TWI793505B - Camera module and electronic device - Google Patents

Abstract

A camera module and electronic device. The camera module includes a circuit board, a bracket on the circuit board and an electronic component. The electronic component is embedded in the inside of the bracket and / or arranged on the inner wall of the bracket. The electronic component is electrically connected with the circuit board. The camera module provided by the invention embeds the electronic component in the bracket and / or is arranged on the inner surface of the bracket. By reasonable circuit layout, the space utilization rate of the camera module can be greatly improved, which is conducive to the miniaturization of the camera module.

Description

Camera module and electronic equipment

The invention relates to the field of optical lenses, in particular to a camera module and electronic equipment.

As people's requirements for camera modules are getting higher and higher, the number of electronic components (such as driver chips, capacitors, inductors, and resistors, etc.) required in the camera modules is also increasing.

When designing a general camera module, the photosensitive chip is placed in the center of the PCB, and the corresponding electronic components are installed outside the photosensitive chip. When there are more and more electronic components, the size of the camera module is limited by the increased electronic components and cannot be reduced. It does not conform to the development trend of camera modules becoming more and more thin, light and short.

In view of this, it is necessary to provide a camera module that improves the space utilization of the module and is beneficial to reducing the overall size of the module.

In addition, the present invention also provides an electronic device including the above-mentioned camera module.

The invention provides a camera module, comprising: a circuit board, a bracket and electronic components. The bracket is arranged on the circuit board. The electronic component is embedded inside the bracket and/or is arranged on the inner side wall of the bracket, and the electronic component is electrically connected with the circuit board.

In the embodiment of the present application, the electronic component is arranged on the inner wall of the bracket, and a first conductive layer or a first FPC board is arranged between the bracket and the electronic component, and the electronic component is provided by the The first conductive layer or the first FPC board is electrically connected with the circuit board.

In the embodiment of the present application, the bracket is provided with an outlet corresponding to the first FPC board, the circuit board is provided with a first window corresponding to the outlet, and the circuit layer of the circuit board is formed by the second Once the window is exposed, the first FPC board extends to the outside of the support through the outlet opening, and is electrically connected to the circuit layer of the circuit board at the first window.

In the implementation manner of the present application, the first conductive layer is a conductive adhesive layer.

In the embodiment of the present application, the bracket is provided with an installation opening, and the installation opening is formed by the end surface of the bracket in contact with the circuit board being recessed toward a direction away from the circuit board, and the electronic component is arranged on the inside the installation port described above.

In the embodiment of the present application, the circuit board is provided with a second window corresponding to the installation port, the circuit layer of the circuit board is exposed through the second window, and the electronic component is placed on the circuit board through the second conductive layer. The second opening is electrically connected to the circuit layer of the circuit board.

In the embodiment of the present application, the electronic component includes a power terminal and a ground terminal, the power terminal is electrically connected to the circuit board through the second conductive layer, and the ground terminal is grounded through the bracket. The support is conductive.

In the embodiment of the present application, the electronic component is embedded in the bracket through the fixing part.

In the embodiment of the present application, the fixing part is a second FPC board or a metal sheet.

The present application also provides an electronic device, including the above-mentioned camera module.

Compared with the conventional technology, the camera module provided by this application embeds electronic components inside the bracket and/or arranges it on the inner surface of the bracket. With a reasonable circuit layout, the space utilization rate of the camera module can be greatly improved, which is beneficial to Miniaturization of camera modules.

100,200,300: camera module

1: circuit board

11: First window opening

12: Controller

13: Outlet

14: The second window opening

2: Bracket

21: base part

211,214: first side wall

212: First cavity

213: tank body

215: Installation port

22: lens barrel

221: second side wall

222: Second cavity

23: Step Department

3: Electronic components

4: photosensitive chip

5: Lens

6: The first conductive layer

7: Conductive glue

8: The first FPC board

81: line

9: Second FPC board

10: Second conductive layer

20: Thermosetting adhesive layer

a: electrical contact point

FIG. 1 is a schematic structural diagram of a camera module 100 provided in an embodiment of the present application.

FIG. 2 is a schematic structural diagram of an embodiment of the camera module 100 provided by an embodiment of the present application through which the first FPC board leads the circuit.

FIG. 3 is a schematic structural diagram of another embodiment of the camera module 100 provided by an embodiment of the present application through which the first FPC board leads out the lines.

FIG. 4 is a schematic structural diagram of the first FPC board in the camera module 100 provided by an embodiment of the present application.

FIG. 5 is a schematic structural diagram of a first side wall arrangement groove in the camera module 100 provided by an embodiment of the present application.

FIG. 6 is a schematic structural diagram of a camera module 200 provided in another embodiment of the present application.

FIG. 7 shows the vertical position of the electronic components in the camera module 200 provided in another embodiment of the present application. Schematic diagram of the placed structure.

FIG. 8 is a side view of the improved camera module 200 in FIG. 7 of the present application when no support is installed on the circuit board.

FIG. 9 is a schematic structural diagram of the electronic components in the camera module 200 provided by another embodiment of the present application being grounded through a bracket.

FIG. 10 is a side view of the improved camera module 200 in FIG. 9 of the present application when no support is installed on the circuit board.

FIG. 11 is a schematic diagram of an electrical conduction path between a power supply terminal and a ground terminal of an electronic component in the camera module 200 provided by another embodiment of the present application.

FIG. 12 is a schematic structural diagram of a camera module 300 provided in another embodiment of the present application.

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

It should be noted that when a component is said to be "fixed" to another component, it can be directly on the other component or there can also be an intervening component. When a component is said to be "connected" to another component, it may be directly connected to the other component or there may be intervening components at the same time. When a component is said to be "set on" another component, it may be set directly on the other component or there may be an intervening component at the same time. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of illustration only.

The system implementation described below is only illustrative, and the division of modules or circuits is only a logical function division, and there may be other division methods in actual implementation. In addition, it is obvious that the word "comprising" does not exclude other elements or steps, and the singular does not exclude the plural. The multiple units or devices stated in the system requirements can also be realized by the same unit or device through software or hardware. The words first, second, etc. are used to denote names and do not imply any particular order.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

During the design process of traditional camera modules, electronic components are usually placed on the circuit board and accommodated inside the bracket. As the camera module has more and more functions, the number of electronic components required is increasing. , will undoubtedly increase the size of the overall bracket, which is not conducive to the miniaturization of the camera module. In order to reduce the size of the camera module, this application adopts three methods for the installation of electronic components. The first solution is to install the electronic components on the inner wall of the bracket to make full use of the space on the inner side wall of the bracket and improve the space utilization inside the camera module. efficiency; the second solution is to embed electronic components inside the bracket, make full use of the space of the bracket itself, improve the space utilization rate of the overall module, and then help reduce the size of the overall camera module; the third-party solution is a combination of the above two methods According to the size of different electronic components, some electronic components are arranged on the inner wall of the bracket, and other electronic components are embedded in the inside of the bracket to maximize the space utilization of the camera module, thereby effectively reducing the volume of the overall camera module, which is beneficial Because of the lightness, thinness and miniaturization of the camera module.

Please refer to FIG. 1 to FIG. 5 , which are the camera module 100 provided in the first embodiment of the present application. The camera module 100 includes a circuit board 1 , a bracket 2 and electronic components 3 , and the bracket 2 is arranged on the circuit board 1 . The electronic component 3 is disposed on the inner wall of the bracket 2 , and the electronic component 3 is electrically connected to the circuit board 1 .

In addition, the camera module 100 also includes a photosensitive chip 4 and a lens 5, the photosensitive chip 4 is arranged on the circuit board 1 and accommodated inside the bracket 2, the lens 5 is arranged on the bracket 2, and the lens 5 Located on the photosensitive path of the photosensitive wafer 4 .

As shown in FIG. 1 , the bracket 2 is roughly a cylindrical hollow body, which includes a base portion 21 and a lens barrel portion 22 connected to the base portion 21 . Both the base part 21 and the lens barrel part 22 are hollow bodies, and the cross-sectional size of the base part 21 is larger than that of the lens barrel part 22 . The base part 21 includes a first side wall 211 , and the barrel part 22 includes a second side wall 221 . The first sidewall 211 surrounds and forms a first cavity 212 , and the second sidewall 221 surrounds and forms a second cavity 222 . A stepped portion 23 is formed between the first sidewall 211 and the second sidewall 221 . The photosensitive wafer 4 is located in the first cavity 212, and the lens 5 is located in the second cavity 222 within. The electronic component 3 is disposed on the inner surface of the first side wall 211 . Specifically, the electronic component 3 is disposed on the inner surface of the first side wall 211 . At this time, it is necessary to consider how to realize the electrical connection between the electronic component 3 and the circuit board 1 .

Please refer to FIG. 1 to FIG. 4 , this solution provides the following two specific implementation methods to realize the electrical connection between the electronic component 3 and the circuit board 1 .

As shown in FIG. 1, in one embodiment, the first conductive layer 6 can be provided on the surface of the first side wall 211, and the first conductive layer 6 can be led to the circuit board 1 to be electrically connected to it, thereby realizing The electronic component 3 is electrically connected to the circuit board 1 . At this time, the circuit board 1 is provided with a corresponding first opening 11 on the outside of the bracket 2 , and the corresponding copper layer is exposed at the first opening 11 . The first conductive layer 6 will be led to the first opening 11, so that the first conductive layer 6 is electrically connected to the exposed copper at the first opening 11, and then through the corresponding circuit of the circuit board 1 layer realizes unified control of the power on and off of the electronic component 3 .

In this embodiment, after the first conductive layer 6 is led out of the bracket 2 , it needs to be electrically connected to the exposed copper at the first opening 11 . Specifically, soldering may be used to electrically connect the first conductive layer 6 to the exposed copper at the first opening 11 by soldering solder paste. But because tin soldering may burn the bracket 2, it is also possible to use a point of conductive glue 7 to connect the drawn first conductive layer 6 to the exposed copper in the first window 11, so as to realize the connection with the circuit board 1. The electrical connection of the layers is finally controlled by the controller 12 to turn on and off the electronic component 3 . Compared with the welding method, the conductive adhesive 7 is directly used for connection, and the operation is simpler and more convenient, and the conductive adhesive 7 does not have the hidden danger of burning the bracket 2 .

In this embodiment, the first conductive layer 6 may be a conductive adhesive layer, or a conductive metal plating layer. Specifically, the first conductive layer 6 is a conductive adhesive layer, which can not only realize the electrical connection between the electronic component 3 and the circuit board 1, but also realize the electrical connection between the electronic component 3 and the inner surface of the first side wall 211. fixed. There is no need to add additional fixing structures for fixing the electronic component 3 on the first side wall 211 , the installation of the electronic component 3 is simple and convenient, and does not occupy too much space inside the bracket 2 .

In this embodiment, when the first conductive layer 6 is a conductive adhesive layer, the conductive adhesive layer is formed on the inner surface of the first side wall 211 of the bracket 2 by laser direct structuring (LDS). According to the For the installation position of the electronic component 3, conductive glue is spread along the inner surface of the first side wall 211 to form the conductive glue layer, and then lead to the position of the first opening 11 of the circuit board 1 outside the bracket 2, so as to realize the The electronic component 3 is electrically connected to the exposed copper at the first opening 11 .

It can be understood that, the present application can specifically design the arrangement form of the first conductive layer 6 according to the specific quantity of the electronic components 3 . If the number of the electronic component 3 is only one, it is only necessary to lead the electronic component 3 out of the bracket 2 through the first conductive layer 6 to realize the electrical connection with the circuit board 1 . In addition, in order to realize the multi-functionalization of the camera module 100, usually a plurality of the electronic components 3 are arranged in the camera module 100, and at this time, the plurality of electronic components 3 are staggered and distributed in the first side wall 211. On the surface, the first conductive layers 6 corresponding to the plurality of electronic components 3 are jointly led out of the support 2 to the circuit board 1 through circuit layout design to realize electrical connection. When different electronic components 3 are electrically extracted, the key lies in the design form of the first conductive layer 6 on the bracket 2 . If the first conductive layer 6 is in the form of a conductive adhesive layer, the conductive adhesive layer can be precisely placed on the surface of the bracket 2 by laser direct structuring (LDS), and the two adjacent conductive adhesive layers can be controlled at the same time. Keep a certain distance between them, and they will not overlap together, so that the electrical properties of different electronic components 3 are respectively guided to the outside of the bracket 2, and connected to the circuit board through the first opening 11 on the circuit board 1 1, the controller 12 ultimately controls the power on and off of different electronic components in a unified manner.

Please refer to Fig. 2 and Fig. 4, and refer to Fig. 1 in combination, in another embodiment, the electronic component 3 is electrically led out in the form of a first FPC board 8, and the electronic component 3 is connected by the first FPC board 8 and The circuit board 1 is electrically connected. The first FPC board 8 is provided with a circuit 81 for realizing electrical connection. One end of the circuit 81 is connected to the electronic component 3, and the other end is connected to the circuit board 1 to realize the connection between the electronic component 3 and the circuit board 1. Electrical connections at the line level. The circuit 81 is arranged on the first FPC board 8 in advance, and then the first FPC board 8 is pasted on the inner surface of the first side wall 211, and the bottom of the first side wall 211 near the circuit board 1 is provided with a The line opening 13 is used to bend the first FPC board 8 to the outside of the bracket 2 and to the circuit board 1 . At this time, a corresponding first window 11 is also provided on the outside of the circuit board 1 located on the bracket 2 , and the circuit 81 on the first FPC board 8 will lead out to the first window 11 . In addition, in this embodiment, both ends of the circuit 81 on the first FPC board 8 are electrically connected to the electronic component 3 and the exposed copper at the first opening 11 by soldering or conductive glue 7 .

In this embodiment, according to the number of electronic components 3 included in the camera module 100 , the design form of the first FPC board 8 is also different. When only one electronic component 3 is included in the camera module 100, only one first FPC board 8 needs to be set, and only one circuit 81 needs to be set on the first FPC board 8. The wire port 13 leads to the outside of the bracket 2 to the first opening 11 on the circuit board 1 , as shown in FIG. 2 . When the camera module 100 contains multiple electronic Component 3, when the first FPC board 8 is designing the circuit, the circuit 81 with a relatively close position can be arranged on the same first FPC board 8, and the first FPC board 8 is located on the inner side of the first side wall 211. Partially cut, respectively lead to each electronic component 3 and electrically connected with it, the part of the first FPC board 8 located outside the first side wall 211 is not separated, and directly extends out of the outlet 13, as shown in Figure 3 and Figure 4 Show. If the installation positions of different electronic components 3 are relatively far away and cannot be led out through the same first FPC board 8 , it may be considered to arrange each circuit 81 on a separate first FPC board 8 . It can be understood that where the lead-out line 81 is needed and where the first FPC board 8 is set, it is not necessary to set all the inner side walls of the first side wall 211 as the first FPC board 8. This design method is more flexible. And it is convenient for line layout.

The first FPC board 8 is used to electrically connect the electronic component 3 and the circuit board 1, the cost is low, and the production and assembly are convenient. When assembling, the electronic component 3 can be fixed on the first FPC board 8 first, and then the The first FPC board 8 is integrally attached to the inner surface of the first side wall 211 , and is integrally attached to facilitate the installation of the electronic component 3 .

It can be understood that, in the first embodiment, when the electronic component 3 is disposed on the inner surface of the first side wall 211 by using the above two different methods, the electronic component 3 will not interfere with the sensing of the photosensitive chip 4 The light entering the first cavity 212 through the lens 5 . In addition, in order to prevent the electronic component 3 from interfering with the photosensitive wafer 4, a part of the inner surface of the first side wall 211 can be recessed toward the outer surface to form a groove 213, as shown in FIG. 5, the electronic component 3 It is fixed in the groove body 213, so that the electronic component 3 with a larger size is fixed on the inner surface of the first side wall 211 so as not to interfere with the light sensitivity of the photosensitive wafer 4, and the refraction spots caused by the existence of the electronic component 3, etc. question.

Please refer to FIG. 6 to FIG. 12 , the camera module 200 provided for the second embodiment of the present application is mainly different from the first embodiment in that the electronic component 3 is embedded in the first side wall of the bracket 2 in the camera module 200 214 interior. It should be noted that, within the scope of the spirit or basic features of the present application, the specific solutions applicable to the first embodiment can also be correspondingly applicable to this embodiment. In order to save space and avoid repetition, here I won't go into details.

It can be understood that, the specific position where the electronic component 3 is embedded in the first side wall 214 can be designed arbitrarily, and there are certain differences in how the electronic component 3 is electrically led out according to the different embedded positions.

Specifically, in the camera module 200 provided by this application, the embedded position of the electronic component 3 is located at the edge of the first side wall 214 close to the end of the circuit board 1, that is, the end face of the first side wall 214 close to the circuit board 1 faces away from The direction of the circuit board 1 is recessed to form an installation opening 215 , and the electronic component 3 is inserted into the installation opening 215 . At the same time, the circuit board 1 is provided with a second window 14 corresponding to the installation opening 215 , and the circuit layer of the circuit board 1 is exposed through the second window 14 . The electronic component 3 is electrically connected to the circuit layer at the second opening 14 through the second conductive layer 10 . In this way, the electronic component 3 is directly fixed on the circuit board 1, and at the same time, the internal space of the bracket 2 can be fully utilized, which improves the space utilization rate of the camera module 200 and is conducive to the miniaturization of the camera module 200. .

There are many forms of installation of the electronic component 3 in the installation opening 215 , which will be specifically described below according to each different installation form.

Please refer to FIG. 7 , in one embodiment, the electronic component 3 can be directly disposed in the installation opening 215 , and the electronic component 3 is electrically connected to the circuit layer at the second opening 14 through the second conductive layer 10 .

In this embodiment, in order to improve the stability of the electronic component 3, thermosetting glue can be added between the electronic component 3 and the side wall of the installation port 215 for bonding and fixing, adding thermosetting glue can also fill the electronic component 3 There is a gap between the installation port 215 to avoid light leakage.

In this embodiment, the second conductive layer 10 may be conductive glue or solder paste. Bonding the electronic component 3 with conductive adhesive is convenient and quick. When the electronic component 3 is fixed by soldering, the bonding force between the electronic component 3 and the circuit board 1 is stronger, the stability of the electronic component 3 can be improved, and the side thrust strength of the bracket 2 can be improved at the same time, which is beneficial to improve the overall camera module 200. side thrust strength.

Please refer to Fig. 6, in another embodiment, the electronic component 3 is installed in the installation port 215 by a fixing part. In this embodiment, the fixing part is the second FPC board 9, and the electronic component 3 faces the circuit On one side of the circuit board 1 , the electrical connection between the electronic component 3 and the circuit board 1 is realized through the second conductive layer 10 . The adoption of the second FPC board 9 can facilitate alignment and bonding of the electronic components 3 in the installation opening 215 and improve the surface flatness of the first side wall 214 after the electronic components 3 are bonded.

In this embodiment, the second FPC board 9 is fixed in the installation opening 215 by the thermosetting adhesive layer 20 .

In this embodiment, the second conductive layer 10 adopts the same design as the above embodiment ideas, so I won’t go into too much detail here.

In this embodiment, after mounting the electronic component 3 in the installation port 215 , if there is a gap, it can be filled with thermosetting glue to avoid light leakage from the camera module 200 due to the gap.

It can be understood that the fixing part can also be a metal sheet (not shown in the figure), which facilitates the installation of the electronic component 3 and the flatness of the surface of the first side wall 214 .

Please refer to FIG. 6 and FIG. 7 again, when designing the opening size of the installation opening 215 , it can be designed according to the quantity and size of the actual electronic components 3 .

As shown in FIG. 6 , when the number of electronic components 3 is small and the size is small, the electronic components 3 can be placed horizontally. The two ends of the electronic component 3 are the power supply terminal and the ground terminal respectively. At this time, the power supply and the ground connection of the electronic component 3 are respectively realized through the two second conductive layers 10 and the two second openings 14 .

As shown in Figure 7, when the number of electronic components 3 is large, or when the electronic components 3 are elongated, in order to make full use of the space of the first side wall 214 of the bracket 2, the electronic components 3 can be placed upright, corresponding The installation port 215 is designed in a strip shape. At this time, the power supply end of the electronic component 3 is electrically connected to the circuit layer at the second opening 14 of the circuit board 1 through a second conductive layer 10, thereby realizing electrical connection with the controller 12 on the circuit board 1. The electronic component 3 is electrically connected through the controller 12; the ground terminal of the electronic component 3 is grounded through the bracket 2.

Specifically, there are three ways for the electronic component 3 to be grounded through the bracket 2 .

As shown in FIGS. 7 and 8 , one way is that the first side wall 214 of the bracket 2 is provided with a plating layer or the bracket 2 is made of metal, and the electronic component 3 and the first side wall 214 are electrically connected by conductive glue 7 . Electrically connected, the first side wall 214 is electrically connected to the circuit board 1 using conductive glue 7, and then the electronic component 3 is indirectly electrically connected to the circuit board 1 through the first side wall 214 to achieve grounding, as shown in FIG. Figure 7 and Figure 8 show. At this time, the first side wall 214 and the circuit board 1 can be connected with the conductive glue 7 entirely, or locally with the conductive glue 7, and the rest of the connection with the thermosetting glue, wherein the partial paste of the conductive glue 7 is helpful To save conductive adhesive and reduce costs.

As shown in FIG. 9 and FIG. 10 , another way is to realize the grounding of the electronic component 3 through the electrical contact point a between the bracket 2 and the outer casing (not shown) of the camera module 200 . At this time, the support 2 is made of metal or the surface of the support 2 is provided with a metal plating layer, so as to realize the function of conduction. The electronic component 3 is grounded through the electrical contact point a between the bracket 2 and the casing, then the bracket 2 and the circuit board 1 can be fixed with conventional thermosetting glue without using conductive glue, which can effectively cut costs.

As shown in FIG. 11 , in another way, the above two grounding ways can be combined to achieve the purpose of grounding the electronic component through the bracket 2 . Specifically, in this embodiment, the electronic component 3 is vertically electrically connected to the circuit board 1 through the second conductive layer 10, and the electronic component 3 is connected to the circuit board through the first side wall 214 and the conductive glue 7. 1 conduction to achieve grounding. In addition, the electronic component 3 can also be grounded through the electrical contact point a between the first side wall 214 and the casing.

In the above second embodiment, the electronic component 3 is embedded in the bracket 2. In addition to saving the space of the camera module 200 and facilitating the miniaturization of the camera module 200, the electronic component 3 is placed in the installation port 215. Inside, due to the limiting effect of the side wall of the installation opening 215, it helps to improve the stability of the electronic component 3 in the installation opening 215; the electronic component 3 is welded upright on the circuit board 1, and connected to the first side wall 214 is fixedly connected, which increases the lateral thrust strength of the bracket 2 , thereby increasing the lateral thrust strength of the camera module 200 . In addition, when the electronic component 3 is placed upright, the surface of the first side wall 214 is provided with a coating, which is conducive to improving the electromagnetic shielding capability of the overall camera module 200, and the first side wall 214 provided with the coating is connected to the external casing Furthermore, grounding can make the cover electronic component 3 placed upright lead the noise directly to the casing when the high-frequency wave occurs, reducing the impact of the noise on the photosensitive chip 4 or other components.

Please refer to Fig. 12, referring to Fig. 1 and Fig. 7 in combination, the camera module 300 provided for the third embodiment of the present application is mainly different from the first embodiment in that the camera module 300 of this solution combines the above two solutions The arrangement of the electronic components 3 is to embed part of the electronic components 3 inside the first side wall 214 of the bracket 2 , and at the same time arrange part of the electronic components 3 on the inner side of the first side wall 214 . It should be noted that, within the scope of the spirit or basic features of the present application, the specific solutions applicable to the first embodiment can also be correspondingly applicable to this embodiment. In order to save space and avoid repetition, here I won't go into details. It can be understood that different installation methods are adopted according to different functions and sizes of the electronic components 3, for example, capacitors or resistors can be mounted vertically, and the capacitors or resistors can be directly embedded in the installation opening 215 of the first side wall 214. One end is electrically connected and fixed to the surface of the circuit board 1 through the second conductive layer 10, and the other end is electrically connected to the bracket 2 through the conductive glue 7, and further realized by the plating of the bracket 2 or the metal bracket 2 itself. Ground; while large-sized flat-shaped circuits such as driver chips or memories The sub-components can be directly mounted on the inner surface of the first sidewall 214 and electrically connected to the circuit board 1 through the first conductive layer 6 or the first FPC board 8 . According to the actual situation of the electronic component 3, combined with the above two design methods, the space of the first side wall 2114 of the bracket 2 can be fully utilized, the space utilization rate can be improved, and the size of the camera module 300 can be reduced, and at the same time, it can be matched with a reasonable layout. This avoids that the electronic components affect the light-sensing of the photosensitive chip 4 and causes problems such as stray light, thereby improving the quality of the camera.

In this embodiment, when two mounting methods of the electronic components 3 are adopted, the layout can be divided into blocks according to the specific positions of the electronic components 3 to realize electrical extraction, and the surface coating of the first side wall 214 can also be laid out in blocks.

Combining the above two installation methods of the electronic components 3 not only has the advantages of the above two installation methods, but also can minimize the camera module 300, increase the side thrust strength of the camera module 300, and increase the camera module 300. 300 overall fit strength to reduce the risk of U-turns. The electronic component 3 is bonded to the first side wall 214 to increase the heat dissipation area of the electronic component 3. In a traditional camera module, the electronic component contacts the circuit board on one side to achieve heat dissipation, but in this application, the electronic component 3 is embedded in the bracket 2 and can be contacted on multiple sides. Realize contact conduction heat dissipation, compared with air conduction, the heat dissipation efficiency is higher. Since the electronic component 3 is placed upright, the surface of the bracket 2 is provided with a plating layer, which increases the electromagnetic shielding capability of the camera module. At the same time, the purpose of noise reduction can also be achieved. Combining the two installation methods of the electronic component 3 can improve the assembly accuracy of the electronic component 3, solve the problem of the gap between the electronic component 3 and the bracket 2, improve the surface flatness of the bracket 2, and eliminate the need for SMT process, reducing the assembly of the camera module 300 process.

The present application also provides an electronic device (not shown in the figure), including the above-mentioned camera module (100, 200, 300).

Compared with the conventional technology, the camera module provided by this application embeds electronic components inside the bracket and/or arranges it on the inner surface of the bracket. With a reasonable circuit layout, the space utilization rate of the camera module can be greatly improved, which is beneficial to Miniaturization of camera modules.

In addition, those skilled in the art can make other corresponding changes and modifications according to the technical concept of the present invention, and all these changes and modifications should belong to the protection scope of the claims of the present invention.

100: Camera module

1: circuit board

11: First window opening

12: Controller

2: Bracket

21: base part

211: first side wall

212: First cavity

22: lens barrel

221: second side wall

222: Second cavity

23: Step Department

3: Electronic components

4: photosensitive chip

5: Lens

6: The first conductive layer

7: Conductive glue

Claims (9)

A camera module, including: a circuit board; a bracket, arranged on the circuit board; electronic components, embedded in the inside of the bracket and/or arranged on the inner side wall of the bracket, the electronic components and the The circuit board is electrically connected, and the electronic components are embedded in the bracket through the fixing part. The camera module according to claim 1, wherein the electronic component is arranged on the inner wall of the bracket, and a first conductive layer or a first FPC board is arranged between the bracket and the electronic component, so The electronic components are electrically connected to the circuit board through the first conductive layer or the first FPC board. The camera module as described in claim 2, wherein, the bracket is provided with an outlet corresponding to the first FPC board, and the circuit board is provided with a first window corresponding to the outlet, and the circuit board The circuit layer of the circuit board is exposed by the first opening, the first FPC board extends through the outlet to the outside of the bracket, and is connected to the circuit layer of the circuit board at the first window. electrical connection. The camera module according to claim 2, wherein the first conductive layer is a conductive adhesive layer. The camera module according to claim 1, wherein the bracket is provided with an installation opening, and the installation opening is formed by the end surface of the bracket in contact with the circuit board being recessed toward a direction away from the circuit board, The electronic components are arranged in the installation opening. The camera module according to claim 5, wherein the circuit board is provided with a second window corresponding to the installation port, the circuit layer of the circuit board is exposed through the second window, and the electronic components are The second conductive layer is electrically connected to the circuit layer of the circuit board at the second opening. The camera module according to claim 6, wherein the electronic component includes a power terminal and a ground terminal, the power terminal is electrically connected to the circuit board through the second conductive layer, and the ground terminal is Grounding is achieved by the bracket, which is electrically conductive. The camera module according to claim 1, wherein the fixing part is a second FPC board or a metal sheet. An electronic device, including the camera module according to any one of claims 1 to 8.

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