CN109246927A - The V segmentation method of finished product PCB - Google Patents
The V segmentation method of finished product PCB Download PDFInfo
- Publication number
- CN109246927A CN109246927A CN201811113174.3A CN201811113174A CN109246927A CN 109246927 A CN109246927 A CN 109246927A CN 201811113174 A CN201811113174 A CN 201811113174A CN 109246927 A CN109246927 A CN 109246927A
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- China
- Prior art keywords
- pcb
- substrate
- hollow
- over again
- out parts
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
Abstract
The present invention relates to the V segmentation methods of finished product PCB a kind of, including the following steps: S1, selects ready plate as substrate, the length of the substrate is greater than the length of the PCB, and the width of the substrate is greater than the width of the PCB；S2, hollow processing is carried out to substrate with edge milling machines, mills out hollow-out parts, the size of the hollow-out parts is consistent with the size of PCB to be done over again, then drills out V-CUT location hole on substrate again；S3, PCB to be done over again is pressed into hollow-out parts, since the length and width of PCB and the length and width of hollow-out parts are consistent, PCB can be embedded in after being pressed into hollow-out parts and be fixed in fixed plate, form a plate structure with fixed plate；S4, the plate structure that PCB and fixed plate are composed is fixed on the work top of automatic V cutting mill by V-CUT location hole thereon, progress V, which is cut, to do over again.V of the present invention cut do over again it is high-efficient.
Description
Technical field
The present invention relates to wiring board art, especially a kind of V segmentation method of finished product PCB.
Background technique
During existing line board machining process, the small PCS wiring board after shape often will appear leakage V cut or V cut it is shallow
Situation, occurs that leakage V is cut or V is cut needs to carry out wiring board V after shallow situation and cut to do over again to reduce the scrappage of wiring board, it is existing at
The V of product PCB is cut there are two types of reworking methods, and 1. use L shape frame, mixes up knife away from rear, the position for needing V to cut production plate and " L "
V secant alignment on shape frame, is done over again using manual V cutting mill.The method defect mainly has: a. the method is only applicable in manual
V cutting mill, low efficiency；B. when plate shape of doing over again is irregular, V low precision is returned, is also easy to produce and scraps.
2. being positioned using the hole on technique edges, V again is carried out using automatic V cutting mill and is cut.The method defect mainly has: a.
When location hole is smaller away from the first knife distance (minimum range depending on different V cutting mills depending on, usually 8mm), it is not possible to directly V is cut,
It must use and location hole is done to face, producing one block of plate needs upper and lower plates twice and input data twice, influences efficiency.B. work as plank
It is poor using the method precision when relatively narrow or longer, it is also easy to produce and scraps.
Summary of the invention
Based on this, it is necessary to provide the V segmentation method of finished product PCB a kind of, including the following steps:
S1, select ready plate as substrate, the length of the substrate is greater than the length of the PCB, the width of the substrate
Degree is greater than the width of the PCB；
The length and width of substrate are all larger than the length and width of PCB to be done over again, can accommodate PCB's to be done over again to process on substrate
Engraved structure.
S2, hollow processing is carried out to substrate with edge milling machines, mills out hollow-out parts, the size of the hollow-out parts and to be done over again
The size of PCB is consistent, then drills out V-CUT location hole on substrate again；
V-CUT location hole is used for positioning of the substrate on automatic V cutting mill.
S3, PCB to be done over again is pressed into hollow-out parts, since the length and width of PCB and the length and width of hollow-out parts are consistent, PCB pressure
It can be embedded in and be fixed in fixed plate after entering to hollow-out parts, form a plate structure with fixed plate；
The shapes and sizes of hollow-out parts are consistent with the shapes and sizes of PCB to be done over again, PCB to be done over again be embedded into hollow-out parts it
Afterwards, the edge of PCB to be done over again and the edge of hollow-out parts fit closely, and PCB to be done over again can be embedded just below in hollow-out parts, again
It will not be moved in hollow-out parts, cut and do over again convenient for the V of automatic V cutting mill.
S4, it the plate structure that PCB is composed with fixed plate is fixed on automatic V by V-CUT location hole thereon cuts
On the work top of machine, progress V, which is cut, to do over again.
After PCB wait do over again is embedded into substrate, planform is no different with the PCB before sharp processing, therefore its V is cut
Process is that conventional V cuts process.
Preferably, the plate for copper-clad plate or scraps plate.
Using copper-clad plate and the wiring board plate scrapped as substrate, to achieve the purpose that economize on resources, and copper-clad plate or
It is just similar to the PCB shape and structure before sharp processing to scrap plate itself, is operated on it convenient for V cutting mill.
Further, the consistency of thickness of the thickness of the plate and PCB to be done over again.
PCB to be done over again is embedded into as made of sheet fabrication by the consistency of thickness of the thickness of plate and PCB to be done over again
After substrate, the flush of PCB to be done over again and substrate cut convenient for carrying out V to it and do over again.
Preferably, further include the steps that drilling out shape milling side location hole on substrate before step S2, to pass through shape
Substrate is fixed on edge milling machines by milling side with location hole.
Shape mills side and is used to substrate being fixed on edge milling machines with location hole, processes convenient for edge milling machines to it.
Preferably, the position of the V-CUT location hole on the plate structure and PCB and upper V-CUT before sharp processing
The position consistency of location hole.
V-CUT location hole on plate structure relative to the PCB to be done over again being embedded in it relative position and should be to
The relative position one of edges of boards V-CUT location hole thereon of the PCB to do over again before the sharp processing PCB to be done over again relative to this
It causes, therefore after plate structure is located on V cutting mill, it can be right using the processing data of the PCB before original sharp processing
Plate structure carries out V and cuts operation, cuts data without new V, and can carry out batch V with same processing data and cut to do over again, effective increasing
V has been added to cut the efficiency done over again.
Preferably, further include the steps that in step S3 will be to be done over again PCB together with substrate bonding.
PCB to be done over again can be prevented PCB to be done over again from cutting together with substrate bonding in V and deviate from base in process of rework
Plate.
Further, using tape-stripping in the part that substrate is in contact with PCB to be done over again, adhesive tape is with substrate and wait return
The equal bonding connection of the PCB of work, PCB that will be to be done over again is together with substrate bonding.
Further, one layer of double-sided adhesive is pasted in the side of the hollow-out parts of the substrate, then again presses PCB to be done over again
Enter into hollow-out parts, so that PCB to be done over again is bonded in hollow-out parts.
The principle of the present invention, effect are further illustrated below with reference to above-mentioned technical proposal:
The present invention by the way that the PCB to be done over again after sharp processing is embedded in the substrate for being machined with V-CUT location hole, obtain with
The consistent plate structure of PCB construction before sharp processing is done over again so that it can be used automatic V cutting mill progress V to cut, is greatly improved
V cuts the efficiency done over again.
Specific embodiment
In order to facilitate the understanding of those skilled in the art, below in conjunction with embodiment, the invention will be described in further detail:
Embodiment 1
A kind of V segmentation method of finished product PCB, including the following steps:
S1, select ready plate as substrate, the length of the substrate is greater than the length of the PCB, the width of the substrate
Degree is greater than the width of the PCB；
S2, hollow processing is carried out to substrate with edge milling machines, mills out hollow-out parts, the size of the hollow-out parts is with PCB's to be done over again
Size is consistent, then drills out V-CUT location hole on substrate again；
S3, PCB to be done over again is pressed into hollow-out parts, since the length and width of PCB and the length and width of hollow-out parts are consistent, PCB is pressed into
It can be embedded in and be fixed in fixed plate after hollow-out parts, form a plate structure with fixed plate；
S4, PCB and the fixed plate plate structure being composed are fixed on automatic V cutting mill by V-CUT location hole thereon
On work top, progress V, which is cut, to do over again.
Embodiment 2
A kind of V segmentation method of finished product PCB, including the following steps:
S1, select ready thickness and the consistent plate of scrapping of PCB to be done over again as substrate, the length of the substrate is greater than institute
The length of PCB is stated, the width of the substrate is greater than the width of the PCB；
S2, hollow processing is carried out to substrate with edge milling machines, mills out hollow-out parts, the size of the hollow-out parts is with PCB's to be done over again
Size is consistent, then drills out V-CUT location hole on substrate again；
S3, PCB to be done over again is pressed into hollow-out parts, since the length and width of PCB and the length and width of hollow-out parts are consistent, PCB is pressed into
It can be embedded in and be fixed in fixed plate after hollow-out parts, and using tape-stripping in the part that substrate is in contact with PCB to be done over again,
Adhesive tape and substrate and the equal bonding connection of PCB to be done over again, PCB that will be to be done over again is together with substrate bonding, so that wait do over again
PCB and fixed plate formed a plate structure；
S4, PCB and the fixed plate plate structure being composed are fixed on automatic V cutting mill by V-CUT location hole thereon
On work top, progress V, which is cut, to do over again.
Embodiment 3
A kind of V segmentation method of finished product PCB, including the following steps:
S1, select ready thickness and the consistent copper-clad plate of PCB to be done over again as substrate, the length of the substrate is greater than institute
The length of PCB is stated, the width of the substrate is greater than the width of the PCB；
S2, shape milling side location hole is drilled out on substrate, substrate is fixed on edge milling machines with location hole to mill side by shape
On, hollow processing is carried out to substrate with edge milling machines, mills out hollow-out parts, the size of the size of the hollow-out parts and PCB to be done over again
Unanimously, V-CUT location hole is then drilled out on substrate again；
S3, PCB to be done over again is pressed into hollow-out parts, since the length and width of PCB and the length and width of hollow-out parts are consistent, PCB is pressed into
It can be embedded in and be fixed in fixed plate after hollow-out parts, and using tape-stripping in the part that substrate is in contact with PCB to be done over again,
Adhesive tape and substrate and the equal bonding connection of PCB to be done over again, PCB that will be to be done over again is together with substrate bonding, so that wait do over again
PCB and fixed plate formed a plate structure；
S4, PCB and the fixed plate plate structure being composed are fixed on automatic V cutting mill by V-CUT location hole thereon
On work top, progress V, which is cut, to do over again.
Embodiment 4
A kind of V segmentation method of finished product PCB, including the following steps:
S1, select ready thickness and the consistent copper-clad plate of PCB to be done over again as substrate, the length of the substrate is greater than institute
The length of PCB is stated, the width of the substrate is greater than the width of the PCB；
S2, shape milling side location hole is drilled out on substrate, substrate is fixed on edge milling machines with location hole to mill side by shape
On, hollow processing is carried out to substrate with edge milling machines, mills out hollow-out parts, the size of the size of the hollow-out parts and PCB to be done over again
Unanimously, V-CUT location hole is then drilled out on substrate again；
S3, one layer of double-sided adhesive is pasted in the side of the hollow-out parts of the substrate, PCB to be done over again then is pressed into hollow-out parts again
In so that PCB to be done over again is bonded in hollow-out parts, PCB to be done over again is pressed into hollow-out parts, due to PCB length and width with
The length and width of hollow-out parts are consistent, and PCB can be embedded in after being pressed into hollow-out parts and be fixed in fixed plate, while the side of PCB to be done over again
Edge can be bonded in the edge for posting the hollow-out parts of double-sided adhesive, so that PCB to be done over again and fixed plate are fixed together to form a plate
Shape structure；
S4, PCB and the fixed plate plate structure being composed are fixed on automatic V cutting mill by V-CUT location hole thereon
On work top, progress V, which is cut, to do over again.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (8)
1. a kind of V segmentation method of finished product PCB, characterized in that it comprises the following steps:
S1, select ready plate as substrate, the length of the substrate is greater than the length of the PCB, the width of the substrate
Degree is greater than the width of the PCB；
S2, hollow processing is carried out to substrate with edge milling machines, mills out hollow-out parts, the size of the hollow-out parts is with PCB's to be done over again
Size is consistent, then drills out V-CUT location hole on substrate again；
S3, PCB to be done over again is pressed into hollow-out parts, since the length and width of PCB and the length and width of hollow-out parts are consistent, PCB is pressed into
It can be embedded in and be fixed in fixed plate after hollow-out parts, form a plate structure with fixed plate；
S4, PCB and the fixed plate plate structure being composed are fixed on automatic V cutting mill by V-CUT location hole thereon
On work top, progress V, which is cut, to do over again.
2. the V segmentation method of finished product PCB according to claim 1, which is characterized in that the plate is copper-clad plate or report
Useless plate.
3. the V segmentation method of finished product PCB according to claim 2, which is characterized in that the thickness of the plate and to be done over again
The consistency of thickness of PCB.
4. the V segmentation method of finished product PCB according to claim 1, which is characterized in that further include in substrate before step S2
On drill out shape milling side location hole the step of, with by shape milling side substrate is fixed on edge milling machines with location hole.
5. the V segmentation method of finished product PCB according to claim 1, which is characterized in that the V-CUT on the plate structure is fixed
The position consistency of the position in position hole and the PCB before sharp processing and upper V-CUT location hole.
6. the V segmentation method of finished product PCB according to claim 1, which is characterized in that further including in step S3 will be wait do over again
PCB together with substrate bonding the step of.
7. the V segmentation method of finished product PCB according to claim 6, which is characterized in that using tape-stripping substrate with wait return
The part that the PCB of work is in contact, adhesive tape and substrate and the equal bonding connection of PCB to be done over again, PCB to be done over again is glued with substrate
It is connected together.
8. the V segmentation method of finished product PCB according to claim 6, which is characterized in that in the side of the hollow-out parts of the substrate
One layer of double-sided adhesive is pasted, then PCB to be done over again is pressed into hollow-out parts again, so that PCB to be done over again is bonded in hollow-out parts
It is interior.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811113174.3A CN109246927B (en) | 2018-09-25 | 2018-09-25 | V-cutting method of finished PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811113174.3A CN109246927B (en) | 2018-09-25 | 2018-09-25 | V-cutting method of finished PCB |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109246927A true CN109246927A (en) | 2019-01-18 |
| CN109246927B CN109246927B (en) | 2021-01-12 |
Family
ID=65056563
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811113174.3A Active CN109246927B (en) | 2018-09-25 | 2018-09-25 | V-cutting method of finished PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109246927B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111113238A (en) * | 2019-12-31 | 2020-05-08 | 太仓市何氏电路板有限公司 | V-CUT processing technology for forming and processing V-shaped groove of aluminum substrate |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006196482A (en) * | 2005-01-11 | 2006-07-27 | Canon Inc | Printed board and device equipped with the same |
| CN204090313U (en) * | 2014-09-15 | 2015-01-07 | 景旺电子科技(龙川)有限公司 | The tool that a kind of aluminium base minor face V-CUT is shaping |
| CN107801306A (en) * | 2017-10-31 | 2018-03-13 | 广德博亚新星电子科技有限公司 | Pcb board V CUT maloperation rectification technique methods and pcb board processing technology |
| CN207589283U (en) * | 2017-11-07 | 2018-07-06 | 深圳市翔宇电路有限公司 | A kind of device of pcb board side depthkeeping gong plate |
| CN207643230U (en) * | 2017-12-13 | 2018-07-24 | 莆田市涵江区华光电子有限公司 | A kind of automatic multitool V of printed wiring board cuts device |
-
2018
- 2018-09-25 CN CN201811113174.3A patent/CN109246927B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006196482A (en) * | 2005-01-11 | 2006-07-27 | Canon Inc | Printed board and device equipped with the same |
| CN204090313U (en) * | 2014-09-15 | 2015-01-07 | 景旺电子科技(龙川)有限公司 | The tool that a kind of aluminium base minor face V-CUT is shaping |
| CN107801306A (en) * | 2017-10-31 | 2018-03-13 | 广德博亚新星电子科技有限公司 | Pcb board V CUT maloperation rectification technique methods and pcb board processing technology |
| CN207589283U (en) * | 2017-11-07 | 2018-07-06 | 深圳市翔宇电路有限公司 | A kind of device of pcb board side depthkeeping gong plate |
| CN207643230U (en) * | 2017-12-13 | 2018-07-24 | 莆田市涵江区华光电子有限公司 | A kind of automatic multitool V of printed wiring board cuts device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111113238A (en) * | 2019-12-31 | 2020-05-08 | 太仓市何氏电路板有限公司 | V-CUT processing technology for forming and processing V-shaped groove of aluminum substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109246927B (en) | 2021-01-12 |
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