CN103855066A - Image induction chip packaging method for protecting chip - Google Patents
Image induction chip packaging method for protecting chip Download PDFInfo
- Publication number
- CN103855066A CN103855066A CN201210494747.8A CN201210494747A CN103855066A CN 103855066 A CN103855066 A CN 103855066A CN 201210494747 A CN201210494747 A CN 201210494747A CN 103855066 A CN103855066 A CN 103855066A
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- CN
- China
- Prior art keywords
- chip
- sensing chip
- video sensing
- packaging method
- video
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 50
- 238000000034 method Methods 0.000 title claims abstract description 34
- 230000006698 induction Effects 0.000 title abstract description 10
- 239000011241 protective layer Substances 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 239000011521 glass Substances 0.000 claims description 8
- 230000004224 protection Effects 0.000 abstract description 6
- 239000010410 layer Substances 0.000 abstract 2
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/1469—Assemblies, i.e. hybrid integration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Abstract
This invention discloses an image induction chip packaging method capable of protecting the chip, which comprises the following steps of arranging the image induction chip on a circuit substrate and covering a protective layer on a sensing area of the image induction chip, connecting to a conductive contact of the circuit substrate and a conductive contact of the image induction chip through a plurality of wires, arranging a packaging member wrapping the plurality of wires on the circuit substrate and the image induction chip, ripping off the protection layer, and arranging a nonopaque covering member on the packaging member to make the sensing area of the image induction chip under the covering member. As a result, the protection layer can prevent the sensing area of the image induction chip from being tainted and damaged before getting the protection from the covering member, and the image induction chip packaging method has high yield rate.
Description
Technical field
The present invention is relevant with video sensing chip packaging method, particularly about a kind of video sensing chip packaging method of protecting chip.
Background technology
Fig. 1 is the method for packing of conventional video sensing chip, first by one such as charge coupled cell (charge coupled device; Be called for short CCD) or CMOS (Complementary Metal Oxide Semiconductor) (complementary metal-oxide-semiconductor; Be called for short CMOS) etc. video sensing chip 10 stick on a circuit substrate 11, then weldering establish plain conductor 12 to connect the conductive junction point of this video sensing chip 10 and the conductive junction point of this circuit substrate 11; Then, utilize special package material to mold a packaging body 13 by compression molding techniques on this circuit substrate 11 and this video sensing chip 10, and on this video sensing chip 10, paste a glass plate 14, make this glass plate 14 be positioned at sensing area 15 tops of this video sensing chip 10; Thus, this many strip metals wire 12 is subject to the coated and easy fracture not of this packaging body 13, and the sensing area 15 of this video sensing chip 10 protects by this glass plate 14, and image that can these glass plate 14 outsides of sensing.
But, the sensing area 15 of this video sensing chip 10 is easily infected with dirty or is sustained damage in aforementioned encapsulation process, and then the quality of its induction image is had to bad impact, therefore, the production rate of good of aforementioned video sensing chip packaging method is compared with low and have much room for improvement.
Summary of the invention
Because the defect existing in above-mentioned prior art; main purpose of the present invention is to provide a kind of video sensing chip packaging method of protecting chip; can avoid the sensing area of video sensing chip in encapsulation process, be infected with dirty or sustain damage, thereby there is higher production rate of good.
For achieving the above object, the video sensing chip packaging method of protecting chip provided by the invention includes the following step: a) a video sensing chip is located on a circuit substrate, and is covered a protective layer on a sensing area of this video sensing chip; B) utilize many wires to connect respectively a conductive junction point of this circuit substrate and a conductive junction point of this video sensing chip; C) packaging body of coated these many wires is set on this circuit substrate and this video sensing chip; D) remove this protective layer; And e) covering members of a light-permeable is located to this packaging body, make the sensing area of this video sensing chip be positioned at this covering members below.
Thus; the sensing area that this protective layer can be avoided this video sensing chip (for example this step b) with this step process c)) before being subject to this covering members protection is infected with dirty or sustains damage, and therefore this video sensing chip packaging method has higher production rate of good.
Accompanying drawing explanation
The schematic diagram of the encapsulating structure that Fig. 1 produces for the video sensing chip packaging method of commonly using;
The schematic diagram of key step when Fig. 2 to Fig. 7 is applied to for the video sensing chip packaging method of protecting chip provided by the present invention the encapsulating structure that one first preferred embodiment provides;
The schematic diagram of another step when Fig. 8 is applied to for the video sensing chip packaging method of protecting chip provided by the present invention the encapsulating structure that the first preferred embodiment provides;
The schematic diagram of the encapsulating structure that Fig. 9 provides for the present invention's one second preferred embodiment; And
The schematic diagram of the encapsulating structure that Figure 10 provides for the present invention 1 the 3rd preferred embodiment.
[main element symbol description]
10 video sensing chip 11 circuit substrates
12 plain conductor 13 packaging bodies
14 glass plate 15 sensing areas
20 encapsulating structure 21 video sensing chips
212 sensing area 214 conductive junction points
22 circuit substrate 222 conductive junction points
23 protective layer 24 stickers
25 wire 26 packaging bodies
262 end face 27 sensing space
28 covering members 29 stickers
30 encapsulating structure 31 packaging bodies
312 end face 314 grooves
40 encapsulating structure 41 covering members
412 lens barrel 414 eyeglasses
Embodiment
For making the object, technical solutions and advantages of the present invention clearer, below in conjunction with specific embodiment, and with reference to accompanying drawing, the present invention is described in more detail.
First in this explanation, in the embodiment and accompanying drawing that will introduce below, identical reference number, represents same or similar element or its architectural feature.
Please first consult Fig. 2 to Fig. 7; Fig. 2 to Fig. 7 shows the manufacturing process of the encapsulating structure 20 (as shown in Figure 7) that the present invention's one first preferred embodiment provides; it utilizes the video sensing chip packaging method of protecting chip provided by the present invention, and this video sensing chip packaging method below will be described as an example of this encapsulating structure 20 example.
This video sensing chip packaging method includes the following step:
A) as shown in Figures 2 and 3, a video sensing chip 21 is located on a circuit substrate 22, and is covered a protective layer 23 on a sensing area 212 of this video sensing chip 21.
This protective layer 23 can utilize special liquid material (for example acrylic acid) to be printed on this video sensing chip 21 and form; also can be and utilize adhesive tape to be transferred on this video sensing chip 21 and form; above-mentioned two kinds of generation types are all quite quick, thereby are applicable to being used in the manufacturing process of this encapsulating structure 20 of a large amount of production.
In the present embodiment; this video sensing chip 21 is first pasted on this circuit substrate 22 by sticker 24, and then, this protective layer 23 just covers on this sensing area 212; and the scope of this protective layer 23 is greater than the scope of this sensing area 212 and is less than the scope of this video sensing chip 21.But this video sensing chip 21 also can just set firmly on this circuit substrate 22 after this protective layer 23 covers this sensing area 212, and the scope of this protective layer 23 also can equal the scope of this video sensing chip 21.
B) as shown in Figure 4, utilize many wires 25 to connect respectively a conductive junction point 222 of this circuit substrate 22 and a conductive junction point 214 of this video sensing chip 21.
The quantity of these many wires 25 is also unrestricted, can arrange according to demand.This step and prior art are as good as, but step a) set protective layer 23 can avoid the sensing area 212 of this video sensing chip 21 in this step, be infected with dirty or sustain damage.
The packaging body 26 of one coated wire 25 is set c) as shown in Figure 5, on this circuit substrate 22 and this video sensing chip 21.
This packaging body 26 utilizes special package material to form by pressing mold mode, uses so that more not easy fracture of wire 25.This protective layer 23 also can avoid the sensing area 212 of this video sensing chip 21 in this step, be infected with dirty or sustain damage.And, in the present embodiment, this packaging body 26 and these protective layer 23 equal height, thus, this protective layer 23 can provide buffering effect in the time of this packaging body 26 moulded section; But this protective layer 23 also can reach buffering effect higher than this packaging body 26.
D) as shown in Figure 6, remove this protective layer 23.Thus, on the sensing area 212 of this video sensing chip 21, be formed with a sensing space 27 that is positioned at these packaging body 26 central authorities.
E) as shown in Figure 7, the covering members of a light-permeable 28 is located to this packaging body 26, makes the sensing area 212 of this video sensing chip 21 be positioned at this covering members 28 belows.
In the present embodiment, this covering members 28 is one to have the glass plate of good light permeability, is pasted on an end face 262 of this packaging body 26 by sticker 29.Thus, the sensing area 212 of this video sensing chip 21 is protected by this covering members 28, and image that can these covering members 28 outsides of sensing.
In aforementioned video sensing chip packaging method; the sensing area 212 that this protective layer 23 can be avoided this video sensing chip 21 (for example this step b) with this step process c)) before being subject to these covering members 28 protections is infected with dirty or sustains damage, and therefore this video sensing chip packaging method has higher production rate of good.
It is worth mentioning that, aforementioned video sensing chip packaging method provided by the present invention is actually and once produces multiple encapsulating structures 20 of sharing this circuit substrate 22, then makes respectively this encapsulating structure 20 separate (as shown in Figure 8) by cutting.But this cutting step also can be in aforementioned this steps d) carry out before, in process, be infected with dirty or sustain damage cutting with the sensing area 212 of avoiding this video sensing chip 21.
Refer to Fig. 9, encapsulating structure that the present invention's one second preferred embodiment provides 30 is with the difference of aforementioned this encapsulating structure 20, and the packaging body 31 of this encapsulating structure 30 has a groove 314 caving in from its end face 312, and this covering members 28 is located in this groove 314; Thus, the thickness of this encapsulating structure 30 is less than the thickness of aforementioned this encapsulating structure 20, is more suitable for being used in the camera, mobile phone, notebook computer of slimming etc. electronic product.
Refer to Figure 10, the encapsulating structure 40 that the present invention 1 the 3rd preferred embodiment provides is with the difference of aforementioned this encapsulating structure 30, the covering members 41 of this encapsulating structure 40 is a camera lens, and this camera lens and prior art are as good as, and includes a lens barrel 412 and multiple eyeglass 414; Thus, as long as this encapsulating structure 40 is attached in camera, mobile phone or notebook computer etc. electronic product, this electronic product is provided with video sensing chip and camera lens simultaneously, and camera lens can be set in addition again, quite convenient in assembling.
In fact; in aforementioned video sensing chip packaging method provided by the present invention; this step e) set covering members is not limited with glass plate and camera lens; also can be the over cap of other materials or structure, as long as this covering members light-permeable and allow the image in this covering members of sensing area energy sensing outside of this video sensing chip.
Above-described specific embodiment; object of the present invention, technical scheme and beneficial effect are further described; institute is understood that; the foregoing is only specific embodiments of the invention; be not limited to the present invention; within the spirit and principles in the present invention all, any modification of making, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (7)
1. the video sensing chip packaging method that can protect chip, is characterized in that, includes the following step:
A) a video sensing chip is located on a circuit substrate, and is covered a protective layer on a sensing area of this video sensing chip;
B) utilize many wires to connect respectively a conductive junction point of this circuit substrate and a conductive junction point of this video sensing chip;
C) packaging body of coated these many wires is set on this circuit substrate and this video sensing chip;
D) remove this protective layer; And
E) covering members of a light-permeable is located to this packaging body, makes the sensing area of this video sensing chip be positioned at this covering members below.
2. the video sensing chip packaging method of protecting chip as claimed in claim 1, wherein the scope of this protective layer is greater than the scope of this sensing area and is less than or equal to the scope of this video sensing chip.
3. the video sensing chip packaging method of protecting chip as claimed in claim 1, wherein this step c) in, this packaging body and this protective layer equal height or lower than this protective layer.
4. the video sensing chip packaging method of protecting chip as claimed in claim 1, wherein this covering members is located on an end face of this packaging body.
5. the video sensing chip packaging method of protecting chip as claimed in claim 1, wherein this packaging body has an end face, and a groove from this end face depression, and this covering members is located in this groove.
6. the video sensing chip packaging method of protecting chip as claimed in claim 1, wherein this covering members is a glass plate.
7. the video sensing chip packaging method of protecting chip as claimed in claim 1, wherein this covering members is a camera lens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210494747.8A CN103855066A (en) | 2012-11-28 | 2012-11-28 | Image induction chip packaging method for protecting chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210494747.8A CN103855066A (en) | 2012-11-28 | 2012-11-28 | Image induction chip packaging method for protecting chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103855066A true CN103855066A (en) | 2014-06-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210494747.8A Pending CN103855066A (en) | 2012-11-28 | 2012-11-28 | Image induction chip packaging method for protecting chip |
Country Status (1)
| Country | Link |
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| CN (1) | CN103855066A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107580170A (en) * | 2017-11-02 | 2018-01-12 | 信利光电股份有限公司 | A kind of camera module and its method for packing |
| CN107808889A (en) * | 2017-11-29 | 2018-03-16 | 苏州晶方半导体科技股份有限公司 | Laminated packaging structure and method for packing |
| CN109449216A (en) * | 2017-08-28 | 2019-03-08 | 广州立景创新科技有限公司 | The production method of camera model |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100342281C (en) * | 2002-06-28 | 2007-10-10 | 京瓷株式会社 | Imaging device packaging, camera module and the producing process of the camera module |
| CN101131941A (en) * | 2007-09-28 | 2008-02-27 | 日月光半导体制造股份有限公司 | Semiconductor chip packaging process and its structure |
| CN101290893A (en) * | 2007-04-16 | 2008-10-22 | 日月光半导体制造股份有限公司 | Glue sealing method of sensor chip |
-
2012
- 2012-11-28 CN CN201210494747.8A patent/CN103855066A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100342281C (en) * | 2002-06-28 | 2007-10-10 | 京瓷株式会社 | Imaging device packaging, camera module and the producing process of the camera module |
| CN101290893A (en) * | 2007-04-16 | 2008-10-22 | 日月光半导体制造股份有限公司 | Glue sealing method of sensor chip |
| CN101131941A (en) * | 2007-09-28 | 2008-02-27 | 日月光半导体制造股份有限公司 | Semiconductor chip packaging process and its structure |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109449216A (en) * | 2017-08-28 | 2019-03-08 | 广州立景创新科技有限公司 | The production method of camera model |
| CN107580170A (en) * | 2017-11-02 | 2018-01-12 | 信利光电股份有限公司 | A kind of camera module and its method for packing |
| CN107580170B (en) * | 2017-11-02 | 2020-11-13 | 信利光电股份有限公司 | Camera module and packaging method thereof |
| CN107808889A (en) * | 2017-11-29 | 2018-03-16 | 苏州晶方半导体科技股份有限公司 | Laminated packaging structure and method for packing |
| CN107808889B (en) * | 2017-11-29 | 2023-10-20 | 苏州晶方半导体科技股份有限公司 | Stacked package structure and packaging method |
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Application publication date: 20140611 |