CN2904569Y

CN2904569Y - Multilayer heat radiation type aluminium foil composite cover plate

Info

Publication number: CN2904569Y
Application number: CN 200620049774
Authority: CN
Inventors: 简泰文
Original assignee: Individual
Current assignee: Individual
Priority date: 2006-01-11
Filing date: 2006-01-11
Publication date: 2007-05-23
Anticipated expiration: 2016-01-11

Abstract

The utility model discloses a multilayer radiation type aluminum foil clad cover plate, which is mainly used when drilling hole on circuit board. The utility model comprises a aluminum foil base material layer, at least one aluminum foil heat radiation layer and resin layers between the aluminum foil layers; the aluminum foil is used to increase surface area radiation and cushion drill bit penetration force, so the drill bit can first goes through the multilayer heat radiation aluminum foil clad cover plate and cushions penetration force, the drill bit wear and slippage can be reduced; and the high speed friction produced heat dissipation capacity is enhanced, the drilling accuracy is effectively and stably promoted, the cost is reduced.

Description

Multilayer heat radiating type aluminium foil composite decking

Technical field:

The utility model relates to a kind of multilayer heat radiating type aluminium foil composite decking, especially refer to a kind of when circuit boring, have additional multilayer buffering heat sinking function, cushioned that drill point runs through and slippage strength and suitably solve the multilayer heat radiating type aluminium foil composite decking of drilled plate thickness of slab inequality or plate face flaw problem.

Background technology:

In recent years because the making rapid progress of electronic technology, so that many high-tech electronic products more humane, with better function constantly weed out the old and bring forth the new, and these electronic products are more constantly towards light, thin, short, little trend designs.Various electronic products all have a slice circuit board at least, and present modal circuit board is printed circuit board (PCB) (PCB; Printed Circuit Board), it is made of many electronic building bricks and circuit board, and the function of circuit board just is to carry and electrically connect each electronic building brick, makes these electronic building bricks can electrically connect each other.

Yet, circuit board adds man-hour holing, for the more little hole in aperture, relative less drill point and the high rotational speed of essential employing, so add the heat radiation in man-hour, during problem such as broken needle and precision and common, at present for boring can be carried out smoothly, the general practice is to place an aluminium sheet or bakelite plate to come usefulness for drill point buffering and heat radiation on circuit board, yet existing commonly used aluminium sheet is thicker and be individual layer because of thickness, so the probability of buffer capacity that provides and reduction drill point broken needle is limited, thinner when using the bradawl pin because of the pin sword, intensity a little less than, desire once to run through thicker hard aluminium sheet stability and still be apparent not enough.

The utility model content:

Technical problem to be solved in the utility model is: at the above-mentioned deficiency of prior art, a kind of multilayer heat radiating type aluminium foil composite decking is provided, can hole in circuit board and add man-hour, at different demands and condition, have additional multilayer buffering heat sinking function, cushioned drill point and run through and slow down slippage strength and suitably solve drilled plate thickness of slab inequality or plate face flaw problem.

In order to solve the problems of the technologies described above, the technical scheme that the utility model adopted is: a kind of multilayer heat radiating type aluminium foil composite decking, include an aluminium foil substrate layer, and also comprise at least one aluminium foil heat dissipating layer and fit in resin bed between aluminium foil layer.

Described cover plate can be organic then padded coaming and inorganic aluminium, and thickness is 70 μ m to 500 μ m.Described aluminium foil substrate layer is the hard rolling aluminum foil, and thickness is 50 μ m to 150 μ m.Described resin bed can be polyethylene, high density polyethylene (HDPE), ultra-high molecular weight polyethylene and copolymer thereof, or OPP, PET film, polypropylene are fine, a kind of in the PU glue, epoxy resin, and its thickness is 5 μ m to 100 μ m.Described aluminium foil heat dissipating layer is the soft chemistry paper tinsel of aluminizing, and thickness is 6 μ m to 35 μ m.

Described aluminium foil layer and resin layers.Described resin bed is attached between aluminium foil substrate layer and the aluminium foil heat dissipating layer.

Compared with prior art, the utility model has the advantages that: owing to have additional multilayer buffering and heat dissipating layer, the power that drill point accurate positioning and available buffer are run through, to avoid the inclined to one side or broken needle in hole, and the heat energy that boring the time is produced can by multilayer dispel the heat the aluminium foil layer band from, produce the harmful effect of chip removal to reduce the borehole friction heating, drill point is prolonged useful life; Effectively increase production efficiency and promote yield, and, can reduce manufacturing cost greatly owing to get material easily.

Description of drawings:

Fig. 1 is a structural representation of the present utility model;

Fig. 2 is the structural representation of the utility model three layer models;

Fig. 3 is the structural representation of the utility model four layer models;

Fig. 4 is that the utility model is placed in not bore state schematic diagram of drilling equipment;

Fig. 5 is that the utility model is placed in drilling equipment bore state schematic diagram.

Label declaration:

Multilayer heat radiating type aluminium

foil composite decking

10,50,60

Aluminium foil substrate layer 20 aluminium foil heat dissipating layers 30

Resin bed 40 printed circuit board (PCB)s 70

Drilling equipment 80 drill points 81

Embodiment:

The technology contents and the constitutive requirements that are disclosed in order further to understand the utility model below promptly cooperate graphic being described as follows, however appended graphic only provide with reference to and explanation usefulness, be not in order to restriction the utility model.

Fig. 1 is the utility model multilayer heat radiating type aluminium foil composite decking 10 structural representations, as shown in the figure, this multilayer heat radiating type aluminium foil composite decking 10 is combined by organic material and inorganic material, includes an aluminium foil substrate layer 20, at least one aluminium foil heat dissipating layer 30 and fits in resin bed 40 between aluminium foil layer; Wherein aluminium foil substrate layer 20 is positioned at orlop, and the resin bed 40 of the single or double of finishing with coating above it and the aluminium foil heat dissipating layer of the required number of plies 30 staggered stacked fitting on the aluminium foil substrate layer 20 are fitted with pressure-sensitive or hot pressing mode flattening-out again.

It also can be combined into three layers of heat radiating type aluminium foil composite decking 50 as shown in Figure 2 on demand, and this moment, the superiors were resin bed 40; Also or four layers of heat radiating type aluminium foil composite decking 60 as shown in Figure 3, its the superiors are aluminium foil heat dissipating layer 30, and no matter be resin bed 40 also or aluminium foil heat dissipating layer 30 all has the ability that makes the drill point buffering, and its gross thickness can be adjusted combination, being used for general hardboard is 70 μ m to 300 μ m, and soft board is 200 μ m to 500 μ m; This resin bed 40 can be Polyethylene polyethylene (PE), high density polyethylene (HDPE) (HDPE), ultra-high molecular weight polyethylene (UHMPE) and copolymer thereof etc., or OPP, PET film, polypropylene fine (acryl glue), PU glue, epoxy resin etc. are wherein a kind of, and be attached between substrate layer 20 and the aluminium foil heat dissipating layer 30 to drench film, coating or pressing, its thickness is 5 μ m to 100 μ m; Aluminium foil substrate layer 20 thickness are 50 μ m to 150 μ m, and aluminium foil heat dissipating layer 30 thickness then are 6 μ m to 35 μ m.

Please consult Fig. 4 and shown in Figure 5 in regular turn, when the user is contacted with when carrying out bore operation on the printed circuit board (PCB) 70 with the aluminium foil substrate layer 20 of the multilayer heat radiating type aluminium foil composite decking 10 of the required number of plies, after drilling equipment 80 is positioned predetermined bore position, even drill point 81 tests are holed, this moment, drill point 81 declines can be advanced into multilayer heat radiating type aluminium foil composite decking 10 earlier, use and reach drill point 81 and accurately locate and slow down the power that directly runs through, to avoid the inclined to one side or broken needle in hole, the heat energy of high speed rotating generation simultaneously also can be by aluminium foil heat dissipating layer 30 heat radiation at a high speed of multilayer, to reduce borehole friction heat printed circuit board (PCB) 70 materials are exerted an influence, and prolonged 81 useful lifes of drill point.

Really can effectively promote drilling quality for ease of understanding the utility model fast, it is as follows that the spy does a comparative descriptions with multilayer heat radiating type aluminium foil composite decking 10 of the present utility model and present general employed cover plate materials:

	Pure aluminum foil (200 μ m)	RES (300μm)	LE-sheet (200μm)	The utility model (180 μ m)
	Pure aluminum foil (200 μ m)	RES (300μm)	LE-sheet (200μm)	The utility model (180 μ m)	The processing procedure ability	0.876	1.05	1.865	?2.369

In the last table: RES is an american goods name, means " the paper aluminium sheet ", LE-sheet is a Japanese goods, means " and lubricated aluminium sheet ".

Boring aperture: 0.2mm, precision: 50 μ m; Hardboard BT/3 sheet one brill/every thickness 0.4T/Tmm (BT is Japanese substrate, and T/T represents 1/3 ounce copper foil)

	Bakelite plate (1.6mm)	The utility model (0.4mm)
	Bakelite plate (1.6mm)	The utility model (0.4mm)	The processing procedure ability	?1.356	?2.861

Boring aperture: 0.25mm, precision: 50 μ m; Soft board PI/5 sheet one brill/every thickness 0.075H/H mm (PI is a polyimides, and H/H represents 1/2 ounce copper foil)

As from the foregoing, the utility model is real has the following advantages:

1, owing to has additional multilayer buffering and heat dissipating layer, the power that this drill point accurate positioning and available buffer are run through, to avoid the inclined to one side or broken needle in hole, and the heat energy that boring the time is produced can by multilayer dispel the heat the aluminium foil layer band from, produce the chip removal harmful effect to reduce the borehole friction heating, drill point is prolonged useful life.

2, simple in structure, hot pressing or pressure-sensitive and drench simple manufactures such as film, coating when cooperate making can effectively increase production efficiency and promote yield, and material obtains easily, make manufacturing cost reduce greatly.

The above only is preferred embodiment of the present utility model, when not being familiar with this skill obvious variation that the personage does and modification such as in order to limit the enforceable scope of the utility model, all should be considered as not departing from flesh and blood of the present utility model.

Claims

1, a kind of multilayer heat radiating type aluminium foil composite decking includes an aluminium foil substrate layer, it is characterized in that: also comprise at least one aluminium foil heat dissipating layer and fit in resin bed between aluminium foil layer.

2, multilayer heat radiating type aluminium foil composite decking according to claim 1 is characterized in that: described cover plate can be organic then padded coaming and inorganic aluminium, and thickness is 70 μ m to 500 μ m.

3, multilayer heat radiating type aluminium foil composite decking according to claim 1, it is characterized in that: described aluminium foil substrate layer is the hard rolling aluminum foil, thickness is 50 μ m to 150 μ m.

4, multilayer heat radiating type aluminium foil composite decking according to claim 1, it is characterized in that: described resin bed can be polyethylene, high density polyethylene (HDPE), ultra-high molecular weight polyethylene and copolymer thereof, or OPP, PET film, polypropylene are fine, a kind of in the PU glue, epoxy resin, and its thickness is 5 μ m to 100 μ m.

5, multilayer heat radiating type aluminium foil composite decking according to claim 1 is characterized in that: described aluminium foil heat dissipating layer is the soft chemistry paper tinsel of aluminizing, and thickness is 6 μ m to 35 μ m.

6, multilayer heat radiating type aluminium foil composite decking according to claim 1 is characterized in that: described aluminium foil layer and resin layers.

7, multilayer heat radiating type aluminium foil composite decking according to claim 1, it is characterized in that: described resin bed is attached between aluminium foil substrate layer and the aluminium foil heat dissipating layer.