CN203632965U - Circuit board and LED lamp thereof - Google Patents
Circuit board and LED lamp thereof Download PDFInfo
- Publication number
- CN203632965U CN203632965U CN201320696773.9U CN201320696773U CN203632965U CN 203632965 U CN203632965 U CN 203632965U CN 201320696773 U CN201320696773 U CN 201320696773U CN 203632965 U CN203632965 U CN 203632965U
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- Prior art keywords
- circuit board
- substrate
- base
- hollow parts
- copper
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- 239000000758 substrate Substances 0.000 claims abstract description 76
- 229910052802 copper Inorganic materials 0.000 claims abstract description 45
- 239000010949 copper Substances 0.000 claims abstract description 45
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 44
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 25
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 25
- 239000004744 fabric Substances 0.000 claims abstract description 15
- 239000011521 glass Substances 0.000 claims abstract description 15
- 239000000919 ceramic Substances 0.000 claims abstract description 13
- 239000004411 aluminium Substances 0.000 claims description 23
- 150000002118 epoxides Chemical class 0.000 claims description 13
- 238000005538 encapsulation Methods 0.000 claims description 11
- 230000000694 effects Effects 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 5
- 238000011161 development Methods 0.000 abstract description 2
- 239000004593 Epoxy Substances 0.000 abstract 2
- 230000004888 barrier function Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 230000007812 deficiency Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920000297 Rayon Polymers 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
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- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
A circuit board and an LED lamp thereof relate to a circuit board. The circuit board comprises a first circuit board and a second circuit board, and the first circuit board and the second circuit board are combined into a planar integrated circuit board through an embedding or splicing method. A substrate of the first circuit board and a substrate of the second circuit board are selected from an aluminum substrate, a copper substrate, a ceramic substrate and an epoxy glass cloth-based copper-clad laminated board, and the substrate of the first circuit board and the substrate of the second circuit board are two different substrates selected from the aluminum substrate, the copper substrate, the ceramic substrate and the epoxy glass cloth-based copper-clad laminated board. Different parts of the circuit board assume different functions, the feature is fully explored and utilized, the strong points are developed and the weak points are avoided, the advantages of the single substrates are combined together, and the disadvantages of the single substrates are abandoned, thus preparing a high-thermal-conductivity, highly reflective and low-cost circuit board with excellent effects in all aspects. A new path is opened up for the development of circuit boards.
Description
Technical field
The utility model relates to circuit board, espespecially a kind of circuit board that is applicable to high-capacity LED lamp with high heat conduction and high reflective function, and for needing to meet the circuit board of high heat conduction and high reflective requirement on other electrical equipment.
Background technology
Scope and field that circuit board uses are very wide.The electric-controlled parts of nearly all electrical equipment, electronic equipment, electromechanical equipment all can use circuit board.Installing electronic elements and arrange circuit on circuit board, is polymerized to electronic component and circuit on circuit board, master-plan that can optimized device, is convenient to manufacture, is convenient to install, dwindles installing space, is convenient to maintenance etc.
The type of circuit board is a lot, the type difference of equipment, and the structure of circuit board is also different.Although circuit board, because different its concrete structures of concrete purposes are varied, be unable to do without substrate, installing electronic elements and wiring on substrate.Therefore, substrate is the essential part of circuit board.
Due to purposes difference, different to the performance requirement of circuit board.Can be beneficial to installing electronic elements and be convenient to make circuit for general circuit board and just can.For the circuit board for LED lamp, LED light source (be beneficial to and paste LED light source encapsulation paster processed) is installed and is convenient to make circuit except being beneficial to, also need to have good thermal conductivity and high reflective.Because the purposes of LED lamp is in continuous expansion, some occasion need to be used high-power LED lamp (as more than 60 watts), and the volume of lamp is in the same old way little.For this reason, must on the circuit board of a small size, encapsulate many LED monomers, also should there is enough useful life simultaneously, this just require circuit board to there is high-termal conductivity and high reflective (or its substrate has high-termal conductivity and on substrate, is convenient to make high reflector layer.Except this not enough, also must accomplish that material cost and production cost are low, have price advantage.In brief, should realize small size, high heat conduction, high reflective and unified cheaply for the circuit board of high-power LED lamp, to realize all-round excellent effect.
In prior art, there are multiple choices as the substrate of LED lamp circuit board, as aluminium base, copper base, ceramic substrate, also has the combination (also referred to as epoxide glass cloth base copper clad laminate) of specular aluminium and athermanous pcb board etc.Aluminium base, copper base, ceramic substrate and epoxide glass cloth base copper clad laminate respectively have advantage, respectively have again deficiency.Therefore distinguish the circuit board of these several substrate manufacture LED lamps of single use, the circuit board of especially making high-capacity LED lamp can not be realized high heat conduction, high reflective and all-round excellent effect cheaply:
The first, make substrate with aluminium base, its advantage is that the cost of material is low.One of shortcoming, the thermal resistance of aluminium-base plate insulating layer is large, and the thermal conductivity of aluminium sheet itself is not strong, therefore, as the substrate of the circuit board of integrated high power LED lamp because of thermal conductivity shortcoming easily cause LED work bad, burn out with useful life not long.Two of shortcoming, is coated with the silver layer complex process with high reflective on aluminium base, cost is high.
The second, make substrate with copper base, one of its advantage, can directly be coated with the silver layer with high reflective on copper base, and its process for plating is simple, and cost is low.Two of its advantage, can directly coat the viscose glue insulating barrier of high heat conduction on copper base, technique is simple, and cost is low, forms high-termal conductivity together with copper base.One of its shortcoming, can not direct wiring on copper base, if will connect up on copper base, must cover insulating barrier processed, due to the existence of insulating barrier, to heat conduction cause unfavorable.Two of its shortcoming, insulating barrier is (when illumination as high-capacity LED lamp) in the time being subject to high temperature, is easily heated and throws off, and causes performance bad, easily breaks down.Three of its shortcoming, selling price is high, and material cost is high.
The 3rd, epoxide glass cloth base copper clad laminate, its advantage, the cost of material is low.One of its shortcoming, in conjunction with easily polluting minute surface in processing, affects light efficiency and even works bad.Two of its shortcoming, because Stress analysis is inadequate, is combined not closely with athermanous pcb board, while being subject to high temperature, (while illumination as high-capacity LED lamp) easily comes off, and affects quality.
The 4th, in prior art, the feature of difference in functionality is born respectively at the each position that does not make full use of LED lamp circuit board.For LED lamp circuit board, function, can be divided into two major parts, one LED light source encapsulation paster is installed, its area is less, and another piece is mainly laid power line.LED light source encapsulation paster being installed and being laid power line is different to the requirement of the circuit board of shared position separately.As the position that the circuit board of high-power LED light source encapsulation paster is installed, require the circuit board of this position to there is high-termal conductivity and be convenient to make high reflector layer, and the position of laying power line circuit board needs that electrical insulating property is good, thermal conductivity is good and cheap, do not need on it, to be convenient to make high reflector layer.Prior art is owing to not making full use of each position of LED lamp circuit board and bear respectively the feature of difference in functionality, in the time selecting substrate, defend tenaciously in single sheet material, or the aluminium base of monoblock, or the copper base of monoblock, the epoxide glass cloth base copper clad laminate of monoblock, what can realize is only the outstanding of a certain performance, or cheap, or high heat conduction, or high reflective, cannot realize the high heat conduction of high-capacity LED lamp circuit board, high reflective and all-round excellent effect cheaply.
Summary of the invention
The utility model technical issues that need to address are, overcome available circuit plate and cannot realize high heat conduction, the high reflective and deficiency of all-round excellent effect cheaply, and a kind of circuit board and LED lamp thereof are provided.This circuit board has high heat conduction, high reflective and all-round excellent feature cheaply, is suitable for the high reflective appliance applications of high-capacity LED lamp and other high power.
A kind of circuit board of the utility model and LED lamp thereof adopt following technical proposals:
A kind of circuit board, comprises first circuit board and second circuit board, and first circuit board and second circuit board are combined into planar integrated circuit plate by the mode of inlaying or splice.
Technique scheme is further elaborated:
The substrate of first circuit board is selected from the one in aluminium base, copper base, ceramic substrate and epoxide glass cloth base copper clad laminate, the substrate of second circuit board is selected from the one in aluminium base, copper base, ceramic substrate and epoxide glass cloth base copper clad laminate, and the substrate of first circuit board and the substrate of second circuit board are two kinds of different substrates in aluminium base, copper base, ceramic substrate, epoxide glass cloth base copper clad laminate.
The substrate of first circuit board is shaped with at least one hollow parts, and makes the first circuit board at least with a hollow parts; The substrate of second circuit board mates with shape and the size of the hollow parts of the substrate of first circuit board, and makes the second circuit board that at least one mates with shape and the size of the hollow parts of first circuit board; Second circuit board inlays the hollow parts in first circuit board.
The hollow parts of first circuit board is polygon, and second circuit board is the polygonal panel that the shape of dividing with the hollow part of first circuit board and size are mated.
The hollow parts of first circuit board is rectangle, and second circuit board is the rectangular slab that the shape of dividing with the hollow part of first circuit board and size are mated.
The hollow parts of first circuit board is oval, and second circuit board is the elliptical flat-plate that the shape of dividing with the hollow part of first circuit board and size are mated.
The hollow parts of first circuit board is circular, and second circuit board is the circular slab that the shape of dividing with the hollow part of first circuit board and size are mated.
On first circuit board and second circuit board, be shaped with respectively interface arrangment, second circuit board inlays in the time of first circuit board, also cause second circuit board and first circuit board clamping by this interface arrangment, inlay the firmness in first circuit board to improve second circuit board.
The substrate of first circuit board is connect by many assembled structures of corresponding plate body, is shaped with the location hole of being convenient to location in mould on it.
The substrate of first circuit board is aluminium base, and the substrate of second circuit board is copper base.
Use a LED lamp for circuit board, the substrate of its first circuit board is aluminium base, and the substrate of second circuit board is copper base, and second circuit board, as the circuit board that LED encapsulation paster is installed, is installed LED encapsulation paster on second circuit board; First circuit board, as the circuit board of laying power line, is laid power line on first circuit board; This power line is electrically connected with the LED being arranged on second circuit board.
The beneficial effects of the utility model are:
1, fully excavate and utilize each position of circuit board to bear respectively the feature of difference in functionality.For LED lamp circuit board, be divided into two major parts from function, one LED light source encapsulation paster is installed, its area is less, and another piece is mainly laid power line.LED light source encapsulation paster is installed different with the requirement of the circuit board of laying power line.Fully excavate and utilize this feature of LED lamp circuit board etc., (mainly referring to the circuit board for the high heat conduction of high-power needs and high reflective function) such as LED lamp circuit boards made to composite type by the mode of inlaying or splice, the substrate in combination with different advantages is got up to become the all-round excellent substrate of a kind of performance, as aluminium base and copper base combine, inexpensive and the good insulating of aluminium base, is used as wiring; Copper base heat conduction is good and be easy to be coated with high reflective silver layer, and for LED encapsulation paster is installed, and this copper base area is little, is not too large on the impact of cost; Another shortcoming of copper base, can not direct wiring on copper base, if will connect up on copper base, must cover insulating barrier processed, due to the existence of insulating barrier, it is unfavorable that heat conduction is caused, or, in high-capacity LED lamp when illumination,, insulating barrier is subject to high temperature, is easily heated and throws off, cause performance bad, easily break down, because copper base is not used further to wiring in the utility model, this shortcoming has been avoided naturally.So combination, maximizes favourable factors and minimizes unfavourable ones, and the combination of advantages of each single substrate together, the weakness of each single substrate is abandoned to it, thereby makes the reflective and circuit board of all-round excellent effect cheaply of high heat conduction, height.For Liao Yitiaoxin road is opened up in the development of circuit board.
2, above-mentioned high heat conduction, high circuit board reflective and all-round excellent effect cheaply are applicable to the electrical equipment that high-capacity LED lamp and other need high heat conduction, high reflective requirement.Can realize high heat conduction, high reflective, long life, good electric property and the unification of low manufacturing cost.
3, circuit board of the present utility model is convenient to manufacture, and is easy to promote.
Accompanying drawing explanation
Fig. 1 is one of the utility model embodiment decomposing schematic representation;
Fig. 2 is one of the utility model embodiment overall schematic;
Fig. 3 is two decomposing schematic representations of the utility model embodiment;
Fig. 4 is two overall schematic of the utility model embodiment;
Fig. 5 is three decomposing schematic representations of the utility model embodiment;
Fig. 6 is three overall schematic of the utility model embodiment;
Fig. 7 is four decomposing schematic representations of the utility model embodiment;
Fig. 8 is five decomposing schematic representations of the utility model embodiment.
In figure: 1, first circuit board; 11, hollow parts; 2, second circuit board; 3, interface arrangment; 4, location hole.
Embodiment
By reference to the accompanying drawings, introduce embodiment of the present utility model below.
As shown in Figures 1 to 8, a kind of circuit board, comprises first circuit board 1 and second circuit board 2, and first circuit board 1 and second circuit board 2 are combined into planar integrated circuit plate by the mode of inlaying or splice.
The substrate of first circuit board 1 is selected from the one in aluminium base, copper base, ceramic substrate, epoxide glass cloth base copper clad laminate, the substrate of second circuit board 2 is selected from the one in aluminium base, copper base, ceramic substrate, epoxide glass cloth base copper clad laminate, and the substrate of the substrate of first circuit board 1 and second circuit board 2 is two kinds of different substrates in aluminium base, copper base, ceramic substrate, epoxide glass cloth base copper clad laminate.
The substrate of first circuit board 1 is shaped with at least one hollow parts 11, and make the first circuit board 1 (in Fig. 1, Fig. 3 and Fig. 5, first circuit board 1 is respectively shaped with a hollow parts 11, and in Fig. 7 and Fig. 8, first circuit board 1 is respectively shaped with three hollow parts 11) with at least one hollow parts 11; The substrate of second circuit board 2 mates with shape and the size of the hollow parts 11 of the substrate of first circuit board 1, and make at least one and each one of second circuit board 2 in the shape of the hollow parts 11 of first circuit board 1 and second circuit board 2(Fig. 1, Fig. 3 that size is mated and Fig. 5, each three of second circuit board 2 in Fig. 7 and Fig. 8); Second circuit board 2 inlays the hollow parts 11 in first circuit board 1.
The hollow parts 11 of first circuit board 1 is polygon, and second circuit board 2 is and the shape of the hollow parts 11 of first circuit board 1 and the polygonal panel that size is mated.
As 1, as shown in Fig. 2, Fig. 7 and Fig. 8, the hollow parts of first circuit board 1 is rectangle, and second circuit board 2 is and the shape of the hollow parts 11 of first circuit board 1 and the rectangular slab that size is mated.
The hollow parts 11 of first circuit board 1 is oval as shown in Figure 5, and second circuit board 2 is and the shape of the hollow parts 11 of first circuit board 1 and the elliptical flat-plate that size is mated.
The hollow parts of first circuit board 1 is circular, and second circuit board 2 is and the shape of the hollow parts 11 of first circuit board 1 and the circular slab that size is mated.
Shape as for first circuit board 1 is determined with the occasion of concrete application, and Fig. 1 and Fig. 7 are rectangle, and Fig. 3, Fig. 5 and Fig. 8 are circular.
On first circuit board 1 and second circuit board 2, be shaped with respectively interface arrangment 3, second circuit board 2 inlays in the time of first circuit board 1, also cause second circuit board 2 and first circuit board 2 clampings by this interface arrangment 3, inlay in the firmness of first circuit board 1 to improve second circuit board 2.
The substrate of first circuit board 1 is connect by many assembled structures of corresponding plate body, is shaped with the location hole 4 of being convenient to location in mould on it.
The substrate of first circuit board 1 is aluminium base, and the substrate of second circuit board 2 is copper base.
A kind of LED lamp that uses circuit board, the substrate of its first circuit board 1 is aluminium base, the substrate of second circuit board 2 is copper base, second circuit board 2 is as the circuit board that LED encapsulation paster is installed, first circuit board 1 is as the circuit board of laying power line, and this power line is electrically connected with the LED being arranged on second circuit board 2.
The above, it is only preferred embodiment of the present utility model, not technical scope of the present utility model is imposed any restrictions, any modification, equivalent variations and modification that every foundation technical spirit of the present utility model is done above embodiment, all still belong in the scope of technical solutions of the utility model.
Claims (9)
1. a circuit board, is characterized in that: comprise first circuit board and second circuit board, first circuit board and second circuit board are combined into planar integrated circuit plate by the mode of inlaying or splice.
2. a kind of circuit board according to claim 1, it is characterized in that: the substrate of first circuit board is selected from the one in aluminium base, copper base, ceramic substrate and epoxide glass cloth base copper clad laminate, the substrate of second circuit board is selected from the one in aluminium base, copper base, ceramic substrate and epoxide glass cloth base copper clad laminate, and the substrate of first circuit board and the substrate of second circuit board are two kinds of different substrates in aluminium base, copper base, ceramic substrate, epoxide glass cloth base copper clad laminate.
3. a kind of circuit board according to claim 2, is characterized in that: the substrate of first circuit board is shaped with at least one hollow parts, and makes the first circuit board at least with a hollow parts; The substrate of second circuit board mates with shape and the size of the hollow parts of the substrate of first circuit board, and makes the second circuit board that at least one mates with shape and the size of the hollow parts of first circuit board; Second circuit board inlays the hollow parts in first circuit board.
4. a kind of circuit board according to claim 3, is characterized in that: the hollow parts of first circuit board is polygon, and second circuit board is the polygonal panel that the shape of dividing with the hollow part of first circuit board and size are mated.
5. a kind of circuit board according to claim 3, is characterized in that: the hollow parts of first circuit board is for oval, and second circuit board is the elliptical flat-plate that the shape of dividing with the hollow part of first circuit board and size are mated.
6. a kind of circuit board according to claim 3, it is characterized in that: on first circuit board and second circuit board, be shaped with respectively interface arrangment, second circuit board inlays in the time of first circuit board, also cause second circuit board and first circuit board clamping by this interface arrangment, inlay the firmness in first circuit board to improve second circuit board.
7. a kind of circuit board according to claim 3, is characterized in that: the substrate of first circuit board is connect by many assembled structures of corresponding plate body, is shaped with the location hole of being convenient to location in mould on it.
8. a kind of circuit board according to claim 3, is characterized in that: the substrate of first circuit board is aluminium base, and the substrate of second circuit board is copper base.
9. a LED lamp, is characterized in that: require a kind of circuit board described in 8 based on right to use, LED encapsulation paster is installed on its second circuit board, lay power line on first circuit board, this power line is electrically connected with the LED being arranged on second circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320696773.9U CN203632965U (en) | 2013-11-07 | 2013-11-07 | Circuit board and LED lamp thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320696773.9U CN203632965U (en) | 2013-11-07 | 2013-11-07 | Circuit board and LED lamp thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203632965U true CN203632965U (en) | 2014-06-04 |
Family
ID=50819400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320696773.9U Expired - Fee Related CN203632965U (en) | 2013-11-07 | 2013-11-07 | Circuit board and LED lamp thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203632965U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105570848A (en) * | 2015-12-02 | 2016-05-11 | 宁波凯耀电器制造有限公司 | Compound type LED circuit board and manufacturing method |
| CN105679161A (en) * | 2016-04-01 | 2016-06-15 | 皖西学院 | Nine-jack experimental board capable of being assembled |
| CN110431350A (en) * | 2017-03-14 | 2019-11-08 | 昕诺飞控股有限公司 | Optical module |
| CN111601457A (en) * | 2020-04-10 | 2020-08-28 | 上海信耀电子有限公司 | Circuit board and preparation method thereof |
-
2013
- 2013-11-07 CN CN201320696773.9U patent/CN203632965U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105570848A (en) * | 2015-12-02 | 2016-05-11 | 宁波凯耀电器制造有限公司 | Compound type LED circuit board and manufacturing method |
| CN105679161A (en) * | 2016-04-01 | 2016-06-15 | 皖西学院 | Nine-jack experimental board capable of being assembled |
| CN105679161B (en) * | 2016-04-01 | 2018-08-28 | 皖西学院 | A kind of nine hole experimental plate of sectional |
| US10816181B2 (en) | 2017-03-01 | 2020-10-27 | Signify Holding B.V. | Light module providing positioning and fixation of a circuit board in a housing |
| CN110431350A (en) * | 2017-03-14 | 2019-11-08 | 昕诺飞控股有限公司 | Optical module |
| CN111601457A (en) * | 2020-04-10 | 2020-08-28 | 上海信耀电子有限公司 | Circuit board and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: DONGGUAN LIANTONGDA CIRCUIT BOARD CO., LTD. Free format text: FORMER OWNER: SHEN LIHAO Effective date: 20150909 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20150909 Address after: 523000 Guangdong city of Dongguan Province Huang Zhenjiang Road Patentee after: DONGGUAN LIANTONGDA CIRCUIT BOARD MANUFACTURING CO., LTD. Address before: 523000 Guangdong city of Dongguan Province Huang Zhenjiang road Huangjiang Dongguan Tongda board factory Patentee before: Shen Lihao |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140604 Termination date: 20171107 |
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| CF01 | Termination of patent right due to non-payment of annual fee |