CN107493656A - A kind of method for improving gong plate efficiency - Google Patents
A kind of method for improving gong plate efficiency Download PDFInfo
- Publication number
- CN107493656A CN107493656A CN201710812038.2A CN201710812038A CN107493656A CN 107493656 A CN107493656 A CN 107493656A CN 201710812038 A CN201710812038 A CN 201710812038A CN 107493656 A CN107493656 A CN 107493656A
- Authority
- CN
- China
- Prior art keywords
- gong
- pcb board
- cutter
- slab
- thick
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
Abstract
The present invention relates to PCB gong plate method and technologies field, more particularly to a kind of method for improving gong plate efficiency, comprise the following steps：Including thick gong and smart gong；The thick gong cutter is more than monolithic pcb board thickness of slab, and is less than pcb board lamination thickness of slab；During the thick gong, lower knife depth of the cutter along Z-direction is less than pcb board lamination thickness of slab；During the smart gong, lower knife depth of the cutter along Z-direction is more than or equal to pcb board lamination thickness of slab.The goal of the invention of the present invention is to provide a kind of method for improving gong plate efficiency solve the low technical problem of existing pcb board gong plate efficiency using technical scheme provided by the invention.
Description
Technical field
The present invention relates to PCB gong plate method and technologies field, more particularly to a kind of method for improving gong plate efficiency.
Background technology
PCB gong triggers are the machines for splitting stamp hole connection and irregular pcb board.
Gong plate is divided into thick gong and smart gong, and the conventional gong plate depth of cutter is 16.5mm during gong plate, and the thickness of lamination
Sword less than cutter is grown.
If pcb board thickness is equal to or more than tool length, the fixed structure rotation during thick gong above cutter can be burnt out
Pcb board, pcb board is caused when rotating in order to avoid the fixed structure above cutter to burn the damage such as plate, fixed structure needs and pcb board
Between form gap, therefore 16.5mm gong plate depth is only capable of completing gong plate operation to 4pnl pcb board, and processing efficiency is low.
The content of the invention
The goal of the invention of the present invention is to provide a kind of method for improving gong plate efficiency, using technical side provided by the invention
Case solves the low technical problem of existing pcb board gong plate efficiency.
Technical scheme is used by the present invention solves above-mentioned technical problem：A kind of method for improving gong plate efficiency, including
Following steps：Including thick gong and smart gong；The thick gong cutter is more than monolithic pcb board thickness of slab, and is less than pcb board lamination thickness of slab；
During the thick gong, lower knife depth of the cutter along Z-direction is less than pcb board lamination thickness of slab；During the smart gong, cutter
It is more than or equal to pcb board lamination thickness of slab along the lower knife depth of Z-direction.
Preferably, during the thick gong, cutter is equal to 15.5mm along the lower knife depth of Z-direction；In smart gong process
In, cutter is equal to 16.5mm along the lower knife depth of Z-direction.
Therefore following beneficial effect can be reached using technical scheme provided by the invention：The present invention is in thick gong mistake
Lower knife depth of the cutter along Z-direction is raised in journey so that gap be present in the fixed mechanism of thick gong cutter and the top surface of pcb board,
The fixed structure of its cutter during thick gong is avoided to cause to burn the damage such as plate to pcb board, smart gong cutter is then to the pcb board of the bottom
Gong plate process is completed, compared with prior art, technical scheme provided by the invention can realize the more gong 1pnl of every axle effect, carry
Rise production efficiency.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, the present invention will be implemented below
The required accompanying drawing used is briefly described in the description of example or prior art.It should be evident that drawings in the following description
Only part of the embodiment of the invention, for those of ordinary skill in the art, is not paying creative labor
Under the premise of, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the thick gong procedure structure schematic diagram of embodiment；
Fig. 2 is embodiment essence gong procedure structure schematic diagram.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes.Obviously, described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other under the premise of creative work is not made
Embodiment, belong to the scope of protection of the invention.
If pcb board thickness is equal to or more than tool length, the fixed structure rotation above cutter can burn out pcb board, in order to
The fixed structure above cutter is avoided to cause to burn the damage such as plate to pcb board when rotating, fixed structure is needed between being formed between pcb board
Gap, therefore 16.5mm gong plate depth is only capable of completing gong plate operation to 4pnl pcb board, processing efficiency is low.
The present embodiment provides a kind of method for improving gong plate efficiency, comprises the following steps：Including thick gong and smart gong.
Wherein thick gong cutter is more than monolithic pcb board thickness of slab, and is less than pcb board lamination thickness of slab.
In order to solve the low technical problem of above-mentioned processing efficiency, during thick gong, lower knife depth of the cutter along Z-direction
Less than pcb board lamination thickness of slab；During smart gong, lower knife depth of the cutter along Z-direction is more than or equal to pcb board lamination plate
It is thick.
Fig. 1 is referred to, during thick gong, cutter is equal to 15.5mm along the lower knife depth of Z-direction；Fig. 2 is referred to,
During smart gong, cutter is equal to 16.5mm along the lower knife depth of Z-direction.
Lower knife depth of the cutter along Z-direction is raised during thick gong so that the fixed mechanism and pcb board of thick gong cutter
Top surface gap be present, avoid the fixed structure of its cutter during thick gong from causing to burn the damage such as plate to pcb board, smart gong cutter is then
Gong plate process is completed to the pcb board of the bottom, compared with prior art, technical scheme provided by the invention can realize that every axle is more
Gong 1pnl effect, improving production efficiency.
In the present embodiment, by taking the pcb board that gong 5pnl/ is folded as an example, using existing gong plate method, then can gong wear 4pnl,
If gong wears 5pnl by force, the fixed structure of thick gong cutter can then burn out the pcb board of top layer.
The present embodiment raises 1.0mm deeply in thick gong parameter Z axis depth control, i.e., thick gong depth becomes 15.5mm by 16.5mm,
Smart gong parameter Z axis depth control is deeply uncompensated, recovers 16.5mm automatically.Thick gong 15.5mm gong of cutter depth wears 4pnl, smart gong
Gong wears 5pnl to cutter on this basis.
Using above-mentioned gong plate method, thick gong cutter need to be more than monolithic pcb board thickness of slab, and be less than pcb board lamination thickness of slab, ensure
Can more gong 1pnl under the premise of quality.
Verify that conventional gong plate and the deep gong plate contrast quality of control can all meet customer need using control methods, and using control
Deep gong method can be with the more gong 1pnl of every axle, improving production efficiency.
Embodiments described above, the restriction to the technical scheme protection domain is not formed.It is any in above-mentioned implementation
Modifications, equivalent substitutions and improvements made within the spirit and principle of mode etc., should be included in the protection model of the technical scheme
Within enclosing.
Claims (2)
- A kind of 1. method for improving gong plate efficiency, it is characterised in that：Comprise the following steps：Including thick gong and smart gong；The thick gong Cutter is more than monolithic pcb board thickness of slab, and is less than pcb board lamination thickness of slab；During the thick gong, lower knife depth of the cutter along Z-direction is less than pcb board lamination thickness of slab；During the smart gong, lower knife depth of the cutter along Z-direction is more than or equal to pcb board lamination thickness of slab.
- A kind of 2. method for improving gong plate efficiency according to claim 1, it is characterised in that：During the thick gong, Cutter is equal to 15.5mm along the lower knife depth of Z-direction；During smart gong, cutter is equal to along the lower knife depth of Z-direction 16.5mm。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710812038.2A CN107493656A (en) | 2017-09-11 | 2017-09-11 | A kind of method for improving gong plate efficiency |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710812038.2A CN107493656A (en) | 2017-09-11 | 2017-09-11 | A kind of method for improving gong plate efficiency |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107493656A true CN107493656A (en) | 2017-12-19 |
Family
ID=60651569
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710812038.2A Pending CN107493656A (en) | 2017-09-11 | 2017-09-11 | A kind of method for improving gong plate efficiency |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107493656A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109600922A (en) * | 2018-12-17 | 2019-04-09 | 惠州市大亚湾科翔科技电路板有限公司 | A kind of special size PCB forming method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101815406A (en) * | 2010-04-08 | 2010-08-25 | 梅州五洲电路板有限公司 | Process for cutting printed circuit board |
| CN102711383A (en) * | 2012-06-27 | 2012-10-03 | 深圳市星河电路有限公司 | Processing method for high-thickness small-aperture high-frequency copper substrate |
| CN103874329A (en) * | 2012-12-11 | 2014-06-18 | 深南电路有限公司 | V-CUT processing method of PCB |
| CN103957665A (en) * | 2014-04-29 | 2014-07-30 | 吉安市华阳电子有限公司 | High-frequency microwave PCB |
| CN104363720A (en) * | 2014-10-21 | 2015-02-18 | 深圳崇达多层线路板有限公司 | Method of forming deep blind groove in printed circuit board (PCB) |
| CN205196103U (en) * | 2015-11-20 | 2016-04-27 | 湖南利尔电路板有限公司 | Circuit board gong type device |
-
2017
- 2017-09-11 CN CN201710812038.2A patent/CN107493656A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101815406A (en) * | 2010-04-08 | 2010-08-25 | 梅州五洲电路板有限公司 | Process for cutting printed circuit board |
| CN102711383A (en) * | 2012-06-27 | 2012-10-03 | 深圳市星河电路有限公司 | Processing method for high-thickness small-aperture high-frequency copper substrate |
| CN103874329A (en) * | 2012-12-11 | 2014-06-18 | 深南电路有限公司 | V-CUT processing method of PCB |
| CN103957665A (en) * | 2014-04-29 | 2014-07-30 | 吉安市华阳电子有限公司 | High-frequency microwave PCB |
| CN104363720A (en) * | 2014-10-21 | 2015-02-18 | 深圳崇达多层线路板有限公司 | Method of forming deep blind groove in printed circuit board (PCB) |
| CN205196103U (en) * | 2015-11-20 | 2016-04-27 | 湖南利尔电路板有限公司 | Circuit board gong type device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109600922A (en) * | 2018-12-17 | 2019-04-09 | 惠州市大亚湾科翔科技电路板有限公司 | A kind of special size PCB forming method |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171219 |