CN103338613A - Electronic equipment with asymmetrical heat dissipation structure - Google Patents
Electronic equipment with asymmetrical heat dissipation structure Download PDFInfo
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- CN103338613A CN103338613A CN2012103905092A CN201210390509A CN103338613A CN 103338613 A CN103338613 A CN 103338613A CN 2012103905092 A CN2012103905092 A CN 2012103905092A CN 201210390509 A CN201210390509 A CN 201210390509A CN 103338613 A CN103338613 A CN 103338613A
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- conducting metal
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Abstract
The invention provides electronic equipment with an asymmetrical heat dissipation structure, which comprises a PCB (printed circuit board) substrate, a heat conducting metal core installed in the PCB substrate, and a miniature high-power device installed on the heat conducting metal core, wherein the heat conducting metal core comprises a base part and a protruding part extending from the base part, the size of the protruding part corresponds to that of the miniature high-power device, the size of the base part is greater than that of the protruding part, and the miniature high-power device is installed on the protruding part. The electronic equipment provided by the invention realizes effective heat dissipation of the high-power miniature device through the asymmetrical heat conducting metal core installed in a first slot part and a second slot part; the surface area of the PCB substrate is not occupied, an intensive circuit pattern design around the high-power miniature device is not affected, and the flexibility is high; and the effective heat dissipation area of the asymmetrical heat conducting metal core is large, and a function of effective heat dissipation of a partial micro area of the PCB substrate is realized.
Description
Technical field
The present invention relates to the electronic equipment dissipating heat field, relate in particular to a kind of electronic equipment with asymmetric radiator structure.
Background technology
Current printed circuit board (pcb) have in the industry a kind of design of high-end wireless communications applications: PCB simultaneously designed the minitype high-power device (≤2mm), and the line pattern design of comparatively dense is arranged around the device, the requirement that is communicated with internal layer is arranged; The PCB another side corresponding with the minitype high-power device area, the graphic designs closeness is not high, but need mount fin in order to distribute a large amount of heats that produce when the minitype high-power device is worked.
Conventional PCB solution is to adopt heat conduction sheet material to be aided with intensive louvre design at the high-power component zone, but the heat-conducting effect of heat conduction sheet material and intensive louvre is not good, the sheet material dielectric loss coefficient is big, cause the radiating effect of minitype high-power device area poor, signal transmission attenuation and distortion be serious, influenced the signal quality of communication product.
The solution of other heat radiation PCB is to adopt lamination to imbed or embed Heat Conduction Material as the method for passage of heat in the high-power component zone, though it is poor to solve conventional heat conduction PCB radiating effect, the problem that the loss of signal and distortion are serious, but need many sheet materials/prepreg pre-slotting before having lamination, Heat Conduction Material surface glue stain is difficult to shortcomings such as removal after need doing oxidation processes and lamination to Heat Conduction Material, and the method for Heat Conduction Material is imbedded or embedded to lamination, being difficult to manufactured size, minimum (≤2.0mm) Heat Conduction Material can't satisfy the high efficiency and heat radiation demand of the local tiny area of PCB.
Summary of the invention
The object of the present invention is to provide a kind of electronic equipment with asymmetric radiator structure, its PCB need not to imbed the minimum Heat Conduction Material of size, just can satisfy the high efficiency and heat radiation demand of the local tiny area of PCB.
For achieving the above object, the invention provides a kind of electronic equipment with asymmetric radiator structure, comprise: the PCB substrate, be installed on the heat-conducting metal core in the PCB substrate and be installed on minitype high-power device on the heat-conducting metal core, described heat-conducting metal core comprises base portion and is extended the lug boss of setting by base portion, the big or small corresponding minitype high-power device of described lug boss arranges, the size of described base portion is greater than the size of lug boss, and described minitype high-power device is installed on this lug boss.
Described PCB substrate respective protrusions portion is provided with first slot part, and corresponding base portion is provided with second slot part, the setting that is connected of this first and second slot part, and the size of described second slot part is greater than the size of first slot part.
Described base portion and lug boss are cylinder or cuboid, and this base portion overlaps with the central shaft of lug boss.
The thickness of described heat-conducting metal core equals the thickness of described PCB substrate.
The height fall of the end face of described lug boss and the corresponding end face of described PCB substrate is less than 0.075mm, and the height fall of the end face of described base portion and the corresponding end face of described PCB substrate is less than 0.075mm.
The diameter of described lug boss is 1.0-3.0mm.
Described lug boss height is greater than the degree of depth of described first slot part, and its difference in height is smaller or equal to 0.25mm.
Described first slot part forms by the heavy process for copper of wet chemistry.
Described heat-conducting metal core is pressed into mode by machinery and is installed in the PCB substrate.
Also comprise housing, described PCB substrate is installed in this housing.
Beneficial effect of the present invention: the present invention has the electronic equipment of asymmetric radiator structure, has realized the high efficiency and heat radiation of high power microdevice by being installed on the PCB substrate asymmetric heat-conducting metal core in first slot part and second slot part; First slot part of the PCB substrate of this electronic equipment is the metallization microflute, it makes outer conductive pattern be communicated with the internal layer conductive pattern, and it does not take the PCB substrate surface area, do not influence high power microdevice dense wire graphic designs on every side, in addition, the flexibility of the second slot part size of this PCB substrate and depth design is strong; In addition, the lug boss of the asymmetric heat-conducting metal core of the PCB substrate of this electronic equipment and the coupling of the minitype high-power device size on the PCB substrate, the bonding area of its base portion is big, make the efficiently radiates heat area of asymmetric heat-conducting metal core big, realized the high efficiency and heat radiation function of the local tiny area of PCB substrate.
In order further to understand feature of the present invention and technology contents, see also following about detailed description of the present invention and accompanying drawing, yet accompanying drawing only provide with reference to and the explanation usefulness, the present invention is limited.
Description of drawings
Below in conjunction with accompanying drawing, by the specific embodiment of the present invention is described in detail, will make technical scheme of the present invention and other beneficial effect apparent.
In the accompanying drawing,
Fig. 1 has the structural representation of the electronic equipment of asymmetric radiator structure for the present invention;
Fig. 2 has the making schematic flow sheet of the electronic equipment of asymmetric radiator structure for the present invention.
Embodiment
For further setting forth technological means and the effect thereof that the present invention takes, be described in detail below in conjunction with the preferred embodiments of the present invention and accompanying drawing thereof.
See also Fig. 1 and Fig. 2, the invention provides a kind of electronic equipment with asymmetric radiator structure, comprise: PCB substrate 2, be installed on the heat-conducting metal core 4 in the PCB substrate 2 and be installed on high power microdevice 6 on the heat-conducting metal core 4, described heat-conducting metal core 4 comprises base portion 42 and extends the lug boss 40 that arranges by base portion 42, the big or small corresponding minitype high-power device 6 of described lug boss 40 arranges, the size of described base portion 42 is greater than the size of lug boss 40, and described minitype high-power device 6 is installed on this lug boss 40.
Described PCB substrate 2 respective protrusions portions 40 are provided with first slot part 20, and corresponding base portion 42 is provided with second slot part 22, the setting that is connected of this first and second slot part 20,22, and the size of described second slot part 22 is greater than the size of first slot part 20.
In the present embodiment, by offer first slot part 20 corresponding with the size of this minitype high-power device 6(≦ 2mm) in minitype high-power device 6 zones (minitype high-power device 6 is corresponding to PCB substrate 2 lip-deep zones) of PCB substrate 2, and adopt the heavy process for copper of wet chemistry to realize 20 metallization of first slot part, conductive pattern is outer to be communicated with the conductive pattern internal layer thereby make, it does not take the PCB surface area, does not influence high power microdevice 6 dense wire graphic designs on every side; Simultaneously, second slot part 22 is offered on another surface at the PCB substrate 2 corresponding with minitype high-power device 6 zones, its size is greater than the size of described first slot part 20, and the size of this second slot part 22 can be designed to conventional bigger size, and the flexibility of its size and depth design is strong.
Described heat-conducting metal core 4 comprises in lug boss 40 in corresponding first slot part 20 and corresponding second slot part 22 and the base portion 42 that is connected with lug boss 40, described lug boss 40 is connected with the step of base portion 42 by one 90 °, and the cylinder that overlaps centered by both or cuboid.
The electronic equipment that the present invention has asymmetric radiator structure also comprises housing (not shown), and described PCB substrate 2 is installed in this housing.
Wherein, the size coupling of the minitype high-power device 6 on described lug boss 40 and the PCB substrate 2, its diameter is 1.0-3.0mm, and the height of described lug boss 40 is greater than the height of described first slot part 20, and both differences in height are smaller or equal to 0.25mm; The size of described base portion 42 is greater than the size of described lug boss 40, and it is designed to stock size, can provide bigger area of dissipation to reach and the fin welding combination area, is convenient to the mechanical push operation of heat-conducting metal core 4 simultaneously.
Described heat-conducting metal core 4 is pressed in first slot part 20 and second slot part 22 by machinery, concrete operations are as follows: the lug boss 40 of heat-conducting metal core 4 is placed in second slot part 22 of PCB substrate 2 down in advance, aim at first slot part 20 simultaneously, from the surface of base portion 42 away from lug boss 40 of heat-conducting metal core 4, exert pressure by machinery, lentamente described heat-conducting metal core 4 fully is pressed in PCB substrate 2 flutings.
After being pressed in PCB substrate 2 flutings fully, the thickness of described heat-conducting metal core 4 equals the thickness of described PCB substrate 2, the height fall of the end face of described lug boss 40 and described PCB substrate 2 corresponding end faces is less than 0.075mm, and the height fall of the end face of described base portion 42 and described PCB substrate 2 corresponding end faces is less than 0.075mm.
Be located on the PCB substrate 2 by the asymmetric high-efficiency heat radiation structure that described heat-conducting metal core 4 and described first, second slot part 20,22 are formed, realized having the PCB of asymmetric high-efficiency heat radiation structure, while is installed fin at lug boss 40 installation minitype high-power devices 6 and the base portion 42 of the heat-conducting metal core 4 of this PCB, constitutes the electronic equipment that the present invention has asymmetric radiator structure.A large amount of heats that the minitype high-power device 6 of this electronic equipment produces when working are absorbed by heat-conducting metal core 4, and are transmitted on the fin 8 that is connected with the heat-conducting metal core and be positioned at the PCB opposite side, thereby realize the high efficiency and heat radiation function of the local tiny area of PCB.
In sum, the present invention has the electronic equipment of asymmetric radiator structure, has realized the high efficiency and heat radiation of high power microdevice by being installed on the PCB substrate asymmetric heat-conducting metal core in first slot part and second slot part; First slot part of the PCB substrate of this electronic equipment is the metallization microflute, it makes outer conductive pattern be communicated with the internal layer conductive pattern, and it does not take the PCB substrate surface area, do not influence high power microdevice dense wire graphic designs on every side, in addition, the flexibility of the second slot part size of this PCB substrate and depth design is strong; In addition, the lug boss of the asymmetric heat-conducting metal core of the PCB substrate of this electronic equipment and the coupling of the minitype high-power device size on the PCB substrate, the bonding area of its base portion is big, make the efficiently radiates heat area of asymmetric heat-conducting metal core big, realized the high efficiency and heat radiation function of the local tiny area of PCB substrate.
The above for the person of ordinary skill of the art, can make other various corresponding changes and distortion according to technical scheme of the present invention and technical conceive, and all these changes and distortion all should belong to the protection range of claim of the present invention.
Claims (10)
1. electronic equipment with asymmetric radiator structure, it is characterized in that, comprise: the PCB substrate, be installed on the heat-conducting metal core in the PCB substrate and be installed on minitype high-power device on the heat-conducting metal core, described heat-conducting metal core comprises base portion and is extended the lug boss of setting by base portion, the big or small corresponding minitype high-power device of described lug boss arranges, the size of described base portion is greater than the size of lug boss, and described minitype high-power device is installed on this lug boss.
2. the electronic equipment with asymmetric radiator structure as claimed in claim 1, it is characterized in that, described PCB substrate respective protrusions portion is provided with first slot part, corresponding base portion is provided with second slot part, the setting that is connected of this first and second slot part, and the size of described second slot part is greater than the size of first slot part.
3. the electronic equipment with asymmetric radiator structure as claimed in claim 1 is characterized in that, described base portion and lug boss are cylinder or cuboid, and this base portion overlaps with the central shaft of lug boss.
4. the electronic equipment with asymmetric radiator structure as claimed in claim 1 is characterized in that, the thickness of described heat-conducting metal core equals the thickness of described PCB substrate.
5. the electronic equipment with asymmetric radiator structure as claimed in claim 4, it is characterized in that, the height fall of the end face of described lug boss and the corresponding end face of described PCB substrate is less than 0.075mm, and the height fall of the end face of described base portion and the corresponding end face of described PCB substrate is less than 0.075mm.
6. the electronic equipment with asymmetric radiator structure as claimed in claim 3 is characterized in that, the diameter of described lug boss is 1.0-3.0mm.
7. the electronic equipment with asymmetric radiator structure as claimed in claim 3 is characterized in that, described lug boss height is greater than the degree of depth of described first slot part, and its difference in height is smaller or equal to 0.25mm.
8. the electronic equipment with asymmetric radiator structure as claimed in claim 1 is characterized in that, described first slot part forms by the heavy process for copper of wet chemistry.
9. the electronic equipment with asymmetric radiator structure as claimed in claim 1 is characterized in that, described heat-conducting metal core is pressed into mode by machinery and is installed in the PCB substrate.
10. the electronic equipment with asymmetric radiator structure as claimed in claim 1 is characterized in that, also comprises housing, and described PCB substrate is installed in this housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210390509.2A CN103338613B (en) | 2012-10-15 | 2012-10-15 | There is the electronic equipment of asymmetric radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210390509.2A CN103338613B (en) | 2012-10-15 | 2012-10-15 | There is the electronic equipment of asymmetric radiator structure |
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| Publication Number | Publication Date |
|---|---|
| CN103338613A true CN103338613A (en) | 2013-10-02 |
| CN103338613B CN103338613B (en) | 2016-05-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210390509.2A Active CN103338613B (en) | 2012-10-15 | 2012-10-15 | There is the electronic equipment of asymmetric radiator structure |
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| CN (1) | CN103338613B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104465552A (en) * | 2014-12-26 | 2015-03-25 | 苏州旭创科技有限公司 | Packaging structure and optical module |
| CN105099564A (en) * | 2015-06-16 | 2015-11-25 | 苏州旭创科技有限公司 | Encapsulation structure and optical module |
| WO2016058396A1 (en) * | 2014-10-17 | 2016-04-21 | 中兴通讯股份有限公司 | Communication system and communication device therefor |
| CN107683016A (en) * | 2017-11-21 | 2018-02-09 | 生益电子股份有限公司 | A kind of quick heat radiating PCB |
| CN110459512A (en) * | 2019-09-12 | 2019-11-15 | 东莞铭普光磁股份有限公司 | Radiate mainboard and optical module |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050079329A1 (en) * | 2003-10-10 | 2005-04-14 | Hideyo Osanai | Metal/ceramic bonding substrate and method for producing same |
| CN102307429A (en) * | 2011-09-02 | 2012-01-04 | 东莞生益电子有限公司 | Embedded high-thermal conductive PCB and manufacturing method thereof |
| CN102368890A (en) * | 2011-10-09 | 2012-03-07 | 东莞生益电子有限公司 | Manufacturing method of PCB with embedded assembly |
-
2012
- 2012-10-15 CN CN201210390509.2A patent/CN103338613B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050079329A1 (en) * | 2003-10-10 | 2005-04-14 | Hideyo Osanai | Metal/ceramic bonding substrate and method for producing same |
| CN102307429A (en) * | 2011-09-02 | 2012-01-04 | 东莞生益电子有限公司 | Embedded high-thermal conductive PCB and manufacturing method thereof |
| CN102368890A (en) * | 2011-10-09 | 2012-03-07 | 东莞生益电子有限公司 | Manufacturing method of PCB with embedded assembly |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016058396A1 (en) * | 2014-10-17 | 2016-04-21 | 中兴通讯股份有限公司 | Communication system and communication device therefor |
| CN104465552A (en) * | 2014-12-26 | 2015-03-25 | 苏州旭创科技有限公司 | Packaging structure and optical module |
| CN104465552B (en) * | 2014-12-26 | 2018-05-04 | 苏州旭创科技有限公司 | Encapsulating structure and optical module |
| CN105099564A (en) * | 2015-06-16 | 2015-11-25 | 苏州旭创科技有限公司 | Encapsulation structure and optical module |
| CN107683016A (en) * | 2017-11-21 | 2018-02-09 | 生益电子股份有限公司 | A kind of quick heat radiating PCB |
| CN110459512A (en) * | 2019-09-12 | 2019-11-15 | 东莞铭普光磁股份有限公司 | Radiate mainboard and optical module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103338613B (en) | 2016-05-11 |
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Address after: 523127 Dongcheng District City, Guangdong province (with sand) science and Technology Industrial Park Road, No. 33 vibration with the number of Patentee after: Shengyi electronic Limited by Share Ltd Address before: 523000 Dongcheng District (Dongguan) science and Technology Industrial Park, Guangdong, China Patentee before: Dongguan Shengyi Electronics Ltd. |