CN110602361B

CN110602361B - Camera assembly and electronic equipment

Info

Publication number: CN110602361B
Application number: CN201910866049.8A
Authority: CN
Inventors: 贾玉虎
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2019-09-12
Filing date: 2019-09-12
Publication date: 2021-03-30
Anticipated expiration: 2039-09-12
Also published as: CN110602361A

Abstract

The application provides a camera assembly, includes: a circuit board; the electronic element is arranged on the circuit board and is electrically connected with the circuit board; the supporting piece is arranged on the circuit board; and the photosensitive chip is arranged on the supporting piece, is arranged at intervals with the circuit board and is electrically connected with the circuit board, and the electronic element is positioned between the photosensitive chip and the circuit board. The application provides a camera subassembly through set up support piece with bed hedgehopping sensitization chip on the circuit board, and electronic component arranges between sensitization chip and circuit board, can save the space that electronic component occupy for camera subassembly can satisfy the miniaturization demand when satisfying high integration requirement.

Description

Camera assembly and electronic equipment

Technical Field

The application relates to the technical field of electronic equipment, in particular to a camera assembly and electronic equipment.

Background

The design direction of electronic devices (e.g. mobile phones, tablet computers) gradually tends to high integration and miniaturization. To meet the requirement of high integration, more and more electronic components need to be integrated on the camera assembly. With the increase of integrated electronic components, the size of the camera assembly is difficult to meet the requirement of miniaturization.

Disclosure of Invention

The technical problem to be solved by the application is to provide a camera assembly and an electronic device, so as to solve the defects existing in the camera assembly of the electronic device.

The embodiment of the application provides a camera subassembly, includes: a circuit board; the electronic element is arranged on the circuit board and is electrically connected with the circuit board; the supporting piece is arranged on the circuit board; and the photosensitive chip is arranged on the supporting piece, is arranged at intervals with the circuit board and is electrically connected with the circuit board, and the electronic element is positioned between the photosensitive chip and the circuit board.

The embodiment of the application also provides electronic equipment, which comprises a shell and the camera assembly, wherein the camera assembly is contained in the shell.

The camera assembly and the electronic equipment provided by the embodiment of the application can save the space occupied by the electronic elements by arranging the supporting piece on the circuit board to heighten the photosensitive chip and arranging the electronic elements between the photosensitive chip and the circuit board, so that the camera assembly can meet the miniaturization requirement while meeting the requirement of high integration level.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a schematic structural view of a camera head assembly according to some embodiments of the present application;

FIG. 2 is a schematic exploded view of the camera head assembly of FIG. 1;

FIG. 3 is a schematic cross-sectional view of the camera head assembly of FIG. 1 taken along direction A-A;

FIG. 4 is a schematic, exploded view of a camera head assembly according to some embodiments of the present application;

FIG. 5 is a schematic, exploded view of a camera head assembly according to some embodiments of the present application;

FIG. 6 is a schematic, exploded view of a camera head assembly according to some embodiments of the present application;

FIG. 7 is a cross-sectional structural schematic view of a camera head assembly according to some embodiments of the present application;

FIG. 8 is a cross-sectional structural schematic view of a camera head assembly according to some embodiments of the present application;

FIG. 9 is a schematic cross-sectional view of a camera head assembly according to some embodiments of the present application;

FIG. 10 is an enlarged, cross-sectional view of a portion of the structure of a camera head assembly according to some embodiments of the present application;

FIG. 11 is a cross-sectional structural schematic view of a camera head assembly according to some embodiments of the present application;

FIG. 12 is a cross-sectional structural schematic view of a camera head assembly according to some embodiments of the present application;

FIG. 13 is a cross-sectional structural schematic view of a camera head assembly according to some embodiments of the present application;

FIG. 14 is a schematic structural view of a camera head assembly according to some embodiments of the present application;

FIG. 15 is a schematic cross-sectional view of the camera head assembly of FIG. 14 taken along the direction B-B;

FIG. 16 is a schematic, exploded view of a camera head assembly according to some embodiments of the present application;

FIG. 17 is a schematic view of a partial cross-sectional configuration of the camera head assembly of FIG. 15;

FIG. 18 is a schematic view of a partial cross-sectional configuration of the camera head assembly of FIG. 15;

FIG. 19 is a schematic cross-sectional view of a portion of a camera head assembly according to further embodiments of the present application;

FIG. 20 is a schematic cross-sectional view of a portion of a camera head assembly according to further embodiments of the present application;

FIG. 21 is a schematic cross-sectional view of a portion of a camera head assembly according to further embodiments of the present application;

FIG. 22 is a schematic cross-sectional view of a portion of a camera head assembly according to further embodiments of the present application;

FIG. 23 is a schematic cross-sectional view of a portion of a camera head assembly according to further embodiments of the present application;

FIG. 24 is a schematic cross-sectional view of a portion of a camera head assembly according to further embodiments of the present application;

FIG. 25 is a schematic, exploded view of a camera assembly according to further embodiments of the present application;

FIG. 26 is a schematic cross-sectional view of the camera head assembly of FIG. 25 taken along direction C-C;

FIG. 27 is a schematic diagram of an electronic device according to further embodiments of the present application.

Detailed Description

The present application will be described in further detail with reference to the following drawings and examples. It is to be noted that the following examples are only illustrative of the present application, and do not limit the scope of the present application. Likewise, the following examples are only some examples and not all examples of the present application, and all other examples obtained by a person of ordinary skill in the art without any inventive work are within the scope of the present application.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present application are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.

The present embodiment provides a camera assembly 100. Referring to fig. 1 and 2, the camera assembly 100 can be applied to an electronic device. The electronic device can be a mobile phone, a tablet computer, an IPAD and other electronic devices with camera components. The camera assembly 100 may generally include a circuit board 10, an electronic component 20, a support 30, and a photo-sensing chip 40. The electronic component 20 is disposed on the circuit board 10 and electrically connected to the circuit board 10. The supporting member 30 is disposed on the circuit board 10. The photosensitive chip 40 is disposed on the supporting member 30, spaced apart from the circuit board 10, and electrically connected to the circuit board 10. The electronic component 20 is located between the photosensitive chip 40 and the circuit board 10.

Fig. 3 is a schematic sectional view taken along a-a in fig. 1. Further, referring to fig. 3, the electronic device 20 is disposed on the circuit board 10, the photo sensor chip 40 is disposed above the electronic device 20 in a vertical direction Z (i.e., a direction substantially perpendicular to the circuit board 10), and the circuit board 10 is disposed with the supporting member 30 for supporting the photo sensor chip 40.

In some embodiments, the height of the supporting member 30 in a direction substantially perpendicular to the circuit board 10 may be greater than the height of the electronic component 20 in a direction substantially perpendicular to the circuit board 10, so that the photosensitive chip 40 is fixed on the supporting member 30 and can keep a certain distance from the electronic component 20, thereby preventing the photosensitive chip 40 from directly contacting the electronic component 20 to cause poor electrical properties.

It is understood that, in other embodiments, of course, the height of the supporting member 30 in the direction substantially perpendicular to the circuit board 10 may also be equal to the height of the electronic component 20 in the direction substantially perpendicular to the circuit board 10, and an insulating layer may be disposed on a side of the photosensitive chip 40 close to the electronic component 20 (i.e., a side contacting with the supporting member 30), so that when the photosensitive chip 40 is fixedly disposed on the supporting member 30, the photosensitive chip 40 does not directly contact with the electronic component 20, thereby avoiding poor electrical contact.

Further, it should be understood that the use of the term "substantially" herein in terms of a numerical quantity or other quantifiable relationship (e.g., perpendicularity or parallelism) is to be understood as indicating a quantity of ± 10%, unless otherwise defined with respect to a particular context. Thus, for example, lines that are substantially perpendicular to each other may be at an angle of between 81 ° and 99 ° to each other.

The camera assembly 100 provided in the embodiment of the present application, by changing the layout of the electronic components 20 and the photosensitive chips 40 in the circuit board 10, the electronic components 20 are arranged below the photosensitive chips 40 in the vertical direction Z, and the electronic components 20 and the photosensitive chips 40 are arranged in layers, so that the layout space of the electronic components 20 and the photosensitive chips 40 in the circuit board 10 is saved. Therefore, the camera assembly 100 can satisfy the size miniaturization requirement while satisfying the high integration. In some embodiments, the size of camera head assembly 100 in the horizontal direction (XY direction as shown in fig. 1) may be reduced by more than 0.5 mm.

It can be understood that the camera assembly provided by the embodiment of the application can be applied to electronic components including a front camera structure, a rear camera structure and other similar camera packaging structures, so that the electronic components with the structure can meet the requirement of size miniaturization while meeting high integration level.

In the embodiment of the present application, the electronic component 20 includes, but is not limited to, a capacitor, a resistor, a charged Erasable Programmable Read-Only Memory (EEPROM), and the like. The electronic component 20 may be soldered to the circuit board 10 by means of soldering, for example, solder paste, to electrically connect the electronic component 20 to the circuit board 10. Of course, in other embodiments, the electronic component 20 may be electrically connected to the circuit board 10 by other means, such as by bonding with a conductive adhesive.

In some embodiments of the present application, the supporting member 30 may be an insulating member, i.e., made of an insulating material. Further, the supporting member 30 may be made of Polyethylene terephthalate (PET), foam, or rubber. When the supporting member 30 is made of PET, foam, or rubber, the supporting member 30 may be attached to the circuit board 10 by, for example, glue, double-sided tape, or the like. Of course, in other embodiments, the supporting member 30 may be fixed on the circuit board 10 by other means, such as a snap fit, a screw connection, or the like.

In some embodiments, referring to fig. 4, the supporting member 30 is substantially a ring structure, and the electronic component 20 is located in an area surrounded by the ring structure. It will be appreciated that the loop structure may be a loop structure having straight sides, such as a rectangular frame structure, a diamond frame structure, a trapezoidal frame structure, or the like. Of course, the ring structure may also be a ring structure with curved edges, such as a circular ring frame structure, an oval frame structure, etc. In the embodiment shown in fig. 4, the support member 30 is a rectangular frame structure formed by four sides that are surrounded end to end.

In other embodiments, referring to fig. 5 and fig. 6, the photo sensor chip 40 may be substantially rectangular and includes two

opposite sides

41 and 42. The supporting member 30 may include at least two supporting portions (e.g., the supporting

portions

31, 32, 33 …), and at least one supporting portion is correspondingly disposed on each side edge of the photosensitive chip 40.

For example, in the embodiment shown in fig. 5, one supporting portion is disposed on each side of the photosensitive chip 40. As shown in fig. 5, the supporting portion 31 is correspondingly disposed on the side 41, and the supporting portion 42 is correspondingly disposed on the side 42, so that a stable supporting structure can be formed to support the photosensitive chip 40.

Of course. In other embodiments, two or more supporting portions may be disposed on each side. For example, in the embodiment shown in fig. 6, the side edge 41 may be provided with two supporting

portions

35 and 36, and the side edge 42 may be provided with two supporting

portions

33 and 34, respectively, to support the photo sensor chip 40 more stably.

The above is given of an embodiment in which the photosensitive chip 40 is rectangular. Of course, in other embodiments, the photosensitive chip 40 may have other shapes, such as a circle, an ellipse, and so on. When the photosensitive chip 40 is circular or elliptical, a plurality of support portions may be provided at intervals in the circumferential direction of the photosensitive chip 40 to provide stable support to the photosensitive chip 40. The shape of the photosensitive chip 40 and the number of the supporting portions are not limited in the present application.

It will be appreciated that the support portion may be an elongate structure as shown in figure 5 or a block-like structure as shown in figure 6. When the supporting portion is a block structure, the supporting portions may be uniformly distributed on the circuit board 10, so as to provide uniform supporting force when supporting the photosensitive chip 40. Of course, in other embodiments, the support portion may take other shapes. The shape of the support portion is not limited in this application.

In some embodiments of the present disclosure, the photosensitive chip 40 may be attached to the supporting member 30 by glue (e.g., resin glue, back glue), double-sided glue, etc., so that the photosensitive chip 40 is fixed on the supporting member 30.

In other embodiments of the present application, the camera assembly may further include a clamping structure disposed between the supporting member 30 and the photosensitive chip 40, and the photosensitive chip 40 is fixed on the supporting member 30 by the clamping structure. The photosensitive chip 40 is disposed on the supporting member 30 through the engaging structure, so that the photosensitive chip 40 can be stably connected to the supporting member 30. Of course, in some embodiments, the photosensitive chip 40 and the supporting member 30 may be further fixedly connected by glue or double-sided tape on the basis of providing the clamping structure, so as to enhance the connection strength between the photosensitive chip 40 and the supporting member 30.

Specifically, referring to fig. 7, in some embodiments of the present disclosure, the supporting element 30 may have an inner sidewall 301 close to the electronic element 20, and the engaging structure includes a step portion 302 formed on the inner sidewall 301 of the supporting element 30. The photosensitive chip 40 is disposed on the step portion 302 and abuts against the inner sidewall 301.

In other embodiments of the present application, please refer to fig. 8, the fastening structure may include a latch 303 disposed on an inner sidewall 301 of the supporting member 30, and a slot 403 disposed on the photosensitive chip 40 and adapted to the latch 303. The latch 303 protrudes from the inner sidewall 301, the slot 403 is recessed from the contact surface between the photosensitive chip 40 and the supporting member 30, and the photosensitive chip 40 is fixedly disposed on the supporting member 30 through the cooperation of the latch 303 and the slot 403.

In some embodiments, the card slot may be opened on the inner sidewall 301 of the supporting member 30, and the photosensitive chip 40 may be provided with a matching card tooth. For example, in the embodiment shown in fig. 9, the engaging structure may include a slot 304 disposed on the inner sidewall 301 of the supporting member 30, and a latch 404 disposed on the photosensitive chip 40 and adapted to the slot 304. The clamping groove 304 is recessed on the inner side wall 301, the latch 404 is raised on the contact surface between the photosensitive chip 40 and the support 30, and the photosensitive chip 40 is fixedly disposed on the support 30 through the cooperation of the latch 404 and the clamping groove 304.

In some embodiments, a clamping groove and a clamping tooth may be disposed on the support 30, and a clamping tooth corresponding to the clamping groove on the support 30 and a clamping groove corresponding to the clamping tooth on the support 30 may be disposed on the photosensitive chip 40. For example, in the embodiment shown in fig. 10, the engaging structure may include a first latch 405 disposed on the photosensitive chip 40, a first slot 305 disposed on the inner sidewall 301 of the supporting member 30 and adapted to the first latch 405, a second latch 306 disposed on the inner sidewall 301 of the supporting member 30, and a second slot 406 disposed on the photosensitive chip 40 and adapted to the second latch 306. The support 30 is fixedly connected with the photosensitive chip 40 by the cooperation of the first latch 405 and the first slot 305 and the cooperation of the second latch 306 and the second slot 406.

This application embodiment is through setting up the block structure between support piece and sensitization chip to on being fixed in support piece with sensitization chip through the block structure, make camera subassembly overall structure in this application embodiment comparatively stable, the assembly is simple and efficiency is higher. In addition, through block structural connection sensitization chip and support piece, can not occupy the extra space in the camera subassembly, provide convenience for camera subassembly internal layout.

It should be noted that the terms "first" and "second" in the embodiments of the present application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature.

In some embodiments of the present application, referring to fig. 11 and 12, a receiving slot 11 may be further formed on the circuit board 10, and the electronic component 20 and the supporting member 30 are received in the receiving slot 11. The photosensitive chip 40 is disposed on the supporting member 30, and the photosensitive chip 40 may be accommodated in the accommodating groove 11 or not be accommodated in the accommodating groove 11.

In some embodiments, as shown in fig. 11, the photo sensor chip 40 may be disposed on the supporting member 30 and accommodated in the accommodating slot 11 of the circuit board 10, and an end of the photo sensor chip 40 may abut against an inner sidewall of the accommodating slot 11.

In other embodiments, as shown in fig. 12, the photo sensor chip 40 may be disposed on the circuit board 10 and located outside the receiving slot 11, that is, the photo sensor chip 40 is not received in the receiving slot 11 of the circuit board 10.

The camera assembly provided by the embodiment of the application has the advantages that the accommodating groove 11 is formed in the circuit board 10, and the electronic element 20 and the supporting piece 30 are both accommodated in the accommodating groove 11, so that the space occupied by the electronic element 20 in the vertical direction Z can be reduced, and the camera assembly 100 can meet the miniaturization requirement while meeting the requirement of high integration level.

In some embodiments of the present application, with continued reference to fig. 3 and 4, the photosensitive chip 40 may be electrically connected to the circuit board 10 by means of wires 43 by way of gold wire bonding.

However, in other embodiments, the photosensitive chip 40 may be electrically connected to the circuit board 10 by means of an external conductive connector. For example, in the embodiment shown in fig. 13, the support 30 has an outer sidewall 308 remote from the electronic component 20, the outer sidewall 308 being disposed opposite the inner sidewall 301. Camera assembly 100 also includes conductive connection 50. The conductive connecting element 50 may be disposed on the outer sidewall of the photosensitive chip 40 and the outer sidewall 308 of the supporting element 30, and extend to the circuit board 10. The photosensitive chip 40 may be electrically connected to the circuit board 10 through the conductive connection member 50. As shown in fig. 13, the conductive connecting element 50 can be attached to the outer sidewall 308 of the supporting element 30 by, for example, glue, and two end portions of the conductive connecting element 50 can respectively extend to the upper surfaces of the photosensitive chip 40 and the circuit board 10 close to the photosensitive chip 40, so as to conduct the photosensitive chip 40 and the circuit board 10.

The camera subassembly that this application embodiment provided is through setting up conductive connecting piece 50 on sensitization chip 40 and support piece 30's lateral wall, switches on sensitization chip 40 and circuit board 10 with the help of this conductive connecting piece 50, can save and beat the gold thread and switch on the space that sensitization chip and circuit occupy for the camera subassembly can satisfy the miniaturization demand when satisfying high integration requirement. Also, the reliability of the electrical connection between the photosensitive chip 40 and the circuit board 10 can be improved.

Referring to fig. 14, 15 and 16, a camera assembly 100 according to an embodiment of the present disclosure may further include a lens 60, a bracket 70 and an optical filter 80. The holder 70 is disposed between the circuit board 10 and the lens 60, and a receiving space 71 is formed between the holder 70 and the circuit board 10. The photosensitive chip 40, the supporting member 30 and the electronic component 20 are all accommodated in the accommodating space 71. The filter 80 may be supported on the support 70 and spaced apart from the photosensitive chip 40.

Specifically, the lens 60, the holder 70, and the circuit board 10 may be sequentially disposed in the vertical direction Z. The holder 70 is used to support the lens 60 and the optical filter 80, and is fixedly connected to the lens 60 and the circuit board 10, respectively, to form the camera assembly 100 that satisfies the size miniaturization requirement. The bracket 70 may be fixedly connected to the circuit board 10 and/or the lens 60 by gluing, welding, screwing, or the like.

In some embodiments, as shown in FIG. 16, the support 70 is a frame-like structure defined by four sides that are joined end-to-end. The four sides of the bracket 70 are disposed on the circuit board 10, and enclose the circuit board 10 to form an accommodating space 71 for accommodating the photosensitive chip 40, the supporting member 30 and the electronic component 20.

Further, referring to fig. 17, the bracket 70 may include a main body portion 72 and a carrying portion 73. The main body 72 is connected to the circuit board 10 and the lens 60, and the carrying portion 73 is disposed on an end of the main body 72 away from the circuit board 10 and connected to the main body 72 and the optical filter 80. The supporting portion 73 supports the optical filter 80.

Specifically, the end of the main body portion 72 away from the circuit board 10 extends in a direction substantially perpendicular to the main body portion 72 to form the bearing portion 73. The receiving portion 73 extends toward the inner space of the accommodating space 71. In the embodiment shown in fig. 16, the carrying portion 73 has a substantially annular structure, and each annular edge of the carrying portion 73 is substantially perpendicular to the corresponding edge of the bracket 70.

Further, referring to fig. 18, an end of the main body 72 away from the circuit board 10 has a connection portion 721 for connecting with a lens. The connection part 721 is connected to the carrier part 73 to form a stepped structure, so that the lens 60 and the filter 80 can be supported.

The filter 80 is supported on the step structure and can be fixed to the supporting portion 73 by glue or double-sided tape. In some embodiments, the filter 80 may be made of blue glass and may be used to filter at least some of the infrared light to improve photographic image quality.

The embodiment of the present application provides that when the camera assembly is used for taking/recording images, the light reaches the optical filter 80 through the lens 60. The light filtered by the filter 80 reaches the photo sensor chip 40. The light sensing chip 40 converts the light image on the light sensing surface into an electrical signal in a corresponding proportional relationship with the light image and transmits the electrical signal to the circuit board 10, thereby realizing the photographing/video recording function. The photosensitive chip 40 may include a photosensitive region and a binding region, the photosensitive region has photosensitive pixels, and the binding region has a pad connected to the photosensitive pixels.

In other embodiments of the present application, referring to fig. 19, the camera assembly 200 may include a circuit board 210, an electronic component 220, a supporting member 230, and a photo sensor chip 240. The electronic component 220 is disposed on the circuit board 210 and electrically connected to the circuit board 210. The supporting member 230 is disposed on the circuit board 210 and covers the electronic element 220. The photosensitive chip 240 is disposed on the supporting member 230, electrically connected to the circuit board 210, and spaced apart from the circuit board 210 by the supporting member 230. The electronic component 220 is located between the photosensitive chip 240 and the circuit board 10. It can be understood that the working principle and the position connection relationship of the circuit board 210, the electronic element 220 and the photosensitive chip 240 are the same as those of the circuit board 10, the electronic element 20 and the photosensitive chip 40 in the above embodiments, so that the description of the embodiment of the present application is not repeated, and the description of the arrangement and the connection relationship of the supporting member 230 is emphasized in the embodiment of the present application.

Specifically, the supporting member 230 covers the electronic component 220 and is fixed on the circuit board 210, and the photosensitive chip 240 is fixed on the supporting member 230. The supporting member 230 may be one of a coating material such as glue, plastic, or resin. When the supporting member 230 is made of glue or a coating material similar to glue, the supporting member 230 can be attached to the electronic component 220 by coating. When the supporting member 230 is made of a covering material such as plastic or resin, the supporting member 230 can be molded on the electronic component 220 by injection molding.

It is understood that the coating or injection molding process may be collectively referred to as a sealing process, in which a coating material such as glue, plastic or resin is mechanically or manually poured into the circuit board 210 with the electronic component 220 mounted thereon, and cured under normal temperature or heating condition to form a thermosetting polymer insulating material with excellent properties. The liquid polyurethane compound used in this process is the potting adhesive. It can be understood that the pouring sealant is in a liquid state before being cured, and has fluidity, and the viscosity of the glue solution is different according to the material, the performance and the production process of the product. The pouring sealant can play the roles of water resistance, moisture resistance, dust prevention, insulation, heat conduction, confidentiality, corrosion resistance, temperature resistance and shock resistance after being completely cured. The most common electronic potting adhesives include, but are not limited to, epoxy potting adhesives, silicone potting adhesives, polyurethane potting adhesives, and the like.

In some embodiments of the present application, the supporting member 230 may be an insulating member, i.e., made of an insulating material. Further, the supporting member 230 may include a coating material such as glue, plastic, or plastic. The photosensitive chip 240 may be fixed on the supporting member 230 by glue or double-sided tape.

Further, the supporting member 230 may partially or completely cover the electronic element 220, so that the photosensitive chip 240 is isolated from the electronic element 220 by the supporting member 230, and the photosensitive chip 240 is prevented from being directly contacted with the electronic element 220 to cause poor electrical properties. Specifically, the photo chip 240 is disposed above the electronic component 220 in a vertical direction Z (i.e., a direction substantially perpendicular to the circuit board 210), and the circuit board 210 is provided with a support 230 to support the photo chip 240.

In some embodiments, the height of the supporting member 230 in a direction substantially perpendicular to the circuit board 210 may be greater than the height of the electronic element 220 in a direction substantially perpendicular to the circuit board 210, so that the photosensitive chip 240 is fixed on the supporting member 230 and can keep a certain distance from the electronic element 220, thereby preventing the photosensitive chip 240 from being in direct contact with the electronic element 220 to cause poor electrical properties.

It is understood that, in other embodiments, of course, the height of the supporting member 230 in the direction substantially perpendicular to the circuit board 210 may also be equal to the height of the electronic element 220 in the direction substantially perpendicular to the circuit board 210, and an adhesive layer may be disposed on a side of the photo sensor chip 240 close to the electronic element 220 (i.e., a side contacting with the supporting member 230) for insulation, so that when the photo sensor chip 240 is fixedly disposed on the supporting member 230, the photo sensor chip 240 does not directly contact with the electronic element 220, thereby avoiding poor electrical contact.

Further, please refer to fig. 20. The support 230 has an outer periphery 231, and a projection of the outer periphery 231 in a direction substantially perpendicular to the circuit board 210 is located within the photo chip 210. The outer periphery 231 of the supporting member 230 is located inside the photo chip 210, so that the supporting member 230 does not protrude to occupy additional space, and space layout of the camera assembly is facilitated.

The camera assembly 200 provided by the embodiment of the application, through changing the layout setting of the electronic element 220 and the photosensitive chip 240 in the circuit board 210, the electronic element 220 is arranged below the photosensitive chip 240 in the vertical direction Z, and the electronic element 220 and the photosensitive chip 240 are arranged in a layered manner, so that the layout space of the electronic element 220 and the photosensitive chip 240 in the circuit board 210 is saved, and the camera assembly 200 can meet the requirement of size miniaturization under the condition of high integration level. In some embodiments, the size of the camera assembly in the horizontal direction (XY direction) may be reduced by more than 0.5 mm.

In other embodiments of the present application, the camera assembly 200 may further include a clamping structure disposed between the supporting member 230 and the photo chip 240, and the photo chip 240 is fixed on the supporting member 230 by the clamping structure. The photo chip 240 is disposed on the supporting member 230 through the engaging structure, so that the photo chip 240 can be stably connected to the supporting member 230. Of course, in some embodiments, the photosensitive chip 240 and the supporting member 230 may be further fixedly connected by glue or double-sided tape on the basis of providing the clamping structure, so as to enhance the connection strength between the photosensitive chip 240 and the supporting member 230.

Specifically, referring to fig. 21, in some embodiments of the present disclosure, the supporting element 230 has an inner sidewall 232 close to the electronic element 220, and the engaging structure includes a step portion 233 formed on the inner sidewall 232 of the supporting element 230. The photosensitive chip 240 is disposed on the step portion 233 and abuts against the inner wall 232.

In other embodiments of the present application, please refer to fig. 22, the engaging structure may include a latch 234 disposed on an inner sidewall of the supporting member 230, and a slot 244 disposed on the photosensitive chip 240 and adapted to the latch 234. The latch 234 protrudes from the inner sidewall 232, the slot 244 is recessed from a contact surface between the photosensitive chip 240 and the support 230, and the photosensitive chip 40 is fixedly disposed on the support 230 by the engagement of the latch 234 and the slot 244.

In some embodiments, the slot may be opened on the inner sidewall 232 of the supporting member 230, and the photosensitive chip 240 may be provided with a matching latch. For example, the engaging structure may include a locking groove 235 disposed on the inner sidewall 232 of the supporting member 230, and a locking tooth 245 disposed on the photosensitive chip 240 and adapted to the locking groove 235. The card slot 235 is recessed on the inner side wall 232, the latch 245 is protruded on the contact surface between the photosensitive chip 240 and the supporting member 230, and the photosensitive chip 240 is fixedly disposed on the supporting member 230 by the cooperation of the latch 245 and the card slot 235.

In some embodiments, a card slot and a card tooth may be disposed on the supporting member 230, and a card tooth corresponding to the card slot on the supporting member 230 and a card slot corresponding to the card tooth on the supporting member 230 may be disposed on the photosensitive chip 240. For example, the engaging structure may include a first latch 246 disposed on the light sensing chip 240, a first engaging groove 236 disposed on an inner sidewall of the supporting member 230 and adapted to the first latch 246, a second latch 237 disposed on the inner sidewall of the supporting member 230, and a second engaging groove 247 disposed on the light sensing chip 240 and adapted to the second latch 237. The first latch 246 is matched with the first slot 236, and the second latch 237 is matched with the second slot 247, so that the supporting member 230 is fixedly connected with the photosensitive chip 240.

In some embodiments of the present application, referring to fig. 23, a receiving slot 211 may be further formed on the circuit board 210, and the electronic component 220 and the supporting member 230 are received in the receiving slot 211. The photo sensor 240 is disposed on the supporting member 230, and the photo sensor 240 may be accommodated in the accommodating cavity 211 or not accommodated in the accommodating cavity 211.

In some embodiments, the photo sensor chip 240 may be disposed on the supporting member 230 and received in the receiving cavity 211 of the circuit board 210, and an end of the photo sensor chip 240 may abut against an inner sidewall of the receiving cavity 211. In other embodiments, the photo sensor chip 240 may be disposed on the circuit board 210 and located outside the receiving cavity 211, that is, the photo sensor chip 240 is not received in the receiving cavity 211 of the circuit board 210.

According to the camera module 200 provided by the embodiment of the application, the circuit board 210 is provided with the accommodating groove 211, and the electronic element 220 and the supporting member 230 are both accommodated in the accommodating groove 211, so that the space occupied by the electronic element 220 in the vertical direction Z can be reduced, and the camera module 200 can meet the requirement of high integration level and the requirement of miniaturization.

In some embodiments of the present application, with continued reference to fig. 19, the photosensitive chip 240 may be electrically connected to the circuit board 210 by a wire 241 by way of a gold wire.

However, in other embodiments, the photosensitive chip 240 may be electrically connected to the circuit board 210 by means of an external conductive connector. For example, in the embodiment illustrated in fig. 24, the support member 230 has an outer sidewall 238 remote from the electronic component 220, the outer sidewall 238 being disposed opposite the inner sidewall 232. Camera assembly 200 also includes conductive connection 250. The conductive connecting member 250 may be disposed on the outer sidewall of the photosensitive chip 240 and the outer sidewall 238 of the supporting member 230, and extend to the circuit board 210. The photosensitive chip 240 may be electrically connected to the circuit board 210 through a conductive connection 250. As shown in fig. 24, the conductive connecting member 250 can be attached to the outer sidewall 238 of the supporting member 230 by, for example, glue, and two end portions of the conductive connecting member 250 can respectively extend to the upper surfaces of the photosensitive chip 240 and the circuit board 210 close to the photosensitive chip 240, so as to conduct the photosensitive chip 240 and the circuit board 210.

The camera assembly 200 that this application embodiment provided is through setting up conductive connection 250 on sensitization chip 240 and support piece 230's lateral wall, switches on sensitization chip 240 and circuit board 210 with the help of this conductive connection 250, can save the gold plating line and switch on the space that sensitization chip and circuit occupy for camera assembly can satisfy the miniaturization demand when satisfying high integration requirement. Also, the reliability of the electrical connection between the photosensitive chip 240 and the circuit board 210 may be improved.

Referring to fig. 25 and fig. 26, the camera head assembly 200 according to the embodiment of the present disclosure further includes a lens 260, a bracket 270, and a filter 280. The holder 270 is disposed between the circuit board 210 and the lens 260, and a receiving space 271 can be formed between the holder 270 and the circuit board 210; the photo sensor chip 240, the supporting member 230 and the electronic component 220 are all accommodated in the accommodating space 271. The filter 280 may be supported on the support 270 and spaced apart from the photo sensor chip 240.

Further, the bracket 270 may include a body portion 272 and a bearing portion 273. The main body 272 is connected to the circuit board 210 and the lens 260, and the carrying portion 273 is disposed on an end of the main body 272 away from the circuit board 210 and connected to the main body 272 and the filter 280. The carrier 273 supports the filter 280.

It should be noted that, the structures and the positional connection relationships of the lens 260, the bracket 270 and the filter 280 refer to the structures and the positional connection relationships in the foregoing embodiments.

The embodiment of the application provides that when the camera assembly is used for photographing/recording, light reaches the optical filter 280 through the lens 260, the light filtered by the optical filter 280 reaches the photosensitive chip 240, and the photosensitive chip 240 converts the optical image on the photosensitive surface into an electrical signal in a corresponding proportional relation with the optical image and transmits the electrical signal to the circuit board 210, so that the photographing/recording function is realized.

The embodiment of the application provides camera subassembly and arranges electronic component in sensitization chip below to arrange with sensitization chip layering. The electronic component can be electrically connected with the circuit board by means of solder paste welding or conductive adhesive bonding and the like. The space occupied by the electronic element in the XY direction can be saved by the mode that the supporting element lifts the electronic element or the supporting element covers the electronic element. The photosensitive chip can be attached to the supporting member by glue (e.g., resin adhesive, back glue), double-sided adhesive, etc. so that the photosensitive chip is fixed on the supporting member. The photosensitive chip can be electrically connected with the circuit board by a wire in a gold wire bonding mode.

Referring to fig. 27, fig. 27 is a schematic structural diagram of an electronic device 1000 provided in the embodiment of the present application, where the electronic device 1000 may be any device having communication and storage functions, for example: the system comprises intelligent equipment with a network function, such as a tablet Computer, a mobile phone, an electronic reader, a remote controller, a Personal Computer (PC), a notebook Computer, vehicle-mounted equipment, a network television, wearable equipment and the like.

The electronic device 1000 according to the embodiment of the present disclosure includes a camera assembly 300 and a housing 400, the camera assembly 300 is accommodated in the housing 400, and the camera assembly 300 is a camera assembly according to any of the embodiments described above.

It is noted that the terms "comprises" and "comprising," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

The above description is only a part of the embodiments of the present application, and not intended to limit the scope of the present application, and all equivalent devices or equivalent processes performed by the content of the present application and the attached drawings, or directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims

1. A camera head assembly, comprising:

a circuit board;

the electronic element is arranged on the circuit board and is electrically connected with the circuit board;

the supporting piece is arranged on the circuit board and provided with an inner side wall close to the electronic element;

the photosensitive chip is arranged on the supporting piece, is arranged at intervals with the circuit board and is electrically connected with the circuit board, and the electronic element is positioned between the photosensitive chip and the circuit board;

the clamping structure is arranged between the support piece and the photosensitive chip, and the photosensitive chip is fixed on the support piece through the clamping structure;

wherein,

the clamping structure comprises a step part formed on the inner side wall of the support part; the photosensitive chip is arranged on the step part and is abutted against the inner side wall; or,

the clamping structure comprises a clamping tooth arranged on the inner side wall of the supporting piece and a clamping groove which is arranged on the photosensitive chip and is matched with the clamping tooth; or,

the clamping structure comprises a clamping tooth arranged on the photosensitive chip and a clamping groove which is arranged on the inner side wall of the supporting piece and is matched with the clamping tooth; or

The clamping structure comprises a first latch arranged on the photosensitive chip, a first clamping groove arranged on the inner side wall of the supporting piece and matched with the first latch, a second latch arranged on the inner side wall of the supporting piece and a second clamping groove arranged on the photosensitive chip and matched with the second latch.

2. The camera assembly of claim 1, wherein a height of the support member in a direction perpendicular to the circuit board is greater than or equal to a height of the electronic component in a direction perpendicular to the circuit board.

3. A camera assembly according to claim 2, wherein the support member is a ring-shaped structure and the electronic components are located within an area enclosed by the ring-shaped structure.

4. The camera assembly according to claim 1 or 2, wherein the photosensitive chip comprises two oppositely disposed side edges, the supporting member comprises at least two supporting portions, and at least one supporting portion is disposed on each side edge.

5. The camera assembly according to claim 1 or 2, wherein a receiving slot is defined in the circuit board, and the electronic component and the supporting member are received in the receiving slot.

6. A camera assembly according to claim 1 or 2, wherein the support has an outer side wall remote from the electronic component; the camera assembly further comprises a conductive connecting piece, wherein the conductive connecting piece is arranged on the photosensitive chip and the outer side wall of the supporting piece and extends to the circuit board; the photosensitive chip is electrically connected with the circuit board through the conductive connecting piece.

7. A camera assembly according to claim 1, wherein the support member is an insulator.

8. A camera assembly according to claim 7, wherein the insulator is made of polyethylene terephthalate, foam or rubber.

9. The camera assembly of claim 1, wherein the support member is secured to the circuit board by glue or double-sided tape, and the photo sensor chip is secured to the support member by glue or double-sided tape.

10. The camera assembly of claim 1, further comprising:

a lens;

the support is arranged between the circuit board and the lens, an accommodating space is formed between the support and the circuit board, and the photosensitive chip, the support piece and the electronic element are accommodated in the accommodating space; and

and the optical filter is supported on the bracket and is arranged at intervals with the photosensitive chip.

11. A camera assembly according to claim 10, wherein the bracket comprises:

a main body part connecting the circuit board and the lens; and

and the bearing part is arranged on one end of the main body part, which is far away from the circuit board, and is connected with the main body part and the optical filter.

12. An electronic device comprising a housing and a camera assembly according to any of claims 1-11, the camera assembly being housed within the housing.