MY153546A - Entry sheet for drilling - Google Patents

Entry sheet for drilling

Info

Publication number
MY153546A
MY153546A MYPI2011005808A MYPI2011005808A MY153546A MY 153546 A MY153546 A MY 153546A MY PI2011005808 A MYPI2011005808 A MY PI2011005808A MY PI2011005808 A MYPI2011005808 A MY PI2011005808A MY 153546 A MY153546 A MY 153546A
Authority
MY
Malaysia
Prior art keywords
water soluble
weight
parts
resin
drilling
Prior art date
Application number
MYPI2011005808A
Inventor
Matsuyama Yousuke
Shimizu Ken-Ichi
Ihara Katsutoshi
Original Assignee
Mitsubishi Gas Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co filed Critical Mitsubishi Gas Chemical Co
Publication of MY153546A publication Critical patent/MY153546A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/16—Perforating by tool or tools of the drill type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B35/00—Methods for boring or drilling, or for working essentially requiring the use of boring or drilling machines; Use of auxiliary equipment in connection with such methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08—Means for treating work or cutting member to facilitate cutting
    • B26D7/088—Means for treating work or cutting member to facilitate cutting by cleaning or lubricating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/127—Lubricants, e.g. during drilling of holes

Abstract

THIS INVENTION RELATES TO AN ENTRY SHEET FOR DRILLING BEING EXCELLENT IN A REDUCTION OF HOLE WALL ROUGHNESS AND HAVING LESS TWINING RESIN AROUND A DRILL, AND PARTICULARLY TO AN ENTRY SHEET FOR DRILLING COMPRISING A METAL FOIL, AND A LAYER OF A WATER SOLUBLE RESIN COMPOSITION LAMINATED AND INTEGRATED ON AT LEAST ONE SURFACE OF THE METAL FOIL, WHEREIN THE WATER SOLUBLE RESIN COMPOSITION COMPRISES 30 TO 85 PARTS BY WEIGHT OF A WATER SOLUBLE RESIN (A) HAVING A NUMBER AVERAGE MOLECULAR WEIGHT OF 80,000 TO 400,000, 10 TO 60 PARTS BY WEIGHT OF POLYETHYLENE GLYCOL (B) HAVING A NUMBER AVERAGE MOLECULAR WEIGHT OF 15,000 TO 25,000, 5 TO 50 PARTS BY WEIGHT OF A WATER SOLUBLE LUBRICANT RESIN (C), AND 0.1 TO 5 PARTS BY WEIGHT OF ONE OR TWO KINDS OR MORE OF WATER SOLUBLE SUBSTANCES (Y) SELECTED FROM THE GROUP CONSISTING OF POLYALCOHOLS, AMINO ACID DERIVATIVE ALCOHOLS, ORGANIC ACIDS AND ORGANIC ACID SALTS, BASED ON 100 PARTS BY WEIGHT OF A WATER SOLUBLE RESIN MIXTURE (X) OF THE WATER SOLUBLE RESIN (A), THE POLYETHYLENE GLYCOL (B) AND THE WATER SOLUBLE LUBRICANT RESIN (C).
MYPI2011005808A 2009-06-01 2010-05-28 Entry sheet for drilling MY153546A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009132367 2009-06-01

Publications (1)

Publication Number Publication Date
MY153546A true MY153546A (en) 2015-02-27

Family

ID=43297476

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2011005808A MY153546A (en) 2009-06-01 2010-05-28 Entry sheet for drilling

Country Status (8)

Country Link
JP (1) JP4798308B2 (en)
KR (1) KR101153259B1 (en)
CN (1) CN102458783B (en)
BR (1) BRPI1011865A2 (en)
MY (1) MY153546A (en)
RU (1) RU2534178C2 (en)
TW (1) TWI503191B (en)
WO (1) WO2010140333A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI547358B (en) * 2010-12-28 2016-09-01 Mitsubishi Gas Chemical Co Drilling cover
MY154888A (en) * 2011-01-07 2015-08-11 Mitsubishi Gas Chemical Co Drill entry sheet
CN104245256B (en) * 2012-03-21 2016-01-20 三菱瓦斯化学株式会社 Cover plate for drilling hole and boring method
CN104321173A (en) 2012-03-27 2015-01-28 三菱瓦斯化学株式会社 Entry sheet for drilling
KR102365234B1 (en) 2014-03-31 2022-02-18 미츠비시 가스 가가쿠 가부시키가이샤 Entry sheet for drilling
CN103937387B (en) * 2014-04-22 2016-06-29 深圳市柳鑫实业股份有限公司 A kind of boring overlay film aluminum-based cover plate of PCB and preparation method thereof
CN105583889A (en) * 2014-10-22 2016-05-18 合正科技股份有限公司 Cover plate for hole drilling
SG11201707185PA (en) 2015-03-19 2017-10-30 Mitsubishi Gas Chemical Co Entry sheet for drilling and method for drilling processing using same
KR102374773B1 (en) * 2015-03-19 2022-03-15 미츠비시 가스 가가쿠 가부시키가이샤 Entry sheet for drilling holes, and hole drilling method using same
WO2017155060A1 (en) * 2016-03-11 2017-09-14 三菱瓦斯化学株式会社 Entry sheet for drilling holes, and hole drilling method in which said sheet is used
JP7157931B2 (en) * 2017-06-01 2022-10-21 三菱瓦斯化学株式会社 Entry sheet for fine-diameter drilling and drilling method using the same
CN109913105A (en) * 2019-01-14 2019-06-21 广东中晨电子科技有限公司 A kind of Aluminum cover with water-soluble coating
CN110281308A (en) * 2019-06-28 2019-09-27 烟台柳鑫新材料科技有限公司 A kind of boring gluing aluminum-based cover plate of PCB and preparation method thereof
CN112662314B (en) * 2020-12-10 2022-08-23 深圳市柳鑫实业股份有限公司 Environment-friendly PCB drilling cover plate and preparation method thereof

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0821765B2 (en) * 1986-11-13 1996-03-04 ジヨンストン，ジエイムズ・エイ Method and apparatus for manufacturing a printed circuit board
JP2855824B2 (en) * 1990-08-08 1999-02-10 三菱瓦斯化学株式会社 Drilling method for printed wiring boards
JP4543243B2 (en) * 1999-06-01 2010-09-15 昭和電工パッケージング株式会社 Small diameter drilling plate and small diameter drilling method
JP4201462B2 (en) * 2000-06-05 2008-12-24 利昌工業株式会社 Entry board for drilling
JP4968652B2 (en) * 2001-07-17 2012-07-04 日本合成化学工業株式会社 Water-dispersible resin composition for perforating printed wiring board, sheet made of the composition, and method for perforating printed wiring board using such sheet
JP2003225892A (en) * 2002-02-05 2003-08-12 Mitsubishi Gas Chem Co Inc Method for drilling
JP2004017190A (en) * 2002-06-13 2004-01-22 Kobe Steel Ltd Resin coated metal sheet used for drilling printed wiring board
US20050003169A1 (en) * 2003-01-28 2005-01-06 Nobuyuki Ikeguchi Lubricant sheet for drilling and method of drilling
TWI306369B (en) * 2003-01-28 2009-02-11 Mitsubishi Gas Chemical Co Lubricant sheet for drilling and method of drilling
JP4541132B2 (en) * 2004-12-27 2010-09-08 昭和電工パッケージング株式会社 Entry board for small-diameter drilling and small-diameter drilling method
CN100531517C (en) * 2005-07-25 2009-08-19 合正科技股份有限公司 High-heat radiation lubricating aluminium cover plate for drilling
JP5011823B2 (en) * 2006-05-30 2012-08-29 三菱瓦斯化学株式会社 Method of manufacturing entry sheet for drilling
KR20080055264A (en) * 2006-12-15 2008-06-19 홍부진 Sheets for drilling
JP5198809B2 (en) * 2007-07-12 2013-05-15 三菱瓦斯化学株式会社 Entry sheet for drilling
KR100879284B1 (en) * 2008-02-12 2009-01-16 (주)상아프론테크 Lublicant sheet for pcb drilling and composition for forming the same
RU2507065C2 (en) * 2008-06-10 2014-02-20 Мицубиси Гэс Кемикал Компани, Инк. Drilling mask

Also Published As

Publication number Publication date
CN102458783A (en) 2012-05-16
JPWO2010140333A1 (en) 2012-11-15
JP4798308B2 (en) 2011-10-19
WO2010140333A1 (en) 2010-12-09
RU2011148789A (en) 2013-07-20
TW201043362A (en) 2010-12-16
TWI503191B (en) 2015-10-11
CN102458783B (en) 2013-07-24
KR20120008533A (en) 2012-01-30
KR101153259B1 (en) 2012-06-07
RU2534178C2 (en) 2014-11-27
BRPI1011865A2 (en) 2019-05-14

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