the support member 15 may also be optionally removed after the glue is cured to form the bonding member 14, i.e. the optical assembly 10 does not include the support member 15, as shown in fig. 6

EXAMPLE III

The optical assembly disclosed in the first and second embodiments can be applied to a camera module, for example, a conventional camera module, a periscopic camera module, a TOF depth information camera module, and the like. Fig. 7 illustrates a schematic diagram of a camera module according to an embodiment of the present application. As shown in fig. 7, the camera module includes: a photosensitive assembly 20 and an optical lens 30 retained on a photosensitive path of the optical assembly 20, wherein the photosensitive assembly 20 includes the optical assembly 10 disclosed in embodiments 1 and 2.

As shown in fig. 7, in the embodiment of the present application, the photosensitive assembly further includes a circuit board 21, a photosensitive chip 22 electrically connected to the circuit board 21, and at least one electronic component 23 disposed on the circuit board 21, wherein the optical assembly 10 is disposed on the circuit board 21. More specifically, the bracket 13 of the optical assembly 10 is attached to the circuit board 21, and the filter element 11 is located in a photosensitive path of the photosensitive chip 22.

Fig. 8 illustrates a schematic diagram of a variant embodiment of the camera module according to an embodiment of the present application. As shown in fig. 8, in this modified embodiment, the camera module is further disposed on a base 24 of the circuit board, and the optical assembly 10 is mounted on the base 24. That is, in this modified embodiment, the manner of mounting the optical module 10 is changed. In particular, in a variant embodiment, the base 24 is a molded base integrally formed on the circuit board 21 by a molding process, but of course, in other examples of the present application, the base 24 may also be implemented as other types of bases, and the position of the base 24 integrally formed on the circuit board may be adjusted.

It is worth mentioning that the camera module can be further applied to an electronic device, such as a smart phone, a tablet computer, etc., as a front camera module or a rear camera module of the electronic device.

Example four

According to another aspect of the present application, a method of making an optical assembly 10 is also provided.

According to the description related to the first embodiment and the second embodiment, the method for manufacturing the optical assembly 10 according to the embodiment of the present application includes: providing a holder 13 and a filter element 11; and a dielectric layer 12 is formed between the holder 13 and the filter element 11.

In the manufacturing method according to the embodiment of the present application, in one example, forming the dielectric layer 12 between the support 13 and the filter element 11 includes: forming the dielectric layer 12 on the support 13; and mounting the filter element 11 on the dielectric layer 12.

In the manufacturing method according to the embodiment of the present application, in one example, forming the dielectric layer 12 between the support 13 and the filter element 11 includes: forming the dielectric layer 12 on the lower surface of the filter element 11; and attaching the filter element 11 with the dielectric layer 12 to the bracket 13.

In the manufacturing method according to the embodiment of the present application, in one example, the forming of the dielectric layer 12 on the support 13 includes: applying an adhesive 14 on said support 13; and attaching the dielectric layer 12 to the adhesive member 14 to form the dielectric layer 12 on the support 13.

In the manufacturing method according to the embodiment of the present application, in one example, the forming of the dielectric layer 12 on the support 13 includes: the dielectric layer 12 is integrally formed on the support 13.

In the manufacturing method according to the embodiment of the present application, in one example, mounting the filter element 11 on the dielectric layer 12 includes: applying a bonding member 14 on the dielectric layer 12; and mounting the filter element 11 on the adhesive 14 to mount the filter element 11 on the dielectric layer 12.

In the manufacturing method according to the embodiment of the present application, in one example, the dielectric layer 12 is formed between the support 13 and the filter element 11, and includes: forming a support 15 on the bracket 13, wherein the support 15 and the surface of the bracket 13 form a receiving cavity 150; applying an adhesive within the receiving cavity 150; attaching the filter element 11 to the adhesive; and curing the adhesive to form the dielectric layer 12 between the support 13 and the filter element 11.

In the preparation method according to the embodiment of the present application, in one example, the method further includes removing the supporter 15.

It should be noted that, in the embodiment of the present application, the dielectric layer 12 is made of a flexible material, and the shore hardness of the flexible material is 10HSA-70 HSA. The dielectric layer 12 is made of any one of foam, a combination of plastic and foam, soft glue and silica gel. When the dielectric layer 12 is made of foam, the thickness of the dielectric layer 12 is 80um-130 um. When the dielectric layer 12 is made of soft rubber, the thickness of the dielectric layer 12 is 20um-100 um. The amount of deformation that can occur to the dielectric layer 12 is 5% -50% of its thickness. .

It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.

Claims

1. An optical assembly, comprising:

a filter element;

a support for carrying the filter element;

a dielectric layer disposed between the holder and the filter element and having a predetermined flexibility for preventing an amount of deformation of the filter element from exceeding a predetermined threshold; and

the support is arranged on the support, and a containing cavity is formed by the support and the surface of the support, wherein the medium layer is formed by curing an adhesive applied in the containing cavity;

the support comprises an inner support unit and an outer support unit, and the accommodating cavity is formed among the surface of the support, the inner side surface of the inner support unit and the inner side surface of the outer support unit;

the height of the outer supporting unit is higher than that of the inner supporting unit, and the filter element is contained in the containing cavity.

2. The optical assembly of claim 1, wherein the filter element is mounted to the support through the dielectric layer.

3. The optical assembly of claim 1, further comprising an adhesive by which the dielectric layer is connected to the support and the filter element, respectively.

4. The optical assembly of claim 1, further comprising an adhesive, wherein the dielectric layer is integrally formed with the support, the dielectric layer being coupled to the filter element by the adhesive.

5. The optical assembly of claim 1, further comprising an adhesive, wherein the dielectric layer is integrally formed on a lower surface of the filter element, the dielectric layer being coupled to the bracket by the adhesive.

6. The optical assembly of any one of claims 3-5, wherein the dielectric layer is made of a flexible material having a shore hardness of 10HSA-70 HSA.

7. The optical assembly of claim 6, wherein the dielectric layer is made of a material selected from any one of foam, a combination of plastic and foam, soft gel, and silicone.

8. The optical assembly of claim 7, wherein the dielectric layer has a thickness of 80-130 um when the dielectric layer is made of foam.

9. The optical assembly of claim 8, wherein the dielectric layer has a thickness of 20-100 um when the dielectric layer is made of soft glue.

10. The optical assembly of claim 1, wherein the dielectric layer has a thickness of 50um to 100 um.

11. The optical assembly of claim 9, wherein the dielectric layer is capable of undergoing a deformation amount of 5% -50% of its thickness.

12. The optical assembly of claim 10, wherein the dielectric layer is capable of undergoing a deformation amount of 5% to 50% of its thickness.

13. The optical assembly of claim 1, wherein the bracket includes a support portion and a suspension portion extending inwardly from the support portion, the filter element being attached to the suspension portion.

14. The optical assembly of claim 13, wherein an upper surface of the suspension portion is lower than an upper surface of the support portion, and an upper surface of the filter element is lower than an upper surface of the support portion.

15. A photosensitive assembly, comprising:

a circuit board;

the photosensitive chip is electrically connected with the circuit board; and

the optical module according to any one of claims 1-14, wherein the optical module is disposed on the circuit board, and the filter element is located in a photosensitive path of the photosensitive chip.

16. The photosensitive assembly of claim 15 further comprising a base disposed on the circuit board, wherein the optical assembly is mounted to the base.

17. The utility model provides a module of making a video recording which characterized in that includes:

an optical lens; and

a photosensitive assembly, the optical lens being retained in a photosensitive path of the photosensitive assembly, wherein the photosensitive assembly comprises the optical assembly of any one of claims 1-15.

18. A method of making an optical assembly, comprising:

providing a filter element and a support; and

forming a dielectric layer between the support and the filter element;

wherein, said forming a dielectric layer between said support and said filter element comprises:

arranging a support on the bracket, wherein the support and the surface of the bracket form a containing cavity, the support comprises an inner support unit and an outer support unit, and the height of the outer support unit is higher than that of the inner support unit;

applying an adhesive in the accommodating cavity;

attaching the filter element to the adhesive; and

and curing the adhesive to form a dielectric layer between the bracket and the filter element.

19. The method of manufacturing of claim 18, further comprising: removing the support member.