CN113093365A

CN113093365A - Optical assembly, periscopic camera module and electronic equipment

Info

Publication number: CN113093365A
Application number: CN202010074203.0A
Authority: CN
Inventors: 陈烈烽; 梅哲文; 叶林敏; 孟楠; 方银丽; 王天一
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2019-12-20
Filing date: 2020-01-22
Publication date: 2021-07-09
Also published as: CN113009668B; CN113009749B; CN113014751A; CN113014752A; CN113014751B; CN113009668A; WO2021120954A1; CN114982215A; CN113014752B; CN113009749A

Abstract

The application discloses an optical assembly, periscopic module and electronic equipment that make a video recording that are used for periscopic module. This optical assembly sets up between periscopic camera module's camera lens subassembly and the sensitization unit for the receipt is passed through periscopic camera module's camera lens subassembly's light, and will light reflection extremely the sensitization unit includes: a reflective component; a carrier for carrying at least a portion of the reflective component; and a dielectric layer disposed between the at least a portion of the reflective assembly and the carrier, having a predetermined flexibility for preventing deformation of the at least a portion of the reflective assembly. Therefore, the deflection of the light path passing through at least one part of the reflection assembly caused by the deformation of the reflection assembly can be avoided, and the overall optical performance of the periscopic camera module is improved.

Description

Optical assembly, periscopic camera module and electronic equipment

Technical Field

The present application relates to the field of optical device technology, and more particularly, to optical assemblies, periscopic camera modules, and electronic devices.

Background

In recent years, with the improvement of the functions of the camera module, the optical system of the camera module has become more complicated. For example, in an optical system of an image pickup module, optical elements such as a mirror, a refractor, a prism, and the like are added in order to realize predetermined optical characteristics. For example, in an optical system, in order to adjust an optical path, a reflection structure is generally installed, and known and common reflection structures include a prism, a mirror, and the like. Here, in some optical systems requiring focusing or anti-shake, since the prism is generally heavy in mass and not favorable for driving, a more common option is to employ a mirror to change the optical path.

In addition to the reflection structure, there are optical elements having other functions such as a light splitting structure and a light collecting structure.

However, in the optical system, since new optical elements are added, the optical elements may have an influence on the optical performance of the entire optical system due to their own performance. For example, in mirror applications, due to the properties of the mirror itself, there may be problems with light shifting caused by the mirror, and so on for other optical elements.

Therefore, it is necessary to provide a solution that avoids the influence of the optical element itself on the optical performance of the entire optical system in the case where other optical elements are applied outside the lens group.

Disclosure of Invention

The present application is proposed to solve the above-mentioned technical problems. The embodiment of the application provides an optical assembly, periscopic camera module and electronic equipment for periscopic camera module, it can be through setting up the dielectric layer between periscopic camera module's optical element and support part at periscopic camera module, avoids optical element self deformation to lead to the skew of the light path through optical element to improve the whole optical performance of periscopic camera module.

According to an aspect of the application, an optical assembly for periscopic camera module is provided, optical assembly sets up between periscopic camera module's lens subassembly and the sensitization unit for the receipt passes through periscopic camera module's lens subassembly's light, and will light reflection extremely the sensitization unit, optical assembly includes:

a reflective component;

a carrier for carrying at least a portion of the reflective component; and the number of the first and second groups,

a dielectric layer disposed between the at least a portion of the reflective element and the carrier having a predetermined flexibility for preventing deformation of the at least a portion of the reflective element.

In an optical assembly according to the present application, the reflective assembly includes a first reflective member facing the lens assembly and a prism facing the first reflective member, the first reflective member including a first mirror and a second mirror;

the first reflector and the second reflector are arranged on the carrier and are V-shaped;

the dielectric layers are respectively disposed between the first reflecting mirror and the carrier, and between the second reflecting mirror and the carrier, and have a predetermined flexibility for preventing deformation of the first reflecting mirror and the second reflecting mirror.

In an optical assembly according to the present application, the reflective assembly includes a first reflective element facing the lens assembly, the first reflective element including a first mirror and a second mirror, and a second reflective element facing the first reflective element, the second reflective element including a third mirror and a fourth mirror;

the carrier comprises a first carrier unit and a second carrier unit, the first reflector and the second reflector are arranged on the first carrier unit, the first reflector and the second reflector are V-shaped, the third reflector and the fourth reflector are arranged on the second carrier unit, and the third reflector and the fourth reflector are inverted V-shaped;

the dielectric layers are respectively arranged between the first reflector and the first carrier unit, between the second reflector and the first carrier unit, between the third reflector and the second carrier unit, and between the fourth reflector and the second carrier unit, and the dielectric layers have preset flexibility for preventing deformation of the first reflector, the second reflector, the third reflector and the fourth reflector.

In an optical assembly according to the present application, the reflection assembly includes: a first mirror facing the lens assembly and a second mirror facing the first mirror;

the carrier comprises a first carrier unit and a second carrier unit, the dielectric layers are respectively arranged between the first reflector and the first carrier unit and between the second reflector and the second carrier unit, and the carrier has preset flexibility for preventing the deformation of the first reflector and the second reflector.

In the optical assembly according to this application, first speculum with the second speculum with the length direction of periscopic camera module group is 45 degrees contained angles.

In the optical assembly according to the present application, the dielectric layer is made of a flexible material having a shore hardness of 10 degrees to 70 degrees.

In the optical assembly according to the present application, the dielectric layer is made of any one material selected from foam, a combination of plastic and foam, soft gel and silica gel.

In the optical component according to the present application, when the dielectric layer is made of foam, the thickness of the dielectric layer is 80um to 130 um.

In the optical assembly according to the present application, when the dielectric layer is made of soft glue, the thickness of the dielectric layer is 20um-100 um.

In the optical component according to the present application, the deformation amount that can occur in the dielectric layer is 5% to 50% of its thickness.

According to another aspect of the present application, there is provided a periscopic camera module, which includes:

an outer frame including a bottom plate and a side plate extending upward from the bottom plate;

the photosensitive assembly comprises a circuit board arranged on the side plate, a photosensitive unit mounted on the circuit board and electrically connected with the circuit board, and a filter element kept on a photosensitive path of the photosensitive unit;

a lens assembly held at a photosensitive path of the photosensitive unit; and

an optical assembly as described above.

In a periscopic camera module according to the application, the lens assembly comprises at least one lens, and at least one lens in the lens is a glass lens.

In the periscopic camera module according to the application, the lens subassembly includes camera lens and protective layer, the camera lens include the lens cone and install in the lens cone an at least lens, the camera lens passes through the protective layer is fixed in outer frame the bottom plate.

In the periscopic camera module according to the application, the protective layer is made of a damping material or a flexible material.

According to yet another aspect of the present application, there is also provided an electronic apparatus, comprising:

an electronic device main body; and

the periscopic camera module is assembled on the electronic equipment body.

Further objects and advantages of the present application will become apparent from an understanding of the ensuing description and drawings.

These and other objects, features and advantages of the present application will become more fully apparent from the following detailed description, the accompanying drawings and the claims.

Drawings

The above and other objects, features and advantages of the present application will become more apparent by describing in more detail embodiments of the present application with reference to the attached drawings. The accompanying drawings are included to provide a further understanding of the embodiments of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. In the drawings, like reference numbers generally represent like parts or steps.

Fig. 1 illustrates a schematic view of deformation of a conventional plane mirror.

Fig. 2A is a schematic diagram illustrating a change in an optical path caused by deformation of a conventional plane mirror.

Fig. 2B is a schematic diagram illustrating a change in an optical path caused by deformation of another conventional plane mirror.

FIG. 3 illustrates a schematic diagram of an optical assembly according to an embodiment of the present application.

Fig. 4 illustrates a schematic diagram of a variant embodiment of the optical assembly according to an embodiment of the present application.

FIG. 5 illustrates a schematic diagram of an optical assembly according to another embodiment of the present application.

Fig. 6 illustrates a schematic view of a variant embodiment of the optical assembly according to another embodiment of the present application.

Fig. 7 illustrates a schematic view of another variant embodiment of the optical assembly according to another embodiment of the present application.

Fig. 8 illustrates a schematic diagram of a first example of a periscopic camera module according to an embodiment of the present application.

Fig. 9 illustrates a schematic diagram of a second example of a periscopic camera module according to an embodiment of the present application.

Fig. 10 illustrates a schematic diagram of a third example of a periscopic camera module according to an embodiment of the present application.

Fig. 11 is a schematic diagram illustrating a further modified embodiment of the optical assembly 10 in the periscopic camera module according to the present application.

Fig. 12 illustrates a schematic diagram of a fourth example of a periscopic camera module according to an embodiment of the present application.

Fig. 13 illustrates a schematic diagram of a fifth example of a periscopic camera module according to an embodiment of the present application.

Fig. 14 illustrates a schematic view of a portion of a first exemplary reflective structure of a periscopic camera module according to an embodiment of the present application.

Fig. 15 illustrates a schematic view of the whole of a first exemplary reflective structure of a periscopic camera module according to an embodiment of the present application.

Fig. 16 illustrates a schematic diagram of a second exemplary reflective structure of a periscopic camera module according to an embodiment of the present application.

Fig. 17 illustrates a schematic view of a third exemplary reflective structure of a periscopic module according to an embodiment of the present application.

Fig. 18A illustrates a schematic diagram of an electronic device according to an embodiment of the application.

Fig. 18B illustrates a schematic diagram of another example of an electronic device according to an embodiment of the application.

Detailed Description

Hereinafter, example embodiments according to the present application will be described in detail with reference to the accompanying drawings. It should be understood that the described embodiments are only some embodiments of the present application and not all embodiments of the present application, and that the present application is not limited by the example embodiments described herein.

Example one

Fig. 1 illustrates a schematic view of deformation of a conventional plane mirror. As shown in fig. 1, the optical elements in the camera module may be reflective elements, such as a flat mirror 1P, the flat mirror 1P being supported by a corresponding carrier 2P, the carrier 2P being made of various materials, such as plastic, etc. Also, the Coefficient of thermal expansion of the planar mirror and the carrier may not be the same (e.g., the Coefficient of Thermal Expansion (CTE) of the mirror 1P may be less than the CTE of the carrier). Further, the carrier 2P itself may have an asymmetric shape, and these factors cause the carrier 2P and the plane mirror 1P supported on the carrier 2P to be easily deformed when the ambient temperature changes (for example, when the temperature rises or falls). Also, because the plane mirror is thin, the curvature of the mounting surface of the plane mirror 1P will cause the reflection surface to curve, which will cause the reflected light to diverge, as shown in fig. 2A and 2B. Fig. 2A illustrates a schematic diagram of a change in an optical path caused by deformation of a conventional one of the plane mirrors, and fig. 2B illustrates a schematic diagram of a change in an optical path caused by deformation of a conventional another one of the plane mirrors.

Since the optical system (generally, including a plurality of optical elements for performing multiple optical reflection, refraction, etc.) of the current camera module is generally sensitive, there are high requirements on the surface shape accuracy and installation accuracy of the optical elements, for example, the reflective element, if at least one reflected light diverges, the light deviates from the predetermined path more seriously, and the corresponding performance of the final optical system is deteriorated. For example, when the optical element is applied to a camera module, the reflection element is bent to make an imaging light path of the camera module inconsistent with a preset one, which finally results in poor imaging quality; even more seriously, the optical elements cannot be effectively assembled into an optical system or a camera module.

In view of the above, the present application provides an optical assembly, as shown in fig. 3. FIG. 3 illustrates a schematic diagram of an optical assembly according to an embodiment of the present application. In the optical module as illustrated in fig. 3, the optical module 10 includes a reflective element 11, a dielectric layer 12, and a carrier 13, the reflective element 11 being mounted to the carrier 13 through the dielectric layer 12, wherein the dielectric layer 12 has a predetermined flexibility so that the reflective element 11 can be effectively prevented from being bent. In this way, the dielectric layer 12 ensures the stability of the reflective element 11 even if the carrier 13 of the optical component 10 is deformed during the heating up or cooling down. That is, the dielectric layer 12 has a predetermined flexibility for preventing deformation of the reflective element 11

Further, in the embodiment of the present application, the dielectric layer 12 is preferably implemented as a flexible material having a shore hardness of 10 degrees to 70 degrees, for example, 20 degrees and 30 degrees, and capable of compressing 5% to 50% (preferably, 30% to 50%) of its thickness or stretching 5% to 50% (preferably, 30% to 50%) of its thickness when subjected to an external force. In addition, in the embodiment of the present application, the upper surface of the dielectric layer 12 corresponds to the reflective element 11, and the lower surface thereof corresponds to the carrier 13, so that when the carrier 13 deforms due to a change in the environmental temperature, the deformation force of the carrier 13 drives the lower surface of the dielectric layer 12 to deform. Since the dielectric layer 12 can be compressed by 5% -50% (preferably, 30% -50%) of its thickness, or stretched by 5% -50% (preferably, 30% -50%) of its thickness, the upper surface will not bend and still be close to a plane, and the deformation force of the carrier 13 will not act on the reflective element 11, so that the reflective surface of the reflective element 11 can maintain a good flatness and can reduce the light divergence, where the flatness of the reflective element 11 can be 0.01 λ -0.2 λ (λ is the sign of the light wavelength), or the flatness of the reflective element 11 can be below 0.16 um. It is also understood that the reflective element 11 has a greater hardness than the dielectric layer 12, and thus deformation (bending) of the reflective element 11 can be suppressed by deformation of the dielectric layer 12.

Further, in the embodiment of the present application, the material of the dielectric layer 12 may be implemented as foam, PET (polyethylene terephthalate, a kind of plastic material) + PU (PU is foam), soft glue, silica gel, etc., where PET + PU may be understood as foaming on the PET material to form a PU layer, where PET may also be implemented as other plastic materials, and even PET may be replaced by metal, i.e., foaming on metal to form a PU layer.

In the present embodiment, as shown in fig. 3, the optical assembly 10 further includes at least one adhesive member 14, the medium layer 12 is connected to the carrier 13 and the reflective element 11 respectively through the adhesive member 14, and the adhesive member 14 may be implemented as an adhesive tool such as glue, double-sided tape, etc. That is, in the embodiment of the present application, the adhesive 14 is first disposed on the dielectric layer 12, the reflective element 11 or the carrier 13, and then the dielectric layer 12, the carrier 13 and the reflective element 11 are fixed by the adhesive 14 to form the optical assembly 10.

Particularly, when the dielectric layer 12 is made of foam, the thickness of the foam is 80 to 130um, preferably 100um, and at this time, the thickness of the reflective element 11 is 0.15 to 2.5mm, preferably 1 to 2 mm; the thickness of the adhesive member 14 is 20um to 40 um. When the dielectric layer 12 is implemented as soft rubber, the thickness of the soft rubber is 20-100 um, preferably 50um, and at this time, the thickness of the reflection element 11 is 0.15-2.5 mm, preferably 1 mm-2 mm.

In a variant of the above embodiment, the dielectric layer 12 may be formed integrally with the carrier 13, i.e. the dielectric layer 12 and the carrier 13 are of one-piece construction. For example, the dielectric layer 12 may be formed on the carrier 13 by coating, spraying, printing, foaming, or the like. For example, when the medium layer 12 is a foam layer, the medium layer 12 may be formed by foaming a predetermined material on the carrier 13. Therefore, the foam layer (i.e., the dielectric layer 12) does not need to be fixed to the carrier 13 through the adhesive member 14, so that errors caused by the adhesive member 14 can be further effectively controlled, and the accuracy of the optical assembly 10 can be improved. It is worth mentioning that in this variant embodiment, the parameters and properties of the dielectric layer 12 are the same as or similar to those described above.

That is, in this modified embodiment, the process of manufacturing the optical component 10 may include: the dielectric layer 12 is formed on the carrier 13, and the reflective element 11 and the dielectric layer 12 are fixed by the adhesive 14 to form the optical assembly 10.

In another modified embodiment of the above embodiment, the dielectric layer 12 is formed integrally with the reflective element 11, that is, the dielectric layer 12 and the reflective element 11 have an integral structure, for example, the dielectric layer 12 may be formed on the reflective element 11 by a coating, spraying, printing, foaming, or the like process.

Fig. 4 illustrates a schematic diagram of a further variant embodiment of the optical assembly 10 according to an embodiment of the present application. As shown in fig. 4, in this modified embodiment of the above-described embodiment, the shape of the lower surface (the surface facing the carrier 13) of the reflecting member 11 is adjusted, which is implemented as a non-flat surface. In particular, in the variant embodiment illustrated in fig. 4, the reflecting element 11 has a trapezoidal cross section, i.e. the lower surface of the reflecting element 11 comprises a first inclined surface, a second inclined surface and a flat surface extending between the first inclined surface and the second inclined surface, and the first inclined surface and the second inclined surface are also arranged on the dielectric layer 12, i.e. the dielectric layer 12 has a shape adapted to the lower surface of the reflecting element 11, so that a more comprehensive protection of the reflecting element 11 is provided, reducing the influence of the deformation of the carrier 13 on the reflecting element 11. It is worth mentioning that in this variant embodiment, the parameters and properties of the dielectric layer 12 are the same as or similar to those described above.

Of course, in other specific examples of this modified embodiment, the lower surface of the reflective element 11 may also be implemented in other shapes, such as a cambered surface, etc., which is not limited by the present application.

Example two

As shown in fig. 5, in this embodiment, the optical assembly 10 is composed of the reflective element 11, the adhesive 14 and the carrier 13. Wherein, the thickness of the bonding member 14 is 50um-100um (including being equal to 50um and being equal to 100 um). That is, in this embodiment, the adhesive 14 functions as a two-in-one of the dielectric layer 12 and the adhesive 14 in embodiment 1, or the dielectric layer 12 in embodiment 1 is formed by curing an adhesive having a thickness of 50um to 100 um. It should be noted that, because the existing adhesive, such as glue, has fluidity, it is not able to apply glue with a thickness of 50um-100um on the reflective element 11 or the carrier 13, in this embodiment, a support 15 is further provided, the support 15 is disposed as the carrier 13, an inner side surface of the support 15 and an upper surface of the carrier 13 form a receiving cavity 150, the adhesive 14 (glue) is disposed in the receiving cavity 150, the reflective element 11 is attached to the adhesive 14, and then the adhesive 14 is cured by baking or other processes to form the optical assembly 10. It is worth mentioning that in this embodiment, the cross section of the support 15 may be implemented as a ring or a quasi-ring.

In this embodiment, the adhesive 14 is preferably a glue having a predetermined flexibility, i.e. a predetermined flexibility after curing into the adhesive 14 to prevent deformation of the reflective element 11. The upper surface of bonding piece 14 is to reflecting element 11, its lower surface subtend carrier 13 leads to when ambient temperature changes carrier 13 takes place deformation, the power of carrier 13 deformation drives bonding piece 14's lower surface deformation, because bonding piece 14 has predetermined flexibility and has 50um-100 um's thickness, and its upper surface can not receive the influence and takes place the bending, still is nearly plane, the power of carrier 13 deformation also can not be used to reflecting element 11. Therefore, deformation of the reflective member 11 can be prevented, so that the reflective member 11 can maintain good flatness.

Further, in this embodiment, the adhesive member 14 has a large deformation capability, and specifically, the adhesive member 14 can be compressed by 5% to 50% (preferably, 30% to 50%) of its thickness or stretched by 5% to 50% (preferably, 30% to 50%) of its thickness when subjected to an external force. Accordingly, when the carrier 13 deforms due to a change in the environmental temperature, the deformation force of the carrier 13 drives the lower surface of the adhesive member 14 to deform, and the dielectric layer 12 can compress 5% to 50% (preferably, 30% to 50%) of its thickness or stretch 5% to 50% (preferably, 30% to 50%) of its thickness. Thus, the upper surface of the reflecting element 11 is not bent and still is nearly flat, and the force of deformation of the carrier 13 is not applied to the reflecting element 11, so that the reflecting surface of the reflecting element 11 can maintain a good flatness and the light divergence can be reduced.

It is worth mentioning that in this embodiment, the thickness of the adhesive member 14 may be lower than the height of the supporting member 15. That is, during the preparation process, the thickness of the glue may be smaller than the height of the supporting member 15, so that the glue is completely contained in the containing cavity 150, and at the same time, the reflecting element 11 is also contained in the containing cavity 150.

In a variant of the above embodiment, the thickness of the glue may also be greater than or equal to the height of the support 15. In this variant embodiment, as shown in fig. 6, the thickness of the adhesive element 14 (glue) is greater than the height of the support element 15. As will be understood by those skilled in the art, since the glue has a certain viscosity, the glue will not overflow from the receiving cavity 150 even if the thickness of the glue is within a certain range of the height difference of the supporting member 15 during the preparation process.

It is also worth mentioning that in other variant embodiments of the above embodiment, the supporting element 15 may also be optionally removed after the glue is cured to form the bonding element 14, i.e. the optical assembly 10 may not include the supporting element 15, as shown in fig. 7.

EXAMPLE III

At present, in order to meet the imaging requirement of the camera module, the optical zoom magnification needs to be improved. In order to increase the optical zoom factor, in the multi-camera module, the focal length of one camera module must be increased so that the back focal space of the camera module is increased.

In traditional camera module of being applied to mobile terminal, because the module of making a video recording tends frivolous trend, focus space after the increase usually is not desired, based on this, the structural design of periscopic formula module has appeared to the back focus space through the module of making a video recording sets up along mobile terminal's length or width direction and replaces the thickness direction setting along mobile terminal, increases the focus of the module of making a video recording, and has avoided increasing camera module's thickness.

In the periscopic camera module, the light does not reach the photosensitive chip directly through the lens along a straight line, but needs to pass through a turn of the optical path, for example, 90 degrees or two 90 degrees turns of the optical path reach the lens. Therefore, in the periscopic imaging module, an optical element such as a mirror needs to be added to change the optical path.

Therefore, the optical assembly 10 disclosed in the first and second embodiments and the modified embodiments thereof can be applied to a periscopic camera module. Of course, the optical assembly 10 disclosed in the above embodiments and the modified embodiments thereof can also be applied to other types of camera modules, for example, a TOF (Time of Flight) depth information camera module, such as a projection module of the TOF camera module.

Fig. 8 illustrates a schematic diagram of a first example of a periscopic camera module according to an embodiment of the present application. As shown in fig. 8, the periscopic camera module includes an optical module, a lens assembly 20, and a photosensitive unit 30, wherein light rays are reflected by the optical module, pass through the lens assembly 20, and finally reach the photosensitive unit 30. In this embodiment, the periscopic camera module further includes an outer frame 40, a filter element 50 and a packaging part 60, wherein the outer frame 40 includes a bottom plate 41 for supporting the optical module and/or the lens assembly 20, and a side plate 42 for providing a mounting surface for the photosensitive unit 30, and the filter element 50 is retained in a photosensitive path of the photosensitive unit 30 for filtering stray light in the optical path.

In this embodiment, the periscopic camera module may further include other optical elements, such as a mirror, a prism, an iris, a liquid lens, etc., wherein the other optical elements may be disposed between the optical module and the lens assembly 20 (not shown in fig. 8), or disposed between the lens assembly 20 and the photosensitive unit 30 (as shown in fig. 8), and of course, the periscopic camera module may not include other optical elements. In this embodiment, the periscopic camera module may further include a motor (not shown) for carrying and moving the lens assembly 20 to perform auto-focusing and/or optical anti-shake.

In this embodiment, as shown in fig. 8, the optical module includes the optical element and at least one driving element 16, the carrier 13 of the optical element is disposed on the driving element 16, and the optical element is driven by the driving element 16 for focusing and/or anti-shake, wherein the driving element 16 may be implemented as a motor. Specifically, the optical assembly is mounted on a housing 161 of the actuator 16, wherein in this embodiment, the actuator 16 further includes a magnet 162 mounted on the carrier 13 and a coil 163 mounted on the housing 161 and facing the magnet 162, and the magnet 162 and the coil 163 form a driving assembly, and the carrier 13 can be driven to rotate to drive the reflection element 11 to rotate for focusing and/or optical anti-shake. Of course, in some variants of this embodiment, the periscopic camera module may also be provided without the drive 16, as shown in fig. 9. Fig. 9 illustrates a schematic diagram of a second example of a periscopic camera module according to an embodiment of the present application.

As mentioned above, the optical assembly may be formed by adhering the reflective element 11 to the carrier 13, and when the reflective element 11 is bent, the light reflection path changes, which may result in incomplete light entering the lens assembly 20, and affect the final image formation of the periscopic camera module. In the periscopic camera module as illustrated in fig. 9, the dielectric layer 12 is disposed between the reflective element 11 and the carrier 13 in the optical assembly to prevent the reflective element 11 from bending, so as to ensure that the light reflection path meets the predetermined requirement and ensure the imaging quality.

Here, it can be understood by those skilled in the art that in the second example of the periscopic camera module shown in fig. 9, details of the optical components may be completely the same as those described in the first embodiment and the second embodiment and the modified embodiments thereof, and thus are not described again to avoid redundancy.

In addition, although the dielectric layer between the reflective element 11 and the carrier 13 is not shown in the first example of the periscopic camera module shown in fig. 8, it can be understood by those skilled in the art that the dielectric layer can also be applied between the reflective element 11 and the carrier 13 in the second example of the periscopic camera module shown in fig. 8, so that the periscopic camera module of the first example shown in fig. 8 can also prevent the deformation of the reflective element 11 via the dielectric layer having a predetermined flexibility.

Fig. 10 illustrates a schematic diagram of a third example of a periscopic camera module according to an embodiment of the present application. In the embodiment shown in fig. 10, in order to highlight the optical components outside the lens assembly 20A, other optical elements between the lens assembly 20A and the photosensitive unit 30A are not shown. Also, those skilled in the art will appreciate that other optical elements may or may not be disposed between the lens assembly 20A and the light sensing unit 30A depending on actual needs.

That is, in the third example of the periscopic camera module shown in fig. 10, an optical assembly is provided outside the lens assembly 20A of the periscopic camera module, and is configured to receive light from the outside of the periscopic camera module and reflect the light to the lens assembly 20A. As shown in fig. 10, the optical assembly includes: a reflective element 11A, a carrier 13A for carrying said reflective element 11A, and a dielectric layer 12A, arranged between said reflective element 11A and said carrier 13A, having a predetermined flexibility for preventing deformation of said reflective element.

The optical module may further include an adhesive 14A, and the medium layer 12A may be connected to the carrier 13A and the reflective element 11A through the adhesive 14A, respectively.

Here, it can be understood by those skilled in the art that in the third example of the periscopic camera module shown in fig. 10, details of the optical components may be completely the same as those described in the first embodiment, the second embodiment and the modified embodiments, and thus are not described again to avoid redundancy.

It should be noted that in the periscopic camera module according to the embodiment of the present application, when the carrier 13 is made of a material with a relatively high density, for example, when the carrier 13 is implemented as a metal member, the carrier 13 has a relatively high weight, and the difficulty of the driving element 16 driving the carrier 13 to drive the reflection unit to rotate increases. Accordingly, in order to reduce the weight of the carrier 13, in some implementations of this variant, the structural configuration of the carrier 13 may be adjusted. Fig. 11 is a schematic diagram illustrating a further modified embodiment of the optical assembly 10 in the periscopic camera module according to the present application. As shown in fig. 11, in this modified embodiment, the carrier 13 is hollowed to reduce its own weight, specifically, the carrier 13 includes two side plates 131 connected adjacently and a sloping plate 132 (three plates connected end to end) extending between the two side plates 131, the reflective element 11 is disposed on the sloping plate 132 of the carrier 13, and the magnets 162 are respectively disposed on the two side plates 131 of the carrier 13. That is, in this modified embodiment, the carrier 13 is implemented as a carrier frame having a triangular prism shape and having a hollowed-out structure. Further, in order to further reduce the mass of the carrier 13, the carrier 13 is provided with a mounting groove 130 formed through a side plate 131 thereof on a side plate thereof, the carrier 13 further includes a carrier plate 133 having a size and a shape corresponding to the mounting groove 130, the magnets 162 are mounted to the carrier plate 133, the carrier plate 133 is fixed to the mounting groove 130 (for example, by an adhesive), and the magnets 162 are provided on both side surfaces of the carrier frame in such a manner as to form the carrier 13. In particular, in this variant embodiment, the carrier plate 133 is made of a material that is lighter, for example a plastic material.

Of course, in other specific examples of this modified embodiment, the structural configuration of the carrier 13 may be adjusted, for example, the mounting groove 130 is concavely formed on the side plate 131 rather than in a penetrating manner, that is, the side plate 131 of the carrier 13 may not be hollowed out. It should be understood that, when the side plate 131 is not hollowed out, in some specific examples, the carrier plate 133 may be further removed to directly mount the magnet 162 to the side plate 131 of the carrier 13, for example, the magnet 162 is mounted to the side plate 131 by an adhesive, which is not limited in this application.

Further, in some modified embodiments of the above embodiments, since the focal length of the telephoto type camera module is long, the aperture is small, and the light incident amount, the photographing definition, the resolving power and other capabilities of the camera module are weak, a glass lens is required to be used to improve the light transmittance and the resolving power of the lens, that is, at least one glass lens is included in the lens assembly 20, and when the glass lens is added, since the glass lens has a large refractive index, the focal length of the camera module can be shortened, which is beneficial to reducing the length and the size of the camera module.

The lens with the glass lens is heavy, and needs to be driven (to realize the function of automatic focusing or optical anti-shake) by a driving part (not shown) with a large volume, so the lens is selected to be attached to the bottom plate 41 in order to not increase the volume of the camera module, the function of automatic focusing or optical anti-shake can be realized by other optical elements (the other optical elements can comprise optical elements such as prisms, reflectors, lenses, and the like, or can be realized by driving the reflecting element 11 to move without arranging other optical elements), when the camera module is subjected to a drop test, the impact force of the drop is transmitted to the lens from the bottom plate 41, and the glass lens is easy to break.

Accordingly, in the periscopic camera module as illustrated in fig. 8, the lens assembly 20 includes a lens 21 of at least one lens 210 and a protective layer 22, the protective layer 22 is located outside a lens barrel of the lens 21, the protective layer 22 may be implemented as a damping material, a soft material, such as rubber, foam, etc., that is, the lens 21 is fixed to the outer frame 40 of the periscopic camera module through the protective layer 22, so that when the periscopic camera module falls from a high place, the protective layer 22 may play a role of buffering, and ensure that the lens 210 in the lens 21 of the periscopic camera module is not broken. It is worth mentioning that in this embodiment the performance of the protection layer 22 is similar to that of the dielectric layer 12, of course, the protection layer 22 may be implemented as the dielectric layer 12.

Example four

Fig. 12 illustrates a schematic diagram of a fourth example of a periscopic camera module according to an embodiment of the present application. A fourth example of the periscopic camera module is an ultra-long-focus periscopic camera module, wherein the lens 21 of the lens assembly 20 has a back focal length, that is, the distance from the light sensing unit 30 to the lens 21 is to be consistent with the back focal length, so as to ensure high imaging quality, and therefore, in another modified embodiment of the foregoing embodiment, the light may need to be reflected multiple times in the periscopic camera module, that is, at least one reflection structure is further disposed between the lens assembly 20 and the light sensing unit 30 to reflect the light (that is, in other optical elements, a reflection structure is further included, as shown in fig. 12), so that the back focal length can be ensured under the condition of controlling the size of the module.

Fig. 13 illustrates a schematic diagram of a fifth example of a periscopic camera module according to an embodiment of the present application. In a fifth example as shown in fig. 13, the periscopic camera module includes an optical assembly 80B disposed between the lens assembly 20B and the photosensitive unit 30B of the periscopic camera module for receiving light rays passing through the lens assembly 20B of the periscopic camera module and reflecting the light rays to the photosensitive unit 30B. The optical component 80B includes: a reflective component; a carrier for carrying at least a portion of the reflective component; and a dielectric layer disposed between the at least a portion of the reflective assembly and the carrier, having a predetermined flexibility for preventing deformation of the at least a portion of the reflective assembly.

That is, in the fifth example of the periscopic camera module as shown in fig. 13, only the optical assembly 80B disposed between the lens assembly 20B and the photosensitive unit 30B may be included, without including the optical module outside the lens assembly 20B as shown in fig. 8 to 10 and 12.

Of course, it can be understood by those skilled in the art that the periscopic camera module according to the embodiment of the present application may also include both the optical assembly outside the lens assembly and the optical assembly between the lens assembly and the photosensitive unit, as shown in fig. 8, 9 and 12.

Here, it can be understood by those skilled in the art that in the fourth example and the fifth example of the periscopic camera module shown in fig. 12 and 13, details of the optical components may be completely the same as those described in the first embodiment, the second embodiment and the modified embodiments thereof, and thus are not described again to avoid redundancy.

That is, in the extra-long-focus periscopic camera module, the rear focus value of the periscopic camera module is large, if no reflection structure is arranged between the lens component 20 and the photosensitive unit 30, the periscopic module is too large, especially in the length direction, and the module length is inevitably too long in order to satisfy the rear focus value.

Further, those skilled in the art will understand that other components in the periscopic camera modules of the first to fifth examples shown in fig. 8 to 10 and fig. 12 and 13, such as the driving member 16, the outer frame 40 including the base plate 41, the filter element 50, the encapsulating portion 60, and the like, may be the same, and a description thereof will not be repeated to avoid redundancy.

In particular, the optical assembly of the periscopic camera module may comprise a reflective structure 70, at least a portion of the reflective structure 70 forming a reflective assembly 71. Fig. 14 illustrates a schematic view of a portion of a first exemplary reflective structure of a periscopic camera module according to an embodiment of the present application. As shown in fig. 14, the reflection assembly 71 is composed of a first reflection mirror 711 and a second reflection mirror 722, preferably, the first reflection mirror 711 and the second reflection mirror 722 of the reflection assembly 71 are V-shaped or L-shaped, that is, one side of the first reflection mirror 711 and the second reflection mirror 722 is connected and fixed, the first reflection mirror 711 and the second reflection mirror 722 are similar to two cantilever beams, when the first reflection mirror 711 and the second reflection mirror 722 are disposed on a carrier 73, the carrier 73 can bend the first reflection mirror 711 and the second reflection mirror 722 in the process of temperature increase or temperature decrease, which affects the precision of the reflection assembly 71.

It is worth mentioning that the first mirror 711 and the second mirror 722 may be integrated, i.e. the first mirror 711 and the second mirror 722 are formed on the same piece of glass or organic material; the first reflecting mirror 711 and the second reflecting mirror 722 may be separated, that is, the first reflecting mirror 711 and the second reflecting mirror 722 are independently mounted on both side surfaces of the second carrier 73.

The reflection assembly 71 is preferably movable, i.e. the reflection assembly 71 comprises a driving member (not shown) which drives the first mirror 711 and the second mirror 722 to achieve focusing and/or anti-shake. Accordingly, in the embodiment of the present application, a dielectric layer 12 is disposed between the first mirror 711, the second mirror 722 and the carrier 73. The details of the dielectric layer are completely the same as those described in the first to third embodiments and the modified embodiments, and are not repeated to avoid redundancy.

In the modified embodiment shown in fig. 14, the reflection assembly 71A includes a first reflection member 711A of the lens assembly 20 and a prism 712A facing the first reflection member 711A, and the first reflection member 711A is composed of a first reflection mirror 713A and a second reflection mirror 714A. Accordingly, the light reaches the first reflecting mirror 713A through the lens assembly 20, is reflected into the prism 712A, is reflected twice, exits from the prism 72, and is reflected by the second reflecting mirror 714A to reach the light sensing unit 30, as shown in fig. 15. Fig. 15 illustrates a schematic view of the whole of a first exemplary reflective structure of a periscopic module according to an embodiment of the application. Here, the reflection assembly 71A uses the principle of reflection such that the distance traveled by the light rays satisfies the back focal length of the lens assembly 20 to the photosensitive unit 30, thereby allowing the periscopic module size to be controlled.

Preferably, the first reflecting mirror 713A and the second reflecting mirror 714A of the first reflecting element 711A are V-shaped or L-shaped, that is, one side of the first reflecting mirror 713A and one side of the second reflecting mirror 714A are fixedly connected, and the first reflecting mirror 713A and the second reflecting mirror 714A are similar to two cantilever beams. It is worth mentioning that the first mirror 713A and the second mirror 714A may be integrated, i.e., the first mirror 713A and the second mirror 714A are formed on the same piece of glass or organic material. The first reflector 713A and the second reflector 714A may be separate bodies, that is, the first reflector 713A and the second reflector 714A are independently mounted on two side surfaces of the carrier 73A.

When the first reflector 713A and the second reflector 714A are disposed on the carrier 73A, the carrier 73A may cause the first reflector 713A and the second reflector 714A to bend during the heating or cooling process, which may affect the accuracy of the reflective assembly 71A. Accordingly, in the present embodiment, a dielectric layer 72A is disposed between the first mirror 713A, the second mirror 714A and the carrier 73A (the details are the same as those of embodiment one and embodiment 2).

In the above embodiment, the first reflecting element 711A and the prism 712A may be assembled to form the reflecting assembly 71A, and then assembled with the lens assembly 20 and the light sensing unit 30 to form the periscopic module.

In another modified embodiment, the first reflective element 711A, the lens assembly 20 and the photosensitive unit 30 may be pre-assembled, and then the prism 712A is assembled to the first reflective element 711A to form the complete periscopic module, it should be noted that the assembly of the prism 712A should be adjusted according to the imaging quality of the photosensitive unit 30, so as to make the imaging quality of the periscopic module meet the requirement.

Fig. 16 illustrates a schematic diagram of a second exemplary reflective structure of a periscopic module according to an embodiment of the present application. As shown in fig. 16, the difference from the modified embodiment shown in fig. 15 is that the prism 712A in the present modified embodiment is replaced with a second reflecting element 712A, wherein the second reflecting element 712A is composed of a third reflecting mirror 715A and a fourth reflecting mirror 716A.

As shown in fig. 16, the carrier 73A includes a first carrier unit 731A and a second carrier unit 732A, the first and

second reflectors

713A and 714A are disposed on the first carrier unit 731A with the first and

second reflectors

713A and 714A having a V-shape, the third and

fourth reflectors

715A and 716A are disposed on the second carrier unit 732A with the third and

fourth reflectors

715A and 716A having an inverted V-shape. Also, the dielectric layers 72A are respectively disposed between the first reflecting mirror 713A and the first carrier unit 731A, between the second reflecting mirror 714A and the first carrier unit 731A, between the third reflecting mirror 715A and the second carrier unit 732A, and between the fourth reflecting mirror 716A and the second carrier unit 732A, and have predetermined flexibility that prevents deformation of the first reflecting mirror 713A, the second reflecting mirror 714A, the third reflecting mirror 715A, and the fourth reflecting mirror 716A.

Fig. 17 illustrates a schematic view of a third exemplary reflective structure of a periscopic module according to an embodiment of the present application. As shown in fig. 17, the reflection assembly 71A includes a first reflection mirror 713A facing the lens assembly 20 and a second reflection mirror 714A facing the first reflection mirror 713A; the carrier 73A includes a first carrier unit 731A and a second carrier unit 732A, and the dielectric layers 72A are respectively disposed between the first reflector 713A and the first carrier unit 731A and between the second reflector 714A and the second carrier unit 732A, and have predetermined flexibility to prevent deformation of the first reflector 713A and the second reflector 714A.

In particular, in this example, the first mirror 713A and the second mirror 714A are at an angle of 45 degrees with respect to the length direction of the periscopic camera module.

That is, after configuring the optical assembly 10 and the reflective structure 70, the periscopic module will often reflect light more than once, so the reflective structure 70 is applied many times, when the reflective structure 70 is implemented as a mirror (plane mirror or plane mirror combination), the carrier 13 will cause the mirror to bend during the temperature raising or lowering process due to the difference of CTE, thereby causing the light transmission to be biased, and making the module imaging undesirable.

Therefore, in the periscopic camera module according to the embodiment of the present application, in the reflective structure 70 having the bending problem, the dielectric layer 12 is disposed between the reflective element 11 and the carrier 13, and the reflective element 11 is not bent by the compensation of the dielectric layer 12.

It should be noted that the optical element may also be used in a 3D device, such as a structured light projection device, a TOF projection device, and a VR/AR projection device, that is, the projection device has a projection unit, the projection light of the projection unit needs to be collimated by at least one collimating system (collimating mirror), the collimating system has a certain limit on the back focal length, and the existing arrangement of the projection unit and the collimating system may cause the height of the whole projection device to be too high, so the optical element may be arranged between the projection unit and the collimating system, and the optical path may be increased by using the reflection and refraction principles under the condition of ensuring the size miniaturization of the projection device, so that the length of the optical path projected by the projection unit meets the requirement of the back focal length of the collimating system. In the above projection apparatus, the number of the optical elements may be 1 or more; further, even if the number of the optical elements is 1, the optical elements may include a plurality of reflecting mirror surfaces and perform multiple reflection; i.e. the number of optical elements, the number of reflections is set as desired, which is essential in order to increase the optical path by reflection, so that the projection device can be miniaturized.

EXAMPLE five

Fig. 18A and 18B illustrate schematic views of an electronic device according to an embodiment of the present application. As shown in fig. 18A and 18B, the electronic device 100 includes an electronic device main body 110 and a camera module 120 assembled to the electronic device main body, wherein particularly, the camera module 120 includes the optical assembly 10 disclosed in the above embodiment and its modified embodiments.

It is noted that in this embodiment, the camera module 120 may be implemented as a periscopic camera module as described above, as shown in fig. 18B, or a general type camera module, as shown in fig. 18A, or another type camera module, for example, a TOF depth information camera module. The optical assembly 10 may be an optical component participating in a projection optical path or a reception optical path of the camera module 120. The position where the camera module 10 is mounted on the electronic device main body 110 is not limited in the present application, and for example, the camera module 10 may be mounted on the front surface of the electronic device main body 110 to serve as a front camera module of the electronic device 100; alternatively, it may be mounted on the back surface of the electronic apparatus main body 110 to serve as a rear camera module of the electronic apparatus 100.

Of course, the type of electronic device is also not limited by this application, and may be implemented as a smart phone, a tablet computer, a laptop computer, or the like.

EXAMPLE six

According to another aspect of the present application, a method of making an optical assembly 10 is also provided.

According to the description related to the first embodiment and the second embodiment, the method for manufacturing the optical assembly 10 according to the embodiment of the present application includes: providing a carrier 13 and a reflective element 11; and a dielectric layer 12 is formed between the carrier 13 and the reflective element 11.

In the manufacturing method according to the embodiment of the present application, in one example, forming a dielectric layer 12 between the carrier 13 and the reflective element 11 includes: forming the dielectric layer 12 on the carrier 13; and, the reflective element 11 is mounted on the dielectric layer 12.

In the manufacturing method according to the embodiment of the present application, in one example, forming a dielectric layer 12 between the carrier 13 and the reflective element 11 includes: forming the dielectric layer 12 on the lower surface of the reflective element 11; and attaching the reflective element 11 with the dielectric layer 12 to the carrier 13.

In the manufacturing method according to the embodiment of the present application, in one example, the forming the dielectric layer 12 on the carrier 13 includes: applying an adhesive 14 on said carrier 13; and attaching the dielectric layer 12 to the adhesive 14 to form the dielectric layer 12 on the carrier 13.

In the manufacturing method according to the embodiment of the present application, in one example, the forming the dielectric layer 12 on the carrier 13 includes: the dielectric layer 12 is integrally formed on the carrier 13.

In the manufacturing method according to the embodiment of the present application, in one example, mounting the reflective element 11 on the dielectric layer 12 includes: applying a bonding member 14 on the dielectric layer 12; and attaching the reflective element 11 to the adhesive 14 to mount the reflective element 11 on the dielectric layer 12.

In the manufacturing method according to the embodiment of the present application, in one example, the forming of the dielectric layer 12 between the carrier 13 and the reflective element 11 includes: forming a support 15 on the carrier 13, wherein the support 15 and the surface of the carrier 13 form a receiving cavity 150; applying an adhesive within the receiving cavity 150; attaching the reflective element 11 to the adhesive; and curing the adhesive to form the dielectric layer 12 between the carrier 13 and the reflective element 11.

In the preparation method according to the embodiment of the present application, in one example, the method further includes removing the supporter 15.

It should be noted that, in the embodiment of the present application, the dielectric layer 12 is made of a flexible material, and the shore hardness of the flexible material is 10 degrees to 70 degrees. The dielectric layer 12 is made of any one of foam, a combination of plastic and foam, soft glue and silica gel. When the dielectric layer 12 is made of foam, the thickness of the dielectric layer 12 is 80um-130 um. When the dielectric layer 12 is made of soft rubber, the thickness of the dielectric layer 12 is 20um-100 um. The amount of deformation that can occur to the dielectric layer 12 is 5% -50% of its thickness.

The foregoing describes the general principles of the present application in conjunction with specific embodiments, however, it is noted that the advantages, effects, etc. mentioned in the present application are merely examples and are not limiting, and they should not be considered essential to the various embodiments of the present application. Furthermore, the foregoing disclosure of specific details is for the purpose of illustration and description and is not intended to be limiting, since the foregoing disclosure is not intended to be exhaustive or to limit the disclosure to the precise details disclosed.

The block diagrams of devices, apparatuses, systems referred to in this application are only given as illustrative examples and are not intended to require or imply that the connections, arrangements, configurations, etc. must be made in the manner shown in the block diagrams. These devices, apparatuses, devices, systems may be connected, arranged, configured in any manner, as will be appreciated by those skilled in the art. Words such as "including," "comprising," "having," and the like are open-ended words that mean "including, but not limited to," and are used interchangeably therewith. The words "or" and "as used herein mean, and are used interchangeably with, the word" and/or, "unless the context clearly dictates otherwise. The word "such as" is used herein to mean, and is used interchangeably with, the phrase "such as but not limited to".

It should also be noted that in the devices, apparatuses, and methods of the present application, the components or steps may be decomposed and/or recombined. These decompositions and/or recombinations are to be considered as equivalents of the present application.

The previous description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other aspects without departing from the scope of the application. Thus, the present application is not intended to be limited to the aspects shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

The foregoing description has been presented for purposes of illustration and description. Furthermore, the description is not intended to limit embodiments of the application to the form disclosed herein. While a number of example aspects and embodiments have been discussed above, those of skill in the art will recognize certain variations, modifications, alterations, additions and sub-combinations thereof.

Claims

1. An optical assembly for a periscopic camera module,

optical assembly sets up between periscopic camera module's lens subassembly and the sensitization unit for the receipt is passed through periscopic camera module's lens subassembly's light, and will light reflection extremely the sensitization unit, optical assembly includes:

a reflective component;

2. The optical assembly of claim 1, wherein the reflective assembly comprises a first reflective element facing the lens assembly and a prism facing the first reflective element, the first reflective element comprising a first mirror and a second mirror;

3. The optical assembly of claim 1, wherein the reflective assembly comprises a first reflective element facing the lens assembly and a second reflective element facing the first reflective element, the first reflective element comprising a first mirror and a second mirror, the second reflective element comprising a third mirror and a fourth mirror;

4. The optical assembly of claim 1, wherein the reflective assembly comprises: a first mirror facing the lens assembly and a second mirror facing the first mirror;

5. The optical assembly of claim 4, wherein the first and second mirrors are angled at 45 degrees from a length direction of the periscopic camera module.

6. The optical assembly of any one of claims 1-5, wherein the dielectric layer is made of a flexible material having a shore hardness of 10 degrees to 70 degrees.

7. The optical assembly of claims 1-5, wherein the dielectric layer is made of a material selected from any one of foam, a combination of plastic and foam, soft gel, and silicone.

8. The optical assembly of claim 7, wherein the dielectric layer has a thickness of 80-130 um when the dielectric layer is made of foam.

9. The optical assembly of claim 7, wherein the dielectric layer has a thickness of 20-100 um when the dielectric layer is made of soft glue.

10. The optical assembly of any one of claims 1-5, wherein the dielectric layer is capable of undergoing a deformation amount of 5% to 50% of its thickness.

11. The utility model provides a periscopic module of making a video recording which characterized in that includes:

a lens assembly held at a photosensitive path of the photosensitive unit; and

an optical assembly according to any one of claims 1 to 10.

12. The periscopic camera module of claim 11, wherein the lens assembly includes at least one lens, at least one of the lenses being a glass lens.

13. The periscopic camera module of claim 12, wherein the lens assembly comprises a lens and a protective layer, the lens comprises a lens barrel and the at least one lens mounted in the lens barrel, and the lens is fixed to the bottom plate of the outer frame through the protective layer.

14. The periscopic camera module of claim 13, wherein the protective layer is made of a damping material or a flexible material.

15. An electronic device, comprising:

an electronic device main body; and

the periscopic camera module according to any one of claims 11-14, assembled to the electronic device body.