CN201577197U - Capacitance-type microphone - Google Patents
Capacitance-type microphone Download PDFInfo
- Publication number
- CN201577197U CN201577197U CN 200920260873 CN200920260873U CN201577197U CN 201577197 U CN201577197 U CN 201577197U CN 200920260873 CN200920260873 CN 200920260873 CN 200920260873 U CN200920260873 U CN 200920260873U CN 201577197 U CN201577197 U CN 201577197U
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- CN
- China
- Prior art keywords
- wiring board
- circuit board
- sidewall
- boss
- electret condencer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model provides a capacitance-type microphone, comprising a first circuit board, a second circuit board and a side wall connected with the first circuit board and the second circuit board and separating the first circuit board and the second circuit board to form a containing cavity, wherein the side wall comprises a first surface opposite to the first circuit board and a second surface opposite to the second circuit board; the first surface and second surface are respectively provided with a conducting element; the containing cavity is internally installed with an acoustic-electro conversion chip; the first circuit board is provided with a sound inlet hole; the capacitance-type microphone also comprises a boss realizing electric connection of the first circuit board and the second circuit board; and the boss connects the side wall between the first circuit board and the second circuit board and pushes against the conducting element. The capacitance-type microphone has good stability, can realize good signal connection among the circuit boards, and is not easy to generate short circuit.
Description
[technical field]
The utility model relates to a kind of microphone, relates in particular to a kind of Electret Condencer Microphone.
[background technology]
Development along with wireless telecommunications, Global Mobile Phone Users is more and more, the user not only is satisfied with conversation to the requirement of mobile phone, and want high-quality communication effect can be provided, especially at present the development of mobile multimedia technology, the speech quality of mobile phone becomes more important, and the microphone of mobile phone is as the voice pick device of mobile phone, and its design quality directly influences speech quality.
And the microphone of using more and better performances at present is microelectromechanical-systems microphone (Micro-Electro-Mechanical-System Microphone is called for short MEMS), and the microelectromechanical-systems microphone is a kind of of Electret Condencer Microphone.
As shown in Figure 1, in the correlation technique, MEMS microphone 10 ' comprises first wiring board 11 ', second wiring board 12 ', makes up with first wiring board 11 ' and second wiring board 12 ' and will separate the sidewall 13 ' that forms host cavity 14 ' between the two, in host cavity 14 ', be provided with MEMS chip 15 ' and control chip 16 ', suitable position at first wiring board 11 ' offers tone-entering hole 110 ', in order to accept and to transmit extraneous sound wave and be provided with conducting resinl 130 ' for the joint face of MEMS chip 15 ', the first wiring board 11 ' and second wiring board 12 ' and sidewall 13 '.The effect of this conducting resinl 130 ' is being electrically connected between fixed sidewall 13 ' and two circuit boards, and then finishes the acoustic-electric conversion.
But, this sidewall and two direct-connected modes of wiring board, making needs to apply a large amount of conducting resinls on two wiring boards, and so the connection of mode can cause the short circuit of unlike signal between two wiring boards, thereby influence the stability of MEMS microphone.
Therefore, be necessary to provide a kind of new MEMS microphone to overcome above-mentioned defective.
[utility model content]
The utility model purpose is to provide a kind of stable performance, can realize the Electret Condencer Microphone that good electrical connects.
The utility model solves the problems of the technologies described above by the following technical programs:
A kind of Electret Condencer Microphone, comprise first wiring board, second wiring board, and connect first wiring board and second wiring board and will separate the sidewall that forms host cavity between the two, described sidewall comprise with the first circuit board opposite first and with the second circuit board opposing second surface, be respectively equipped with conducting element on described first surface and the second surface, in this host cavity acoustic-electro conversion chip is installed, first wiring board is provided with tone-entering hole, wherein, this Electret Condencer Microphone also comprises the boss of realizing that first wiring board and second wiring board are electrically connected, this boss connects sidewall between first wiring board and second wiring board, and with described conducting element butt.
As a kind of improvement of the present utility model, described boss is arranged on the peripheral region of first wiring board and the peripheral region of second wiring board.
As a kind of improvement of the present utility model, described boss is arranged on the second surface of the first surface of sidewall and sidewall.
As a kind of improvement of the present utility model, described boss is arranged on the second surface of the peripheral region of first circuit board and sidewall.
As a kind of improvement of the present utility model, described boss is arranged on the first surface of the peripheral region of second circuit board and sidewall.
As a kind of improvement of the present utility model, described boss is arranged on the peripheral region of first wiring board and the peripheral region of second wiring board, and on the second surface of the first surface of sidewall and sidewall.
As a kind of improvement of the present utility model, the height of described boss is less than or equal to 0.05mm.
As a kind of improvement of the present utility model, described conducting element is conducting strip or lead-in wire.
Compared with prior art, the utlity model has following advantage: owing between first wiring board and second wiring board, be provided with boss, sidewall is electrically connected with two circuit boards under the connection of boss, so just can reduce the contact area of conducting resinl on sidewall and the circuit board, thereby avoid a large amount of conducting resinls to make unlike signal problem of short-circuit between circuit board, improve the stability of microphone greatly.
[description of drawings]
Fig. 1 is the schematic diagram of correlation technique MEMS microphone.
Fig. 2 is the schematic diagram of the utility model Electret Condencer Microphone.
Fig. 3 is the three-dimensional exploded view of the utility model scheme one.
Fig. 4 is the three-dimensional exploded view of the utility model scheme two.
Fig. 5 is the three-dimensional exploded view of the utility model scheme three.
[embodiment]
The utility model is described in further detail below in conjunction with drawings and embodiments.
See also Fig. 2, the utility model Electret Condencer Microphone 10 is used on the electronic equipment to accept external acoustic waves and sound wave is converted to the signal of telecommunication, in the present embodiment, the utility model Electret Condencer Microphone is MEMS (Micro-Electro-Mechanical-System Microphone) microphone.
Electret Condencer Microphone 10 mainly comprises first wiring board 11, second wiring board 12 and connects first wiring board 11 and second wiring board 12 and will separate the sidewall 13 that forms reception room 130 between the two, sidewall 13 comprise with first wiring board, 11 opposite first 131 and with second wiring board, 12 opposing second surface 132.Be respectively arranged with conducting element on described first surface 131 and the second surface 132, in the embodiments of the present invention, described conducting element can be conducting strip or lead-in wire.
The acoustic-electro conversion chip that is used for voice signal is converted into the signal of telecommunication is installed in reception room 130, and this acoustic-electro conversion chip comprises MEMS chip 14 and control circuit chip 15, is electrically connected with metal wire between the two.MEMS chip 14 comprises vibrating diaphragm and backboard.In order to accept external acoustic waves, first wiring board 11 is provided with tone-entering hole 110, when the external sound signal enters tone-entering hole 110 and is delivered on the vibrating diaphragm of MEMS chip 14, will cause the vibrating diaphragm vibration, and causing the distance between vibrating diaphragm and the backboard to change, capacitance changes and forms electric current.
Be provided with the boss 16 of realizing electrical connection between first wiring board 11 and second wiring board 12, this boss 16 connects sidewalls 13 between first wiring board 11 and second wiring board 12, and described boss 16 comprises boss 16a and boss 16b.Wherein, boss 16a connects the sidewall 13 and first wiring board 11, and boss 16b connects the sidewall 13 and second wiring board 12.In the present embodiment, five kinds of plans of establishment to boss 16 can be arranged:
Scheme one in the lump with reference to Fig. 3, is respectively equipped with boss 16 at the peripheral region of first wiring board 11 and the peripheral region of second wiring board 12, the boss 16b that it comprises the boss 16a of the peripheral region that is arranged on first wiring board 11 and is arranged on the peripheral region of second wiring board 12.
Scheme two in the lump with reference to Fig. 4, is being respectively equipped with boss 16 on the first surface 131 of sidewall 13 He on the second surface 132, and it comprises boss 16a and the boss 16b that is arranged on the second surface 132 on the first surface 131 that is arranged on sidewall 13.
Scheme three in the lump with reference to Fig. 5, is being respectively equipped with boss 16 on the first surface 131 of sidewall 13 He on second wiring board 12, the boss 16b that it comprises the boss 16a on the first surface 131 that is arranged on sidewall 13 and is arranged on the peripheral region of second wiring board 12.
Scheme four please refer to Fig. 2, is respectively equipped with boss 16 on the second surface 132 of first wiring board 11 and sidewall 13, and it comprises the boss 16a of the peripheral region that is arranged on first wiring board 11 and is arranged on boss 16b on the second surface 132 of sidewall 13.
Scheme five, please refer to Fig. 2, on the first surface 131 of first wiring board 11, second wiring board 12 and sidewall 13 and second surface 132, be respectively equipped with boss 16, it comprises the boss 16a on the first surface 131 that lays respectively at first wiring board 11 and sidewall 13, and lays respectively at the boss 16b on the second surface 132 of second wiring board 12 and sidewall 13.
To sum up be five kinds of plans of establishment to boss 16.In five kinds of schemes, boss 16a all with the first surface 131 of sidewall 13 on the conducting element butt, and connect the sidewall 13 and first wiring board 11; Boss 16b all with the second surface 132 of sidewall 13 on the conducting element butt, and connect the sidewall 13 and second wiring board 12.So sidewall 13 is connected electrically in respectively between first wiring board 11 and second wiring board 12 by boss 16a and boss 16b, and sidewall 13 and boss 16 all be metallic conductors, so can realize the transmission of the signal of telecommunication between two wiring boards well.In being connected of boss 16 and sidewall 13, adopt the mode of a small amount of conducting resinl 161 of point on the joint face of the two, make its tight connection.Simultaneously, epoxy glue 160 is set around first wiring board 11 and second wiring board 12, purpose is the slit between two wiring boards of sealing and the sidewall 13, and boss 16a and boss 16b are fixed on two wiring boards.
Like this, under the connection of boss 16, sidewall 13 firmly is connected electrically between first wiring board 11 and second wiring board 12.When MEMS chip 14 is converted into electric current with capacitance, 12 of first wiring board 11 and second wiring boards will be realized being electrically connected between signal by sidewall 13, thereby finish the acoustic-electric conversion of Electret Condencer Microphone 10.
In the present embodiment, the height of described boss 16a and boss 16b all is less than or equal to 0.05mm.
To sum up, owing between first wiring board and second wiring board, be provided with boss, sidewall is electrically connected with two wiring boards under the connection of boss, so just can reduce the contact area of conducting resinl on sidewall and the wiring board, thereby avoid a large amount of conducting resinls to make unlike signal problem of short-circuit between circuit board, improve the stability of microphone greatly.
Above-described only is execution mode of the present utility model; should be pointed out that for the person of ordinary skill of the art at this, under the prerequisite that does not break away from the utility model creation design; can also make improvement, but these all belong to protection range of the present utility model.
Claims (8)
1. Electret Condencer Microphone, comprise first wiring board, second wiring board, and connect first wiring board and second wiring board and will separate the sidewall that forms host cavity between the two, described sidewall comprise with the first circuit board opposite first and with the second circuit board opposing second surface, be respectively equipped with conducting element on described first surface and the second surface, acoustic-electro conversion chip is installed in the host cavity, first wiring board is provided with tone-entering hole, it is characterized in that: this Electret Condencer Microphone also comprises the boss of realizing that first wiring board and second wiring board are electrically connected, this boss connects sidewall between first wiring board and second wiring board, and with described conducting element butt.
2. Electret Condencer Microphone according to claim 1 is characterized in that: described boss is arranged on the peripheral region of first wiring board and the peripheral region of second wiring board.
3. Electret Condencer Microphone according to claim 1 is characterized in that: described boss is arranged on the second surface of the first surface of sidewall and sidewall.
4. Electret Condencer Microphone according to claim 1 is characterized in that: described boss is arranged on the second surface of the peripheral region of first circuit board and sidewall.
5. Electret Condencer Microphone according to claim 1 is characterized in that: described boss is arranged on the first surface of the peripheral region of second circuit board and sidewall.
6. Electret Condencer Microphone according to claim 1 is characterized in that: described boss is arranged on the peripheral region of first wiring board and the peripheral region of second wiring board, and on the second surface of the first surface of sidewall and sidewall.
7. according to each described Electret Condencer Microphone in the claim 1 to 6, it is characterized in that: the height of described boss is less than or equal to 0.05mm.
8. Electret Condencer Microphone according to claim 1 is characterized in that: described conducting element is conducting strip or lead-in wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920260873 CN201577197U (en) | 2009-11-30 | 2009-11-30 | Capacitance-type microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920260873 CN201577197U (en) | 2009-11-30 | 2009-11-30 | Capacitance-type microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201577197U true CN201577197U (en) | 2010-09-08 |
Family
ID=42697067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200920260873 Expired - Lifetime CN201577197U (en) | 2009-11-30 | 2009-11-30 | Capacitance-type microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201577197U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110602361A (en) * | 2019-09-12 | 2019-12-20 | Oppo广东移动通信有限公司 | Camera assembly and electronic equipment |
-
2009
- 2009-11-30 CN CN 200920260873 patent/CN201577197U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110602361A (en) * | 2019-09-12 | 2019-12-20 | Oppo广东移动通信有限公司 | Camera assembly and electronic equipment |
| CN110602361B (en) * | 2019-09-12 | 2021-03-30 | Oppo广东移动通信有限公司 | Camera assembly and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170602 Address after: Singapore Ang Mo Kio 65 Street No. 10 techpoint Building 1 floor, No. 8 Co-patentee after: AAC Acoustic Technologies (Changzhou) Co., Ltd. Patentee after: AAC Technologies (Singapore) Co., Ltd. Address before: Wujin Nanxiashu town Jiangsu city Changzhou province 213167 Co-patentee before: AAC Acoustic Technologies (Shenzhen) Co., Ltd. Patentee before: AAC Acoustic Technologies (Changzhou) Co., Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100908 |