CN102769992A - Three-dimensional LED circuit board - Google Patents
Three-dimensional LED circuit board Download PDFInfo
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- CN102769992A CN102769992A CN2012102024730A CN201210202473A CN102769992A CN 102769992 A CN102769992 A CN 102769992A CN 2012102024730 A CN2012102024730 A CN 2012102024730A CN 201210202473 A CN201210202473 A CN 201210202473A CN 102769992 A CN102769992 A CN 102769992A
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Abstract
The invention relates to a three-dimensional LED circuit board comprising a double-side circuit board. The double-side circuit board comprises two circuit layers and an insulation layer sandwiched between the two circuit layers. At least one of the two circuit layers is a formable thick metal loading circuit after being bent. At least LED components are mounted on the thick metal loading circuit. The thick metal loading circuit can be bent to form a three-dimensional shape by any angle, so that lighting emitting direction of LEDs mounted on the thick metal loading circuit can be changed. Stereoscopic lighting of LEDs of the LED module in multiple angles and different directions can be realized by a simplest and easiest processing manner. Besides, the three-dimensional LED circuit board is simple in manufacture and production, high in efficiency and low in cost.
Description
Technical field
The invention belongs to the LED application, be specifically related to change the luminous direction of illumination of LED with the bending angle, form the three-dimensional luminous pattern and the LED three-dimensional circuit board of moulding, LED module and LED lamp ornaments lighting are used.
Background technology
Now the luminous LED lamp band of a kind of side being arranged on the market, be to take pin LED lamp pearl with artificial welding one by one Great Wall lamp bar in the circuit board, but production efficiency is extremely low, and cost is high, can't volume production, and use install inconvenient.The another kind of on the market SMD luminous LED lamp band of side, its lighting angle is little, and cost is high, also can't popularize.And above-mentioned two kinds of luminous direction of illuminations of LED are all unadjustable, can not realize that leading circuit is crooked towards different directions with LED, can't be implemented in same plane and perhaps form the pattern of various tiny exquisitenesses in a plurality of planes.
The present invention is intended to overcome the above problems and other technical problem.
Summary of the invention
In view of the above, the invention provides a kind of led circuit plate of three-dimensional modeling, it is characterized in that, the luminous direction of illumination of bending angle change LED with wiring board forms the luminous pattern and the moulding of three-dimensional modeling.
The present invention also provides a kind of led circuit plate of three-dimensional modeling; Comprise: double-sided wiring board; Said double-sided wiring board comprises the two-tier circuit layer and is clipped in the insulating barrier between the said two-tier circuit layer; Wherein, the circuit layer of one deck at least in the said two-tier circuit layer is the thick metal bearer circuit that can finalize the design after the bending; Be installed in said thick metal and carry the components and parts that comprise LED at least on the circuit; Wherein, said thick metal carries circuit and forms three-dimensional modeling with arbitrarily angled bending typing, changes thus to be installed in the luminous direction of illumination that said thick metal carries the LED on the circuit.
According to a preferred embodiment of the invention, described LED three-dimensional circuit board is characterized in that, said LED directly is encapsulated in the LED that obtains on the said thick metal bearer circuit with led chip.
The present invention also provides a kind of LED three-dimensional circuit board, comprising: two-sided soft-circuit board; Be combined in the reinforcing chip on the double-surface flexible wiring board, wherein, but reinforcing chip bending typing; Be installed in the components and parts that comprise LED at least on the said circuit board;
Wherein, described reinforcing chip and FPC bending typing together form three-dimensional modeling, change the luminous direction of illumination that is installed in the LED on the said FPC thus.
According to a preferred embodiment of the invention, described LED three-dimensional circuit board is characterized in that, said LED directly is encapsulated in the LED that obtains on the said circuit board with led chip.
According to a preferred embodiment of the invention, described LED three-dimensional circuit board is characterized in that said reinforcing chip is a metallic plate, or has the metallic plate of non-metallic layer, or non-metal board.
The present invention also provides a kind of LED three-dimensional circuit board, comprising: single face wiring board, said single face wiring board are the thick metallic circuits that can finalize the design after the bending; Be installed in said thick metal and carry the components and parts that comprise LED at least on the circuit;
Wherein, said thick metal carries circuit and forms three-dimensional modeling with arbitrarily angled bending typing, changes thus to be installed in the luminous direction of illumination that said thick metal carries the LED on the circuit.
According to a preferred embodiment of the invention, described LED three-dimensional circuit board is characterized in that, LED directly is encapsulated in the LED that obtains on the thick metal bearer circuit of said single face with led chip.
According to a preferred embodiment of the invention, described LED three-dimensional circuit board is characterized in that, carries the position that needs bridge joint on the circuit at said thick metal, realizes the bridge joint conducting with conductive oil, conducting resinl, conductive paste or welding conductors, components and parts.
The LED module of this three-dimensional modeling of the present invention can be widely used in LED lamp band, LED Christmas lamp, LED neon light, LED guardrail pipe, LED advertisement and identifier, LED illuminating module, LED rainbow tube, LED sign module, LED exposes lamp etc., and it is manufactured simply, efficient is high, cost is low.
According to a preferred embodiment of the invention, described bending angle is in the angular range of 0-180 degree.
According to a preferred embodiment of the invention, said LED is adopting surface mounted LED lamp, direct insertion LED lamp or Piranha formula LED lamp.
According to a preferred embodiment of the invention, the bending typing angle of the carrying circuit of different LED correspondence is identical unanimity on the said led circuit plate, or size inequality.
According to one embodiment of the invention, said bending typing reinforcing chip works to do bending styling and heat radiation.
According to the present invention, thick metal carries circuit and works to do conduction, typing support and heat radiation simultaneously.
In following description, with the details of setting forth one or more embodiment of the present invention to accompanying drawing and embodiment.From these descriptions, accompanying drawing and claim, can know other features, objects and advantages of the present invention.
Description of drawings
Through combining following this specification of advantages, it is more obvious that characteristic of the present invention, purpose and advantage will become, in the accompanying drawings:
The wiring board sketch map of Fig. 1 for making in one embodiment of the invention.
The wiring board sketch map of Fig. 2 for making in further embodiment of this invention.
Fig. 3 pastes the cross sectional representation behind the hot pressing bending typing prop carrier for wiring board.
Fig. 4 in one embodiment of the invention in the circuit board SMT mount the sketch map that has welded LED and element.
Fig. 5 in further embodiment of this invention in the circuit board SMT mount the sketch map that has welded LED and element.
Fig. 6 is the schematic cross-section behind bearer circuit plate plate bending 90 degree that post LED lamp and element as shown in Figure 4.
Fig. 7 is the schematic cross-section behind bearer circuit plate bending 45 degree that post LED lamp and element as shown in Figure 4.
Fig. 8 is the schematic cross-section after the bearer circuit plate that posts LED lamp and element as shown in Figure 5 bends 90 degree and 45 degree respectively.
Fig. 9 has sealed the sketch map that glue is lighted the cross section, back for the LED lamp among Fig. 6.
Figure 10 has sealed the sketch map that glue is lighted the cross section, back for the LED lamp among Fig. 7.
LED lamp among Figure 11 Fig. 8 has sealed the sketch map that glue is lighted the cross section, back.
Figure 12 is the sketch map after thick metal single sided board has welded LED lamp and element.
Embodiment
Concrete mode to the LED module of a kind of three-dimensional modeling of the present invention is described in more detail below with reference to accompanying drawings.
It will be appreciated by those skilled in the art that these execution modes have only enumerated some specific embodiments of the present invention, the present invention and protection range thereof do not had any restriction, some other similarly or the execution mode that is equal to equally also can be used for embodiment of the present invention.
Before describing the present invention in detail; Those skilled in the art are to be understood that; " element " should be done the understanding on the most wide in range connotation in this application, promptly comprises all types of elements that are used for electronic devices and components, electric component or other type of circuit, for example the element of surface mount (SMT) type; The element of tape welding pin or pin such as various SMT type element, support (promptly with the pin) element of type, various high power devices or the like are not restricted to LED.
In addition, term " wiring board " and " circuit board " can use in the present invention with exchanging.
According to preferred embodiment various, relevant making step is following.
Will be like Fig. 1, the back side of carrying the wiring board 3 that circuit 1 forms by power supply main traverse line circuit 2, LED shown in Figure 2; Stiffened aluminium sheet 4 contrapositions thick with the 0.2mm of gluing mount; With bonder hot pressing 5-10 second, use the pressing machine 150 ℃ to 180 ℃ following hot pressing 90 seconds to 180 seconds then, be placed at last in the baking box with 120 ℃ to 160 ℃ baking-curings 45 minutes to 90 minutes; (identify among Fig. 3: 1 is LED carrying line layer to obtain structure as shown in Figure 3; 2 is power supply main traverse line line layer, and 4 is the stiffened aluminium sheet layer, and 9,10,11 are respectively insulating barrier).Wherein, stiffened aluminium sheet 4 not only plays the effect of reinforcement, also can play the effect of heat radiation simultaneously.
Tradition with SMT mounts welding procedure, with the solder joint print solder paste on the steel mesh contraposition wiring board 3, paster LED lamp 5, Chip-R 6 is welded on the wiring board 3, obtains like Fig. 4, structure shown in Figure 5.Structure shown in Figure 12 identifies among the figure for being the sketch map after thick metal single sided board has welded LED lamp and element: 5 is that paster LED lamp, 12 is that the thick metallic circuit of single face, 13 is the gap bridge conductor.
Will be like Fig. 4, the wiring board bending forming (like Fig. 6, Fig. 7, shown in Figure 8) that has welded LED lamp 5 and Chip-R 6 that mounts shown in Figure 5; Bending 90 degree shown in Figure 6; Line bending 45 degree shown in Figure 7; Shown in Figure 8 respectively along bending 90 degree and 45 degree separately, its bending angle can carry out 0 degree as required and to the angular range of 180 degree, bend.
The LED lamp of bending forming is sealed sealing 8, obtain like Fig. 9, Figure 10, structure shown in Figure 11,7 luminous direction of illuminations for LED lamp after the moulding.Because main traverse line circuit 2 is characteristics of flexible circuit board; Can twine bending arbitrarily; Add that power supply main traverse line circuit 2 and LED carry circuit 1 and be combined as a whole, LED carries circuit 1 and can bend along the angle of bending axis bending 0 degree to 180 degree again, so just can realize the luminous irradiation of LED towards the different directions multi-angle; And can be on same plane or a plurality of planes realize 3-dimensional irradiation around the pattern that forms various tiny exquisitenesses, form three-dimensional luminous pattern and moulding.The mode of this formation three-dimensional contouring is very simple, is easy to processing, and is very flexible, and with low cost.
More than combine accompanying drawing to combine specific embodiment that the present invention has been carried out detailed description.But, it will be appreciated by those skilled in the art that the above only is to illustrate and describe some embodiments, to scope of the present invention, especially the scope of claim does not have any restriction.Scope of the present invention is limited accompanying claims.
Claims (8)
1. a LED three-dimensional circuit board is characterized in that, comprising:
Double-sided wiring board, said double-sided wiring board comprise the two-tier circuit layer and are clipped in the insulating barrier between the said two-tier circuit layer that wherein, the circuit layer of one deck at least in the said two-tier circuit layer is the thick metal bearer circuit that can finalize the design after the bending;
Be installed in said thick metal and carry the components and parts that comprise LED at least on the circuit;
Wherein, said thick metal carries circuit and forms three-dimensional modeling with arbitrarily angled bending typing, changes thus to be installed in the luminous direction of illumination that said thick metal carries the LED on the circuit.
2. LED three-dimensional circuit board according to claim 1 is characterized in that, said LED directly is encapsulated in the LED that obtains on the said thick metal bearer circuit with led chip.
3. a LED three-dimensional circuit board is characterized in that, comprising:
Two-sided soft-circuit board;
Be combined in the reinforcing chip on the double-surface flexible wiring board, wherein, reinforcing chip can be finalized the design in bending;
Be installed in the components and parts that comprise LED at least on the said double-surface flexible wiring board;
Wherein, said reinforcing chip and said double-surface flexible wiring board bending typing together form three-dimensional modeling, change the luminous direction of illumination that is installed in the LED on the said double-surface flexible wiring board thus.
4. LED three-dimensional circuit board according to claim 3 is characterized in that, said LED directly is encapsulated in the LED that obtains on the said circuit board with led chip.
5. according to claim 3 or 4 described LED three-dimensional circuit boards, it is characterized in that said reinforcing chip is a metallic plate, or have the metallic plate of non-metallic layer, or non-metal board.
6. a LED three-dimensional circuit board is characterized in that, comprising:
Single face wiring board, said single face wiring board are the thick metal bearer circuits that can finalize the design after the bending;
Be installed in said thick metal and carry the components and parts that comprise LED at least on the circuit;
Wherein, said thick metal carries circuit and forms three-dimensional modeling with arbitrarily angled bending typing, changes thus to be installed in the luminous direction of illumination that said thick metal carries the LED on the circuit.
7. LED three-dimensional circuit board according to claim 6 is characterized in that, LED directly is encapsulated in the LED that obtains on the said thick metal bearer circuit with led chip.
8. LED three-dimensional circuit board according to claim 6 is characterized in that, carries the position that needs bridge joint on the circuit at said thick metal, realizes the bridge joint conducting with conductive oil, conducting resinl, conductive paste or welding conductors, components and parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102024730A CN102769992A (en) | 2012-06-08 | 2012-06-08 | Three-dimensional LED circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102024730A CN102769992A (en) | 2012-06-08 | 2012-06-08 | Three-dimensional LED circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102769992A true CN102769992A (en) | 2012-11-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012102024730A Pending CN102769992A (en) | 2012-06-08 | 2012-06-08 | Three-dimensional LED circuit board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015117289A1 (en) * | 2014-02-08 | 2015-08-13 | 深圳市日上光电股份有限公司 | Led through-hole lamp |
| CN104952864A (en) * | 2015-06-24 | 2015-09-30 | 厦门多彩光电子科技有限公司 | LED (light emitting diode) lamp filament and manufacturing method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009111040A (en) * | 2007-10-29 | 2009-05-21 | Fujitsu Ltd | Semiconductor device |
| CN101441357A (en) * | 2007-11-23 | 2009-05-27 | 联茂电子股份有限公司 | Luminous module, molding mode of the same and application thereof |
| CN201383901Y (en) * | 2009-02-18 | 2010-01-13 | 王定锋 | Buried hole type circuit board |
| CN201688230U (en) * | 2009-12-03 | 2010-12-29 | 王定锋 | LED lamp band |
| CN201689617U (en) * | 2010-04-09 | 2010-12-29 | 王定锋 | LED display |
| CN202652681U (en) * | 2012-06-08 | 2013-01-02 | 王定锋 | LED three-dimensional circuit board |
-
2012
- 2012-06-08 CN CN2012102024730A patent/CN102769992A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009111040A (en) * | 2007-10-29 | 2009-05-21 | Fujitsu Ltd | Semiconductor device |
| CN101441357A (en) * | 2007-11-23 | 2009-05-27 | 联茂电子股份有限公司 | Luminous module, molding mode of the same and application thereof |
| CN201383901Y (en) * | 2009-02-18 | 2010-01-13 | 王定锋 | Buried hole type circuit board |
| CN201688230U (en) * | 2009-12-03 | 2010-12-29 | 王定锋 | LED lamp band |
| CN201689617U (en) * | 2010-04-09 | 2010-12-29 | 王定锋 | LED display |
| CN202652681U (en) * | 2012-06-08 | 2013-01-02 | 王定锋 | LED three-dimensional circuit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015117289A1 (en) * | 2014-02-08 | 2015-08-13 | 深圳市日上光电股份有限公司 | Led through-hole lamp |
| CN104952864A (en) * | 2015-06-24 | 2015-09-30 | 厦门多彩光电子科技有限公司 | LED (light emitting diode) lamp filament and manufacturing method thereof |
| CN104952864B (en) * | 2015-06-24 | 2017-06-23 | 厦门多彩光电子科技有限公司 | LED filament and its manufacture method |
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Application publication date: 20121107 |