CN103152976B - For the ceramic base printed circuit board that LED installs - Google Patents
For the ceramic base printed circuit board that LED installs Download PDFInfo
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- CN103152976B CN103152976B CN201310096702.XA CN201310096702A CN103152976B CN 103152976 B CN103152976 B CN 103152976B CN 201310096702 A CN201310096702 A CN 201310096702A CN 103152976 B CN103152976 B CN 103152976B
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- circuit board
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Abstract
The present invention provides a kind of ceramic base printed circuit board installed for LED, comprising: the ceramic substrate being combined as a whole by adhesive layer and organic material circuit card, described organic material circuit card is formed some first through holes, described adhesive layer is formed some 2nd through holes, the shape of described some first through holes and some 2nd through holes and size one_to_one corresponding respectively, described ceramic substrate is exposed by the first through hole and the 2nd through hole, thus forms some blind slots for installing LED. Low cost of manufacture of the present invention; There is good heat conductivility; The light that the LED emission being mounted thereon can be made to go out can be fully utilized; Improve production efficiency and the quality product of ceramic base printed circuit board.
Description
Technical field
The present invention relates to LED applied technical field, it is specifically related to a kind of ceramic base printed circuit board installed for LED.
Background technology
In recent years, LED/light source, owing to its life-span length, light effect are high, radiate remarkable advantage low with low in energy consumption, is widely applied in various fields.
With in recent years to the requirement of LED light device miniaturization, the size for the printed circuit board (PCB) of LED installation is pursuing miniaturization. The miniaturization of LED light device heat radiation and electric property to the printed circuit board (PCB) installed for LED simultaneously is had higher requirement. For this reason, it is proposed that adopt the technical scheme of ceramic base printed circuit board.
Existing ceramic base printed circuit board comprises ceramic substrate and is formed directly into the layers of copper conducting wire of ceramic base plate surface, wherein layers of copper conducting wire adopts the copper-plated technique of DBC or DPC to anchor at ceramic base plate surface, but adopt the copper-plated processing unit of DBC or DPC to have high input, cause the manufacturing cost of existing ceramic base printed circuit board very expensive, it is difficult to popularize in civilian LED field except war products.
Summary of the invention
In view of this, it is necessary to for the problem that background technology is mentioned, it is provided that the ceramic base printed circuit board that a kind of new texture, cost are low.
It is an object of the invention to be achieved through the following technical solutions:
A kind of ceramic base printed circuit board installed for LED, comprising: the ceramic substrate being combined as a whole by adhesive layer and organic material circuit card, described organic material circuit card is formed some first through holes, described adhesive layer is formed some 2nd through holes, the shape of described some first through holes and some 2nd through holes and size one_to_one corresponding respectively, described ceramic substrate is exposed by the first through hole and the 2nd through hole, thus forms some blind slots for installing LED.
Described ceramic substrate is the ceramic substrate that aluminium oxide ceramic substrate or aluminium nitride ceramics substrate etc. have excellent thermal conductivity and reflectivity.
Visible ray is had the reflecting rate of more than 88% for the surface installing LED by described ceramic substrate.
Visible ray is had the reflecting rate of more than 90% for the surface installing LED by described ceramic substrate.
Described organic material circuit card is individual layer, bilayer or multilayer printed circuit board.
Described for LED install ceramic base printed circuit board on offer at least one for fixedly mounting the installation through hole of ceramic base printed circuit board.
Compared with prior art, the present invention possesses following advantage:
1, adopt organic material circuit card conducting wire can be provided lower to connect structure by cost, greatly reduce the manufacturing cost of ceramic base printed circuit board;
2, LED can be directly installed on ceramic base plate surface to be connected with ceramic substrate formation heat conduction so that the heat that LED produces can conduct to ceramic substrate in time and dispel the heat, and therefore ceramic base printed circuit board has good heat conductivility;
3, having excellent reflecting rate for installing the ceramic base plate surface of LED, therefore ceramic base printed circuit board has excellent reflective function, and the light that the LED emission being mounted thereon is gone out can be fully utilized;
4, by organic material circuit card, adhesive layer and ceramic substrate pressing are integrated the ceramic base printed circuit board that can form new texture, it is to increase the production efficiency of ceramic base printed circuit board and quality product.
Accompanying drawing explanation
Fig. 1 is the two dimensional structure schematic diagram of the embodiment of the present invention;
Fig. 2 is the cross-sectional view of the embodiment of the present invention.
Embodiment
As shown in Figures 1 and 2, the ceramic base printed circuit board for LED installation of the present embodiment comprises: the ceramic substrate 1 being combined as a whole by adhesive layer 2 and organic material circuit card 3, described organic material circuit card 3 is formed some first through holes 31, described adhesive layer 2 is formed some 2nd through holes 21, the shape of described first through hole 31 and the 2nd through hole 21 and size one_to_one corresponding respectively, described ceramic substrate 1 is exposed by the first through hole 31 and the 2nd through hole 21, thus on ceramic base printed circuit board described in the present embodiment, form some blind slots 4 for installing LED.
Described LED can be arranged on the surface of the described ceramic substrate 1 bottom as described blind slot 4 so that the heat that LED produces can conduct to described ceramic substrate 1 in time and realize heat radiation.
As shown in Figure 1, ceramic base printed circuit board is rectangle, and across corner one is offered one and installed through hole 5 by respectively, for for the secure components such as screw through thus this ceramic base printed circuit board is fixed. In fact, the correct position of the ceramic base printed circuit board of the present invention all can be offered at least one and install through hole so that described ceramic base printed circuit board can be fixedly mounted by the cooperation of the secure components such as screw and described installation through hole. Certainly, ceramic base printed circuit board can also be other shapes such as circle, hexagon.
Described ceramic substrate 1 can be the ceramic substrate that aluminium oxide ceramic substrate, aluminium nitride ceramics substrate etc. have excellent thermal conductivity and reflectivity. Visible ray is had the reflecting rate of more than 88% for the surface installing LED by described ceramic substrate 1, preferably there is the reflecting rate of more than 90%, the ceramic base printed circuit board of the present embodiment is thus made to have excellent reflective function, thus the light that the LED emission being mounted thereon is gone out can be fully utilized.
Described adhesive layer 2 is epoxy glue layer in the present embodiment, it is understood that this adhesive layer 2 can also be organic material circuit card can be combined in ceramic substrate by any other together with adhesive material be prepared from.
Described organic material circuit card 3 is single layer board, comprises organic material substrate 32, is formed in the layers of copper circuit 33 of this organic material substrate 32 outside surface and covers the outside surface of described organic material substrate 32 and the solder mask 34 of corresponding layers of copper circuit 33.Wherein, described organic material substrate 32 is prepared from by the organic materials of such as FR4 or BT etc. It should be appreciated that organic material circuit card can also be double-deck or multilayer circuit board.
The ceramic base printed circuit board for LED installation of the present embodiment can be prepared by the following method:
The first step, ceramic substrate 1, the organic material circuit card 3 being formed with the first through hole 31 are provided and are formed with the adhesive layer 2 of the 2nd through hole 21;
2nd step, by superimposed successively to ceramic substrate 1, adhesive layer 2 and organic material circuit card 3, lamination process ensures the first through hole 31 and the 2nd through hole 21 one_to_one corresponding;
3rd step, superimposed good ceramic substrate 1, adhesive layer 2 and organic material circuit card 3 are put into laminating machine carry out pressing and make pottery and printed circuit board (PCB);
4th step, offer at the correct position of this ceramic base printed circuit board and through hole 5 is installed.
Claims (4)
1. the ceramic base printed circuit board installed for LED, comprises the ceramic substrate and organic material circuit card that are combined as a whole by adhesive layer, it is characterised in that:
Described organic material circuit card is formed some first cylindricality through holes, described adhesive layer is formed some 2nd cylindricality through holes, the shape of described some first cylindricality through holes and some 2nd cylindricality through holes and size one_to_one corresponding respectively, described ceramic substrate is exposed by the first cylindricality through hole and the 2nd cylindricality through hole, thus forms some cylindricality blind slots for installing LED;
Visible ray is had the reflecting rate of more than 88% for the surface installing LED by described ceramic substrate;
Described ceramic substrate is aluminium oxide ceramic substrate.
2. the ceramic base printed circuit board installed for LED according to claim 1, it is characterised in that: visible ray is had the reflecting rate of more than 90% for the surface installing LED by described ceramic substrate.
3. the ceramic base printed circuit board installed for LED according to claim 1, it is characterised in that: described organic material circuit card is individual layer, bilayer or multilayer printed circuit board.
4. the ceramic base printed circuit board installed for LED according to any one of claim 1 to 3, it is characterised in that: it offers at least one for fixedly mounting the installation through hole of described ceramic base printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310096702.XA CN103152976B (en) | 2013-03-25 | 2013-03-25 | For the ceramic base printed circuit board that LED installs |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310096702.XA CN103152976B (en) | 2013-03-25 | 2013-03-25 | For the ceramic base printed circuit board that LED installs |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103152976A CN103152976A (en) | 2013-06-12 |
| CN103152976B true CN103152976B (en) | 2016-06-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310096702.XA Active CN103152976B (en) | 2013-03-25 | 2013-03-25 | For the ceramic base printed circuit board that LED installs |
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| CN (1) | CN103152976B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105376933B (en) * | 2015-12-22 | 2018-01-19 | 乐健科技（珠海）有限公司 | Ceramic base printed circuit board and preparation method thereof, LED module and preparation method thereof |
| CN113411952B (en) * | 2021-06-07 | 2022-04-12 | 中国电子科技集团公司第二十九研究所 | Embedded micro-channel printed circuit board compatible with various blind grooves and preparation method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1825640A (en) * | 2004-09-30 | 2006-08-30 | 晶元光电股份有限公司 | Semiconductor luminescent element composition |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10351934B4 (en) * | 2003-11-07 | 2017-07-13 | Tridonic Jennersdorf Gmbh | Light-emitting diode arrangement with heat dissipating board |
| US7745832B2 (en) * | 2004-09-24 | 2010-06-29 | Epistar Corporation | Semiconductor light-emitting element assembly with a composite substrate |
| CN101290913B (en) * | 2007-04-17 | 2011-07-06 | 晶元光电股份有限公司 | Electronic element component having compound material base |
| CN203151859U (en) * | 2013-03-25 | 2013-08-21 | 乐健科技（珠海）有限公司 | A ceramic-based printed circuit board used for installing LEDs |
-
2013
- 2013-03-25 CN CN201310096702.XA patent/CN103152976B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1825640A (en) * | 2004-09-30 | 2006-08-30 | 晶元光电股份有限公司 | Semiconductor luminescent element composition |
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| CN103152976A (en) | 2013-06-12 |
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