TW201429331A - Printed circuit board and manufacturing method thereof - Google Patents

Abstract

Disclosed herein are a printed circuit board and a manufacturing method thereof. A manufacturing method of a printed circuit board includes forming a predetermined pattern circuit on a prepared base substrate; processing a dummy cavity in a dummy region on the substrate with exception of a portion having the predetermined pattern circuit formed therein; preparing a dummy reinforcement as a warpage preventing material for preventing warpage of the substrate; processing a circuit portion cavity corresponding to the predetermined pattern circuit formed on the substrate in the dummy reinforcement; coupling the dummy reinforcement having the circuit portion cavity processed therein on the base substrate having the dummy cavity processed thereon; and forming an insulating layer for protecting a circuit and the dummy reinforcement on upper and lower surfaces of the base substrate having the dummy reinforcement coupled thereon to complete the manufacturing of the printed circuit board.

Description

Printed circuit board and method of manufacturing same

The present invention relates to a printed circuit board (PCB) and a method of fabricating the same, and more particularly to a printed circuit board capable of preventing substrate warpage and a method of manufacturing the same, the printed circuit board and the method of manufacturing the same by laying a The warpage preventing material is in a dummy region of one of the substrates, and the dummy region does not include a region on the substrate where a circuit pattern is formed.

Recently, in the case of a tablet computer and a smart phone, in order to increase the display area and ensure the battery capacity, the size of the motherboard has become large. For this reason, when a surface mounting technology (SMT) process is performed, wafer mounting defects due to substrate warpage have rapidly increased. To avoid this problem, surface mount technology has produced a printed circuit board array by reducing the existing four array arrangement to a two array arrangement. As a result, the productivity of the surface adhesion technology is degraded. In order to solve the above problems, some companies have produced some products (printed circuit boards) as a fixture type to smoothly carry out This surface sticking technique. The introduction of the above production system may result in additional losses, such as product insertion into the fixture.

An object of the present invention is to provide a printed circuit board and a manufacturing method for manufacturing the same, which can prevent (suppress) the manufacture of the printed circuit by providing a material having a low coefficient of thermal expansion and high strength properties in an area. In the process of the board, the warpage generated in the printed circuit board due to heat and gravity, in which the electronic components located on the printed circuit board are mounted in this area.

According to an embodiment of the invention, there is provided a printed circuit board comprising: a substrate; and a circuit pattern formed on at least one surface of the substrate, wherein a warpage preventing material is disposed on a dummy region of the substrate The warpage preventing material is used to prevent warpage of the substrate, and the dummy region does not include an area in which the circuit pattern is formed.

The substrate may be a copper clad laminate (CCL).

The warpage preventing material may be a material having a low coefficient of thermal expansion, a high glass transition temperature (Tg), and high strength properties.

The warpage preventing material includes at least one of aromatic aramid, carbon fiber, and copper invar copper (CIC).

According to another embodiment of the present invention, a method of manufacturing a printed circuit board is provided, comprising: a) forming a predetermined circuit pattern on a preliminary substrate; b) processing a dummy cavity on a dummy region on the substrate, wherein the dummy region does not include a portion having the predetermined pattern of the circuit; c) preparing a dummy reinforcing material as a warpage preventing material for Preventing the substrate from warping; d) processing a portion of the circuit cavity in the dummy reinforcing material, the circuit portion cavity corresponding to the predetermined circuit pattern formed on the substrate; e) coupling the dummy reinforcing material on the substrate a dummy reinforcing material having a cavity portion of the circuit, wherein the substrate has the dummy cavity; and f) forming an insulating layer for protecting a circuit and the dummy reinforcing material on the upper surface and the lower surface of the substrate, To complete the fabrication of the printed circuit board, wherein the substrate has this dummy reinforcing material coupled to the substrate.

In step a), the substrate can be a copper foil substrate (CCL).

In step b), a dummy cavity located in the dummy region of the substrate can be processed by a press process.

In step c), the dummy reinforcing material for preventing warpage of the substrate may be a material having a low coefficient of thermal expansion, a high glass transition temperature (Tg), and high strength properties.

The dummy reinforcing material may include at least one of aromatic aramid, carbon fiber, and copper invar copper (CIC).

In step d), the portion of the circuit portion of the circuit located in the dummy reinforcing material may be processed by a press process.

In the step f), the insulating layer may be formed of a thermo-setting resin or a thermo-plastic resin.

In order to better understand the above and other aspects of the present invention, the preferred embodiments are described below, and in conjunction with the drawings, the detailed description is as follows:

200‧‧‧Printed circuit board

201‧‧‧Substrate

202‧‧‧ seed layer

203‧‧‧ circuit pattern

204c‧‧‧Dummy cavity

205‧‧‧Anti-warping material

205c‧‧‧ circuit part cavity

206‧‧‧Insulation

1 is a plan view showing the structure of a printed circuit board in accordance with an embodiment of the present invention.

2 is a cross-sectional view showing the structure of a printed circuit board in accordance with an embodiment of the present invention.

FIG. 3 is a flow chart showing a method of manufacturing a printed circuit board according to an embodiment of the present invention.

4A-4E are diagrams showing a continuous process diagram of a method of fabricating a printed circuit board in accordance with an embodiment of the present invention.

The interpretation of the words and characters used in the specification and claims of the present invention should not be limited to a specific meaning or dictionary definition, but should be construed as having a meaning or concept related to the technical scope of the present invention, wherein the technology of the present invention The scope is based on the most appropriate method by which the inventor can appropriately define the concept of the vocabulary to describe his or her knowledge of the invention.

In the present specification, any <RTI ID=0.0> </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; "Unit", "Component", "Device" or similar terms indicate that at least A function or a unit of function can be achieved by a hardware, a software or a combination of the software and the hardware.

Various embodiments in accordance with the present invention will be described in detail below in conjunction with the accompanying drawings.

1 and 2 illustrate a printed circuit board structure in accordance with an embodiment of the present invention, wherein FIG. 1 is a plan view and FIG. 2 is a cross-sectional view.

Referring to FIGS. 1 and 2, a printed circuit board 200 according to an embodiment of the present invention includes a substrate 201, a circuit pattern 203, and a warpage preventing material 205.

The substrate 201 forms a substrate of a printed circuit board 200 in accordance with an embodiment of the present invention, and the substrate 201 (a core layer) has a single layer or a multilayer structure. As the substrate 201 as described above, a copper foil substrate can be used.

The circuit pattern 203 is formed on at least one surface of the substrate 201 (formed on both surfaces in this embodiment). The above-described circuit pattern 203 can be formed in various forms according to an application product and design requirements.

The warpage preventing material 205 may be laid in a dummy region of the substrate, the warpage preventing material 205 is used to prevent warpage of the substrate, and the dummy region does not include a region where the circuit pattern 203 is formed.

Here, a material having a low thermal expansion coefficient, a high glass transition temperature (Tg), and a high strength property may be used as the warpage preventing material 205.

For example, aromatic aramid, carbon fiber, and copper invar copper (CIC) and the like can be used as the warpage preventing material 205.

In Fig. 2, the symbol 202 represents a seed layer, and the symbol 206 represents an insulating layer.

Next, a manufacturing flow of a printed circuit board having the above structure according to an embodiment of the present invention will be described.

3 is a flow chart showing a method of manufacturing a printed circuit board according to an embodiment of the present invention, and FIGS. 4A-4E are views showing a continuous process chart of a method of manufacturing a printed circuit board according to an embodiment of the present invention.

Referring to FIGS. 3 and 4A, in a method of manufacturing a printed circuit board according to an embodiment of the present invention, first, a predetermined circuit pattern 203 is formed on a preliminary substrate 201 (S301). In the present embodiment, the above circuit pattern 203 can be formed in various forms according to application products and design specifications.

Further, a copper foil substrate can be used as the substrate 201.

As described above, when a predetermined circuit pattern 203 is formed on the substrate 201, as shown in FIG. 4B, a dummy cavity 204c is processed on a dummy region on the substrate 201, wherein the dummy region does not include a predetermined formation. One portion of the circuit pattern 203 (S302).

In this example, the dummy cavity 204c located in the dummy region of the substrate 201 can be processed by a press process.

Next, prepare a dummy reinforcement The warpage preventing material 205 is used to prevent substrate warpage (S303). Here, as the dummy reinforcing material for preventing warpage of the substrate as described above, a material having a low coefficient of thermal expansion, a high glass transition temperature (Tg), and high strength properties can be used.

In this case, aromatic polyamines, carbon fibers, and Invar copper sandwiches and the like can be used as dummy reinforcing materials.

As described above, when the dummy reinforcing material as the warpage preventing material 205 is prepared, as shown in FIG. 4C, a circuit portion cavity 205c is prepared in the dummy reinforcing material, and the circuit portion cavity 205c is formed on the substrate. The predetermined circuit pattern 203 on 201 (S304). In this example, the circuit portion cavity 205c located within the dummy reinforcing material can be processed by a stamping process.

Here, the preparation of the dummy reinforcing material as described above (S303) and the processing of the circuit portion cavity (S304) must be limited to the execution sequence as shown in FIG. As described above, the process of preparing the dummy reinforcing material (warpage preventing material 205) and the process of processing the circuit portion cavity 205c in the dummy reinforcing material (warpage preventing material 205) are different from forming the circuit pattern in the substrate (S301) The manufacturing process and the process of processing the dummy cavity (S302) in the dummy region of the substrate. Therefore, with regard to the process sequence, each step can be completed in the same order as the flowchart shown in FIG. 3, but steps S303 and S304 can be performed earlier than steps S301 and S302, and steps S303 and S304 can also be followed by step S301. S302 is performed almost simultaneously.

Meanwhile, as described above, when the circuit portion cavity 205c in the dummy reinforcing material (warpage preventing material 205) is finished, as shown in FIG. 4D, the dummy reinforcing material (warpage preventing material 205) may be coupled to the substrate 201. Upper, where the dummy reinforcement material has There is a circuit portion cavity 205c, and the substrate 201 has a dummy cavity 204c (S305). In this case, the coupling of the substrate 201 to the dummy reinforcing material (warpage preventing material 205) can be performed by an adhesive method using an adhesive and by a thermal-compression method.

As described above, when the coupling dummy reinforcing material (warpage preventing material 205) is completed on the substrate 201, as shown in FIG. 4E, an insulating layer 206 is formed on the upper surface and the lower surface of the substrate to protect the circuit and The reinforcing material (warpage preventing material 205) is dummy to complete the manufacture of the printed circuit board, where the substrate has a dummy reinforcing material (warpage preventing material 205) coupled thereto (S306). In this case, a thermo-setting resin or a thermo-plastic resin may be used as the material of the insulating layer 206. In this example, the inner substrate protected by the insulating layer 206 may be configured as a single layer or multiple layers.

As described above, the printed circuit board and the method of manufacturing the same according to the embodiment of the present invention can increase the strength of the entire surface of the printed circuit board by laying the warpage preventing material of the substrate in a dummy region of the substrate. Therefore, warpage of the printed circuit board can be prevented in the process of manufacturing the printed circuit board, and a required fixed productivity can be maintained, and the productivity of the printed circuit board is not lowered even if the existing transportation method is used.

In conclusion, the present invention has been disclosed in the above embodiments, but it is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

200‧‧‧Printed circuit board

201‧‧‧Substrate

202‧‧‧ seed layer

203‧‧‧ circuit pattern

205‧‧‧Anti-warping material

206‧‧‧Insulation

Claims (11)

A printed circuit board comprising: a substrate; and a circuit pattern formed on at least one surface of the substrate, wherein a warpage preventing material is laid in a dummy region of the substrate, the warpage preventing material is used for preventing The substrate is warped, and the dummy region does not include a region where the circuit pattern is formed. The printed circuit board of claim 1, wherein the substrate is a copper foil substrate. The printed circuit board of claim 1, wherein the warpage preventing material is a material having a low coefficient of thermal expansion, a high glass transition temperature, and high strength properties. The printed circuit board of claim 3, wherein the warpage preventing material comprises at least one of an aromatic polyamine, a carbon fiber, and an Invar copper sandwich. A method of manufacturing a printed circuit board, comprising: a) forming a predetermined circuit pattern on a preliminary substrate; b) processing a dummy cavity on a dummy region on the substrate, wherein the dummy region does not include a predetermined formation Part of the circuit pattern; c) preparing a dummy reinforcing material as a warpage preventing material for preventing warpage of the substrate; d) processing a portion of the circuit cavity in the dummy reinforcing material, the circuit portion is empty a cavity corresponding to the predetermined circuit pattern formed on the substrate; e) coupling the dummy reinforcing material on the substrate, the dummy reinforcing material having the circuit portion cavity, and the substrate having the dummy cavity; Forming an insulating layer for protecting a circuit and the dummy reinforcing material on the upper surface and the lower surface of the substrate to complete the manufacture of the printed circuit board, wherein the substrate has the dummy reinforcing material coupled to the substrate . The manufacturing method according to claim 5, wherein in the step a), the substrate is a copper foil substrate. The manufacturing method according to claim 5, wherein in the step b), the dummy cavity located in the dummy region of the substrate is processed by a stamping process. The manufacturing method according to claim 5, wherein in the step c), the dummy reinforcing material for preventing warpage of the substrate is a material having a low thermal expansion coefficient, a high glass transition temperature, and a high strength property. . The manufacturing method of claim 8, wherein the dummy reinforcing material comprises at least one of an aromatic polyamine, a carbon fiber, and an Invar copper sandwich. The manufacturing method of claim 5, wherein in the step d), the circuit portion cavity located in the dummy reinforcing material is processed by a stamping process. The manufacturing method according to claim 5, wherein in the step f), the insulating layer is formed of a thermosotropic resin or a thermoplastic resin.